Cooling device with heat exchange structure

Abstract

The utility model provides a cooling device with a heat exchange structure, which comprises a cooling fin and a temperature conducting ring pad, and the left side and the right side of the cooling fin are respectively provided with a side connection temperature conducting sheet used for conducting heat dissipation temperature. Compared with the prior art, the cooling device has the advantages that the external cooling fan is connected through the inner connecting bolt, vibration force of the external cooling fan can be slowly released through the slow pressing spring, and cooling stability of the external semiconductor chilling plate is conducted through the cooling fins; the cooling effect of the semiconductor chilling plate is directly conducted through the first temperature-conducting bent pipe and the second temperature-conducting bent pipe, the first temperature-conducting bent pipe and the second temperature-conducting bent pipe are embedded into the interior of the cooling fin through the temperature-conducting cavity, and the cooling effect of the semiconductor chilling plate is improved through the temperature-conducting plate. And the contact area between the temperature-conducting bent pipe I and the temperature-conducting bent pipe II is increased by using the temperature-conducting ring pad.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat exchange cooling in workpiece manufacturing and relates to a cooling device with a heat exchange structure. Background Art

[0002] The cooling structure with heat exchange function mainly refers to the heat exchange cooler, which is widely used in various industrial fields. It is generally made of metal materials with good sealing performance, and the shape can be square, round, etc. When the heating medium flows in the tube, it exchanges heat with the environment or latent heat release medium through the shell. The cooling structure with heat exchange function plays an important role in many industrial and civil equipment, and its cooling efficiency directly affects the stability and service life of the equipment. When the cooling efficiency of this structure is insufficient, a series of problems will arise.

[0003] When the cooling efficiency is insufficient, the high temperature environment will not only affect the normal operation of the equipment, but may also cause thermal stress inside the equipment, leading to fatigue of the workpiece material and performance degradation. Long-term high temperature operation may also accelerate the aging of the equipment and shorten its service life. Therefore, a cooling device with a heat exchange structure is urgently needed to solve the above problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a cooling device with a heat exchange structure to solve the problems raised in the above background technology.

[0005] The utility model is realized by the following technical scheme: a cooling device with a heat exchange structure, comprising: a cooling fin and a thermal conductive ring pad, wherein both sides of the cooling fin are provided with side-connected thermal conductive plates for conducting heat dissipation temperature;

[0006] A mounting base for connecting the cooling fin and the side connecting thermal conductive plate is provided between the cooling fin and the side connecting thermal conductive plate, and an external fixing hole for fixed connection is provided inside the mounting base;

[0007] A connecting groove for interlocking with an external cooling fan is provided in the middle of the side connecting thermal conductive plate, an inner connecting bolt for connecting and fixing with the external cooling fan is provided inside the connecting groove, a pressure relief spring for slow release of the fixing of the inner connecting bolt is provided outside the inner connecting bolt, the external cooling fan can be connected by using the inner connecting bolt, and the pressure relief spring can relieve the vibration force of the external cooling fan.

[0008] As a preferred embodiment, a group of connecting wing plates for positioning and connecting the inner connecting bolt (150) are provided on the outer side of the lower end thereof, and a group of main mounting plates for connecting and fixing with cooling fins are provided on the inner side of the connecting wing plates, so that the cooling of the external semiconductor refrigeration plate can be stably conducted by using the cooling fins.

[0009] As a preferred embodiment, a temperature conducting bend pipe 1 is provided on the left side inside the main mounting plate for conducting the cooling temperature to the left side of the cooling fin, and a temperature conducting bend pipe 2 is provided on the right side inside the main mounting plate for conducting the cooling temperature to the right side of the cooling fin. The cooling effect of the semiconductor refrigeration plate can be directly conducted by using the temperature conducting bend pipe 1 and the temperature conducting bend pipe 2.

[0010] As a preferred embodiment, a mounting seat for mounting with an external semiconductor cooling plate is provided at the lower end of the main mounting plate, and an embedded groove for interlocking connection with the external semiconductor cooling plate is provided inside the lower end of the mounting seat.

[0011] As a preferred embodiment, a plurality of groups of temperature conducting cavities for cooling are provided inside the left and right ends of the cooling fins. The temperature conducting cavities are provided inside the temperature conducting cavities for increasing the contact area between the temperature conducting bend pipe 1 and the temperature conducting bend pipe 2 and the cooling fins. The temperature conducting bend pipe 1 and the temperature conducting bend pipe 2 can be interlocked with the inside of the cooling fins by using the temperature conducting cavities.

