Radiator

Abstract

The utility model discloses a radiator, which comprises a mounting plate, a radiating body and a first heat conduction assembly, and is characterized in that the mounting plate is used for placing a heating element; the heat dissipation body is fixedly arranged on one side of the mounting plate, the heat dissipation body comprises a plurality of heat dissipation fins which are arranged at intervals, and each heat dissipation fin is provided with a head part and a tail part which are opposite to each other; the first heat conduction assembly is fixedly arranged on the side, facing the mounting plate, of the heat dissipation body, one end of the first heat conduction assembly abuts against the head and makes contact with the heating element, and the other end of the first heat conduction assembly extends in the direction away from the head and is arranged along the tail so that heat of the heating element can be transmitted to the tail from the head. The utility model provides a radiator which solves the problem that an existing radiator is low in radiating efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of computer accessories, in particular to a radiator. Background Art

[0002] As the computing performance of electronic components (such as chips, processors or controllers) increases, the heat generated by electronic components (such as chips, processors or controllers) during operation is also increasing. Once the heat cannot be quickly dissipated to the outside, the computing performance of the electronic components (such as chips, processors or controllers) will decline or become disabled due to overheating. Therefore, relevant manufacturers are actively investing in the development and improvement of various forms of heat dissipation devices to improve heat dissipation efficiency.

[0003] For example, the CPU is an important component of the computer, mainly including the operation logic component, register component and control component, etc. The CPU will generate a lot of heat when running at high speed. If the CPU heat cannot be dissipated in time, the internal components of the CPU will be damaged, which will affect the normal operation of the computer.

[0004] The structure of a computer radiator usually includes a base and a plurality of cooling fins fixed to the base. In order to improve the heat dissipation effect, a fan is also fixed to the outside of the base. The cold air blown by the fan undergoes convection heat exchange with the cooling fins, so that the heat generated by the computer is dissipated to the external environment. In other words, the heat generated in the CPU will slowly transfer from the center of the cooling fins to the edge of the cooling fins, and then exchange heat with the cold air generated by the fan; however, this heat dissipation method that relies on heat transfer to transfer the heat of the CPU to the cooling fins has a low heat dissipation efficiency. Utility Model Content

[0005] The main purpose of the utility model is to provide a radiator, aiming to solve the problem of low heat dissipation efficiency of the existing radiator.

[0006] In order to achieve the above-mentioned purpose, the radiator proposed by the utility model comprises:

[0007] A mounting plate for placing heating elements;

[0008] A heat dissipation body, fixedly disposed on one side of the mounting plate, the heat dissipation body comprising a plurality of heat dissipation fins arranged at intervals, the heat dissipation fins having opposite head and tail portions; and

[0009] A first heat-conducting component is fixedly arranged on a side of the heat dissipation body facing the mounting plate, one end of the first heat-conducting component abuts against the head portion and contacts the heating element, and the other end of the first heat-conducting component extends in a direction away from the head portion and is arranged along the tail portion to transfer the heat of the heating element from the head portion to the tail portion.

[0010] Optionally, in one embodiment of the utility model, the first heat-conducting component has a first end and a second end relative to each other, and the first heat-conducting component includes two heat-conducting pipes arranged opposite to each other, and the first ends of the two heat-conducting pipes are commonly abutted against the head, and the second ends of the two heat-conducting pipes are arranged along the edge of the tail to cover the tail of the plurality of the heat dissipating fins.

[0011] Optionally, in an embodiment of the present invention, a cooling channel is formed inside the heat pipe, the cooling channel is filled with a coolant, and the coolant flows from the first end to the second end in the cooling channel.

[0012] Optionally, in an embodiment of the utility model, a heat dissipation groove is further provided inside the heat dissipation body, a plurality of heat dissipation fins are arranged at equal intervals along the periphery of the heat dissipation groove, and the heads of the heat dissipation fins are connected to the groove wall of the heat dissipation groove.

[0013] Optionally, in an embodiment of the utility model, the radiator further includes a second heat-conducting component, the second heat-conducting component includes a heat-conducting column, the heat-conducting column is fixed in the heat dissipation groove, and the heat-conducting column abuts against a side of the first heat-conducting component away from the mounting plate.

