Silicon plate cooling mechanism with waste heat recovery function
By designing a silicon plate cooling mechanism including mounting frame, heat exchanger and circulation pump, the problem of waste heat recovery during the silicon plate cooling process is solved, the effective utilization of heat is achieved, and the heat consumption is reduced.
Patent Information
- Application Number
- CN202420864285.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-24
AI Technical Summary
The existing silicon plates cannot effectively recover waste heat during cooling, resulting in excessive heat consumption.
A silicon plate cooling mechanism including mounting frame, heat exchanger, circulation pump and heat transfer tube is designed. The heat in the cooling circulating pipe is transmitted to the heat exchanger through the circulation pump and heat transfer tube, so as to discharge the silicon plate during cooling. The recovery and utilization of heat.
It effectively reduces excessive heat consumption and reuses the recovered heat by preheating working fluids or heating.
Smart Images
Figure CN222356333U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon plate heat recovery, in particular to a silicon plate cooling mechanism with waste heat recovery. Background Art
[0002] Silicon panels and silicon sludge are products made from recycled photovoltaic silicon panels and are usually associated with the recycling and reuse process of solar panels.
[0003] Existing silicon panels are unable to recycle waste heat while cooling, resulting in excessive heat consumption. Utility Model Content
[0004] The utility model aims to provide a silicon plate cooling mechanism with waste heat recovery, which can reduce excessive heat consumption by solving the problem of recycling waste heat during the cooling process of the silicon plate.
[0005] To achieve the above-mentioned purpose, a silicon plate cooling mechanism with waste heat recovery is provided, including a mounting frame and a heat exchanger, a circulating pump is arranged on one side of the outside of the mounting frame, a second heat transfer pipe is arranged on the middle part of the inner side of the circulating pump, a second heat transfer pipe and a fourth heat transfer pipe are arranged on both sides of the heat exchanger, a cooling device is arranged on the outer end of the fourth heat transfer pipe, a limiting frame is arranged around the top of the mounting frame, a baffle frame is arranged on the upper inner side of the limiting frame, a silicon plate body is arranged on the lower inner side of the limiting frame, a cooling circulation pipeline is arranged below the silicon plate body, a cooling circulation pipeline is arranged on the upper middle surface of the mounting frame, a first heat transfer pipe and a third heat transfer pipe are arranged on both sides of the bottom of the cooling circulation pipeline, and supports are arranged around the bottom of the mounting frame.
[0006] According to the silicon plate cooling mechanism with waste heat recovery, the circulating pump is fixedly contacted with an outer side of the mounting frame, the second transfer heat pipe is heat exchanged with the circulating pump through the inside of one side of the mounting frame, and the first transfer heat pipe is heat exchanged with the upper inner side of the circulating pump.
[0007] According to the silicon plate cooling mechanism with waste heat recovery, the heat exchanger is connected to the inner side of the mounting frame with a limit clamp, the two sides of the heat exchanger are respectively connected to the second transfer heat pipe and the fourth transfer heat pipe for heat exchange, one side of the cooling device is connected to the outer end of the fourth transfer heat pipe for heat exchange, and the top of the cooling device is connected to the third transfer heat pipe for heat exchange.
[0008] According to the silicon plate cooling mechanism with waste heat recovery, the limit frame is fixedly contacted and connected to the top of the mounting frame on all sides, and the baffle frame is fixedly contacted and connected to the upper inner side of the limit frame.
[0009] According to the silicon plate cooling mechanism with waste heat recovery, the silicon plate body is connected to the lower inner side of the limiting frame through a baffle frame.
[0010] According to the silicon plate cooling mechanism with waste heat recovery, the cooling circulation pipeline is connected to the upper middle surface of the mounting frame in a suspended support, and the upper part of the cooling circulation pipeline is in contact with the lower surface of the silicon plate body.
[0011] According to the silicon plate cooling mechanism with waste heat recovery, the two sides of the bottom of the cooling circulation pipeline are respectively connected to the first transfer heat pipe and the third transfer heat pipe for heat exchange, and the cooling circulation pipeline is connected to the circulation pump and the cooling device for heat exchange through the first transfer heat pipe and the third transfer heat pipe.
[0012] According to the silicon plate cooling mechanism with waste heat recovery, the bottom of the mounting frame is fixedly contacted and connected to the support on all sides, and the heat exchanger and the cooling device are suspended and connected through the support and the mounting frame and the plane.
