Driving circuit board, controller, power-assisted steering motor system and vehicle

Abstract

The utility model discloses a driving circuit board, a controller, a power-assisted steering motor system and a vehicle. According to the driving circuit board, the first MOS transistor and the second MOS transistor are arranged on the first surface of the circuit board, and the source electrode of the first MOS transistor and the drain electrode of the second MOS transistor are electrically connected through the first conductive wiring laid on the first surface, so that the impedance discontinuity caused by large current is reduced, and the inductance effect is increased; the voltage fluctuation and interference in the circuit board are reduced, and the thermal stability of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and more specifically to a drive circuit board, a controller, a power steering motor system and a vehicle. Background Art

[0002] The Electric Power Steering System (EPS) is a power steering system that uses a motor as power to assist the driver in steering operations. It has developed rapidly in recent years and is gradually replacing traditional hydraulic and electro-hydraulic power steering devices. When the driver manipulates the steering wheel to steer, the torque sensor detects the direction of the steering wheel and the magnitude of the torque, and transmits the voltage signal to the electronic control unit. The electronic control unit sends instructions to the motor controller based on the torque voltage signal, rotation direction and vehicle speed signal detected by the torque sensor, so that the motor outputs a steering assist torque of corresponding magnitude and direction, thereby generating auxiliary power. Among them, the motor drive circuit is the main circuit that controls the motor commutation and drive current.

[0003] The existing motor drive circuit usually controls the gate of the driving bridge MOS tube through a pulse width modulation (PWM) wave signal, thereby controlling the motor commutation and the size of the driving current. An RC circuit is also added between the drain and source of the driving bridge MOS tube to absorb transient jumps; a resistor R and a transient suppression device (TVS tube) protection circuit are added between the gate and source of the MOS tube. However, during the operation of the motor drive circuit, the current flowing through the circuit is large, and the current needs to be switched and changed in direction at a high frequency. Due to the parasitic inductance and / or parasitic capacitance of each device in the motor drive circuit, when the driving bridge MOS tube repeatedly turns on and off the large current, LC oscillation will occur. This oscillation will form interference and radiation, affecting the normal operation of the circuit; the overshoot and undershoot voltage generated, when exceeding the maximum withstand voltage of the MOS tube drain source or gate source, is likely to cause damage to the MOS tube. The layout design of the motor drive circuit will also affect the thermal stability of the motor drive circuit and the service life of the device. Utility Model Content

[0004] The present utility model is proposed to solve at least one of the above problems. According to the first aspect of the present application, a driving circuit board for a power steering motor is provided, comprising: a circuit board; a three-phase driving circuit, which is arranged on the circuit board, and each phase of the driving circuit comprises a first MOS tube and a second MOS tube, wherein the first MOS tube and the second MOS tube in each phase of the driving circuit are both located on the first surface of the circuit board, and the source of the first MOS tube and the drain of the second MOS tube in each phase of the driving circuit are electrically connected through a first conductive wiring laid on the first surface.

[0005] Exemplarily, the drive circuit of each phase is also electrically connected to a corresponding motor connection terminal, wherein each motor connection terminal is electrically connected to a corresponding source of the first MOS tube and a drain of the second MOS tube through the first conductive wiring.

[0006] Exemplarily, the three-phase drive circuits are all arranged on the first surface of the circuit board.

[0007] Exemplarily, a heat dissipation component is further included, which is arranged on the second surface of the circuit board and is in contact with and connected to the second surface of the circuit board, and the second surface is opposite to the first surface.

[0008] Exemplarily, a power supply circuit is also included, and each phase of the drive circuit also includes a first capacitor and a second capacitor, the positive electrode of the first capacitor, the drain of the first MOS tube, and the power supply end of the second capacitor are all electrically connected to the positive end of the power supply circuit, and the negative electrode of the first capacitor and the ground end of the second capacitor are all electrically connected to the negative end of the power supply circuit, wherein the positive electrode of the first capacitor, the power supply end of the second capacitor and the corresponding drain of the first MOS tube of the same drive circuit are electrically connected through a second conductive wiring located on the first surface.

[0009] Exemplarily, the negative electrode of the first capacitor and the ground terminal of the second capacitor are electrically connected via a third conductive wiring located on the first surface.

[0010] Exemplarily, at least two drive circuits in the three-phase drive circuit further include a sampling resistor, a power supply end of each of the sampling resistors is electrically connected to the source of the corresponding second MOS tube via a fourth conductive wiring located on the first surface, and a ground end of the sampling resistor, a negative electrode of the first capacitor, and a ground end of the second capacitor of the same drive circuit are electrically connected via a fifth conductive wiring located on the first surface.

[0011] Exemplarily, the first conductive wiring, the second conductive wiring, the third conductive wiring, the fourth conductive wiring, and the fifth conductive wiring are all copper-clad structures disposed on the first surface of the circuit board.

