Air purifier and photocuring 3D printer

Abstract

The utility model provides an air purifier and a photocuring 3D printer, the air purifier comprises a purification area, the purification area comprises an air inlet, an air outlet and a semiconductor refrigeration part arranged between the air inlet and the air outlet, and the purification area is filled with an adsorption part; the atomization area is communicated with the purification area so as to generate water mist to infiltrate the adsorption part; wherein gas enters the purification area from the gas inlet, is adsorbed and cooled by the adsorption piece, and is discharged from the gas outlet. The semiconductor refrigeration part is provided with a refrigeration end and a heating end, the air inlet is arranged close to the heating end, and the air outlet is arranged close to the refrigeration end, so that air enters the purification area after being heated from the air inlet, and is discharged after being cooled by the air outlet; according to the invention, unreacted gas or other volatile organic compounds in gas can be effectively purified, and gas which is not fully filtered is prevented from being discharged.

Description

Technical Field

[0001] The present application belongs to the field of 3D printing technology, and specifically relates to an air purifier and a light-curing 3D printer. Background Art

[0002] Photocuring 3D printers generally use a light source in a specific wavelength range to irradiate liquid photocurable resin and trigger a photochemical reaction, so that the photocurable resin in the area irradiated by the light source is solidified from the liquid state, and the object to be formed can be obtained after curing layer by layer. Since liquid photocurable resin has a certain volatility, it will produce a strong odor during use and release some gases that are harmful to the human body. Therefore, long-term use will cause environmental pollution and may affect human health.

[0003] The existing light-curing 3D printers generally release harmful gases directly into the air, or filter the gases generated during the printing process by setting up a single adsorption filter device. However, the harmful substances in the gas cannot be completely filtered out, and they will still cause harm when discharged into the atmosphere. Moreover, the unreacted gases or other volatile organic compounds in the gas cannot be effectively purified. Utility Model Content

[0004] The present application provides an air purifier and a light-curing 3D printer to solve the problem of how to effectively purify unreacted gas or other volatile organic compounds in the gas and avoid the discharge of insufficiently filtered gas.

[0005] In order to solve the above technical problems, the present application provides an air purifier, comprising:

[0006] A purification area, the purification area comprising an air inlet, an air outlet, and a semiconductor refrigeration element disposed between the air inlet and the air outlet, and the purification area is filled with an adsorption element;

[0007] an atomization zone, the atomization zone being in communication with the purification zone to generate water mist to infiltrate the adsorbent;

[0008] The gas enters the purification zone from the gas inlet, is adsorbed and cooled by the adsorbent, and is discharged from the gas outlet.

[0009] As a further improvement of the present application, the semiconductor refrigeration element is provided with a cooling end and a heating end, the air inlet is arranged close to the heating end, and the air outlet is arranged close to the cooling end, so that the gas enters the purification area after being heated from the air inlet, and is discharged after being cooled through the air outlet.

[0010] As a further improvement of the present application, the purification zone is provided with an air inlet chamber, an air outlet chamber, and an adsorption chamber communicating with the air inlet chamber and the air outlet chamber;

[0011] The air inlet is arranged on the air inlet chamber, the air outlet is arranged on the air outlet chamber, and the semiconductor refrigeration element is arranged across the air inlet chamber and the air outlet chamber to isolate the air inlet and the air outlet; the adsorption chamber is connected to the atomization area, and the adsorption element is filled in the adsorption chamber.

[0012] As a further improvement of the present application, a partition is provided in the adsorption chamber, one end of the partition is connected to the semiconductor refrigeration element, and the other end of the partition is arranged close to the atomization area and a first gap is provided between the partition and the atomization area.

[0013] As a further improvement of the present application, an air intake baffle is provided on one side of the adsorption chamber close to the air intake chamber, and the air intake baffle is extended in a direction close to the partition and a second gap is provided between the air intake baffle and the partition, so that the gas enters the adsorption chamber through the second gap between the air intake baffle and the partition after being heated by the air intake chamber.

[0014] As a further improvement of the present application, an air outlet baffle is provided on one side of the adsorption chamber close to the air outlet chamber, and the air outlet baffle is extended in a direction close to the partition and a third gap is provided between the air outlet baffle and the partition, so that the gas adsorbed and cooled by the adsorption chamber enters the air outlet chamber for cooling through the third gap between the air outlet baffle and the partition.

