Packaging structure of non-contact intelligent card with FPCB (Flexible Printed Circuit Board)

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By using the physical positioning method of positioning holes and the high-frequency antenna in the form of enameled wire in the packaging structure of the contactless smart card, the problems of high raw material cost and high scrapping rate of packaging lamination for contactless smart cards with FPCB boards are solved, and the yield rate is improved. and cost reduction effects.

CN222380121UActive Publication Date: 2025-01-21BEIJING HUAHONG INTEGRATED CIRCUIT DESIGN +1

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Patent Information

Application Number: CN202323431286.2
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2023-12-15
Publication Date: 2025-01-21
Estimated Expiration: 2033-12-15

AI Technical Summary

Technical Problem

The existing contactless smart cards with FPCB board have high raw materials cost and high scrap rate for packaging and lamination, resulting in appearance problems and low yield rate of contactless smart cards.

Method used

A packaging structure including a first coating, an intermediate layer and a second coating is adopted, precise positioning is ensured through the physical positioning of positioning holes, and the printed high-frequency antenna is replaced by a high-frequency antenna in the form of an enameled wire to reduce the area of the FPCB board.

Benefits of technology

It improves the yield rate of packaging lamination, reduces the cost of contactless smart card raw materials, ensures that the components on the FPCB board are aligned with the display area of the printed layer, and avoids relative position deviation.

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Abstract

The utility model relates to a packaging structure of a non-contact intelligent card with an FPCB (Flexible Printed Circuit Board), belongs to the technical field of packaging of intelligent cards, and solves the problem that the non-contact intelligent card with the FPCB is high in raw material cost or high in rejection rate of packaging lamination in the prior art. The film comprises a first covering film, a middle layer and a second covering film which are sequentially arranged, a first positioning hole is formed in the first covering film, a second positioning hole is formed in the middle layer, a third positioning hole is formed in the second covering film, and the first positioning hole, the second positioning hole and the third positioning hole are vertically aligned. The middle layer comprises an FPCB electronic circuit module and a wound high-frequency antenna, the wound high-frequency antenna is connected with the FPCB electronic circuit module, and the wound high-frequency antenna is an enameled wire. According to the utility model, the positioning holes are used for positioning, so that the accurate positioning of the first covering film, the second covering film and the middle layer is ensured, and the yield of packaging lamination is improved; and by adopting the high-frequency antenna in the form of the enameled wire, the area of the FPCB is reduced, and the cost of raw materials is reduced.

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Description

Technical Field

[0001] The utility model relates to the technical field of smart card packaging, in particular to a packaging structure of a contactless smart card with an FPCB board. Background Art

[0002] As contactless smart cards are used in more and more application scenarios, the functions supported by contactless smart cards are becoming more and more abundant, such as display, fingerprint, buttons, etc. The internal circuits of contactless smart cards are becoming more and more complex, from the original Inlay packaging of a contactless module to the Inlay circuit made of FPCB. FPCB is a flexible printed circuit board, which is a circuit board made of polymer materials as the substrate through printed circuits and drilling technology. It has high bendability and flexibility, good electrical properties and signal transmission efficiency. It is very suitable for making circuits and packaging into smart card products. FPCB also has shortcomings, which will greatly increase the cost of smart card raw materials.

[0003] Contactless smart cards may support human-computer interaction components such as display, fingerprint, and buttons. This requires that the display screen, fingerprint module, or buttons on the FPCB board be aligned with the display area or logo area of the printed layer during packaging and lamination. Otherwise, it will cause relative position deviation, affecting the appearance of the contactless smart card, causing the entire card to be scrapped, and reducing the yield rate of contactless smart card packaging and lamination. Utility Model Content

[0004] In view of the above analysis, the embodiment of the utility model aims to provide a packaging structure of a contactless smart card with an FPCB board, so as to solve the problem of high raw material cost or high scrap rate of packaging lamination of existing contactless smart cards with FPCB boards.