[0014] Optionally, in an embodiment of the present invention, the second heat-conducting component further includes a heat-conducting sheet, the heat-conducting sheet and the heat-conducting column are respectively arranged on two opposite sides of the first heat-conducting component, and the heat-conducting sheet is in contact with the heating element.

[0015] Optionally, in an embodiment of the utility model, the radiator further includes a locking piece, at least one of the plurality of cooling fins is provided with a first fixing hole, the first fixing hole is provided at the tail of the cooling fin, and the locking piece passes through the first fixing hole to be connected to the mounting plate.

[0016] Optionally, in one embodiment of the utility model, the radiator also includes a cooling fan, which is arranged on the side of the heat dissipation body away from the mounting plate, and the cooling fan is provided with a second fixing hole, and the locking member passes through the second fixing hole and the first fixing hole in sequence to be connected to the mounting plate.

[0017] Optionally, in an embodiment of the present invention, the heat sink further comprises an elastic member, the elastic member is arranged at an end of the locking member away from the mounting plate, the elastic member is sleeved on the outer periphery of the locking member and abuts against the second fixing hole.

[0018] Optionally, in an embodiment of the utility model, the heat dissipation fin is provided with a notch, and the notch is provided on a side of the first fixing hole away from the head.

[0019] Optionally, in an embodiment of the present invention, a shrinkage-proof groove is provided on the side of the mounting plate facing away from the heat dissipation body.

[0020] Optionally, in an embodiment of the present invention, the mounting plate is provided with a through hole, and the heating element is in contact with the first heat-conducting component through the through hole.

[0021] Compared with the prior art, in a technical solution provided by the utility model, by placing the mounting plate in the heat sink on the circuit board, the heating element on the circuit board will be fixed on the mounting plate; in order to dissipate the heat generated by the heating element in time, a heat dissipation body can also be fixed on one side of the mounting plate, wherein the heat dissipation body includes a plurality of heat dissipation fins arranged at intervals, and the plurality of heat dissipation fins can increase the heat dissipation area and improve the heat dissipation efficiency. Considering that the heating element is only partially in contact with the heat dissipation body, the efficiency of heat dissipation by heat transfer of the heat dissipation body itself is low. In this solution, a first heat conduction component in contact with the heating element is also provided on the side of the heat dissipation body facing the mounting plate, and the heat dissipation fin has a relative head and tail, and one end of the first heat conduction component is abutted against the head, and the other end is extended in a direction away from the head until it extends to the position of the tail, and is arranged along the edge of the tail; in this way, the heat generated during the operation of the heating element can be directly conducted from the head of the heat dissipation fin to the tail of the heat dissipation fin through the first heat conduction component, accelerating the heat transfer process and effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 This is a schematic structural diagram of an embodiment of the radiator of the utility model;

[0024] Figure 2 This is a structural explosion diagram of an embodiment of the radiator of the utility model;

[0025] Figure 3 This is a schematic diagram of the combined structure of the heat dissipation body, the first heat conduction component and the second heat conduction component in one embodiment of the heat sink of the utility model;

[0026] Figure 4 This is a structural schematic diagram of the first heat-conducting component in an embodiment of the radiator of the utility model;

[0027] Figure 5This is a schematic diagram of the structure of the heat dissipation body in one embodiment of the heat dissipation device of the utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the second heat-conducting component in an embodiment of the radiator of the utility model;

[0029] Figure 7 It is a structural schematic diagram of a mounting plate in an embodiment of a radiator of the utility model.

[0030] Description of Figure Numbers:

[0031] Label name Label name 100 Mounting Plate 310 Heat pipe 110 Anti-shrink channel 311 First End 120 Through Hole 313 Second end 200 Heat dissipation body 400 The second heat conducting component 210 Cooling fins 410 Thermal Conductive Column 211 head 420 Thermal Conductive Sheet 213 Tail 500 Locking parts 215 First fixing hole 600 Cooling fan 2151 gap 610 Second fixing hole 220 Heat sink 700 Elastic parts 300 The first heat conducting component

[0032] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0037] The structure of a computer radiator usually includes a base and a plurality of cooling fins fixed to the base. In order to improve the heat dissipation effect, a fan is also fixed to the outside of the base. The cold air blown by the fan undergoes convection heat exchange with the cooling fins, so that the heat generated by the computer is dissipated to the external environment. In other words, the heat generated in the CPU will slowly transfer from the center of the cooling fins to the edge of the cooling fins, and then exchange heat with the cold air generated by the fan; however, this heat dissipation method that relies on heat transfer to transfer the CPU heat to the cooling fins has a low heat dissipation efficiency.