[0015] As a further improvement of the present application, a side of the partition plate close to the air outlet baffle is configured as a curved surface, and a height of the curved surface gradually increases in a direction close to the air outlet baffle.

[0016] As a further improvement of the present application, the atomization area includes an atomization chamber for accommodating liquid, and an atomization element for atomizing the liquid;

[0017] The atomizing element is disposed between the atomizing chamber and the purification zone to atomize the liquid in the atomizing chamber and generate water mist to wet the adsorption element.

[0018] As a further improvement of the present application, a support baffle is provided on one side of the atomization area close to the purification area, and a plurality of accommodating holes for accommodating the atomization element are provided on the support baffle. The number of the atomization elements is configured to be several, and a plurality of the atomization elements are arranged in the corresponding accommodating holes to atomize the gas in the atomization chamber and then infiltrate the adsorption element.

[0019] The present application also provides a photocuring 3D printer, comprising any of the above-mentioned air purifiers, wherein the air purifier is connected to the exhaust port of the photocuring 3D printer, so that the gas exhausted by the photocuring 3D printer enters the purification area through the air inlet, and is discharged from the air outlet after being adsorbed and cooled by the adsorbent.

[0020] Compared with the prior art, the air purifier and the light-curing 3D printer provided in the embodiments of the present application include a purification area and an atomization area connected to the purification area. The purification area is filled with an adsorbent for adsorbing gas. Water mist is generated in the atomization area to wet the adsorbent. When the gas enters the purification area, it will be adsorbed and cooled by the moistened adsorbent, and discharged from the air outlet after purification, thereby achieving purification of the exhaust gas. The heating and cooling effect of the semiconductor refrigeration element is utilized to accelerate the release of unreacted gas or other volatile organic compounds in the gas, thereby improving the adsorption effect of the adsorbent. When the gas after adsorption and cooling is transmitted to the air outlet, some residual volatile components in the gas are condensed or adsorbed on the semiconductor refrigeration element due to the decrease in temperature, thereby further reducing the odor in the exhaust gas. The adsorption and purification effect is good, and it has a strong wide range of applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a schematic diagram of the structure of an air purifier provided in an embodiment of the present application;

[0023] Figure 2 is an exploded view of an air purifier provided in an embodiment of the present application;

[0024] Figure 3 is a top view of an air purifier provided in an embodiment of the present application;

[0025] Figure 4 yes Figure 3 A cross-sectional view of the air purifier along AA is shown;

[0026] Figure 5 It is a schematic diagram of the structure of the purification area in the air purifier provided in the embodiment of the present application;

[0027] Figure 6 It is a structural schematic diagram of a partition in an air purifier provided in an embodiment of the present application;

[0028] Figure 7 It is a structural schematic diagram of the atomization area in the air purifier provided in an embodiment of the present application;

[0029] Figure 8 is a schematic structural diagram of a light-curing 3D printer provided in an embodiment of the present application;

[0030] Description of reference numerals:

[0031] 10-purification area; 11-air inlet chamber; 111-air inlet; 12-air outlet chamber; 121-air outlet; 122-push plate; 13-semiconductor refrigeration element; 131-cooling end; 132-heating end; 14-adsorption chamber; 141-partition plate; 142-air inlet baffle; 143-air outlet baffle;

[0032] 20-atomization area; 21-atomization chamber; 22-support baffle; 23-accommodation hole; 24-bottom plate; 25-first gap; 26-second gap; 27-third gap;

[0033] 30-Light-curing 3D printer. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically limited. All directional indications in the embodiments of the present application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions.

[0036] In order to make the description of the disclosed content more detailed and complete, the following is an illustrative description of the implementation methods and specific embodiments of the present application; however, this is not the only form of implementing or using the specific embodiments of the present application. The implementation methods cover the features of multiple specific embodiments and the method steps and sequences used to construct and operate these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences.

[0037] Please refer to Figure 1-Figure 8In order to solve the problem of how to effectively purify unreacted gas or other volatile organic compounds in the gas and avoid the exhaust of unfiltered gas, the embodiment of the present application provides an air purifier and a light-curing 3D printer. Please refer to Figure 1 , is a schematic diagram of the structure of an air purifier provided in an embodiment of the present application, wherein the air purifier includes a purification area 10 and an atomization area 20 connected to the purification area 10.