[0012] Exemplarily, a pre-driver circuit is further included, the circuit board has a multi-layer structure, the pre-driver circuit is arranged in an intermediate layer in the multi-layer structure of the circuit board, and the intermediate layer is arranged between the first surface and the second surface.

[0013] According to another aspect of the present application, a controller is also provided, comprising the above-mentioned driving circuit board.

[0014] According to another aspect of the present application, a power steering motor system is also provided, comprising the above-mentioned controller.

[0015] According to another aspect of the present application, a vehicle is also provided, comprising the above-mentioned controller or the above-mentioned power steering motor system.

[0016] According to the driving circuit board of the power steering motor in the embodiment of the present application, by arranging the first MOS tube and the second MOS tube on the first surface of the circuit board and electrically connecting the source of the first MOS tube and the drain of the second MOS tube through the first conductive wiring laid on the first surface, the impedance discontinuity and increased inductance effect caused by large current are reduced, the voltage fluctuation and interference in the circuit board are reduced, and the thermal stability of the circuit board is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A circuit diagram of a conventional driving circuit of a power steering motor is shown;

[0019] Figure 2 A schematic diagram showing the parasitic parameter effects on a circuit board of a conventional power steering motor drive circuit;

[0020] Figure 3 A circuit diagram of a driving circuit board of a power steering motor according to an embodiment of the present application is shown;

[0021] Figure 4 A circuit diagram of a driving circuit board of a power steering motor according to another embodiment of the present application is shown;

[0022] Figure 5A circuit diagram of a driving circuit board of a power steering motor according to another embodiment of the present application is shown;

[0023] Figure 6 A circuit diagram of a driving circuit board of a power steering motor according to another embodiment of the present application is shown. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more obvious, the exemplary embodiments according to the utility model will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments of the utility model, and it should be understood that the utility model is not limited to the exemplary embodiments described here. Based on the embodiments of the utility model described in the utility model, all other embodiments obtained by those skilled in the art without creative work should fall within the protection scope of the utility model.

[0025] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0026] It should be understood that the utility model can be implemented in different forms and should not be interpreted as being limited to the embodiments proposed herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

[0027] In order to thoroughly understand the present invention, a detailed structure will be presented in the following description to illustrate the technical solution proposed by the present invention. The optional embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0028] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0029] In the existing electric power steering system, the EPS electronic control unit is mainly composed of a power supply circuit, a communication circuit, a sensor interface circuit, a microprocessor, a pre-drive circuit, and a motor drive circuit. The power supply circuit provides the control unit circuit with the power required for operation. The communication circuit mainly realizes the signal communication between the controller and the vehicle host. The sensor interface circuit mainly connects the motor position sensor and the torque angle sensor. The microprocessor is the central processing chip for the steering control signal. The main function of the pre-drive circuit is to convert the PWM motor control signal sent by the microprocessor into a signal that meets the input requirements of the motor drive circuit. The motor drive circuit is the main circuit for controlling the motor commutation and the size of the drive current. The circuit diagram of the existing steering power motor drive circuit is shown in the figure below. Figure 1 As shown, the gate of the drive bridge MOS tube is controlled by the PWM wave signal to control the motor commutation and the size of the drive current. During the operation of the electric power steering system, due to the large current flowing through the motor drive circuit, the current needs to switch and change direction at a high frequency. The layout design of the motor drive circuit board is crucial to the reliability and stability of the motor drive circuit.

[0030] The parasitic parameter effects on the circuit board of the existing steering power motor drive circuit are as follows: Figure 2 As shown in the figure, L DRAIN is the parasitic inductance generated by the drain wiring of the MOS tube, L SOURCE is the parasitic inductance generated by the source wiring of the MOS tube, MotorInductance is the inductance of the motor coil, C MOSFET It is the parasitic capacitance of the MOS tube, and the bypass capacitor is the bypass capacitor; due to the existence of these parasitic inductances and capacitances, when the driving bridge MOS tube repeatedly opens and closes the large current, LC oscillation will occur at the switch node between the source of the upper bridge MOS tube and the drain of the lower bridge MOS tube. This oscillation will form interference and radiation, affecting the normal operation of the circuit; when the overshoot and undershoot voltages generated exceed the maximum withstand voltage of the drain-source or gate-source of the MOS tube, it is easy to cause damage to the MOS tube. The layout design of the motor drive circuit will also affect the thermal stability of the motor drive circuit and the service life of the device.

[0031] Combine the following Figure 3 A driving circuit board of a power steering motor according to an embodiment of the present application is described, wherein the driving circuit board 300 comprises: a circuit board 301; a three-phase driving circuit 302, which is arranged on the circuit board 301, and each phase driving circuit comprises a first MOS tube and a second MOS tube, wherein the first MOS tube and the second MOS tube in each phase driving circuit are both located on the first surface of the circuit board, and the source of the first MOS tube in each phase driving circuit is adjacent to the drain of the second MOS tube and is electrically connected via a first conductive wiring laid on the first surface.