[0038] Based on this, the utility model proposes a radiator, in which a first heat-conducting component in contact with the heating element is provided on the side of the heat dissipation body facing the mounting plate, and one end of the first heat-conducting component is abutted against the head of the heat dissipation fin, and the other end is extended in a direction away from the head until it extends to the position of the tail of the heat dissipation fin, and is arranged along the edge of the tail; in this way, the heat generated by the heating element during operation can be directly conducted from the head of the heat dissipation fin to the tail of the heat dissipation fin through the first heat-conducting component, thereby accelerating the heat transfer process.

[0039] like Figure 1 - Figure 7 As shown, the radiator comprises:

[0040] The mounting plate 100 is used to place the heating element;

[0041] The heat dissipation body 200 is fixedly disposed on one side of the mounting plate 100. The heat dissipation body 200 includes a plurality of heat dissipation fins 210 disposed at intervals. The heat dissipation fins 210 have a head portion 211 and a tail portion 213 that are opposite to each other; and

[0042] The first heat-conducting component 300 is fixedly disposed on a side of the heat dissipation body 200 facing the mounting plate 100. One end of the first heat-conducting component 300 abuts against the head portion 211 and contacts the heating element. The other end of the first heat-conducting component 300 extends in a direction away from the head portion 211 and is disposed along the tail portion 213 to transfer the heat of the heating element from the head portion 211 to the tail portion 213.

[0043] In the technical solution adopted in this embodiment, by placing the mounting plate 100 in the radiator on the circuit board, the heating element on the circuit board will be fixed on the mounting plate 100; in order to dissipate the heat generated by the heating element in time, a heat dissipation body 200 can also be fixed on one side of the mounting plate 100, wherein the heat dissipation body 200 includes a plurality of heat dissipation fins 210 arranged at intervals. The provision of a plurality of heat dissipation fins 210 can increase the heat dissipation area and improve the heat dissipation efficiency. Considering that the heating element is only partially in contact with the heat dissipation body 200, the efficiency of heat dissipation by relying solely on the heat transfer of the heat dissipation body 200 itself is low. In this solution, a first heat-conducting component 300 in contact with the heating element is further provided on the side of the heat dissipation body 200 facing the mounting plate 100. The heat dissipation fin 210 has a head 211 and a tail 213 relative to each other. By abutting one end of the first heat-conducting component 300 with the head 211 and extending the other end in a direction away from the head 211 until it reaches the position of the tail 213, and arranging it along the edge of the tail 213; in this way, the heat generated during the operation of the heating element can be directly conducted from the head 211 of the heat dissipation fin 210 to the tail 213 of the heat dissipation fin 210 through the first heat-conducting component 300, thereby reducing the temperature difference between the head 211 and the tail 213, accelerating the heat transfer process, and effectively improving the heat dissipation efficiency.

[0044] Specifically, there is no specific limitation on the number of heat sink fins 210. It is understandable that the increase in the number of heat sink fins 210 will increase the heat dissipation area. The specific number of settings can be set according to the actual heat dissipation requirements. In addition, there is no specific limitation on the distance between multiple heat sink fins 210. For example, they can be arranged at equal intervals or at any intervals. It should be explained that there is no specific limitation on the material of the first heat-conducting component 300. For example, it can be a material with high thermal conductivity such as copper or aluminum. Similarly, in this embodiment, there is no specific limitation on the shape of the first heat-conducting component 300. For example, it can be a hollow structure such as a circular ring or a square ring. Preferably, the ring is arranged around the edge of the tail 213 of the heat sink fin 210, and a connecting rod is provided in the ring. The connecting rod can be used to directly transfer the heat from the head 211 of the heat sink fin 210 to the tail 213 of the heat sink fin 210, thereby accelerating the heat transfer process on the heat sink fin 210. In addition, there is no specific limitation on the connection method between the first heat conducting component 300 and the heat dissipation body 200, for example, it can be fixedly connected by soldering, or it can be bonded, etc. It can be understood that the heat sink can be used in computers as a heat dissipation device for a central processing unit chip, and can also be used in other electronic devices that require a heat sink.

