Electrophoresis barrel plating device
By setting up a shelving platform and a leakage network in the electroplating box, the problem of the inability to effectively deal with multi-layer batch and model parts in the prior art is solved, and efficient electroplating treatment is achieved.
Patent Information
- Application Number
- CN202420822651.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-04-19
AI Technical Summary
Existing roller plating equipment cannot effectively perform multi-layer batch and model electroplating treatment, resulting in limited electroplating efficiency.
An electrophoretic roller plating device is designed, using a shelving platform and leakage network in the electroplating box, allowing components of different sizes to be electroplating at different locations, and the flow and collection of the plating solution is realized through the bottom collection tank and square hole.
The electroplating of parts of different sizes is realized in the same batch, which improves the electroplating efficiency and meets the electroplating needs of multi-layer batch and model.
Smart Images

Figure CN222362172U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to electrophoresis equipment, in particular to an electrophoresis roller plating device. Background Art
[0002] Roll plating requires the use of drum electroplating, which is a plating method in which a certain number of small parts are placed in a special plating box, and various metal or alloy coatings are deposited on the surface of the parts in an indirect conductive manner under the action of the plating solution to achieve surface protection, decoration and various functional purposes. This allows the parts to be placed in the plating solution pool for electroplating using the plating box.
[0003] CN202220971954.7An anti-deviation wire roll plating device, the utility model discloses an anti-deviation wire roll plating device, comprising: a roll plating machine, a control box and a roll plating rack, one side of the roll plating machine is equipped with a control box; the top surfaces of both sides of the roll plating machine are also vertically connected with two support rods, the two support rods are fixedly connected by a fixing rod, a motor is installed on the top of the fixing rod, the output end of the motor passes through the inside of the fixing rod and is connected to the screw rod, a hanger is also connected between the two support rods, the two ends of the hanger are connected with sliders, and a roll plating rack is also hung on the hanger. The anti-deviation wire roll plating device hangs the roll plating rack on the hanger.
[0004] In the prior art, the motor, screw, bearing and bracket cooperate with each other so that the bracket can slide up and down between the support rods, and can drive the roller plating rack to move up and down inside the roller plating machine, thereby replacing the existing method of relying on external tools for lifting, so as to achieve the purpose of convenient operation. However, the electroplating equipment cannot perform electroplating of parts in multiple layers, batches and models, and the efficiency of the electroplating process is affected. Utility Model Content
[0005] In order to overcome the deficiencies of the prior art, the utility model provides an electrophoresis roller plating device.
[0006] The utility model is implemented by the following technical scheme: an electrophoretic roller plating device, provided with a plating component, a top connecting component is arranged on the plating component, the top connecting component is a connecting assembly table, a round hole is arranged on the connecting assembly table, an assembling round rod is arranged in the round hole, a lifting groove is arranged on the assembling round rod, a connecting plate is arranged on the connecting assembly table, the plating component is assembled on the connecting plate, the plating component is an plating box, a plurality of leakage holes are arranged on the plating box, a shelving platform is arranged inside the plating box, and a layered processing component is arranged on the shelving platform.
[0007] The placing platform is divided into a left platform and a right platform, and the left platform and the right platform are respectively welded on the inner wall of the electroplating box.
[0008] The left platform and the right platform are provided with a placing platform, the placing platform adopts an electroplating platform with a seepage net, and placing heads are provided on both sides of the electroplating platform.
[0009] The leakage net arranged on the shelf platform adopts square leakage holes, and the square leakage holes are symmetrically distributed on the shelf platform.
[0010] The bottom of the electroplating box is provided with a bottom plate, a bottom collecting groove is provided on the bottom plate, and square holes are provided on both sides of the bottom collecting groove.