[0032] According to the driving circuit board of the power steering motor of the embodiment of the present application, by arranging the first MOS tube and the second MOS tube on the first surface of the circuit board and placing the source of the first MOS tube adjacent to the drain of the second MOS tube and electrically connecting them through the first conductive wiring laid on the first surface, the impedance discontinuity and increased inductance effect caused by large current are reduced, the voltage fluctuation and interference in the circuit board are reduced, and the thermal stability of the circuit board is improved.

[0033] Embodiment 1

[0034] The circuit diagram of the driving circuit board of the power steering motor according to the embodiment of the present application is as follows: Figure 3 As shown, the positive pole of the 12V power input is connected to the P+ terminal, and the negative pole is connected to the P- terminal; one end of the L1 inductor is connected to the power input P+ terminal, and the other end is connected to the drain of the total shutdown MOS device Q1; the main function of the L1 inductor is to suppress and filter out interference signals on the power line. The internal source-drain diode of Q1 is in a reverse biased state, and its on and off is controlled by the gate drive signal, thereby controlling the on and off of the total motor drive power supply. The source of Q1 is connected to the source of Q2, and the gate is connected to the gate, and can be controlled simultaneously by the gate drive signal; the internal source-drain diode of Q2 is in a forward biased state when it is normal, and is in a reverse biased state when the input power line is reversed, thereby realizing the anti-reverse connection protection function. The power output from the drain of Q2 is connected to the drain of the high-side MOS tubes Q12, Q16, and Q23 of the drive bridge to power the motor drive circuit.

[0035] The positive electrode of the electrolytic capacitor C135, the power supply end of the ceramic capacitor C132, and the drain of the high-side MOS tube Q12 of the driving bridge of the first driving circuit are connected through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias (VIA) on the copper cladding; the source of Q12 is connected to the drain of the low-side MOS tube Q15 of the driving bridge and the first-phase motor connection terminal U through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface; the source of Q15 is connected to one end of the current sampling resistor R106 through the copper cladding on the same surface; the ground end of the current sampling resistor R106 is connected to the negative electrode of C135 and the ground end of C132 through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface; the first-phase motor half-bridge driving circuit is formed.

[0036] The gate and source signals of the high-side MOS tube Q12 and the gate and source signals of the low-side MOS tube Q15 of the first phase driving bridge are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit, which can reduce the loop area between the gate and source of the MOS tube drive signal and suppress the common-mode interference and radiation of the MOS tube drive signal. The PWM wave control signal provided by the pre-drive circuit controls the on and off of the MOS tube, thereby changing the direction of the phase current. When the high-side MOS tube Q12 is turned on, the first phase is connected to the power supply; when the low-side MOS tube Q15 is turned on, the first phase is grounded. The high-side MOS tube Q12 and the low-side MOS tube Q15 cannot be turned on at the same time. In an example, the current size can be controlled by adjusting the duty cycle of the PWM wave signal. The motor drive control needs to continuously control the switching of the high-side MOS and low-side MOS switches of the drive bridge. Due to the presence of parasitic inductance in the circuit and the phase coil inductance of the motor, oscillation will occur at the switch node between the source of the high-side MOS tube Q12 and the drain of the low-side MOS tube Q15, forming overshoot and undershoot voltages. The high-frequency switch oscillation signal will cause interference and radiation; when the overshoot and undershoot voltages exceed the tolerance range of the device, the device will be damaged. In this embodiment, the positive electrode of the capacitor C135, the power supply end of C132 and the drain of the high-side MOS tube Q12 are placed close to each other on the same surface, and are connected by copper cladding on the same surface to minimize the inductance and resistance between the capacitor and the drain of the MOS tube Q12; the source of the high-side MOS tube Q12 and the drain of the low-side MOS tube Q15 are placed close to each other, and are connected by a wide area of ​​copper cladding on the same surface to reduce the parasitic inductance at the first phase switch node; the source of the low-side MOS tube Q15 and the sampling resistor R106 are placed close to each other on the same surface, The inductance and resistance of the connection between the source of the low-side MOS tube Q15 and the sampling resistor R106 are reduced by connecting them with copper on the same surface; the ceramic capacitor C132 is placed closest to the drain of the high-side MOS tube Q12 and the ground end of the current sampling resistor R106, so that the C132 ceramic capacitor, the high-side MOS tube Q12, the low-side MOS tube Q15, and the sampling resistor R106 form the smallest high-frequency signal loop area, so that the C132 capacitor can more effectively reduce and suppress the high-frequency noise interference generated by the first-phase half-bridge drive circuit. The electrolytic capacitor C135, the high-side MOS tube Q12, the low-side MOS tube Q15, and the current sampling resistor R106 form the smallest loop area, and by reducing the parasitic inductance and resistance of the loop, the C135 electrolytic capacitor can more effectively reduce and suppress the voltage fluctuation generated in the first-phase half-bridge drive circuit, further reduce the circuit noise, and reduce the risk of damage to the first-phase half-bridge drive MOS tube and other devices due to overshoot or undershoot voltage at the switch node of the high-side MOS tube Q12 and the low-side MOS tube Q15. The current sampling resistor R106 collects the current of the first phase motor drive coil, converts the current signal into a voltage signal, and transmits it to the pre-drive circuit through a differential line in the inner layer between the two ground layers, which can improve the stability of the current sampling signal.

