Semiconductor turnover box of array type lead frame

Abstract

The utility model discloses a semiconductor turnover box of an array type lead frame, which comprises a polypropylene box body, the upper surface of the polypropylene box body is fixedly connected with a polyethylene base, the upper surface of the polypropylene box body is provided with a polypropylene box cover, the polyethylene base is internally provided with a bolt, and the polyethylene box cover is provided with a screw. A front baffle is fixedly connected to the upper surface of the polyethylene base, side plates and first sleeves are fixedly connected to the two sides of the front baffle, second sleeves are slidably connected to the inner surfaces of the first sleeves, lifting springs are arranged in the second sleeves, and trays and limiting devices are fixedly connected to the upper surfaces of the second sleeves. The limiting device comprises a clamping block, a connecting block, a wedge-shaped block, a button, a limiting strip and a clamping spring, through the limiting device, the semiconductor lead frame can be effectively fixed, the stability of the semiconductor lead frame is improved, the metal pins can be protected while the semiconductor lead frame is fixed, the semiconductor lead frame is convenient to install and take out, and meanwhile the limiting device has the effects of moisture prevention, static prevention and high temperature resistance.

Description

Technical Field

[0001] The utility model relates to the technical field of turnover boxes, in particular to a semiconductor turnover box of an array lead frame. Background Art

[0002] Semiconductor turnover boxes are mainly used to place and transport semiconductors in semiconductor production. In order to simplify transportation and minimize the risk of contamination, chip manufacturers use semiconductor turnover boxes to carry and store semiconductors. At present, traditional semiconductor lead frames have a set of metal pins. The pins are slender and easy to bend. During the transportation process, special attention must be paid to avoid bumps and moisture. Therefore, general semiconductor turnover boxes are mainly made of polyethylene plastic, PP, PE, and PVC, which can prevent static electricity and have certain flame retardant and high temperature resistance.

[0003] After searching, it was found that the technical solution provided by the utility model with application number CN202122549846.9 includes a box body, the upper surface of which is equipped with a limiting mechanism, the inner bottom wall of the box body is fitted with two symmetrical drying bags, and the rear surface of the box body is hinged with a cover plate by a hinge; by connecting the external air pump to the air nozzle through a conduit, opening the air valve, and filling the gas into the annular wrapped airbag through the second air pipe and the first air pipe, and using the limiting plate to limit the annular wrapped airbag, so that the annular wrapped airbag can quickly fix the chip, and using the plasticity of the annular wrapped airbag and cooperating with the sponge pad to seal the top of the annular wrapped airbag, but this inflatable protection method will cause the metal pins of the semiconductor lead frame to be squeezed and deformed, causing quality problems in the semiconductor lead frame during welding, and relying on the airbag to squeeze the semiconductor, when the airbag is inflated too much, the semiconductor will be unevenly stressed and there will be a risk of breakage. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a semiconductor turnover box with an array lead frame. The semiconductor lead frame can be effectively fixed by a limiting device to improve its stability, and the metal pins can be protected while being fixed, so that installation and removal are convenient. At the same time, the polypropylene box body also has the effects of moisture-proof, anti-static and high temperature resistance.

[0005] The utility model also provides a semiconductor turnover box with the above-mentioned array lead frame, a polypropylene box body, a polyethylene base is fixedly connected to the upper surface of the polypropylene box body, a polypropylene box cover is arranged on the upper surface of the polypropylene box body, bolts are arranged inside the polyethylene base, a front baffle is fixedly connected to the upper surface of the polyethylene base, and side plates are fixedly connected to the two sides of the front baffle;

[0006] A first sleeve, wherein the inner surface of the first sleeve is slidably connected to the second sleeve, a lifting spring is arranged inside the second sleeve, a tray is fixedly connected to the upper surface of the second sleeve, a semiconductor is arranged on the upper surface of the tray, metal pins are fixedly connected to both sides of the semiconductor, and a drying box is arranged on the lower surface of the tray;

[0007] The limiting device includes a clamping block, a connecting block, a wedge-shaped block, a button, a limiting strip and a clamping spring. The front surface of the clamping block is fixedly connected to the connecting block, the upper surface of the connecting block is fixedly connected to the wedge-shaped block, and both sides of the button are fixedly connected to the limiting strip.

