Component circular pad structure and PCB

Abstract

The embodiment of the utility model belongs to the technical field of bonding pads, and relates to a circular bonding pad structure of a component and a PCB (Printed Circuit Board). The circular bonding pad structure of the component comprises a bonding pad main body, and one side of the bonding pad main body is arranged in an arc shape. One side of the bonding pad main body adopts an arc-shaped design, the arc-shaped design can increase the contact area between the bonding pad main body and a welding pen, the welding pen needs to be in close contact with the bonding pad main body in the welding process to ensure that soldering tin can be uniformly distributed on the bonding pad main body, and the arc-shaped design can enable the welding pen to better adapt to the shape of the bonding pad main body; therefore, the contact area is increased and the welding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering pads, and more specifically, to a circular soldering pad structure of a component and a PCB board. Background Art

[0002] The pad is the basic building block of surface mount assembly, used to form the pad pattern of the circuit board, that is, a combination of pads designed for special component types. It is located at the bottom of the electronic component and attached to the circuit board. It is usually round, square or rectangular. There are many types of pads, including surface mount pads (SurfaceMountPad), through-hole pads (Thru-HolePad), etc.

[0003] For example, a Chinese patent (publication number CN219876282U) discloses a socket-compatible PCB packaging structure, wherein the socket-compatible PCB packaging structure includes a plurality of first packaging pads for connecting SMD device pins and a plurality of second packaging pads for connecting SMD device pins with sockets, wherein the first packaging pads and the second packaging pads are the same in number, the second packaging pads are distributed outside the first packaging pads, and correspond one-to-one with the first packaging pads, and there is a gap between the first packaging pads and the second packaging pads. In specific practice, the inventors found the following defects:

[0004] The sides of the pads are all set in straight lines. When employees use soldering pens, it is inconvenient to touch the solder on the pads, which leads to low welding efficiency and difficulty in ensuring the welding effect. Utility Model Content

[0005] The technical problem to be solved by the embodiment of the utility model is that the side surface of the pad is arranged in a straight line, and it is inconvenient for employees to touch the solder on the pad when using a soldering pen, which leads to low welding efficiency and difficulty in ensuring the welding effect.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A circular pad structure for a component comprises: a pad body, one side of which is arranged in an arc shape. The arc design can increase the contact area between the pad body and the soldering pen. During the welding process, the soldering pen needs to be in close contact with the pad body to ensure that the solder can be evenly distributed on the pad body. The arc design can make the soldering pen better adapt to the shape of the pad body, thereby increasing the contact area and improving the welding efficiency.

[0008] A PCB board comprises a plurality of circular pad structures of components and a PCB board body, wherein the pad body is arranged on the PCB board body.

[0009] As an improvement of the utility model, an electronic component body is welded between two adjacent pad bodies, a plurality of mounting holes are opened on the PCB board body, and the arc-shaped side of the pad body is close to the soldering foot position of the electronic component body. During welding, the employee uses a soldering pen to solder solder paste from the arc-shaped side of the pad body.

[0010] As an improvement of the utility model, a protective heat dissipation mechanism is provided on the top of the solder pad body, and the protective heat dissipation mechanism is used for protecting the electronic component body during transportation and dissipating heat during use. The protection of the electronic component body by the protective heat dissipation mechanism during transportation can reduce the situation where the electronic component body is affected by external force and falls off. During use, the protective heat dissipation mechanism can accelerate the dissipation of heat from the electronic component body to the outside, thereby achieving heat dissipation.

[0011] As an improvement of the utility model, the protective heat dissipation mechanism includes two connecting seats respectively fixedly installed on both sides of the top of the PCB board body, and threaded rods are threadedly connected in the two connecting seats. The outer surfaces of the two threaded rods are provided with connecting plates through bearing sleeves, and a protective frame is fixedly connected between the two connecting plates.

[0012] As an improvement of the utility model, a limit plate is provided on one side of the protection frame, and a plurality of protective heat conductive plates are provided between the limit plate and the protection frame. The protective heat conductive plate is rotatably arranged. When the electronic component body is protected, the protective heat conductive plate is arranged parallel to the protection frame. At this time, the protective heat conductive plate and the protection frame cooperate to cover the electronic component body to achieve protection of the electronic component body. When in use, the protective heat conductive plate is rotated to be perpendicular to the protection frame. At this time, the protective heat conductive plate is in contact with the electronic component body to improve heat dissipation.