[0038] As an optional implementation, please refer to Figure 2 , which is an exploded view of the air purifier provided in an embodiment of the present application. It can be observed that the purification area 10 includes an air inlet 111, an air outlet 121 and a semiconductor refrigeration element 13 arranged between the air inlet 111 and the air outlet 121. The present application fills the purification area 10 with an adsorbent to adsorb the gas entering the purification area 10. The atomization area 20 is used to generate water mist to infiltrate the adsorbent, so that the adsorbent can cool the incoming hot air while adsorbing the odor in the gas, so that the cooled gas is discharged from the air outlet 121, thereby completing the purification of the gas.

[0039] In an embodiment of the present application, the adsorbent can be set to a material with hydrophobic, water-conducting and breathable properties, such as setting the adsorbent to a sponge, filling the sponge in the purification area 10, and soaking the sponge with water mist generated in the atomization area 20, so that the hot air entering the purification area 10 is cooled in the sponge and the odor is adsorbed onto the sponge. Of course, it is also feasible to set the adsorbent to other optional materials with hydrophobic, water-conducting and breathable properties, or to set the adsorbent in the form of a water curtain. The present application does not further limit the specific setting form of the adsorbent.

[0040] For further information, please refer to Figure 3 and Figure 4 ,in Figure 3 A top view of an air purifier provided in an embodiment of the present application, Figure 4 for Figure 3 The air purifier shown is a cross-sectional view along AA; the semiconductor refrigeration element 13 is provided with a cooling end 131 and a heating end 132. The present application sets the air inlet 111 close to the heating end 132, heats the gas entering the air inlet 111, and heats the gas before entering the purification area 10. By heating the gas, the release of unreacted gas or other volatile organic compounds in the gas can be accelerated, so that the unvolatile gas in the gas can be further released under the action of heating at the heating end 132.

[0041] Furthermore, after the gas is heated, it will be transmitted to the area where the adsorbent is located. Since the adsorbent is made of a material with hydrophobic, water-conducting and breathable properties, and the water mist generated in the atomization area 20 soaks the adsorbent, the adsorbent and the liquid soaked in the adsorbent can absorb the odor in the gas, and can also cool the gas while absorbing the odor. After the adsorption is completed, the gas will be transmitted to the outlet 121.

[0042] The present application sets the gas outlet 121 close to the cooling end 131. When the gas after adsorption and cooling is transmitted to the gas outlet 121, during the cooling process, some volatile components remaining in the gas may condense or adsorb on the cooling end 131 of the semiconductor refrigeration element 13 due to the decrease in temperature, thereby reducing the odor in the exhaust gas.

[0043] In a specific embodiment provided in the present application, the semiconductor refrigeration element 13 is preferably set in the form of a semiconductor refrigeration sheet, and the refrigeration technology realized by the Peltier effect of semiconductor materials is used. The main components of the semiconductor refrigeration sheet are two different types (N-type and P-type) of semiconductor materials connected to each other by metal wires to form multiple thermocouples. The multiple thermocouples are arranged between two ceramic plates. When current passes through these thermocouples, one end will absorb heat and become cold, and the other end will release heat and become hot. By controlling the direction of the current, it is possible to change which side is the cold end or the hot end to achieve the effect of cooling or heating.

[0044] The present application uses a semiconductor refrigeration plate having the characteristics of a cooling end 131 and a heating end 132, and arranges it between the air inlet 111 and the air outlet 121, so that the gas entering the air purifier is transmitted in the order of the air inlet 111, the heating end 132, the adsorbent, the cooling end 131, and the air outlet 121, thereby achieving purification of the gas.

[0045] Please continue to refer to Figure 4 In order to better fill the adsorption component, the semiconductor refrigeration component 13 is separated from the adsorption component to avoid the heating end 132 of the semiconductor refrigeration component 13 affecting the adsorption cooling effect of the adsorption component. The present application divides the purification area 10 into an air inlet chamber 11, an air outlet chamber 12 and an adsorption chamber 14 connecting the above-mentioned air inlet chamber 11 and the air outlet chamber 12.