[0011] Compared with the prior art, the utility model can place parts that need to be electroplated in an electroplating box when in use, and use the electroplating box to hold the parts. At the same time, a shelf platform is provided in the electroplating box, and parts of different sizes can be placed on the shelf platforms at different positions for electroplating of the parts. Parts of different sizes can be electroplated in the same batch, which meets the needs of electroplating of parts and further improves the electroplating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the structure of the utility model;
[0013] Figure 2 It is a three-dimensional diagram of the utility model;
[0014] Figure 3 It is a three-dimensional diagram of the utility model;
[0015] Figure 4 It is a cross-sectional view of the utility model;
[0016] In the figure: 1 is a connecting assembly table, 2 is an assembly round rod, 3 is a lifting groove, 4 is a connecting plate, 5 is an electroplating box, 51 is a shelf platform, 52 is a shelf head, 53 is a leakage net, 54 is an electroplating platform, 6 is a leakage hole, 61 is a bottom collecting groove, and 62 is a square hole. DETAILED DESCRIPTION
[0017] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.
[0018] An electrophoretic roller plating device is provided with a plating component, on which a top connecting component is provided, the top connecting component is a connecting assembly table 1, a round hole is provided on the connecting assembly table 1, an assembling round rod 2 is provided in the round hole, a lifting groove 3 is provided on the assembling round rod 2, a connecting plate 4 is provided on the connecting assembly table, the plating component is assembled on the connecting plate 4, the plating component is a plating box 5, a plurality of leakage holes 6 are provided on the plating box 5, a shelf platform 51 is provided inside the plating box 5, and a layered processing component is provided on the shelf platform 51.
[0019] When electroplating treatment is required, the electroplated parts can be placed on the shelf platform 51, and then a layer of parts is placed on the shelf platform 51, and then the upper layer is used to shelf parts. The shelf platform 51 is divided into a left platform and a right platform. The left platform and the right platform are respectively welded on the inner wall of the electroplating box 5. The shelf platform 51 is arranged on the left platform and the right platform. The shelf platform 51 adopts an electroplating platform 54 with a leakage net, and shelf heads 52 are arranged on both sides of the electroplating platform 54. In this way, the shelf platform is used to shelf and process parts, which meets the needs of electroplating treatment of parts of different sizes.
[0020] The leakage net 53 arranged on the shelf platform 51 adopts square leakage holes, and the square leakage holes are symmetrically distributed on the shelf platform 51. The square leakage holes can be used to make the plating liquid flow up and down, so that the parts can be electroplated as a whole. At the same time, a bottom plate 6 is arranged at the bottom of the electroplating box 5, and a bottom collecting groove 61 is arranged on the bottom plate 6. Square holes 62 are arranged on both sides of the bottom collecting groove 61. The bottom collecting groove 61 can collect the plating liquid and then flow out of the bottom of the electroplating box 5 from the square holes 62.
[0021] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.
Claims
1. An electrophoretic barrel plating device, provided with an electroplating component, a top connecting component is provided on the electroplating component, the top connecting component is a connecting assembly platform, a round hole is provided on the connecting assembly platform, an assembly round rod is provided in the round hole, a lifting groove is provided on the assembly round rod, a connecting plate is provided on the connecting assembly platform, and the electroplating component is assembled on the connecting plate, characterized in that: The electroplating component is an electroplating box, a plurality of leakage holes are arranged on the electroplating box, a placing platform is arranged inside the electroplating box, and a layered processing component is arranged on the placing platform.
2. The electrophoretic barrel plating device according to claim 1, characterized in that: The placing platform is divided into a left platform and a right platform, and the left platform and the right platform are respectively welded on the inner wall of the electroplating box.
3. The electrophoretic barrel plating device according to claim 2, characterized in that: The left platform and the right platform are provided with a placing platform, the placing platform adopts an electroplating platform with a seepage net, and placing heads are provided on both sides of the electroplating platform.
4. The electrophoretic barrel plating device according to claim 3, characterized in that: The leakage net arranged on the shelf platform adopts square leakage holes, and the square leakage holes are symmetrically distributed on the shelf platform.
5. The electrophoretic barrel plating device according to claim 1, characterized in that: The bottom of the electroplating box is provided with a bottom plate, a bottom collecting groove is provided on the bottom plate, and square holes are provided on both sides of the bottom collecting groove.
Citation Information
Patent Citations
Anti-deviation line barrel plating equipment
CN217203044U