[0013] As an improvement of the utility model, one end of the protective heat conducting plate is fixedly connected to a connecting shaft, one end of the connecting shaft is connected to the side of the protective frame through a bearing, the other end of the protective heat conducting plate is fixedly connected to a rectangular plug rod, and a rectangular slot for plugging with the rectangular plug rod is opened on the limit plate.

[0014] As an improved approach of the present invention, two connecting pieces are further provided between the limiting plate and the protection frame.

[0015] As an improved manner of the utility model, the connecting piece includes a chamber arranged in the protective frame, a connecting rod is inserted and connected in the chamber, and one end of the connecting rod passes through the chamber and is fixedly connected to the limiting plate.

[0016] As an improvement of the utility model, a spring located in the chamber is provided on the outer surface of the connecting rod, and the two ends of the spring are respectively fixedly connected to the chamber and the connecting rod. The action force of the spring can keep the limit plate in contact with the protective frame through the connecting rod, thereby improving the stability of the connection between the rectangular slot and the rectangular plug rod.

[0017] Compared with the prior art, the embodiments of the present invention mainly have the following beneficial effects:

[0018] In the present application, one side of the pad body adopts an arc design, which can increase the contact area between the pad body and the soldering pen. During the welding process, the soldering pen needs to be in close contact with the pad body to ensure that the solder can be evenly distributed on the pad body. The arc design can make the soldering pen better adapt to the shape of the pad body, thereby increasing the contact area and improving welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of the circular pad structure of the components and the PCB board provided for this application;

[0020] Figure 2 A schematic diagram of the structure of the PCB board body provided for this application;

[0021] Figure 3 A schematic diagram of the structure of the protective heat dissipation mechanism provided in this application;

[0022] Figure 4 A schematic diagram of the structure of a rectangular slot provided for this application;

[0023] Figure 5 A schematic diagram of a partial top view and cutaway structure of the protection frame provided in the present application;

[0024] Figure 6 A schematic diagram of the structure of a rectangular plug provided in this application;

[0025] Figure 7 This is a schematic diagram of the structure of the protective heat conduction plate provided in this application when conducting heat.

[0026] Indicated in the figure:

[0027] 1. Pad body;

[0028] 2. PCB board body;

[0029] 3. Electronic components body;

[0030] 4. Protective heat dissipation mechanism; 401. Connecting seat; 402. Threaded rod; 403. Connecting plate; 404. Protective frame; 405. Limiting plate; 406. Protective heat conduction plate; 407. Connecting shaft; 408. Rectangular slot; 409. Rectangular plug rod; 410. Chamber; 411. Connecting rod; 412. Spring. DETAILED DESCRIPTION

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Reference to "embodiments" herein means that specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] As described in the background art, in the prior art, the side surfaces of the pads are all arranged in straight lines, and it is inconvenient for employees to touch the solder on the pads when using soldering pens, which results in low welding efficiency and difficulty in ensuring welding effects.

[0033] In order to solve this technical problem, the utility model provides a circular solder pad structure of a component and a PCB board, which are applied to provide a circular solder pad structure of a component and a PCB board that are easier to solder.

[0034] Specifically, please refer to Figure 1 , the circular pad structure of components and PCB board specifically include:

[0035] The pad body 1 has one side that is arc-shaped.

[0036] The utility model provides a circular soldering pad structure for components and a PCB board. In the present application, one side of the soldering pad body 1 adopts an arc design. The arc design can increase the contact area between the soldering pad body 1 and the soldering pen. During the welding process, the soldering pen needs to be in close contact with the soldering pad body 1 to ensure that the solder can be evenly distributed on the soldering pad body 1. The arc design can enable the soldering pen to better adapt to the shape of the soldering pad body 1, thereby increasing the contact area and improving the welding efficiency.

[0037] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] Embodiment 1 of the circular pad structure of the utility model component

[0041] Please refer to Figure 1 The circular soldering pad structure of the component of the utility model includes: a soldering pad body 1, one side of the soldering pad body 1 is arranged in an arc shape, and one side of the soldering pad body 1 in the present application adopts an arc design, and the arc design can increase the contact area between the soldering pad body 1 and the soldering pen. During the welding process, the soldering pen needs to be in close contact with the soldering pad body 1 to ensure that the solder can be evenly distributed on the soldering pad body 1. The arc design can make the soldering pen better adapt to the shape of the soldering pad body 1, thereby increasing the contact area and improving the welding efficiency; during the welding process, the soldering pen needs to overcome a certain resistance to apply the solder to the soldering pad body 1. If the side of the soldering pad body 1 adopts a straight line design, the soldering pen needs to use more force to apply the solder to the soldering pad body 1, which may result in poor welding effect or damage to the components, and the arc design can reduce the resistance during welding, so that employees can apply the solder to the soldering pad body 1 more easily.

