Surface-mounted electronic device
By using structures such as limiting plates and rubber pads to form a sealing environment in patch electronic devices, the problem of electronic devices being susceptible to dust pollution is solved, and good protection effects and convenient chip removal process is achieved.
Patent Information
- Application Number
- CN202323656310.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-31
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2033-12-31
AI Technical Summary
Due to its small size and precision, electronic devices are easily affected by dust, resulting in limited installation and use, and the prior art is difficult to effectively prevent dust pollution.
A patch electronic device including a dustproof module and a sheet retrieval module is designed to limit the position through the first limit plate and the second limit plate, and a structure of rubber pads and fine wire is used to form a sealing environment to prevent dust. Enter, and provide convenient way to pick up the film.
It effectively prevents the chip from being contaminated by dust, improves the convenience of the chip and the protection effect, and makes the chip not easily affected by dust during installation and use.
Smart Images
Figure CN222366496U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic devices, in particular to a patch type electronic device. Background Art
[0002] Chip, also known as microcircuit, microchip, integrated circuit. It refers to a small silicon wafer containing an integrated circuit, which is often part of a computer or other electronic device.
[0003] Since electronic devices are small in size and are high-precision components, once dust accumulates on them, they are difficult to clean, which affects the installation and use of the electronic devices. Summary of the invention
[0004] The utility model aims to solve one of the technical problems existing in the prior art or related technology.
[0005] To this end, the technical solution adopted in this utility model is:
[0006] A chip-type electronic device includes a dustproof module and a chip removal module, the dustproof module includes a shell, a first limit plate and a second limit plate connected to the bottom of the shell inner cavity, a chip slidably connected between the first limit plate and the second limit plate, the chip removal module includes two rubber pads installed inside the shell, two plastic thin plates installed inside the shell, a cross bar embedded in the top of the shell, two thin iron wires passing through the top of the shell and connected to the cross bar, and a push rod connected between the two thin iron wires, wherein the push rod is arranged between the first limit plate and the chip.
[0007] By adopting the above technical solution, the chip is limited by the first limiting plate and the second limiting plate, and then the two rubber pads are fitted together, so that the chip is in a relatively sealed environment, with a good protection effect, and effectively preventing problems with the chip.
[0008] In a preferred example, the utility model can be further configured as follows: the first limiting plate is set as one, the second limiting plate is set as two, the first limiting plate is located between the two second limiting plates, and the shape and manufacturing material of the first limiting plate are equal to those of the second limiting plates.
[0009] In a preferred example, the utility model can be further configured as follows: the two plastic sheets are symmetrical about the horizontal center plane of the shell, and the two plastic sheets are arranged in a "く" shape.
[0010] In a preferred example, the utility model can be further configured as follows: a tube body is movably sleeved on the outer side of the thin iron wire, the tube body is embedded in the top of the shell, and the tube body is inclined.
[0011] In a preferred example, the utility model can be further configured as follows: two thin iron wires are respectively located on the top of the two second limiting plates, and the bottom ends of the thin iron wires pass through the tube body and extend to the inside of the second limiting plates.
[0012] In a preferred example, the utility model can be further configured as follows: the length of the push rod is equal to the distance between the two second limit plates, and the outer wall of the push rod is in contact with the outer wall of the second limit plate.
[0013] In a preferred example, the utility model can be further configured as follows: the two rubber pads are attached to each other, and a joint seam is formed at the attached position.
[0014] By adopting the above technical solution, the beneficial effects achieved by the utility model are as follows:
[0015] 1. In the utility model, the chip is limited by the first limiting plate and the second limiting plate, and then the two rubber pads are fitted together, so that the chip is in a relatively sealed environment, with a good protection effect, and effectively preventing problems with the chip.
[0016] 2. In the utility model, when taking out the chip, you only need to lift up the cross bar, then insert a thin iron wire into the shell, and then the thin iron wire pushes the push rod, the push rod is stressed, and then pushes the chip outward, the chip extends out from the joint, and it is easy to remove, thereby improving the convenience of using the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the dustproof module of the utility model;
[0019] Figure 3 This is a schematic diagram of the film taking module of the utility model.
[0020] Reference numerals:
[0021] 100, dustproof module; 110, housing; 120, first limiting plate; 130, second limiting plate; 140, chip;
[0022] 200, film taking module; 210, rubber pad; 220, plastic sheet; 230, cross bar; 240, thin iron wire; 250, push rod;
[0023] 300. Pipe body;
[0024] 400. Seams. Implementation
[0025] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.
[0026] It should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention.
[0027] A surface-mount electronic device provided by some embodiments of the utility model is described below in conjunction with the accompanying drawings. Example
[0028] Combination Figure 1-3 As shown, the present invention provides a patch type electronic device, including a dustproof module 100 and a chip removal module 200, wherein the dustproof module 100 includes a housing 110, a first limiting plate 120 and a second limiting plate 130 connected to the bottom of the inner cavity of the housing 110, and a chip 140 slidably connected between the first limiting plate 120 and the second limiting plate 130;
[0029] The chip taking module 200 includes two rubber pads 210 installed inside the shell 110, two plastic thin plates 220 installed inside the shell 110, a cross bar 230 embedded in the top of the shell 110, two thin iron wires 240 passing through the top of the shell 110 and connected to the cross bar 230, and a push rod 250 connected between the two thin iron wires 240, and the push rod 250 is arranged between the first limiting plate 120 and the chip 140.