[0045] Alternatively, if Figure 3 and Figure 4 As shown, in one embodiment of the utility model, the first heat-conducting component 300 has a first end 311 and a second end 313 relative to each other. In order to maximize the contact area between the first heat-conducting component 300 and the heat-dissipating fins 210 in a limited space, the first heat-conducting component 300 includes two heat-conducting pipes 310 arranged opposite to each other. Preferably, the first ends 311 of the two heat-conducting pipes 310 are jointly abutted against the head 211, and the second ends 313 of the two heat-conducting pipes 310 are arranged along the edge of the tail 213, so as to completely cover the tails 213 of the multiple heat-dissipating fins 210, thereby completing the heat transfer from the head 211 to the tail 213 of the heat-dissipating fins 210.

[0046] Optionally, in an embodiment of the utility model, in order to further improve the heat dissipation effect, a cooling channel is formed inside the heat pipe 310, and the cooling channel is filled with a coolant. It should be noted that the coolant in this embodiment can be a cooling liquid such as cooling water or alcohol flowing in the cooling channel, and can also be a condensed gas such as hydrofluorocarbon flowing in the cooling channel; it can be understood that the coolant needs to enter the cooling channel from the first end 311 and flow out from the second end 313, and the heat is taken away by the flow of the coolant, which can further improve the heat dissipation efficiency.

[0047] Alternatively, if Figure 5As shown, in one embodiment of the utility model, in order to enable the heat dissipation body 200 to dissipate heat evenly, a heat dissipation groove 220 may be further provided inside the heat dissipation body 200, and a plurality of heat dissipation fins 210 are arranged at equal intervals along the periphery of the heat dissipation groove 220. The plurality of heat dissipation fins 210 are arranged at equal intervals, which can evenly distribute the heat generated in the heat dissipation element, and is conducive to accelerating the heat dissipation rate. In addition, the head 211 of the heat dissipation fin 210 is connected to the groove wall of the heat dissipation groove 220. In order to simplify the production process and improve the manufacturing efficiency, the heat dissipation groove 220 and the plurality of heat dissipation fins 210 are manufactured by an integrated molding process, preferably, casting molding. It should be noted that the material of the heat dissipation body 200 is not specifically limited, for example, it can be a material with high thermal conductivity such as copper or aluminum.

[0048] Alternatively, if Figure 1 , Figure 2 and Figure 6 As shown, in one embodiment of the utility model, in order to improve the heat dissipation efficiency of the heat dissipation body 200 itself, the heat sink further includes a second heat-conducting component 400, and the second heat-conducting component 400 includes a heat-conducting column 410, which is fixed in the heat dissipation slot 220, and the heat-conducting column 410 is interference-fitted with the heat dissipation slot 220, and the surface of the heat-conducting column 410 abuts against the side of the first heat-conducting component 300 away from the mounting plate 100. In this way, in addition to the first heat-conducting component 300 transferring heat from the head 211 to the tail 213 for heat dissipation, the heat can also be slowly transferred from the head 211 of the heat dissipation fin 210 to the tail 213 of the fin through the heat-conducting column 410 in the heat dissipation slot 220, so as to improve the uniformity of heat dissipation. Preferably, in another embodiment, the second heat-conducting component 400 further includes a heat-conducting sheet 420, and the heat-conducting sheet 420 and the heat-conducting column 410 are respectively arranged on opposite sides of the first heat-conducting component 300, and the heat-conducting sheet 420 is in contact with the heating element, so that the heating element is transferred to the first heat-conducting component 300 through the heat-conducting sheet 420, and then transferred to the heat-conducting column 410 by the first heat-conducting component 300, thereby expanding the heat conduction path and maximizing the heat dissipation efficiency. It should be noted that the material of the heat-conducting column 410 and the heat-conducting sheet 420 is not specifically limited, and can be, for example, copper or aluminum and other materials with high thermal conductivity.