[0046] As an optional embodiment, the present application arranges the semiconductor refrigeration element 13 across the air inlet chamber 11 and the air outlet chamber 12 to separate the air inlet chamber 11 and the air outlet chamber 12 to prevent the gas from directly entering the air outlet chamber 12 from the air inlet chamber 11 and dispersing without purification to cause harm. The adsorption element is filled in the adsorption chamber 14, and the adsorption chamber 14 is arranged to be connected with the above-mentioned air inlet chamber 11 and the air outlet chamber 12 respectively, so that the gas entering the air purifier must be transmitted in the order of the air inlet chamber 11, the adsorption chamber 14 and the air outlet chamber 12.

[0047] Specifically, the present application arranges the air inlet 111 on the air inlet chamber 11, and correspondingly arranges the air outlet 121 on the air outlet chamber 12, and arranges the semiconductor refrigeration component 13 across the air inlet chamber 11 and the air outlet chamber 12 to isolate the air inlet chamber 11 and the air outlet chamber 12, fills the adsorption component in the adsorption chamber 14, and connects the adsorption chamber 14 with the atomization area 20, so as to generate atomized gas to infiltrate the adsorption component, and adsorbs and cools the gas entering the adsorption chamber 14 through the adsorption component.

[0048] The present application arranges a semiconductor refrigeration element 13 between the air inlet chamber 11 and the air outlet chamber 12, and connects the adsorption chamber 14 with the air inlet chamber 11 and the air outlet chamber 12, thereby extending the contact distance between the gas and the adsorption element in the air purifier and improving the purification effect of the gas.

[0049] As an optional implementation, in order to further extend the contact distance between the gas and the adsorbent, please continue to refer to Figure 4 In the present application, a partition 141 is provided in the adsorption chamber 14, one end of the partition 141 is connected to the semiconductor refrigeration element 13, and the other end of the partition 141 is arranged close to the atomization area 20, so that a first gap 25 is reserved between the other end of the partition 141 and the atomization area 20. Figure 4 Taking the example shown, the adsorption chamber 14 is divided into a first chamber and a second chamber by a partition 141. At this time, the gas entering the adsorption chamber 14 from the air inlet chamber 11 needs to first enter the first chamber for adsorption cooling, and then pass through the first gap 25 to enter the second chamber for adsorption cooling. The original adsorption distance of the adsorption chamber 14 is extended to the adsorption distance of the first chamber and the second chamber by the setting of the partition 141. Of course, if the cost permits, the partition 141 can continue to be added in the adsorption chamber 14 to extend the contact distance between the gas and the adsorbent in the air purifier, thereby improving the purification effect of the gas.

[0050] For further information, please refer to Figure 5 , is a structural schematic diagram of the purification zone 10 in the air purifier provided in an embodiment of the present application. In the present application, an air intake baffle 142 is arranged on a side close to the air intake chamber 11. The air intake baffle 142 is preferably arranged at a connecting position between the air intake chamber 11 and the adsorption chamber 14. The air intake baffle 142 is extended in a direction close to the partition 141 and a second gap 26 is provided between the baffle 141, so that the gas enters the adsorption chamber 14 through the second gap 26 between the air intake baffle 142 and the partition 141.

[0051] Since the gas entering the air inlet chamber 11 can be heated by the heating end 132 of the semiconductor refrigeration component 13, the gas will be further compressed when passing through the second gap 26 and entering the adsorption chamber 14. Since the molecules in the gas are forced to be closer during the compression process, the collisions between the molecules in the gas will become more frequent, thereby further increasing the gas temperature, accelerating the release of unreacted gas or other volatile organic compounds in the gas, and further releasing the unvolatile gas in the gas under the heating action of the heating end 132.

[0052] As an optional embodiment, the present application provides an outlet baffle 143 on a side close to the outlet chamber 12. The outlet baffle 143 is preferably arranged at the connecting position between the adsorption chamber 14 and the outlet chamber 12. The outlet baffle 143 is also extended in a direction close to the partition 141 and a third gap 27 is provided between the baffle 141, so that the gas filtered and cooled in the second area of ​​the adsorption chamber 14 enters the outlet chamber 12 through the third gap 27 for cooling.

[0053] The present application sets an outlet baffle 143 at the connecting position between the adsorption chamber 14 and the outlet chamber 12, so as to compress the gas in the adsorption chamber 14 after adsorption and cooling. According to the adiabatic compression effect in the ideal gas law, when the gas is compressed again, the gas temperature will increase. At this time, the gas entering the outlet chamber 12 will have its temperature reduced under the action of the cooling end 131 of the semiconductor refrigeration element 13. During the re-cooling process, some volatile components in the gas may condense or be adsorbed on the cold surface due to the temperature reduction, thereby reducing the odor.