[0037] The positive electrode of the electrolytic capacitor C103, the power supply end of the ceramic capacitor C170, and the drain of the high-side MOS tube Q16 of the driving bridge are connected through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface; the source of the high-side MOS tube Q16 of the driving bridge is connected to the drain of the low-side MOS tube Q19 and the second-phase motor connection terminal V through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding; the source of Q19 is connected to one end of the current sampling resistor R152 through the copper cladding on the same surface; the ground end of the current sampling resistor R152 is connected to the negative electrode of C103 and the ground end of C170 through the copper cladding on the same surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding; the second-phase motor half-bridge drive circuit is formed.

[0038] The gate and source signals of the high-side MOS tube Q16 of the driving bridge and the gate and source signals of the low-side MOS tube Q19 are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit, which can reduce the loop area between the gate and source of the MOS tube drive signal and suppress the common-mode interference and radiation of the MOS tube drive signal. In one example, the PWM wave control signal provided by the pre-drive circuit can control the on and off of the MOS tube, thereby changing the direction of the phase current. When the high-side MOS tube Q16 is turned on, the second phase is connected to the power supply; when the low-side MOS tube Q19 is turned on, the second phase is grounded, and the high-side MOS tube Q16 and the low-side MOS tube Q19 cannot be turned on at the same time. In one example, the current size can be controlled by adjusting the duty cycle of the PWM wave signal. The motor drive control needs to continuously control the switching of the high-side MOS and low-side MOS switches of the drive bridge. Due to the existence of parasitic inductance in the circuit and the phase coil inductance of the motor, oscillation will be generated at the switch node between the source of the high-side MOS tube Q16 and the drain of the low-side MOS tube Q19, forming overshoot and undershoot voltages. The high-frequency switch oscillation signal will cause interference and radiation; when the overshoot and undershoot voltages exceed the tolerance range of the MOS tube, the second-phase half-bridge drive MOS tube will be damaged. In this embodiment, the positive electrode of the capacitor C103, the power supply end of C170 and the drain of the high-side MOS tube Q16 are placed close to each other on the same surface, and connected by copper cladding on the same surface, so as to minimize the inductance and resistance between the capacitor C103 and the drain of the MOS tube Q16; the source of the high-side MOS tube Q16 and the drain of the low-side MOS tube Q19 are placed close to each other, and connected by a wide area of ​​copper cladding on the same surface, and connected to the copper cladding of the same network of the inner layer and the bottom layer through a large number of vias on the copper cladding, so as to reduce the parasitic inductance at the second-phase switch node; the source of the low-side MOS tube Q19 and the sampling circuit are connected by a large number of vias on the copper cladding. The resistor R152 is placed close to the same surface, and the parasitic inductance and resistance between the source of the low-side MOS tube Q19 and the sampling resistor R152 are reduced by copper cladding on the same surface; the ceramic capacitor C170 is placed close to the drain of the high-side MOS tube Q16 and the ground end of the current sampling resistor R152, so that the C170 ceramic capacitor, the high-side MOS tube Q16, the low-side MOS tube Q19, and the sampling resistor R152 form the smallest high-frequency signal loop area, so that the C170 capacitor can more effectively reduce and suppress the high-frequency noise interference generated by the second-phase half-bridge drive circuit. The electrolytic capacitor C103, the high-side MOS tube Q16, the low-side MOS tube Q19, and the current sampling resistor R152 form the smallest loop area, and by reducing the parasitic inductance and resistance of the loop, the C103 electrolytic capacitor can more effectively reduce and suppress the voltage fluctuation generated in the second-phase half-bridge drive circuit, and reduce the risk of damage to the second-phase half-bridge drive MOS tube due to overshoot or undershoot voltage at the switch node of the high-side MOS tube Q16 and the low-side MOS tube Q19. The current sampling resistor R152 collects the current of the second-phase motor drive coil, converts the current signal into a voltage signal, and transmits it to the pre-drive circuit through a differential line in the inner layer between the two ground layers, which can improve the stability of the current sampling signal.