[0049] Alternatively, if Figure 1 - Figure 3As shown, in one embodiment of the utility model, in order to facilitate the installation and disassembly of the heat dissipation body 200 and the mounting plate 100, the heat sink also includes a locking member 500, at least one of the plurality of heat dissipation fins 210 is provided with a first fixing hole 215, the first fixing hole 215 is provided at the tail 213 of the heat dissipation fin 210, and the locking member 500 is connected to the mounting plate 100 by penetrating the first fixing hole 215. It should be noted that the thickness of the heat dissipation fin 210 provided with the first fixing hole 215 is greater than the thickness of other heat dissipation fins 210 to ensure the strength of the overall structure. Preferably, the heat dissipation fin 210 provided with the first fixing hole 215 can be provided with a plurality of them, and evenly distributed, so as to improve the structural stability of the heat dissipation body 200. Of course, other fixing holes can also be provided separately for connecting and fixing with other components.

[0050] Alternatively, if Figure 2 As shown, in one embodiment of the utility model, since the radiator is a device for dissipating the heat generated when the electronic device is running, in order to accelerate the heat dissipation of the heat dissipation body 200, the radiator also includes a heat dissipation fan 600, and the heat dissipation fan 600 is arranged on the side of the heat dissipation body 200 away from the mounting plate 100. This design enables the heat dissipation fan 600 to effectively dissipate the heat from the heat dissipation body 200, and the cold air generated by the heat dissipation fan 600 can generate heat exchange with the heat on the heat dissipation fins 210, thereby maintaining the normal operation of the electronic device. In addition, in order to facilitate the fixing of the heat dissipation fan 600, the heat dissipation fan 600 is provided with a second fixing hole 610, and the locking member 500 passes through the second fixing hole 610 and the first fixing hole 215 in sequence and is connected to the mounting plate 100. This design enables the heat dissipation fan 600 to be stably fixed on the mounting plate 100 while ensuring its normal operation. The use of the locking member 500 can ensure that the heat dissipation fan 600 will not loosen or fall off during operation, thereby ensuring the stability and reliability of the electronic device.

[0051] Alternatively, if Figure 1 and Figure 2As shown, in one embodiment of the utility model, the heat sink further includes an elastic member 700, which is arranged at one end of the locking member 500 away from the mounting plate 100, and is sleeved on the outer periphery of the locking member 500, and one end of the elastic member 700 abuts against the second fixing hole 610, and its function is to provide a certain buffer and elastic force between the locking member 500 and the second fixing hole 610. The advantage of this design is that the distance between the heat dissipation body 200 and the mounting plate 100 can be effectively adjusted. Specifically, when the height of the heating element from the first heat-conducting component 300 is relatively low, the locking member 500 can be tightened by compressing the elastic member 700, so that the first heat-conducting component 300 and the heating element are in close contact; when the height of the heating element from the first heat-conducting component 300 is relatively high, the locking member 500 can be loosened under the elastic action of the elastic member 700, so that the distance between the heat dissipation body 200 and the mounting plate 100 is relatively large, and a space for placing the heating element can be reserved, thereby making the first heat-conducting component 300 and the heating element in close contact.

[0052] Alternatively, if Figure 5 As shown, in one embodiment of the utility model, in order to further improve the heat dissipation efficiency, a notch 2151 is provided on the heat dissipation fin 210. These notches 2151 are designed on the side of the first fixing hole 215 away from the head 211, so that a semi-enclosed structure is formed between the first fixing hole 215 and the locking member 500. This design not only increases the heat dissipation area, but also promotes the conduction of heat, thereby effectively improving the heat dissipation efficiency. The design of the notch 2151 not only takes into account the heat dissipation effect, but also fully considers the stability and durability of the structure. Through precise geometric design and material selection, it is ensured that the notch 2151 will not cause excessive deformation or damage to the heat dissipation fin 210 while bearing heat. In addition, this design also has the advantage of easy installation and disassembly. Through simple operation, the locking member 500 can be inserted into the first fixing hole 215 to form a semi-enclosed structure. This makes the installation and disassembly of the heat dissipation fin 210 very convenient, improving production efficiency and maintenance convenience.

[0053] Alternatively, if Figure 7 As shown, in one embodiment of the utility model, in order to facilitate the contact between the heating element and the first heat-conducting component 300, a through hole 120 can be provided on the mounting plate 100, so that the heating element contacts the first heat-conducting component 300 through the through hole 120, and the heat generated by the heating element is transferred in time. In this embodiment, the shape of the through hole 120 is not specifically limited, for example, it can be square or circular, and preferably has the same shape as the heating element.