[0005] The utility model provides a packaging structure of a contactless smart card with an FPCB board, comprising a first covering film, an intermediate layer and a second covering film which are arranged in sequence, wherein the first covering film is provided with a first positioning hole, the intermediate layer is provided with a second positioning hole, and the second covering film is provided with a third positioning hole, the first positioning hole, the second positioning hole and the third positioning hole are arranged in alignment up and down, the intermediate layer comprises an FPCB board electronic circuit module and a wound high-frequency antenna, the wound high-frequency antenna is connected to the FPCB board electronic circuit module, and the wound high-frequency antenna is an enameled wire.

[0006] Furthermore, the first covering film includes a first substrate and a first bleeding site, the first bleeding site is located at two opposite sides of the first substrate, and the first positioning hole is provided on the first bleeding site.

[0007] Furthermore, the middle layer further comprises a second substrate and a second bleeding site, the second bleeding site is located at two opposite sides of the second substrate, and the second positioning hole is provided on the second bleeding site.

[0008] Furthermore, the second covering film includes a third substrate and a third bleeding site, the third bleeding site is located at two opposite sides of the third substrate, and the third positioning hole is provided on the third bleeding site.

[0009] Furthermore, a fourth positioning hole is provided on the first substrate, a fifth positioning hole is provided on the FPCB board electronic circuit module, and a sixth positioning hole is provided on the third substrate.

[0010] Furthermore, the fourth positioning hole, the fifth positioning hole and the sixth positioning hole are arranged vertically opposite to each other.

[0011] Furthermore, a slot hole is provided in the second substrate, and the FPCB board electronic circuit module is arranged in the slot hole.

[0012] Furthermore, the wound high-frequency antenna is arranged on the second substrate and around the slot.

[0013] Furthermore, the wound high-frequency antenna is provided with a first antenna tap welding point, the FPCB board electronic circuit module is provided with a second antenna tap welding point, and the first antenna tap welding point is connected to the second antenna tap welding point.

[0014] Furthermore, the FPCB board electronic circuit module is also provided with a capacitor position, and the capacitor position is arranged adjacent to the second antenna tap welding point.

[0015] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0016] (1) In the utility model, the first positioning hole of the first coating, the second positioning hole of the middle layer and the third positioning hole of the second coating are aligned vertically. The positioning holes are a physical positioning method with high positioning accuracy. Positioning by the positioning holes can ensure the precise positioning of the first coating, the second coating and the middle layer without any relative position offset, thereby improving the yield rate of packaging lamination. By replacing the printed high-frequency antenna on the FPCB board with a high-frequency antenna in the form of an enameled wire, the board area of the FPCB board is not restricted by the area of the printed high-frequency antenna, thereby reducing the area of the FPCB board, thereby reducing the cost of raw materials for contactless smart cards with FPCB boards.

[0017] (2) The utility model has a fourth positioning hole on the first substrate, a fifth positioning hole on the electronic circuit module of the FPCB board, and a sixth positioning hole on the third substrate. The fourth positioning hole, the fifth positioning hole and the sixth positioning hole are directly opposite to each other, which further ensures that the components on the FPCB board are aligned with the display area or the logo area of the printed layer without any relative position offset, thereby reducing the scrap rate of the contactless smart card packaging lamination and improving the yield rate of the packaging lamination.

[0018] In the present invention, the above-mentioned technical solutions can also be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present invention will be described in the subsequent description, and some advantages can become obvious from the description, or can be understood by implementing the present invention. The purpose and other advantages of the present invention can be achieved and obtained through the contents specifically pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are only used for the purpose of illustrating specific embodiments and are not to be considered as limiting the present invention. In the entire drawings, the same reference symbols represent the same components.

[0020] Figure 1 This is one of the structural schematic diagrams of the packaging structure of a contactless smart card with an FPCB board in a specific embodiment;

[0021] Figure 2 The second structural diagram of the packaging structure of the contactless smart card with FPCB board in a specific embodiment;

[0022] Figure 3 It is a schematic structural diagram of the intermediate layer of a specific embodiment.