[0039] The positive electrode of the electrolytic capacitor C171, the power supply end of the ceramic capacitor C100, and the drain of the high-side MOS tube Q23 of the driving bridge are connected through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding; the source of the high-side MOS tube Q23 of the driving bridge is connected to the drain of the low-side MOS tube Q26 and the third-phase motor connection terminal W through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding; the source of Q26 is connected to one end of the current sampling resistor R209 through the copper cladding on the same surface; the ground end of the current sampling resistor R209 is connected to the negative electrode of the capacitor C171 and the ground end of C100 through the copper cladding on the same surface, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding; a third-phase motor half-bridge drive circuit is formed. The gate and source signals of the high-side MOS tube Q23 of the driving bridge and the gate and source signals of the low-side MOS tube Q26 are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit, which can reduce the loop area between the gate and source of the MOS tube drive signal and suppress the common-mode interference and radiation of the MOS tube drive signal. In one example, the PWM wave control signal provided by the pre-drive circuit can be used to control the on and off of the MOS tube, thereby changing the direction of the phase current. When the high-side MOS tube Q23 is turned on, the third phase is connected to the power supply; when the low-side MOS tube Q26 is turned on, the third phase is grounded, and the high-side MOS tube Q23 and the low-side MOS tube Q26 cannot be turned on at the same time. In one example, the current size can be controlled by adjusting the duty cycle of the PWM wave signal. The motor drive control needs to continuously control the switching of the high-side MOS and low-side MOS switches of the drive bridge. Due to the presence of parasitic inductance in the circuit and the phase coil inductance of the motor, oscillation will occur at the switch node between the source of the high-side MOS tube Q23 and the drain of the low-side MOS tube Q26, forming overshoot and undershoot voltages. The high-frequency switch oscillation signal will cause interference and radiation; when the overshoot or undershoot voltage exceeds the tolerance range of the MOS tube, the third-phase half-bridge drive MOS tube will be damaged. In the embodiment, the positive electrode of the capacitor C171, the power supply end of C100 and the drain of the high-side MOS tube Q23 are placed close to the same surface, and connected by copper cladding on the same surface, the inductance and resistance between the capacitors C171, C100 and the drain of the MOS tube Q23 are minimized; the source of the high-side MOS tube Q23 and the drain of the low-side MOS tube Q26 are placed close to the same surface, and connected by a wide area of ​​copper cladding on the same surface, reducing the parasitic inductance and line resistance at the third-phase switch node; the source of the low-side MOS tube Q26 and the sampling resistor R209 are close to the same surface. The parasitic inductance and line resistance of the connection between the source of the low-side MOS tube Q26 and the sampling resistor R209 are reduced by placing them in the same surface copper connection; the ceramic capacitor C100 is placed close to the drain of the high-side MOS tube Q23 and the ground end of the current sampling resistor R209, so that the ceramic capacitor C100, the high-side MOS tube Q23, the low-side MOS tube Q26, and the sampling resistor R209 form a minimum high-frequency signal loop area, so that the capacitor C100 can more effectively reduce and suppress the high-frequency noise interference generated by the third-phase half-bridge drive circuit.The electrolytic capacitor C171, the high-side MOS tube Q23, the low-side MOS tube Q26, and the current sampling resistor R209 form a minimum loop area, which reduces the parasitic inductance and resistance of the loop, so that the C171 electrolytic capacitor can more effectively reduce and suppress the voltage fluctuation generated in the third-phase half-bridge drive circuit, and reduce the risk of damage to the third-phase half-bridge drive MOS tube due to overshoot or undershoot voltage at the switch node of the high-side MOS tube Q23 and the low-side MOS tube Q26. The current sampling resistor R209 collects the current of the third-phase motor drive coil, converts the current signal into a voltage signal, and transmits it to the pre-drive circuit through a differential line in the inner layer between the two ground layers, which can improve the stability of the current sampling signal.

[0040] In one example, the driver circuit board also includes: power supply circuit B2, microprocessor B3, pre-drive circuit B4 and some discrete devices, interface circuit B1. In one example, the torque and angle sensor, motor position sensor, host CAN, redundant motor drive sub-board are all connected to the microprocessor through the interface circuit; the power supply circuit provides the required power for the control circuit; the microprocessor circuit receives the signal of the torque and angle sensor, the signal of the motor position sensor, and the vehicle speed signal, and outputs the PWM wave signal of the motor drive control after processing; the pre-drive circuit converts the PWM wave signal output by the microprocessor into a signal that meets the voltage amplitude requirements of the motor drive circuit, and the pre-drive circuit integrates overvoltage, undervoltage, overcurrent protection functions, and current sampling amplifiers.

[0041] like Figure 3 As shown, in one example, the first phase driving circuit includes a first MOS transistor Q12 and a second MOS transistor Q15, wherein Q12 is a high-side MOS transistor of the driving bridge, and Q15 is a low-side MOS transistor of the driving bridge. Figure 2 , the source of the driving bridge high-side MOS tube Q12 and the drain of the driving bridge low-side MOS tube Q15 are connected through the copper clad laid on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface. In one example, in the other two items of the driving circuit, similarly, the second phase driving circuit includes a driving bridge high-side MOS tube Q16 and a driving bridge low-side MOS tube Q19. In one example, the source of the driving bridge high-side MOS tube Q16 and the drain of the driving bridge low-side MOS tube Q19 are connected through the copper clad laid on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface, and the third phase driving circuit includes a driving bridge high-side MOS tube Q23 and a driving bridge low-side MOS tube Q26. Refer to Figure 2 The source of the driving bridge high-side MOS tube Q23 and the drain of the driving bridge low-side MOS tube Q26 are connected through the copper clad laid on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface.