[0012] As a preferred embodiment, the embedded groove passes through the mounting seat and the inside of the main mounting plate, and the inside of the embedded groove is fixed to the outside of the external semiconductor refrigeration plate by bolts. The upper end of the external semiconductor refrigeration plate is the refrigeration end, and the upper end surface of the refrigeration end and the inner surface of the lower end of the cooling fin are in contact with each other.

[0013] As a preferred embodiment, the external semiconductor refrigeration plate is a GJKJ type semiconductor refrigeration component, the cooling fins are made by splicing and combining several groups of thermal conductive plates, and the several groups of thermal conductive plates are all made of an aluminum alloy material, and a group of thermal conductive contact plates for integrally connecting with the several groups of thermal conductive plates are provided at the lower end of the cooling fins, which can improve the cooling effect of the semiconductor refrigeration plate by using the thermal conductive plates.

[0014] As a preferred embodiment, the interior of the main mounting plate is connected and fixed to the first thermal bending pipe and the second thermal bending pipe, and the first thermal bending pipe and the second thermal bending pipe are arranged in a mirror image manner;

[0015] The first and second thermally conductive bends are both made of a metal copper material. The first and second thermally conductive bends are respectively connected to a plurality of groups of embedded grooves and fit with the inner side of a group of thermally conductive ring pads. The inner wall of each group of embedded grooves fits with a group of thermally conductive ring pads. The thermally conductive ring pads are made of a metal copper material. The contact area with the first and second thermally conductive bends can be increased by using the thermally conductive ring pads.

[0016] After adopting the above technical scheme, the beneficial effects of the utility model are: by using the internal connecting bolt to connect the external cooling fan, and at the same time its pressure relief spring can relieve the vibration force of the external cooling fan, by using the cooling fins to stably conduct the cooling of the external semiconductor refrigeration plate, by using the thermal conductive bend pipe 1 and the thermal conductive bend pipe 2 to directly conduct the cooling effect of the semiconductor refrigeration plate, by using the thermal conductive cavity to make the thermal conductive bend pipe 1 and the thermal conductive bend pipe 2 interlock with the inside of the cooling fins, by using the thermal conductive plate to improve the cooling effect of the semiconductor refrigeration plate, and by using the thermal conductive ring pad to increase the contact area with the thermal conductive bend pipe 1 and the thermal conductive bend pipe 2. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 It is a schematic diagram of a top view of the right front oblique side of a cooling device with a heat exchange structure of the utility model;

[0019] Figure 2 It is a schematic diagram of a top view of the right front oblique side of a mounting seat in a cooling device with a heat exchange structure of the utility model;

[0020] Figure 3 This is a structural diagram of the bottom of a mounting seat in a cooling device with a heat exchange structure according to the utility model, viewed from the front side;

[0021] Figure 4 This is an enlarged view of the structure at point A in a cooling device with a heat exchange structure of the utility model;

[0022] In the figure: 100-cooling fin, 110-side connecting thermal conductive plate, 120-external fixing hole, 130-mounting base, 140-connecting groove, 150-internal connecting bolt, 160-pressure relief spring, 170-connecting wing plate, 180-main mounting plate, 190-thermal conductive bend pipe 1, 200-thermal conductive bend pipe 2, 210-mounting seat, 220-embedded groove, 230-thermal conductive cavity, 240-thermal conductive ring pad. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-Figure 4 A cooling device with a heat exchange structure includes: a cooling fin 100, a temperature conducting elbow 190, a temperature conducting cavity 230 and a temperature conducting ring pad 240, and both sides of the cooling fin 100 are provided with side connection temperature conducting sheets 110 for conducting heat dissipation temperature;

[0025] A mounting base 130 for connecting the cooling fin 100 and the side connecting thermal conductive plate 110 is provided between the cooling fin 100 and the side connecting thermal conductive plate 110, and an external fixing hole 120 for fixed connection is provided inside the mounting base 130;

[0026] A connecting groove 140 for interlocking with an external cooling fan is provided in the middle of the side connecting thermal conductive plate 110, an inner connecting bolt 150 for connecting and fixing with the external cooling fan is provided inside the connecting groove 140, a pressure relief spring 160 for fixing and releasing the inner connecting bolt 150 is provided outside the inner connecting bolt 150, the external cooling fan can be connected by using the inner connecting bolt 150, and the pressure relief spring 160 can relieve the vibration force of the external cooling fan.