[0042] Embodiment 2 of the PCB board of the utility model

[0043] Please refer to Figure 2 The utility model comprises: a plurality of circular pad structures of components, and a PCB body 2 , on which a pad body 1 is arranged.

[0044] Further, such as Figure 1 As shown, an electronic component body 3 is welded between two adjacent pad bodies 1, a plurality of mounting holes are opened on the PCB board body 2, and the arc-shaped side of the pad body 1 is close to the solder foot position of the electronic component body 3. During welding, the employee uses a soldering pen to weld solder paste from the arc-shaped side of the pad body 1.

[0045] Embodiment 3 of the PCB board of the utility model

[0046] Please refer to Figure 3-Figure 7Furthermore, the PCB board of the utility model is provided with a protective heat dissipation mechanism 4 on the top of the pad body 1. The protective heat dissipation mechanism 4 is used for protecting the electronic component body 3 during transportation and dissipating heat during use. The protection of the electronic component body 3 by the protective heat dissipation mechanism 4 during transportation can reduce the situation where the electronic component body 3 is affected by external force and falls off. During use, the protective heat dissipation mechanism 4 can accelerate the heat dissipation of the electronic component body 3 to the outside, thereby achieving heat dissipation.

[0047] Further, such as Figure 3-Figure 4 As shown, the protective heat dissipation mechanism 4 includes two connecting seats 401 respectively fixedly installed on both sides of the top of the PCB board body 2, and the two connecting seats 401 are threadedly connected with threaded rods 402. The outer surfaces of the two threaded rods 402 are provided with connecting plates 403 through bearing sleeves, and a protective frame 404 is fixedly connected between the two connecting plates 403. By rotating the threaded rods 402, the connecting plates 403 and the protective frame 404 can be driven to rise and fall.

[0048] Further, such as Figure 3-Figure 4 As shown, a limiting plate 405 is provided on one side of the protection frame 404, and a plurality of protective heat conductive plates 406 are provided between the limiting plate 405 and the protection frame 404. The protective heat conductive plate 406 is rotatably provided. When the electronic component body 3 is protected, the protective heat conductive plate 406 is provided in parallel with the protection frame 404. At this time, the protective heat conductive plate 406 cooperates with the protection frame 404 to cover the electronic component body 3 to achieve protection of the electronic component body 3. When in use, the protective heat conductive plate 406 is rotated to be perpendicular to the protection frame 404. At this time, the protective heat conductive plate 406 is in contact with the electronic component body 3 to improve heat dissipation.

[0049] Further, such as Figure 4 and Figure 6 As shown, one end of the protective heat conductive plate 406 is fixedly connected to a connecting shaft 407, and one end of the connecting shaft 407 is connected to the side of the protective frame 404 through a bearing, and the other end of the protective heat conductive plate 406 is fixedly connected to a rectangular plug rod 409, and a rectangular slot 408 is provided on the limiting plate 405 to be plugged into the rectangular plug rod 409. The protective heat conductive plate 406 can be limited by plugging the rectangular plug rod 409 into the rectangular slot 408. When the rectangular slot 408 is separated from the rectangular plug rod 409, the protective heat conductive plate 406 can rotate around the connecting shaft 407 to achieve adjustment of the protective heat conductive plate 406. The protective heat conductive plate 406 is made of heat-conducting materials in the prior art, such as alumina ceramics; alumina ceramics is a ceramic material with alumina as the main body, and alumina ceramics have good conductivity, mechanical strength and high temperature resistance. Among them, the more alumina content, the more the inherent characteristics of alumina can be exerted, and the better the performance.

[0050] Further, such as Figure 4-Figure 5 As shown, two connecting members are further provided between the limiting plate 405 and the protection frame 404 , and the connecting members are used to connect the limiting plate 405 and the protection frame 404 together.

[0051] Further, such as Figure 5 As shown, the connecting member includes a chamber 410 arranged in the protective frame 404, and a connecting rod 411 is inserted into the chamber 410. One end of the connecting rod 411 passes through the chamber 410 and is fixedly connected to the limit plate 405. The limit plate 405 and the protective frame 404 can be connected together through the connecting rod 411.