[0030] Furthermore, the first limiting plate 120 is set as one, and the second limiting plate 130 is set as two. The first limiting plate 120 is located between the two second limiting plates 130, and its shape and manufacturing material are equal to those of the second limiting plate 130. This structural design reduces the manufacturing difficulty of the first limiting plate 120 and the second limiting plate 130.
[0031] Furthermore, the two plastic sheets 220 are symmetrical about the horizontal center plane of the housing 110 , and the two plastic sheets 220 are arranged in a “く” shape. This layout design facilitates the chip 140 to extend from the joint seam 400 .
[0032] Furthermore, the length of the push rod 250 is equal to the distance between the two second limiting plates 130 , and the outer wall of the push rod 250 fits the outer wall of the second limiting plates 130 . With this size design, the push rod 250 can push the chip 140 outward. Example
[0033] Combination Figure 1 and Figure 3As shown, on the basis of the first embodiment, a tube body 300 is movably sleeved on the outer side of the thin iron wire 240, and the tube body 300 is embedded in the top of the outer shell 110. The tube body 300 is inclined. The setting of the tube body 300 can reduce the degree of wear of the thin iron wire 240 and ensure the service life of the thin iron wire 240.
[0034] Specifically, the two thin iron wires 240 are respectively located at the top of the two second limiting plates 130, and the bottom ends of the thin iron wires 240 pass through the tube body 300 and extend to the inside of the second limiting plates 130. This structural design can guide the thin iron wires 240 to ensure that the thin iron wires 240 can push the tube body 300. Example
[0035] Combination Figure 1 As shown, in the above embodiment, the two rubber pads 210 are attached to each other, and a joint seam 400 is formed at the joint. The joint seam 400 is provided to ensure that the chip 140 can be smoothly extended from the housing 110.
[0036] The working principle and use process of the utility model are as follows: in the initial state, the chip 140 is limited by the first limiting plate 120 and the second limiting plate 130, and then the two rubber pads 210 are fitted together to place the chip 140 in a relatively sealed environment, effectively preventing the chip 140 from being attached with dust. Then, when the user takes out the chip 140, he only needs to lift out the cross bar 230, and then insert the thin iron wire 240 into the shell 110, and then the thin iron wire 240 pushes the push rod 250, the push rod 250 is subjected to force, and then pushes the chip 140 outward, and the chip 140 extends out from the joint seam 400, with a good protection effect, effectively preventing the chip 140 from having problems.
[0037] In the present utility model, the term "plurality" refers to two or more than two, unless otherwise clearly defined. The term "and / or" used in this article includes any and all combinations of one or more related listed items. The terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "connection" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.
[0038] It should be noted that when an element is referred to as being "assembled on", "installed on", "fixed on" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0039] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0040] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A surface-mount electronic device, characterized in that: include: The dustproof module (100) comprises a housing (110), a first limiting plate (120) and a second limiting plate (130) connected to the bottom of the inner cavity of the housing (110), and a chip (140) slidably connected between the first limiting plate (120) and the second limiting plate (130); the chip taking module (200) comprises two rubber pads (210) installed inside the housing (110), two plastic thin plates (220) installed inside the housing (110), a cross bar (230) embedded in the top of the housing (110), two thin iron wires (240) passing through the top of the housing (110) and connected to the cross bar (230), and a push rod (250) connected between the two thin iron wires (240), wherein the push rod (250) is arranged between the first limiting plate (120) and the chip (140).
2. A surface-mount electronic device according to claim 1, characterized in that: The first limiting plate (120) is provided as one, and the second limiting plates (130) are provided as two. The first limiting plate (120) is located between the two second limiting plates (130), and has the same shape and manufacturing material as the second limiting plates (130).
3. A surface-mount electronic device according to claim 1, characterized in that: The two plastic thin plates (220) are symmetrical about the horizontal center plane of the housing (110), and the two plastic thin plates (220) are arranged in a "く" shape.
4. A surface-mount electronic device according to claim 1, characterized in that: A tube body (300) is movably sleeved on the outside of the thin iron wire (240), and the tube body (300) is embedded in the top of the outer shell (110), and the tube body (300) is arranged in an inclined manner.
5. A surface-mount electronic device according to claim 4, characterized in that: The two thin iron wires (240) are respectively located on the top of the two second limiting plates (130), and the bottom ends of the thin iron wires (240) pass through the tube body (300) and extend into the interior of the second limiting plates (130).
6. A surface-mount electronic device according to claim 1, characterized in that: The length of the push rod (250) is equal to the distance between the two second limit plates (130), and the outer wall of the push rod (250) is in close contact with the outer wall of the second limit plate (130).
7. A surface-mount electronic device according to claim 1, characterized in that: The two rubber pads (210) are attached to each other, and a joint seam (400) is formed at the attached position.