Embedded copper structure of multilayer printed circuit board

Abstract

The utility model discloses a multilayer printed circuit board embedded copper structure, which comprises a substrate and an embedded copper cavity arranged in the substrate, a copper block is arranged in the embedded copper cavity, a plurality of uniformly distributed grooves are arranged in the embedded copper cavity, and a plurality of salient points matched with the grooves are fixedly arranged on the copper block; according to the utility model, the bumps and the glue overflow grooves are arranged, and the bumps on the copper block are matched with the grooves of the copper embedding cavity, so that better contact between the copper block and the substrate is ensured, the conduction efficiency and the stability of a circuit are improved, the contact resistance is reduced, the improvement of equipment performance is facilitated, and the matching of the bumps and the grooves not only enhances the contact performance, but also improves the reliability of the circuit. In addition, the stress capacity of the copper block is improved in the pressing process, possible deformation of the copper block is reduced, the service life of equipment is prolonged accordingly, redundant glue in the pressing process can be contained through the design of the glue overflowing groove, and the situation that the glue overflows is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a copper-buried structure of a multi-layer printed circuit board. Background Art

[0002] A multilayer printed circuit board, also known as a multilayer circuit board or PCB, is a printed circuit board with more than two layers. It consists of connecting wires on several layers of insulating substrates and pads for assembling and soldering electronic components. It has the function of conducting the circuits of each layer and the function of insulation between them.

[0003] The buried copper structure of a multilayer printed circuit board (PCB) is a special design that aims to improve the heat dissipation, mechanical strength and electrical performance of the circuit board. This structure buries a copper block or copper layer inside the PCB and is tightly combined with other parts of the PCB through a specific process.

[0004] However, during the actual copper embedding operation, the copper block needs to be pressed when placed in the copper embedding cavity inside the substrate. During the pressing process, the copper block is prone to deformation and glue overflow is prone to occur between the copper block and the copper embedding cavity, thereby affecting the normal use of the circuit board.

[0005] Therefore, it is necessary to design a multi-layer printed circuit board buried copper structure to solve the above problems. Utility Model Content

[0006] The utility model aims to solve the shortcomings in the prior art and proposes a multi-layer printed circuit board buried copper structure.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A multilayer printed circuit board buried copper structure comprises a substrate and a buried copper cavity provided in the substrate, a copper block is arranged in the buried copper cavity, a plurality of evenly distributed grooves are provided in the buried copper cavity, and a plurality of protrusions adapted to the grooves are fixedly mounted on the copper block.

[0009] Preferably, a plurality of overflow glue grooves distributed in a linear array are symmetrically arranged in the buried copper cavity.

[0010] Preferably, a covering layer is provided on the substrate.

[0011] Preferably, the copper block fits the buried copper cavity.

[0012] The utility model has the following beneficial effects:

[0013] By setting the bumps and the overflow glue groove, the bumps on the copper block cooperate with the grooves of the buried copper cavity to ensure better contact between the copper block and the substrate, thereby improving the conduction efficiency and stability of the circuit, reducing the contact resistance, and helping to improve the performance of the equipment. The cooperation of the bumps and the grooves not only enhances the contact performance, but also improves the force bearing capacity of the copper block during the pressing process, reduces the possible deformation of the copper block, and thus extends the service life of the equipment. The design of the overflow glue groove can accommodate excess glue during the pressing process, effectively avoiding the occurrence of glue overflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a multi-layer printed circuit board buried copper structure proposed by the utility model;

[0015] Figure 2 It is a schematic diagram of the overall front view and cross-section structure of a multi-layer printed circuit board buried copper structure proposed by the utility model;

[0016] Figure 3 for Figure 2 A schematic diagram of the structure at A;

[0017] In the figure: 1, substrate; 11, covering layer; 2, buried copper cavity; 21, groove; 22, overflow glue groove; 3, copper block; 31, bump. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-3 A multi-layer printed circuit board buried copper structure includes a substrate 1 and a buried copper cavity 2 provided in the substrate 1, a copper block 3 is provided in the buried copper cavity 2, a plurality of evenly distributed grooves 21 are provided in the buried copper cavity 2, and a plurality of convex points 31 adapted to the grooves 21 are fixedly mounted on the copper block 3. The convex points 31 on the copper block 3 can fit with the grooves 21 in the buried copper cavity 2, ensuring that the copper block 3 and the substrate 1 can be better in contact, and in the process of pressing, the force bearing capacity of the copper block 3 can be improved and deformation can be reduced through the cooperation between the convex points 31 and the grooves 21.

[0020] Reference Figure 3 A plurality of overflow glue grooves 22 distributed in a linear array are symmetrically arranged in the buried copper cavity 2. The overflow glue grooves 22 can accommodate excess glue during the pressing process to avoid glue overflow.

[0021] Reference Figure 1 A covering layer 11 is disposed on the substrate 1. The covering layer 11 can protect the circuit from the influence of the external environment.

[0022] Reference Figure 2 , the copper block 3 fits with the buried copper cavity 2. This ensures that the copper block is installed more closely.

[0023] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A multi-layer printed circuit board buried copper structure, comprising a substrate (1) and a buried copper cavity (2) provided in the substrate (1), wherein a copper block (3) is arranged in the buried copper cavity (2), characterized in that: The buried copper cavity (2) is provided with a plurality of evenly distributed grooves (21), and the copper block (3) is fixedly mounted with a plurality of protrusions (31) adapted to the grooves (21).

2. A multilayer printed circuit board buried copper structure according to claim 1, characterized in that: A plurality of overflow glue grooves (22) distributed in a linear array are symmetrically arranged in the buried copper cavity (2).

3. A multilayer printed circuit board buried copper structure according to claim 1, characterized in that: A covering layer (11) is provided on the substrate (1).

4. A multilayer printed circuit board buried copper structure according to claim 1, characterized in that: The copper block (3) is in close contact with the buried copper cavity (2).

Images