[0008] According to the semiconductor turnover box of the array lead frame, the lower end of the bolt is threadedly connected to the polypropylene box body, and the number of the bolts is four and they are distributed in a rectangular array for easy disassembly and assembly.

[0009] According to the semiconductor turnover box of the array lead frame, the lower end of the lifting spring is fixedly connected to the first sleeve, and the upper end of the lifting spring is fixedly connected to the second sleeve.

[0010] According to the semiconductor turnover box of an array lead frame, the number of the metal pins is multiple and distributed in a linear array, and a pull rod is fixedly connected to the front surface of the drying box for facilitating the pulling out of the drying box. By placing a desiccant in the drying box, the internal space of the box is kept dry, which has a moisture-proof effect.

[0011] According to the semiconductor turnover box of the array lead frame, two sides of the drying box are fixedly connected with sliding bars, and the outer surfaces of the sliding bars are slidably connected with the front baffle.

[0012] According to the semiconductor turnover box of the array lead frame, one end of the retaining spring is fixedly connected to the connecting block, and the other end of the retaining spring is fixedly connected to the front baffle.

[0013] According to the semiconductor turnover box of the array lead frame, the outer surface of the button is slidably connected to the front baffle, and the lower surface of the connecting block is slidably connected to the front baffle.

[0014] According to the semiconductor turnover box of the array lead frame, the number of the limiting devices is four and they are distributed in a rectangular array.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0017] Figure 1 This is an overall structural diagram of a semiconductor turnover box of an array lead frame of the utility model;

[0018] Figure 2 This is an internal structure diagram of a semiconductor turnover box of an array lead frame of the utility model;

[0019] Figure 3 It is a partial structural diagram of a semiconductor turnover box of an array lead frame of the utility model;

[0020] Figure 4 This is a structural cross-sectional view of a semiconductor turnover box of an array lead frame of the utility model;

[0021] Figure 5 This is a structural diagram of a lifting spring of a semiconductor turnover box of an array lead frame of the utility model;

[0022] Figure 6 for Figure 4 A schematic diagram of the enlarged structure in the middle.

[0023] Legend:

[0024] 1. Polypropylene box body; 2. Polyethylene base; 3. Polypropylene box cover; 4. Bolts; 5. Front baffle; 6. Side panel; 7. First sleeve; 8. Second sleeve; 9. Lifting spring; 10. Semiconductor; 11. Metal pin; 12. Drying box; 13. Pull rod; 14. Slide bar; 15. Block; 16. Connecting block; 17. Wedge block; 18. Button; 19. Limit strip; 20. Block spring; 21. Tray. DETAILED DESCRIPTION

[0025] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0026] Reference Figure 1-6 The utility model embodiment is a semiconductor turnover box of an array lead frame, which includes a polypropylene box body 1, a polyethylene base 2 is fixedly connected to the upper surface of the polypropylene box body 1, a polypropylene box cover 3 is arranged on the upper surface of the polypropylene box body 1, bolts 4 are arranged inside the polyethylene base 2, the lower ends of the bolts 4 are threadedly connected to the polypropylene box body 1, the number of bolts 4 is four and they are distributed in a rectangular array, a front baffle 5 is fixedly connected to the upper surface of the polyethylene base 2, and side panels 6 are fixedly connected to both sides of the front baffle 5.

[0027] A first sleeve 7, the inner surface of which is slidably connected to a second sleeve 8, a lifting spring 9 is arranged inside the second sleeve 8, a tray 21 is fixedly connected to the upper surface of the second sleeve 8, a semiconductor 10 is arranged on the upper surface of the tray 21, metal pins 11 are fixedly connected to both sides of the semiconductor 10, a drying box 12 is arranged on the lower surface of the tray 21, the lower end of the lifting spring 9 is fixedly connected to the first sleeve 7, the upper end of the lifting spring 9 is fixedly connected to the second sleeve 8, the number of the metal pins 11 is plural and distributed in a linear array, and a pull rod 13 is fixedly connected to the front surface of the drying box 12.