[0042] Exemplarily, each phase drive circuit is also electrically connected to a corresponding motor connection terminal, wherein each motor connection terminal is electrically connected to a source of a corresponding first MOS transistor and a drain of a corresponding second MOS transistor through a first conductive wiring. Figure 3 As shown, in one example, capacitors C135, C132, the high-side MOS transistor Q12 of the driving bridge, the low-side MOS transistor Q15 of the driving bridge, and the current sampling resistor R106 are connected through the same-surface copper cladding, and a large number of vias are used on the copper cladding surface to connect with the copper cladding of the same network in the inner layer and the bottom layer, so that the high-frequency loop area in the first phase driving circuit is reduced, thereby reducing the high-frequency interference signal of the circuit. In one example, similarly, the structures in the other two driving circuits are the same as the structure in the first driving circuit.

[0043] Exemplarily, the three-phase drive circuits are all arranged on the first surface of the circuit board. Exemplarily, the drive circuit board also includes a heat dissipation component, which is arranged on the second surface of the circuit board and is in contact and connected with the second surface of the circuit board, and the second surface is opposite to the first surface. In one example, each device in the three-phase drive circuit is arranged on the first surface of the circuit board, and a heat dissipation component is arranged on the second surface of the drive circuit board, and the second surface is opposite to the first surface. In one example, a radiator is arranged on the back of the drive circuit board, and the radiator includes a metal block, and the radiator contacts the second surface of the drive circuit board. Since each device in the three-phase drive circuit is arranged on the first surface of the circuit board, the contact area of ​​the radiator contacting the drive circuit board is large, and the heat dissipation effect is better, which improves the heat dissipation effect of the motor drive circuit board, thereby enhancing the thermal stability of the drive circuit board.

[0044] Exemplarily, the driving circuit board also includes a power supply circuit, and each phase driving circuit also includes a first capacitor and a second capacitor, the positive electrode of the first capacitor, the drain electrode of the first MOS tube, and the power supply end of the second capacitor are all electrically connected to the positive end of the power supply circuit, and the negative electrode of the first capacitor and the ground end of the second capacitor are all electrically connected to the negative end of the power supply circuit, wherein the positive electrode of the first capacitor, the power supply end of the second capacitor and the drain electrode of the corresponding first MOS tube of the same driving circuit are electrically connected through the second conductive wiring located on the first surface. Different driving circuits may correspond to different second conductive wirings. Reference Figure 3In one example, in the first driving circuit, the positive terminal of the power supply circuit is electrically connected to the positive electrode of the electrolytic capacitor C135, the drain of the driving bridge high-side MOS tube Q12 and the power supply terminal of the ceramic capacitor C132, and the negative terminal of the power supply circuit is electrically connected to the negative electrode of the electrolytic capacitor C135 and the ground terminal of the ceramic capacitor C132, wherein the positive electrode of the electrolytic capacitor C135, the power supply terminal of the ceramic capacitor C132 and the corresponding drain of the driving bridge high-side MOS tube Q12 are electrically connected through the same-surface copper cladding located on the first surface, which can provide a minimum loop area for the first-phase half-bridge driving circuit, thereby reducing the inductance effect and resistance between the electrolytic capacitor C135 and the first-phase half-bridge driving MOS tube, and reducing the voltage fluctuation and interference of the first-phase half-bridge driving circuit. In one example, in the second driving circuit, the positive terminal of the power supply circuit is electrically connected to the positive electrode of the electrolytic capacitor C103, the drain of the driving bridge high-side MOS tube Q16 and the power supply terminal of the ceramic capacitor C170, and the negative terminal of the power supply circuit is electrically connected to the negative electrode of the electrolytic capacitor C103 and the ground terminal of the ceramic capacitor C170, wherein the positive electrode of the electrolytic capacitor C103, the power supply terminal of the ceramic capacitor C170 and the corresponding drain of the driving bridge high-side MOS tube Q16 are electrically connected through the same-surface copper cladding located on the first surface, which can provide a minimum loop area for the second-phase half-bridge driving circuit, thereby reducing the inductance effect and resistance between the C103 electrolytic capacitor and the second-phase half-bridge driving MOS tube, and reducing the voltage fluctuation and interference of the second-phase half-bridge driving circuit. In one example, in the third driving circuit, the positive terminal of the power supply circuit is electrically connected to the positive electrode of the electrolytic capacitor C171, the drain of the driving bridge high-side MOS tube Q23 and the power supply terminal of the ceramic capacitor C100, and the negative terminal of the power supply circuit is electrically connected to the negative electrode of the electrolytic capacitor C171 and the ground terminal of the ceramic capacitor C100, wherein the positive electrode of the electrolytic capacitor C171, the power supply terminal of the ceramic capacitor C100 and the corresponding drain of the driving bridge high-side MOS tube Q23 are electrically connected through the same-surface copper cladding located on the first surface, which can provide a minimum loop area for the third-phase half-bridge driving circuit, thereby reducing the inductance effect and resistance between the electrolytic capacitor C171 and the third-phase half-bridge driving MOS tube, and reducing the voltage fluctuation and interference of the third-phase half-bridge driving circuit.