[0052] Further, such as Figure 5 As shown, the outer surface of the connecting rod 411 is provided with a spring 412 located in the chamber 410, and the two ends of the spring 412 are fixedly connected to the chamber 410 and the connecting rod 411 respectively. The force of the spring 412 can enable the limit plate 405 to maintain contact with the protective frame 404 through the connecting rod 411, thereby improving the stability of the connection between the rectangular slot 408 and the rectangular insertion rod 409.

[0053] During transportation, if Figure 3 As shown, at this time, the protective frame 404, the limiting plate 405 and the protective heat conducting plate 406 cooperate with each other to cover the electronic component body 3, so as to protect the electronic component body 3 and reduce the situation where the electronic component body 3 is affected by external force during transportation and falls off. When in use, the protective heat dissipation mechanism 4 has the shape of Figure 3 Switch to Figure 7 Specifically, firstly, the threaded rod 402 is rotated to make the connecting plate 403 and the protective frame 404 rise, and then the limiting plate 405 is pulled in the direction away from the protective frame 404 to make the limiting plate 405 away from the protective frame 404, at this time, the rectangular slot 408 is separated from the rectangular plug rod 409, and the protective heat conductive plate 406 is rotated to stand upright around the connecting shaft 407, and then the limiting plate 405 is loosened to make the rectangular slot 408 and the rectangular plug rod 409 plugged together, and the threaded rod 402 is rotated in the opposite direction to make the connecting plate 403 drive the protective frame 404 to descend, so that the protective heat conductive plate 406 is in contact with the electronic component body 3, and at this time, the heat generated by the electronic component body 3 can be transferred to the outside through the protective heat conductive plate 406 to achieve heat dissipation;

[0054] The protective heat dissipation mechanism 4 has the following form: Figure 7 Switch to Figure 3404, and the protective frame 404 is lowered. Then, the threaded rod 402 is rotated to make the connecting plate 403 and the protective frame 404 rise, and then the limit plate 405 is pulled away from the protective frame 404. At this time, the rectangular slot 408 is separated from the rectangular plug rod 409, and the protective heat conducting plate 406 is rotated to a horizontal level with the connecting shaft 407 as the center, and then the limit plate 405 is loosened to make the rectangular slot 408 and the rectangular plug rod 409 plugged together, and the threaded rod 402 is rotated in the opposite direction to make the connecting plate 403 drive the protective frame 404 to descend.

[0055] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A PCB board, comprising a plurality of circular pad structures of components, wherein the circular pad structures of components include: A pad body (1), one side of the pad body (1) being arranged in an arc shape, characterized in that it also comprises a PCB board body (2), the pad body (1) being arranged on the PCB board body (2); An electronic component body (3) is welded between two adjacent pad bodies (1), and a plurality of mounting holes are provided on the PCB board body (2); A protective heat dissipation mechanism (4) is provided on the top of the pad body (1), and the protective heat dissipation mechanism (4) is used for protecting the electronic component body (3) during transportation and dissipating heat during use; The protective heat dissipation mechanism (4) comprises two connection seats (401) respectively fixedly mounted on both sides of the top of the PCB board body (2), the two connection seats (401) are both threadedly connected with a threaded rod (402), the outer surfaces of the two threaded rods (402) are both provided with a connection plate (403) via a bearing sleeve, and a protective frame (404) is fixedly connected between the two connection plates (403); A limiting plate (405) is provided on one side of the protection frame (404), and a plurality of protective heat-conducting plates (406) are provided between the limiting plate (405) and the protection frame (404); One end of the protective heat conducting plate (406) is fixedly connected to a connecting shaft (407), one end of the connecting shaft (407) is connected to the side of the protective frame (404) via a bearing, the other end of the protective heat conducting plate (406) is fixedly connected to a rectangular plug rod (409), and the limiting plate (405) is provided with a rectangular slot (408) plugged into the rectangular plug rod (409).

2. The PCB board according to claim 1, characterized in that: Two connecting pieces are also provided between the limiting plate (405) and the protection frame (404).

3. The PCB board according to claim 2, characterized in that: The connecting member comprises a chamber (410) arranged in the protective frame (404), a connecting rod (411) is inserted into the chamber (410), and one end of the connecting rod (411) passes through the chamber (410) and is fixedly connected to the limiting plate (405).

4. The PCB board according to claim 3, characterized in that: The outer surface of the connecting rod (411) is provided with a spring (412) located in the chamber (410), and two ends of the spring (412) are respectively fixedly connected to the chamber (410) and the connecting rod (411).

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