[0054] Please refer to further Figure 2 It can be observed that the present application sets the air inlet 111 as a tubular structure with a larger diameter, which can absorb the exhausted gas in time, and when setting the air outlet 121, it is set in the form of an air outlet grid, so that the purified gas can be dispersed from the air outlet grid, so that the refrigeration end 131 can further cool the gas, extend the cooling time, and further reduce the odor in the gas.

[0055] Preferably, a push plate 122 that can be pushed open can be provided on the air outlet chamber 12, and the air outlet grid can be provided on the push plate 122. By pushing open the push plate 122, the semiconductor refrigeration component 13 can be replaced and maintained, the volatile components adsorbed on the semiconductor refrigeration plate can be cleaned, and the adsorption component in the adsorption chamber 14 can be replaced regularly to avoid mold caused by use in a closed structure and affect the purification effect.

[0056] In the embodiment of the present application, the gas entering the air purifier needs to enter the air inlet chamber 11 from the air inlet 111, enter the first area of ​​the adsorption chamber 14 through the second gap 26 after heating, and then enter the second area of ​​the adsorption chamber 14 through the first gap 25, and then enter the air outlet chamber 12 after passing through the third gap 27 for cooling, and then disperse from the air outlet 121 set in the air outlet chamber 12, thereby achieving purification of the gas.

[0057] Preferably, please refer to Figure 6 , is a structural schematic diagram of the partition 141 in the air purifier provided in an embodiment of the present application. In the present application, the side of the partition 141 close to the air outlet baffle 143 is set as an arc surface. It can be observed that the height of the arc surface gradually decreases along the direction close to the atomization area 20. In other words, the height of the arc surface gradually increases along the side close to the air outlet baffle 143 until it extends to the position of the air outlet baffle 143, forming a third gap 27 between the air outlet baffle 143; the present application further compresses the gas entering the air outlet chamber 12 in cooperation with the third gap 27 by setting a arc surface with a height gradually increasing along the direction of the air outlet baffle 143, so as to increase its temperature so that purification can be completed to a greater extent in the air outlet chamber 12.

[0058] Furthermore, the air intake baffle 142 provided in the present application is also preferably arranged in an arc shape on the side close to the partition 141, and the height of the arc surface of the air intake baffle 142 gradually increases in the direction close to the air intake chamber 11 until it extends to the connecting position between the air intake chamber 11 and the adsorption chamber 14, so as to compress the gas entering the adsorption chamber 14.

[0059] Of course, the air inlet baffle 143 may also be configured as an arc-shaped structure, and the arc surface height of the air inlet baffle 143 may be gradually increased in the direction approaching the air outlet chamber 12 until it extends to the communication position between the adsorption chamber 14 and the air outlet chamber 12 .

[0060] It is understandable that it is also feasible to set the above-mentioned partition 141, the above-mentioned air intake baffle 142 and the above-mentioned air intake baffle 143 as an inclined structure, as long as it can cooperate with the first gap 25, the second gap 26 and the third gap 27 to achieve gas compression, which is feasible and technical personnel in this field should know.

[0061] As an optional implementation, please refer to Figure 7 , is a schematic diagram of the structure of the atomization area 20 in the air purifier provided in the embodiment of the present application. The atomization area 20 provided in the present application includes an atomization chamber 21 for accommodating liquid and an atomization element for atomizing gas. It can be observed that the atomization element is arranged between the atomization chamber 21 and the purification area 10, specifically between the atomization chamber 21 and the adsorption chamber 14, and the liquid in the atomization chamber 21 is atomized by the atomization element to generate water mist to infiltrate the adsorption element.

[0062] Exemplarily, the present application provides a support baffle 22 on one side of the atomization area 20 close to the atomization chamber 21, and a plurality of accommodating holes 23 for accommodating atomizing components are provided on the support baffle 22, and each atomizing component is arranged in a corresponding accommodating hole 23 to atomize the gas in the atomization chamber 21 and then infiltrate the adsorption component.