[0045] Exemplarily, the negative electrode of the first capacitor and the ground terminal of the second capacitor are electrically connected through a third conductive wiring located on the first surface. In one example, in the first driving circuit, the negative electrode of the electrolytic capacitor C135 and the ground terminal of the ceramic capacitor C132 are connected through the same-surface copper clad located on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface. In one example, in the second driving circuit, the negative electrode of the electrolytic capacitor C103 and the ground terminal of the ceramic capacitor C170 are connected through the same-surface copper clad located on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface. In one example, in the third driving circuit, the negative electrode of the electrolytic capacitor C171 and the ground terminal of the ceramic capacitor C100 are connected through the same-surface copper clad located on the first surface, and are connected to the copper clad of the same network in the inner layer and the bottom layer through a large number of vias on the copper clad surface.

[0046] Exemplarily, at least two drive circuits in the three-phase drive circuit further include a sampling resistor, and the power supply end of each sampling resistor is electrically connected to the source of the corresponding second MOS tube through a fourth conductive wiring located on the first surface, and the ground end of the sampling resistor of the same drive circuit, the negative electrode of the first capacitor, and the ground end of the second capacitor are electrically connected through a fifth conductive wiring located on the first surface. Different drive circuits may correspond to different fifth conductive wirings. In one example, in the first drive circuit, the sampling resistor R106 is connected to the source of the low-side MOS tube Q15 of the driving bridge through the same-surface copper cladding located on the first surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface, and the ground end of the sampling resistor R106, the negative electrode of the electrolytic capacitor C135, and the ground end of the ceramic capacitor C132 are connected through the same-surface copper cladding, and are connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface. In one example, in the first driving circuit, the sampling resistor R152 is connected to the source of the low-side MOS transistor Q19 of the driving bridge through the copper cladding on the same surface located on the first surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface. The ground terminal of the sampling resistor R152 is connected to the negative electrode of the electrolytic capacitor C103 and the ground terminal of the ceramic capacitor C170 through the copper cladding on the same surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface. In one example, in the first driving circuit, the sampling resistor R209 is connected to the source of the low-side MOS transistor Q23 of the driving bridge through the copper cladding on the same surface located on the first surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface. The ground terminal of the sampling resistor R209 is connected to the negative electrode of the electrolytic capacitor C171 and the ground terminal of the ceramic capacitor C100 through the copper cladding on the same surface, and is connected to the copper cladding of the same network in the inner layer and the bottom layer through a large number of vias on the copper cladding surface.

[0047] Exemplarily, the first conductive wiring, the second conductive wiring, the third conductive wiring, the fourth conductive wiring and the fifth conductive wiring are all copper-clad structures disposed on the first surface of the circuit board.

[0048] Exemplarily, a pre-drive circuit is also included, the circuit board has a multi-layer structure, the pre-drive circuit is arranged in an intermediate layer in the multi-layer structure of the circuit board, and the intermediate layer is arranged between the first surface and the second surface. In one example, the gate and source signals of the high-side MOS tube Q12 of the first phase drive bridge and the gate and source signals of the low-side MOS tube Q15 are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit; the gate and source signals of the high-side MOS tube Q16 of the second phase drive bridge and the gate and source signals of the low-side MOS tube Q19 are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit; the gate and source signals of the high-side MOS tube Q23 of the first phase drive bridge and the gate and source signals of the low-side MOS tube Q26 are respectively routed through differential lines in the inner layer close to the ground layer to the pre-drive circuit.

[0049] In one example, the three-phase drive circuit 302 can be separated from other parts on the drive circuit board and designed separately on a circuit board, and then the three-phase drive circuit is electrically connected to other parts on the drive circuit board.

[0050] Embodiment 2

[0051] Combine the following Figure 4 A driving circuit board of a power steering motor according to another embodiment of the present application is described. Figure 4 As shown, based on the first implementation mode, the following Figure 1 The R106 current sampling resistor shown in the figure retains the two-phase current sampling resistors R152 and R209, and the other phase current can be calculated according to Kirchhoff's current law. In one embodiment, a processor can be used to calculate the other phase current. Figure 4 As shown, the source of Q15 is connected to the negative electrode of capacitor C135, the negative electrode of C103, the ground terminal of C132, the ground terminal of C170, and the ground terminal of resistor R152 through the same surface copper. In one example, removing resistor R106 can change the device layout of the driver circuit board and reduce the heat dissipation pressure.