[0027] A group of connecting wing plates 170 for positioning and connecting the inner connecting bolt (150) are provided on the outer side of the lower end thereof, and a group of main mounting plates 180 for connecting and fixing with the cooling fins 100 are provided on the inner side of the connecting wing plates 170, so that the cooling of the external semiconductor refrigeration plate can be stably conducted by using the cooling fins 100.

[0028] A thermal conductive bend 190 for conducting the cooling temperature to the left side of the cooling fin 100 is provided on the left side inside the main mounting plate 180, and a thermal conductive bend 200 for conducting the cooling temperature to the right side of the cooling fin 100 is provided on the right side inside the main mounting plate 180. The cooling effect of the semiconductor refrigeration plate can be directly conducted by using the thermal conductive bend 190 and the thermal conductive bend 200.

[0029] A mounting seat 210 for mounting with an external semiconductor cooling plate is disposed at the lower end of the main mounting plate 180 , and an inner groove 220 for interlocking and connecting with the external semiconductor cooling plate is disposed inside the lower end of the mounting seat 210 .

[0030] Several groups of heat conduction cavities 230 for cooling are provided inside the left and right ends of the cooling fin 100. The heat conduction cavities 230 are provided inside the cooling fin 100 for increasing the contact area between the heat conduction bend 190 and the heat conduction bend 200 and the cooling fin 100. The heat conduction bend 190 and the heat conduction bend 200 can be interlocked with the inside of the cooling fin 100 by using the heat conduction cavities 230.

[0031] The embedded groove 220 passes through the mounting seat 210 and the main mounting plate 180. The inside of the embedded groove 220 is fixed to the outside of the external semiconductor refrigeration plate by bolts. The upper end of the external semiconductor refrigeration plate is the refrigeration end, and the upper end surface of the refrigeration end fits with the inner surface of the lower end of the cooling fin 100.

[0032] The external semiconductor refrigeration plate is a GJKJ type semiconductor refrigeration component. The cooling fin 100 is made of a plurality of groups of thermal conductive plates spliced ​​together, and the plurality of thermal conductive plates are all made of an aluminum alloy material. A group of thermal conductive contact plates for integrally connecting with the plurality of thermal conductive plates are provided at the lower end of the cooling fin 100. The cooling effect of the semiconductor refrigeration plate can be improved by using the thermal conductive plates.

[0033] The interior of the main mounting plate 180 is connected and fixed to the first temperature conducting elbow 190 and the second temperature conducting elbow 200, and the first temperature conducting elbow 190 and the second temperature conducting elbow 200 are arranged in a mirror image manner;

[0034] The thermal conductive bend 190 and the thermal conductive bend 200 are both made of a metallic copper material. The thermal conductive bend 190 and the thermal conductive bend 200 are respectively interlocked and connected with a plurality of groups of embedded grooves 220 and are fitted with the inner side of a group of thermal conductive ring pads 240. The inner wall of each group of embedded grooves 220 is fitted with a group of thermal conductive ring pads 240. The thermal conductive ring pads 240 are made of a metallic copper material. The contact area with the thermal conductive bend 190 and the thermal conductive bend 200 can be increased by using the thermal conductive ring pads 240.

[0035] See also Figure 1-Figure 4As the first embodiment of the utility model: In order to solve the problem that when the cooling efficiency is insufficient, the high temperature environment will not only affect the normal operation of the equipment, but also may cause thermal stress inside the equipment, resulting in fatigue and performance degradation of the workpiece material. Long-term high temperature operation may also accelerate the aging of the equipment and shorten its service life. First, when the present invention uses the new type to cool the workpiece manufacturing equipment or the workpiece produced, the staff provides a cooling source by using an external semiconductor refrigeration sheet. Since the external semiconductor refrigeration sheet is a GJKJ type semiconductor refrigeration component, and the embedded groove 220 runs through the mounting seat 210 and the main Inside the mounting plate 180, the inside of the embedded groove 220 is fixed to the outside of the external semiconductor refrigeration plate by bolts. The upper end of the external semiconductor refrigeration plate is the refrigeration end. The upper end surface of the refrigeration end fits with the inner surface of the lower end of the cooling fin 100. The refrigeration end of the external semiconductor refrigeration plate can directly provide a cooling effect to the bottom of the cooling fin 100. At the same time, since the temperature conducting bend 190 and the temperature conducting bend 200 are both made of a metal copper material, the temperature conducting bend 190 and the temperature conducting bend 200 are used to coordinate with the external semiconductor refrigeration plate to cool down together, thereby effectively improving the cooling and heat exchange effect.