[0063] In the embodiment of the present application, the atomizing element is preferably provided in the form of an ultrasonic plate. The liquid contained in the atomizing chamber 21 is water. The electronic high-frequency oscillation characteristics of the ultrasonic plate are utilized to break up the molecular structure of liquid water to produce naturally floating water mist. Since the atomizing element is arranged at the connecting position between the atomizing chamber 21 and the adsorption chamber 14, the ultrasonic plate can atomize the gas in the atomizing chamber 21 and then infiltrate the adsorption element.

[0064] For further information, please refer to Figure 7 In the present application, a bottom plate 24 is disposed at the bottom of the atomizing chamber 21 . The cavity formed between the bottom plate 24 and the atomizing chamber 21 can also be used to place an ultrasonic plate to improve the atomization effect of the liquid in the atomizing chamber 21 .

[0065] In a specific embodiment provided in the present application, four accommodating holes 23 for accommodating atomizers are provided on the above-mentioned support baffle 22, so four ultrasonic plates need to be arranged in the corresponding accommodating holes 23. As for whether an ultrasonic plate needs to be placed at the bottom, it can be arranged according to actual needs, and the present application does not make further restrictions on this.

[0066] As an optional implementation, cotton for conducting water may be arranged in the atomization chamber 21 to conduct the gas in the atomization chamber 21 to a position close to the wave plate to improve the atomization effect of the ultrasonic plate.

[0067] Of course, it can also be arranged to wet the adsorption element by directly spraying the adsorption chamber 14 with a water curtain. As long as the adsorption element can be wetted to adsorb and cool the gas entering the adsorption chamber 14, any structure and method selected are feasible, and the present application does not impose further restrictions on this.

[0068] It should be noted that, since the adsorbent is in a wet state for a long time, it is necessary to regularly replace or treat the adsorbent, and at the same time, regularly replace and replenish the liquid in the atomization chamber 21 to ensure the deodorization efficiency of the adsorbent.

[0069] Based on the above-mentioned air purifier, the present application also provides a light-curing 3D printer, which is connected to the exhaust port of the light-curing 3D printer 30 so that the gas exhausted by the light-curing 3D printer 30 enters the purification area 10 through the air inlet 111, and is discharged from the air outlet 121 after being adsorbed and cooled by the adsorption component.

[0070] For details, please refer to Figure 8 , is a structural schematic diagram of the photocuring 3D printer 30 provided in an embodiment of the present application. In the present application, an air purifier is arranged at the exhaust port of the photocuring 3D printer 30. Since the photocuring 3D printer 30 will discharge waste gas containing acrylic resin during the printing process, direct discharge of the waste gas will cause air pollution and physical harm to the staff, so the waste gas needs to be purified. In the present application, the waste gas is connected to the air inlet chamber 11 of the air purifier, so that the heating end 132 of the semiconductor refrigeration component 13 contacts the waste gas to heat the waste gas, thereby accelerating the release of unreacted monomers and other volatile organic compounds in the waste gas. The heating temperature and heating time of the heating end 132 can also be adjusted accordingly according to actual needs, and those skilled in the art should know this.

[0071] Furthermore, after being heated, the exhaust gas enters the first area of ​​the adsorption chamber 14 through the second gap 26. In the process of entering the first area, the exhaust gas is further compressed and the temperature is increased. Through the absorption and cooling of the adsorbent and atomized gas in the adsorption chamber 14, the odor in the exhaust gas can be removed and the temperature of the gas can be further reduced.

[0072] Afterwards, the exhaust gas enters the second area of ​​the adsorption chamber 14 through the first gap 25, and the wetted adsorbent in the second area absorbs and cools the gas again, and then enters the gas outlet chamber 12 through the third gap 27. Due to the arc-shaped design of the partition 141 and the setting of the third gap 27, the gas entering the gas outlet chamber 12 can be compressed and heated again, and the treated gas is cooled by the cooling end 131 of the semiconductor refrigeration plate. During the cooling process, some volatile components in the gas will condense or adsorb on the cooling end 131 due to the decrease in temperature, thereby reducing the odor. The purified gas is dissipated from the outlet 121, completing the effective purification of the exhaust gas generated during the 3D printing process.

[0073] For other details about the above-mentioned light-curing 3D printer to implement the above-mentioned technical solution, please refer to the description of the air purifier provided in the above-mentioned application embodiment, which will not be repeated here.