[0028] The limiting device includes a card block 15, a connecting block 16, a wedge block 17, a button 18, a limiting strip 19 and a locking spring 20. The front surface of the card block 15 is fixedly connected to the connecting block 16, the upper surface of the connecting block 16 is fixedly connected to the wedge block 17, both sides of the button 18 are fixedly connected to the limiting strip 19, both sides of the drying box 12 are fixedly connected with the sliding strip 14, the outer surface of the sliding strip 14 is slidably connected to the front baffle 5, one end of the locking spring 20 is fixedly connected to the connecting block 16, the other end of the locking spring 20 is fixedly connected to the front baffle 5, the outer surface of the button 18 is slidably connected to the front baffle 5, the lower surface of the connecting block 16 is slidably connected to the front baffle 5, and the number of the limiting devices is four and they are distributed in a rectangular array.

[0029] Working principle: Press the button 18, the button 18 squeezes the wedge block 17, and the wedge block 17 drives the card block 15 to retract inward. After the semiconductor 10 is put down, release the button 18, and the card block 15 is ejected again under the action of the wedge block 17 and stuck on the upper surface of the semiconductor 10. At the same time, the metal pins 11 are placed in the grooves on both sides of the side plate 6 to achieve protection. Then, desiccant is loaded into the drying box 12 to keep the inside of the device dry. Finally, the polypropylene box cover 3 is covered to achieve sealing.

[0030] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor turnover box of an array lead frame, characterized in that: include: A polypropylene box body (1), the upper surface of the polypropylene box body (1) being fixedly connected to a polyethylene base (2), the upper surface of the polypropylene box body (1) being provided with a polypropylene box cover (3), the interior of the polyethylene base (2) being provided with bolts (4), the upper surface of the polyethylene base (2) being fixedly connected to a front baffle (5), and both sides of the front baffle (5) being fixedly connected to side panels (6); A first sleeve (7), the inner surface of the first sleeve (7) is slidably connected to a second sleeve (8), a lifting spring (9) is arranged inside the second sleeve (8), a tray (21) is fixedly connected to the upper surface of the second sleeve (8), a semiconductor (10) is arranged on the upper surface of the tray (21), both sides of the semiconductor (10) are fixedly connected to metal pins (11), and a drying box (12) is arranged on the lower surface of the tray (21); A limiting device, the limiting device comprising a clamping block (15), a connecting block (16), a wedge block (17), a button (18), a limiting strip (19) and a clamping spring (20), the front surface of the clamping block (15) being fixedly connected to the connecting block (16), the upper surface of the connecting block (16) being fixedly connected to the wedge block (17), and both sides of the button (18) being fixedly connected to the limiting strip (19).

2. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: The lower ends of the bolts (4) are threadedly connected to the polypropylene box body (1), and the number of the bolts (4) is four and they are distributed in a rectangular array.

3. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: The lower end of the lifting spring (9) is fixedly connected to the first sleeve (7), and the upper end of the lifting spring (9) is fixedly connected to the second sleeve (8).

4. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: The number of the metal pins (11) is plural and distributed in a linear array, and a pull rod (13) is fixedly connected to the front surface of the drying box (12).

5. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: Slide bars (14) are fixedly connected to both sides of the drying box (12), and the outer surface of the slide bar (14) is slidably connected to the front baffle (5).

6. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: One end of the locking spring (20) is fixedly connected to the connecting block (16), and the other end of the locking spring (20) is fixedly connected to the front baffle (5).

7. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: The outer surface of the button (18) is slidably connected to the front baffle (5), and the lower surface of the connecting block (16) is slidably connected to the front baffle (5).

8. The semiconductor turnover box of the array lead frame according to claim 1, characterized in that: The number of the limiting devices is four and they are distributed in a rectangular array.

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