Copper dotted device for settlement monitoring

Abstract

The utility model discloses a copper dotted device for settlement monitoring, which is characterized by comprising a nail head, a nail cap and a nail body, the nail head is sequentially welded with the nail cap and the nail body, and a fixing device is arranged at the lower part of the nail body. The permanent sedimentation copper marking point is convenient to carry and stable and convenient to install during measurement and monitoring, and the copper nail head and the nail body can resist corrosion.

Description

Technical Field

[0001] The utility model relates to the field of surveying and mapping monitoring, in particular to a copper point device used for settlement monitoring. Background Art

[0002] A settlement monitoring point refers to a specific location point used to observe and record changes in ground settlement. It is widely used in engineering construction and surveying and mapping. Its setting method and materials used vary depending on the application environment and needs.

[0003] Settlement monitoring points usually need to be embedded in concrete or other objects for use, or they can be welded to metal structures and cast on site.

[0004] At present, we have two ways to install settlement monitoring points, one is pre-embedded and the other is drilling installation. The settlement monitoring points we use for pre-embedded installation are usually pre-embedded leveling points with pre-embedded screws at the tail. The pre-embedded screws are small and easy to lose. If the pre-embedded screws are lost, the settlement monitoring points are easy to be damaged and moved. If the drilling installation requires drilling and then using glue to install, it is not as stable as the pre-embedded installation and affects the accuracy.

[0005] Currently, the settlement monitoring points on the market are basically made of stainless steel, which will still corrode over time and affect the accuracy.

[0006] The applicant found that there were deficiencies in the measurement work of the traditional embedded settlement monitoring points: the embedded screws were too small and easy to lose, and the accuracy of the glue installation was affected.

[0007] In view of this, a copper point device for settlement monitoring is proposed. Utility Model Content

[0008] The utility model aims to provide a copper point device for settlement monitoring, which can be better buried in concrete and ensures that the device will not move easily.

[0009] The present application provides a copper point device for sedimentation monitoring, which adopts the following technical solution:

[0010] A copper point device for settlement monitoring is characterized in that it comprises a nail head, a nail cap and a nail body, the nail head is welded to the nail cap and the nail body in sequence, and a fixing device is arranged at the bottom of the nail body.

[0011] By adopting the above technical solution, there is no need to carry embedded screws during measurement and monitoring, and point devices can also be fixed to improve measurement accuracy.

[0012] Furthermore, the nail head is a hemispherical body.

[0013] Furthermore, the nail cap is a concentric ring sheet with a thickness of 2 mm.

[0014] Furthermore, the nail body is cylindrical.

[0015] Furthermore, the fixing device is A-shaped.

[0016] Furthermore, the nail head and the nail body are made of copper.

[0017] Furthermore, the nail cap is made of stainless steel.

[0018] Furthermore, the nail cap panel can be engraved.

[0019] Beneficial Effects

[0020] Compared with the prior art, the copper point device for settlement monitoring of the utility model has the advantages of being easy to carry, stable and convenient to install, and the copper nail head and nail body are more corrosion-resistant. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic rendering of the utility model as a whole.

[0023] exist Figure 1 Chinese: 1. Nail head, 2. Nail cap, 3. Nail body, 31. Fixing device. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings.

[0025] [Example 1]

[0026] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all of the embodiments.

[0027] The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0028] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.

[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] The circuits, electronic components and control modules involved are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by the utility model does not involve improvements to software and methods.

[0032] A copper point device for settlement monitoring, characterized in that it comprises a nail head 1, a nail cap 2 and a nail body 3, wherein the nail head 1 is welded to the nail cap 2 and the nail body 3 in sequence, and a fixing device 31 is provided at the lower part of the nail body 3.

[0033] By adopting the above technical solution, there is no need to carry embedded screws during measurement and monitoring, and point devices can also be fixed to improve measurement accuracy.

[0034] Furthermore, the nail head 1 is a hemispherical body.

[0035] Furthermore, the nail cap 2 is a concentric ring sheet with a thickness of 2 mm.

[0036] Furthermore, the nail body 3 is cylindrical.

[0037] Furthermore, the fixing device 31 is A-shaped.

[0038] Furthermore, the nail head 1 and the nail body 3 are made of copper.

[0039] Furthermore, the nail cap 2 is made of stainless steel.

[0040] Furthermore, the nail cap 2 panel can be engraved.

[0041] When measuring the settlement of buildings and structures, the specific location of the settlement observation point is determined according to the engineering design requirements. When pouring concrete for the structure, after determining the location of the settlement observation point, the copper point device for settlement monitoring is placed in the concrete, exposing the nail head 1 and the nail cap 2. When measuring the settlement on the ground, dig a pit according to the preset location of the copper point device for settlement monitoring. The size of the pit should be able to accommodate the copper point device for settlement monitoring and sufficient concrete. Lay a layer of sand or gravel at the bottom of the pit, then put in the copper point device for settlement monitoring, and make sure it is stable and vertical. Next, pour concrete into the pit until the concrete completely covers and fixes the copper point device for settlement monitoring. During the curing period of the concrete, it should be properly maintained to ensure its strength and stability. After the concrete solidifies, the level mark should be checked to see if it is stable and vertical, and necessary adjustments should be made.

[0042] The working process and beneficial effects of the utility model are as follows: In concrete, due to the effect of the fixing device 31, the point-shaped device is not easy to move and is more stable.

Claims

1. A copper point device for sedimentation monitoring, characterized in that: The nail head (1) comprises a nail cap (2) and a nail body (3). The nail head (1) is welded to the nail cap (2) and the nail body (3) in sequence, and a fixing device (31) is provided at the lower part of the nail body (3).

2. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail head (1) is a hemispherical shape.

3. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail cap (2) is a concentric ring thin sheet with a thickness of 2 mm.

4. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail body (3) is cylindrical.

5. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The fixing device (31) is A-shaped.

6. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail head (1) and the nail body (3) are made of copper.

7. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail cap (2) is made of stainless steel.

8. A copper point device for sedimentation monitoring according to claim 1, characterized in that: The nail cap (2) panel can be engraved with words.

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