[0013] The above scheme has the beneficial effect that by arranging the first heat transfer pipe, the circulation pump, the second heat transfer pipe and the heat exchanger, the liquid coolant that takes away the heat from the surface of the silicon plate body inside the cooling circulation pipeline can pass through the first heat transfer pipe, the circulation pump and the second heat transfer pipe in sequence to reach the heat exchanger, and the heat discharged during the cooling process of the silicon plate body is collected by the heat exchanger and used for preheating the working fluid, heating or other purposes, thereby reducing excessive heat consumption.
[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;
[0016] Figure 1 This is a schematic diagram of the structure of a silicon plate cooling mechanism with waste heat recovery according to the utility model;
[0017] Figure 2 This is a structural cross-sectional view of a silicon plate cooling mechanism with waste heat recovery according to the utility model;
[0018] Figure 3 This is a structural explosion diagram of a limit frame of a silicon plate cooling mechanism with waste heat recovery according to the utility model;
[0019] Figure 4 The utility model is a front cross-sectional view of a silicon plate cooling mechanism with waste heat recovery.
[0020] Legend:
[0021] 1. Installation frame; 2. Limiting frame; 3. Baffle frame; 4. Circulation pump; 5. Support; 6. First heat transfer pipe; 7. Second heat transfer pipe; 8. Heat exchanger; 9. Cooling device; 10. Third heat transfer pipe; 11. Cooling circulation pipeline; 12. Silicon plate body; 13. Fourth heat transfer pipe. DETAILED DESCRIPTION
[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0023] Reference Figure 1-4 The utility model embodiment provides a silicon plate cooling mechanism with waste heat recovery, which includes a mounting frame 1 and a heat exchanger 8, a circulating pump 4 is arranged on one side of the outside of the mounting frame 1, a second heat transfer pipe 7 is arranged on the middle part of the inner side of the circulating pump 4, the second heat transfer pipe 7 and the fourth heat transfer pipe 13 are arranged on both sides of the heat exchanger 8, and a cooling device 9 is arranged on the outer end of the fourth heat transfer pipe 13, a limiting frame 2 is arranged around the top of the mounting frame 1, a baffle frame 3 is arranged on the upper inner side of the limiting frame 2, a silicon plate body 12 is arranged on the lower inner side of the limiting frame 2, a cooling circulation pipeline 11 is arranged below the silicon plate body 12, a cooling circulation pipeline 11 is arranged on the upper middle surface of the mounting frame 1, a first heat transfer pipe 6 and a third heat transfer pipe 10 are arranged on both sides of the bottom of the cooling circulation pipeline 11, and supports 5 are arranged around the bottom of the mounting frame 1.
[0024] The circulation pump 4 is fixedly contacted and connected to one side of the outside of the installation frame 1, the second heat transfer pipe 7 is connected to the circulation pump 4 through heat exchange inside one side of the installation frame 1, the first heat transfer pipe 6 is connected to the upper inner side of the circulation pump 4 through heat exchange, the heat exchanger 8 is connected to the inner side of the installation frame 1 by limiting engagement, the two sides of the heat exchanger 8 are respectively connected to the second heat transfer pipe 7 and the fourth heat transfer pipe 13 through heat exchange, one side of the cooling device 9 is connected to the outer end of the fourth heat transfer pipe 13 through heat exchange, the upper part of the cooling device 9 is connected to the third heat transfer pipe 10 through heat exchange, the limiting frame 2 is fixedly contacted and connected to the top of the installation frame 1 around the periphery, the baffle frame 3 is fixedly contacted and connected to the upper inner side of the limiting frame 2, and by setting the baffle frame 3, the silicon plate body 12 can be prevented from being separated from the inner side of the limiting frame 2, thereby improving the stability of the installation of the silicon plate body 12, and the silicon plate body 12 can be prevented from being separated from the inner side of the limiting frame 2. The plate body 12 is connected to the lower inner side of the limit frame 2 through the baffle frame 3, the cooling circulation pipe 11 is connected to the upper middle surface of the mounting frame 1 in a suspended support, the upper part of the cooling circulation pipe 11 is in contact with the lower surface of the silicon plate body 12, the bottom sides of the cooling circulation pipe 11 are respectively connected to the first heat transfer pipe 6 and the third heat transfer pipe 10 for heat exchange, the cooling circulation pipe 11 is connected to the circulation pump 4 and the cooling device 9 for heat exchange through the first heat transfer pipe 6 and the third heat transfer pipe 10, and the cooling device 9 is set to reduce the temperature of the coolant again so that it can be circulated to the silicon plate again to absorb more heat. The bottom of the mounting frame 1 is fixedly contacted with the support 5 on all sides, and the heat exchanger 8 and the cooling device 9 are both connected to the support between the support 5 and the mounting frame 1 and the plane in a suspended manner.