[0052] Embodiment 3

[0053] Combine the following Figure 5 A driving circuit board of a power steering motor according to another embodiment of the present application is described. Figure 5 As shown, based on the first implementation mode, the following Figure 1 The R152 current sampling resistor shown in the figure retains the two-phase current sampling resistors R106 and R209, and the other phase current can be calculated according to Kirchhoff's current law. In one embodiment, a processor can be used to calculate the other phase current. Figure 5As shown, the source of Q19 is connected to the negative electrode of capacitor C135, the negative electrode of C103, the ground terminal of C132, the ground terminal of C170, and the ground terminal of resistor R106 through the same-surface copper cladding. In one example, removing resistor R152 can change the device layout of the driver circuit board and reduce the heat dissipation pressure.

[0054] Embodiment 4

[0055] Combine the following Figure 6 A driving circuit board of a power steering motor according to another embodiment of the present application is described. Figure 6 As shown, based on the first implementation mode, the following Figure 1 The R209 current sampling resistor shown in the figure retains the two-phase current sampling resistors R152 and R106, and the other phase current can be calculated according to Kirchhoff's current law. In one embodiment, a processor can be used to calculate the other phase current. Figure 6 As shown, the source of Q26 is connected to the negative electrode of capacitor C135, the negative electrode of C103, the ground terminal of C132, the ground terminal of C170, and the ground terminal of resistor R106 through the same-surface copper cladding. In one example, removing resistor R209 can change the device layout of the driver circuit board and reduce the heat dissipation pressure.

[0056] According to another aspect of the present application, a controller is also provided, comprising the above-mentioned driving circuit board.

[0057] According to another aspect of the present application, a power steering motor system is also provided, comprising the above-mentioned controller.

[0058] According to another aspect of the present application, a vehicle is also provided, comprising the above-mentioned controller or the above-mentioned power steering motor system.

[0059] The utility model has been described through the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and description, and are not intended to limit the utility model to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the utility model is not limited to the above embodiments, and more variations and modifications can be made according to the teachings of the utility model, and these variations and modifications all fall within the scope of protection claimed by the utility model. The protection scope of the utility model is defined by the attached claims and their equivalents.

Claims

1. A driving circuit board for a power steering motor, characterized in that: include: Circuit boards; A three-phase drive circuit is arranged on the circuit board, and each phase of the drive circuit includes a first MOS tube and a second MOS tube, wherein the first MOS tube and the second MOS tube in each phase of the drive circuit are located on the first surface of the circuit board, and the source of the first MOS tube and the drain of the second MOS tube in each phase of the drive circuit are electrically connected through a first conductive wiring laid on the first surface.

2. The driving circuit board according to claim 1, characterized in that: Each phase of the driving circuit is also electrically connected to a corresponding motor connection terminal, wherein each of the motor connection terminals is electrically connected to a corresponding source of the first MOS tube and a drain of the second MOS tube through the first conductive wiring.

3. The driving circuit board according to claim 1, characterized in that: The three-phase drive circuits are all arranged on the first surface of the circuit board.

4. The driving circuit board according to claim 1, characterized in that: It also includes a heat dissipation component, which is arranged on the second surface of the circuit board and is in contact with and connected to the second surface of the circuit board, and the second surface is opposite to the first surface.

5. The driving circuit board according to claim 1, characterized in that: It also includes a power supply circuit, and each phase of the drive circuit also includes a first capacitor and a second capacitor, the positive electrode of the first capacitor, the drain of the first MOS tube, and the power supply end of the second capacitor are all electrically connected to the positive end of the power supply circuit, and the negative electrode of the first capacitor and the ground end of the second capacitor are all electrically connected to the negative end of the power supply circuit, wherein the positive electrode of the first capacitor, the power supply end of the second capacitor and the corresponding drain of the first MOS tube of the same drive circuit are electrically connected through a second conductive wiring located on the first surface.

6. The driving circuit board according to claim 5, characterized in that: The negative electrode of the first capacitor and the ground terminal of the second capacitor are electrically connected via a third conductive wiring located on the first surface.

7. The driving circuit board according to claim 6, characterized in that: At least two drive circuits in the three-phase drive circuit further include a sampling resistor, a power supply end of each of the sampling resistors is electrically connected to the source of the corresponding second MOS tube via a fourth conductive wiring located on the first surface, and a ground end of the sampling resistor, a negative electrode of the first capacitor, and a ground end of the second capacitor of the same drive circuit are electrically connected via a fifth conductive wiring located on the first surface.

8. The driving circuit board according to claim 7, characterized in that: The first conductive wiring, the second conductive wiring, the third conductive wiring, the fourth conductive wiring and the fifth conductive wiring are all copper-clad structures disposed on the first surface of the circuit board.

9. The driving circuit board according to claim 4, characterized in that: A pre-driver circuit is also included. The circuit board has a multi-layer structure. The pre-driver circuit is arranged in a middle layer of the multi-layer structure of the circuit board. The middle layer is arranged between the first surface and the second surface.

10. A controller, characterized in that: It comprises a driving circuit board as claimed in any one of claims 1 to 9.

11. A power steering motor system, characterized in that: Comprising a controller as claimed in claim 10.

12. A vehicle, characterized in that: It comprises the controller as claimed in claim 10 or the power steering motor system as claimed in claim 11.

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