[0036] See also Figure 1-Figure 4 , as the second embodiment of the utility model: based on the description in the above embodiments, further, since the thermal conductive bend 190 and the thermal conductive bend 200 are respectively connected to each other with a plurality of groups of embedded grooves 220 and fit with the inner side of a group of thermal conductive ring pads 240, and the inner wall of each group of embedded grooves 220 fits with a group of thermal conductive ring pads 240, when the thermal conductive bend 190 and the thermal conductive bend 200 provide cooling effect for the cooling fin 100, the contact area with the thermal conductive bend 190 and the thermal conductive bend 200 can be increased through the thermal conductive ring pad 240, thereby reducing the cooling loss of the thermal conductive bend 190 and the thermal conductive bend 200.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cooling device with a heat exchange structure, comprising: A cooling fin (100), a thermal conductive bend pipe (190), a thermal conductive cavity (230) and a thermal conductive ring pad (240), characterized in that: both left and right sides of the cooling fin (100) are provided with side-connected thermal conductive sheets (110) for conducting heat dissipation temperature; A mounting base (130) for connecting the cooling fin (100) and the side connecting thermal conductive plate (110) is provided between the cooling fin (100) and the side connecting thermal conductive plate (110), and an external fixing hole (120) for fixed connection is provided inside the mounting base (130); A connection groove (140) for interlocking with an external cooling fan is provided in the middle of the side connection thermal conductive plate (110); an internal connection bolt (150) for connecting and fixing with the external cooling fan is provided inside the connection groove (140); and a pressure relief spring (160) for fixing and releasing the internal connection bolt (150) is provided outside the internal connection bolt (150).

2. A cooling device with a heat exchange structure according to claim 1, characterized in that: A group of connecting wing plates (170) for positioning and connecting the inner connecting bolt (150) are provided on the outer side of the lower end thereof, and a group of main mounting plates (180) for connecting and fixing with the cooling fins (100) are provided on the inner side of the connecting wing plates (170).

3. A cooling device with a heat exchange structure according to claim 2, characterized in that: A thermal conductive bend pipe 1 (190) for conducting cooling temperature to the left side of the cooling fin (100) is provided on the left side inside the main installation plate (180), and a thermal conductive bend pipe 2 (200) for conducting cooling temperature to the right side of the cooling fin (100) is provided on the right side inside the main installation plate (180).

4. The cooling device with a heat exchange structure according to claim 3, characterized in that: A mounting seat (210) for mounting with an external semiconductor cooling plate is provided at the lower end of the main mounting plate (180), and an embedded groove (220) for interlocking connection with the external semiconductor cooling plate is provided inside the lower end of the mounting seat (210).

5. The cooling device with a heat exchange structure according to claim 1, characterized in that: A plurality of groups of temperature conducting cavities (230) for cooling are provided inside the left and right ends of the cooling fin (100), and a temperature conducting cavity (230) is provided inside the temperature conducting cavity (230) for increasing the contact area between the first temperature conducting bend (190) and the second temperature conducting bend (200) and the cooling fin (100).

6. The cooling device with a heat exchange structure according to claim 4, characterized in that: The embedded groove (220) passes through the mounting seat (210) and the main mounting plate (180), and the inside of the embedded groove (220) is fixed to the outside of the external semiconductor refrigeration plate by bolts. The upper end of the external semiconductor refrigeration plate is the refrigeration end, and the upper end surface of the refrigeration end and the inner surface of the lower end of the cooling fin (100) are in contact with each other.

7. The cooling device with a heat exchange structure according to claim 6, characterized in that: The external semiconductor refrigeration sheet is a GJKJ type semiconductor refrigeration component, the cooling fin (100) is made by splicing and assembling a plurality of groups of thermal conductive sheets, and the plurality of groups of thermal conductive sheets are all made of an aluminum alloy material, and a group of thermal conductive contact plates for integrally connecting with the plurality of groups of thermal conductive sheets are provided at the lower end of the cooling fin (100).

8. The cooling device with a heat exchange structure according to claim 2, characterized in that: The interior of the main installation plate (180) is connected and fixed to the first thermal bending pipe (190) and the second thermal bending pipe (200), and the first thermal bending pipe (190) and the second thermal bending pipe (200) are arranged in a mirror image manner; The first thermal conductive bend (190) and the second thermal conductive bend (200) are both made of a metal copper material. The first thermal conductive bend (190) and the second thermal conductive bend (200) are respectively connected to a plurality of groups of embedded grooves (220) and are fitted with the inner side of a group of thermal conductive ring pads (240). The inner wall of each group of embedded grooves (220) is fitted with a group of thermal conductive ring pads (240). The thermal conductive ring pads (240) are made of a metal copper material.

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