[0025] Working principle: The mounting frame 1 is mounted on the upper surface of the mounting frame 1 and the inner side of the limiting frame 2 to receive sunlight to the maximum extent. Through the circulating pump 4 and the heat exchanger 8, and the first transfer heat pipe 6, the second transfer heat pipe 7 and the fourth transfer heat pipe 13 connecting the two, the coolant absorbs heat from the silicon plate and flows through the heat exchanger 8, so that the heat of the coolant is transferred to another fluid, thereby realizing the recovery of waste heat.
[0026] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.
Claims
1. A silicon plate cooling mechanism with waste heat recovery, comprising: The mounting frame (1) and the heat exchanger (8) are characterized in that a circulation pump (4) is arranged on one side of the outside of the mounting frame (1), a second heat transfer pipe (7) is arranged in the middle of the inner side of the circulation pump (4), a second heat transfer pipe (7) and a fourth heat transfer pipe (13) are arranged on both sides of the heat exchanger (8), a cooling device (9) is arranged at the outer end of the fourth heat transfer pipe (13), a limiting frame (2) is arranged around the top of the mounting frame (1), a baffle frame (3) is arranged on the upper inner side of the limiting frame (2), a silicon plate body (12) is arranged on the lower inner side of the limiting frame (2), a cooling circulation pipe (11) is arranged below the silicon plate body (12), a cooling circulation pipe (11) is arranged on the upper middle surface of the mounting frame (1), a first heat transfer pipe (6) and a third heat transfer pipe (10) are arranged on both sides of the bottom of the cooling circulation pipe (11), and supports (5) are arranged around the bottom of the mounting frame (1).
2. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The circulation pump (4) is fixedly contacted with one side of the outside of the mounting frame (1), the second heat transfer pipe (7) is heat exchange-connected with the circulation pump (4) through the inside of one side of the mounting frame (1), and the first heat transfer pipe (6) is heat exchange-connected with the upper inside of the circulation pump (4).
3. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The heat exchanger (8) is connected to the inner side of the mounting frame (1) by means of a position-limiting snap-fit connection. The two sides of the heat exchanger (8) are respectively connected to the second heat transfer pipe (7) and the fourth heat transfer pipe (13) for heat exchange. One side of the cooling device (9) is connected to the outer end of the fourth heat transfer pipe (13) for heat exchange. The top of the cooling device (9) is connected to the third heat transfer pipe (10) for heat exchange.
4. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The limiting frame (2) is fixedly connected to the top of the installation frame (1) at all four sides, and the baffle frame (3) is fixedly connected to the upper inner side of the limiting frame (2).
5. The silicon plate cooling mechanism with waste heat recovery according to claim 4, characterized in that: The silicon plate body (12) is connected to the lower inner side of the limiting frame (2) through a baffle frame (3).
6. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The cooling circulation pipeline (11) is connected to the upper middle surface of the installation frame (1) in a suspended support manner, and the upper part of the cooling circulation pipeline (11) is in contact with the lower surface of the silicon plate body (12).
7. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The two sides of the bottom of the cooling circulation pipeline (11) are respectively connected to the first transfer heat pipe (6) and the third transfer heat pipe (10) for heat exchange, and the cooling circulation pipeline (11) is connected to the circulation pump (4) and the cooling device (9) for heat exchange through the first transfer heat pipe (6) and the third transfer heat pipe (10).
8. The silicon plate cooling mechanism with waste heat recovery according to claim 1, characterized in that: The bottom of the installation frame (1) is fixedly connected to the support (5) on all sides, and the heat exchanger (8) and the cooling device (9) are suspended and connected to the plane through the support (5) and the installation frame (1).