[0074] The air purifier and light-curing 3D printer provided in the embodiments of the present application include a purification area and an atomization area connected to the purification area. The purification area is filled with an adsorbent for adsorbing gas. Water mist is generated by the atomization area to wet the adsorbent. When the gas enters the purification area, it will be adsorbed and cooled by the moistened adsorbent, and discharged from the air outlet after purification, thereby achieving purification of the exhaust gas; the heating and cooling effect of the semiconductor refrigeration element is utilized to accelerate the release of unreacted gas or other volatile organic compounds in the gas, thereby improving the adsorption effect of the adsorbent; when the gas after adsorption and cooling is transmitted to the air outlet, some residual volatile components in the gas are condensed or adsorbed on the semiconductor refrigeration element due to the decrease in temperature, thereby further reducing the odor in the exhaust gas, having a good adsorption and purification effect, and having a strong wide range of applicability.

[0075] It can be understood that the technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above embodiments are merely exemplary embodiments used to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. An air purifier, characterized in that: include: A purification area, the purification area comprising an air inlet, an air outlet, and a semiconductor refrigeration element disposed between the air inlet and the air outlet, and the purification area is filled with an adsorption element; an atomization zone, the atomization zone being in communication with the purification zone to generate water mist to infiltrate the adsorbent; The gas enters the purification zone from the gas inlet, is adsorbed and cooled by the adsorbent, and is discharged from the gas outlet.

2. The air purifier according to claim 1, characterized in that: The semiconductor refrigeration element is provided with a cooling end and a heating end, the air inlet is arranged close to the heating end, and the air outlet is arranged close to the cooling end, so that the gas enters the purification area after being heated from the air inlet and is discharged after being cooled through the air outlet.

3. The air purifier according to claim 1, characterized in that: The purification area is provided with an air inlet chamber, an air outlet chamber, and an adsorption chamber communicating with the air inlet chamber and the air outlet chamber; The air inlet is arranged on the air inlet chamber, the air outlet is arranged on the air outlet chamber, and the semiconductor refrigeration element is arranged across the air inlet chamber and the air outlet chamber to isolate the air inlet and the air outlet; the adsorption chamber is connected to the atomization area, and the adsorption element is filled in the adsorption chamber.

4. The air purifier according to claim 3, characterized in that: A partition is provided in the adsorption chamber, one end of the partition is connected to the semiconductor refrigeration element, and the other end of the partition is arranged close to the atomization area and a first gap is provided between the partition and the atomization area.

5. The air purifier according to claim 4, characterized in that: An air intake baffle is provided on one side of the adsorption chamber close to the air intake chamber. The air intake baffle is extended in a direction close to the partition and a second gap is provided between the air intake baffle and the partition, so that the gas enters the adsorption chamber through the second gap between the air intake baffle and the partition after being heated by the air intake chamber.

6. The air purifier according to claim 4, characterized in that: An air outlet baffle is provided on one side of the adsorption chamber close to the air outlet chamber. The air outlet baffle is extended in a direction close to the partition and a third gap is provided between the air outlet baffle and the partition, so that the gas adsorbed and cooled by the adsorption chamber enters the air outlet chamber for cooling through the third gap between the air outlet baffle and the partition.

7. The air purifier according to claim 6, characterized in that: A side of the partition plate close to the air outlet baffle is configured as a curved surface, and a height of the curved surface gradually increases in a direction close to the air outlet baffle.

8. The air purifier according to claim 1, characterized in that: The atomization area includes an atomization chamber for accommodating liquid and an atomization element for atomizing the liquid; The atomizing element is disposed between the atomizing chamber and the purification zone to atomize the liquid in the atomizing chamber and generate water mist to wet the adsorption element.

9. The air purifier according to claim 8, characterized in that: A supporting baffle is provided on one side of the atomization area close to the purification area, and a plurality of accommodating holes for accommodating the atomization element are provided on the supporting baffle. The number of the atomization elements is configured to be several, and the several atomization elements are arranged in the corresponding accommodating holes to atomize the gas in the atomization chamber and then infiltrate the adsorption element.

10. A light-curing 3D printer, characterized in that: The air purifier comprises the air purifier as described in any one of claims 1 to 9, wherein the air purifier is connected to the exhaust port of the light-curing 3D printer, so that the gas exhausted by the light-curing 3D printer enters the purification area through the air inlet, is adsorbed and cooled by the adsorbent, and then is discharged from the air outlet.

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