[0054] Alternatively, if Figure 7As shown, in one embodiment of the utility model, in order to prevent the mounting plate 100 from shrinking and deforming during the production process, which affects the appearance of the mounting plate 100, an anti-shrinkage groove 110 is provided on the side of the mounting plate 100 away from the heat dissipation body 200. The anti-shrinkage groove 110 can effectively prevent the mounting plate 100 from shrinking and deforming during the production process, thereby ensuring the appearance quality of the mounting plate 100. It should be noted that a plurality of anti-shrinkage grooves 110 can be provided. Preferably, a plurality of anti-shrinkage grooves 110 are evenly arranged along the periphery of the through hole 120. This even arrangement can better ensure the stability of the mounting plate 100 and prevent it from deforming during use. There is no specific limitation on the shape of the anti-shrinkage groove 110, for example, it can be square, it can also be round, etc., as long as it can play a role in preventing shrinkage.

[0055] The above description is only an optional embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A radiator, characterized in that: The radiator comprises: A mounting plate for placing heating elements; A heat dissipation body, fixedly disposed on one side of the mounting plate, the heat dissipation body comprising a plurality of heat dissipation fins arranged at intervals, the heat dissipation fins having opposite head and tail portions; and A first heat-conducting component is fixedly arranged on a side of the heat dissipation body facing the mounting plate, one end of the first heat-conducting component abuts against the head portion and contacts the heating element, and the other end of the first heat-conducting component extends in a direction away from the head portion and is arranged along the tail portion to transfer the heat of the heating element from the head portion to the tail portion.

2. The heat sink according to claim 1, characterized in that The first heat-conducting component has a first end and a second end opposite to each other, and includes two heat-conducting pipes arranged opposite to each other, and the first ends of the two heat-conducting pipes are commonly abutted against the head, and the second ends of the two heat-conducting pipes are arranged along the edge of the tail to cover the tail of the plurality of heat-dissipating fins.

3. The heat sink according to claim 2, characterized in that A cooling channel is formed inside the heat conducting pipe. The cooling channel is filled with a coolant, and the coolant flows from the first end to the second end in the cooling channel.

4. The heat sink according to claim 1, characterized in that A heat dissipation groove is further provided inside the heat dissipation body, and a plurality of heat dissipation fins are arranged at equal intervals along the outer circumference of the heat dissipation groove, and the heads of the heat dissipation fins are connected to the groove wall of the heat dissipation groove.

5. The heat sink according to claim 4, characterized in that The heat sink further includes a second heat-conducting component, which includes a heat-conducting column. The heat-conducting column is fixed in the heat dissipation slot, and the heat-conducting column abuts against a side of the first heat-conducting component away from the mounting plate.

6. The heat sink according to claim 5, characterized in that The second heat-conducting component further includes a heat-conducting sheet, and the heat-conducting sheet and the heat-conducting column are respectively arranged on two opposite sides of the first heat-conducting component, and the heat-conducting sheet is in contact with the heating element.

7. The heat sink according to claim 1, characterized in that The radiator further includes a locking member, at least one of the plurality of heat dissipation fins is provided with a first fixing hole, the first fixing hole is provided at the tail of the heat dissipation fin, and the locking member passes through the first fixing hole to be connected to the mounting plate.

8. The heat sink according to claim 7, characterized in that The radiator further comprises a cooling fan, which is arranged on a side of the heat dissipation body away from the mounting plate. The cooling fan is provided with a second fixing hole, and the locking member passes through the second fixing hole and the first fixing hole in sequence to be connected to the mounting plate.

9. The heat sink according to claim 8, characterized in that The heat sink further comprises an elastic member, the elastic member being arranged at one end of the locking member away from the mounting plate, the elastic member being sleeved on the outer periphery of the locking member and abutting against the second fixing hole; and / or, The heat dissipation fin is provided with a notch, and the notch is arranged on a side of the first fixing hole away from the head.

10. The radiator according to any one of claims 1 to 9, characterized in that: The side of the mounting plate facing away from the heat dissipation body is provided with an anti-shrinkage groove; and / or, The mounting plate is provided with a through hole, and the heating element contacts the first heat-conducting component through the through hole.

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