[0023] Reference numerals:

[0024] 1-first coating; 11-first positioning hole; 12-first substrate; 13-first bleed position; 14-fourth positioning hole; 2-middle layer; 21-second positioning hole; 22-FPCB board electronic circuit module; 23-winding high-frequency antenna; 24-second substrate; 25-second bleed position; 26-fifth positioning hole; 27-slot hole; 28-first antenna tap welding point; 29-second antenna tap welding point; 30-capacitor position; 3-second coating; 31-third positioning hole; 32-third substrate; 33-third bleed position; 34-sixth positioning hole. DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0026] It should be noted that the electronic circuit part is a necessary circuit for realizing smart cards to support more functions, and the high-frequency antenna coil is used to provide smart card coupling energy and realize NFC communication. Due to the requirements of component layout and wiring, the electronic circuit part cannot fundamentally reduce the area of the FPCB board; the high-frequency antenna coil cannot reduce the area of the antenna because it needs to provide sufficient coupling energy for the electronic circuit, thereby reducing the area of the FPCB board.

[0027] A specific embodiment of the utility model is as follows Figure 1 As shown, a packaging structure of a contactless smart card with an FPCB board is disclosed, including a first covering film 1, an intermediate layer 2 and a second covering film 3, the intermediate layer 2 is located between the first covering film 1 and the second covering film 3, the first covering film 1 is provided with a first positioning hole 11, the intermediate layer 2 is provided with a second positioning hole 21, and the second covering film 3 is provided with a third positioning hole 31, the first positioning hole 11, the second positioning hole 21 and the third positioning hole 31 are aligned up and down, the intermediate layer 2 includes an FPCB board electronic circuit module 22 and a wound high-frequency antenna 23, the wound high-frequency antenna 23 is connected to the FPCB board electronic circuit module 22, and the wound high-frequency antenna 23 is an enameled wire.

[0028] Compared with the prior art, the packaging structure of the contactless smart card with FPCB provided in this embodiment has the first positioning hole 11 of the first coating 1, the second positioning hole 21 of the middle layer 2 and the third positioning hole 31 of the second coating 3 aligned vertically. The positioning holes are a physical positioning method with high positioning accuracy. Positioning by means of positioning holes can ensure the precise positioning of the first coating 1, the second coating 3 and the middle layer 2 without relative position offset, thereby improving the yield rate of packaging lamination. By replacing the printed high-frequency antenna on the FPCB with a high-frequency antenna in the form of an enameled wire, the board area of the FPCB is not restricted by the area of the printed high-frequency antenna, thereby reducing the area of the FPCB, thereby reducing the area of the FPCB, and achieving the purpose of reducing the cost of raw materials for the contactless smart card with FPCB.

[0029] Specifically, Figure 1 As shown, the first coating 1 includes a first substrate 12 and a first bleeding site 13. The first bleeding site 13 is located on two opposite sides of the first substrate 12. A first positioning hole 11 is provided on the first bleeding site 13. Preferably, two first positioning holes 11 are provided, and the two first positioning holes 11 are arranged along the length direction of the first bleeding site 13.

[0030] Accordingly, if Figure 1As shown, the middle layer 2 also includes a second substrate 24 and a second bleeding site 25. The second bleeding site 25 is located on two opposite sides of the second substrate 24. The second positioning hole 21 is provided on the second bleeding site 25. Preferably, two second positioning holes 21 are provided, and the two second positioning holes 21 are arranged along the length direction of the second bleeding site 25.

[0031] Accordingly, if Figure 1 As shown, the second coating 3 includes a third substrate 32 and a third bleeding site 33. The third bleeding site 33 is located on two opposite sides of the third substrate 32. The third positioning hole 31 is provided on the third bleeding site 33. Preferably, two third positioning holes 31 are provided, and the two third positioning holes 31 are arranged along the length direction of the third bleeding site 33.

[0032] The first coating 1, the middle layer 2 and the second coating 3 are positioned by aligning the first positioning hole 11, the second positioning hole 21 and the third positioning hole 31 up and down, so that the first coating 1, the middle layer 2 and the second coating 3 will not have a relative position offset, thereby reducing the scrap rate of the contactless smart card packaging lamination and improving the yield rate of the packaging lamination.

[0033] Furthermore, if Figure 2 As shown, the first substrate 12 is provided with a fourth positioning hole 14, the FPCB board electronic circuit module 22 is provided with a fifth positioning hole 26, and the third substrate 32 is provided with a sixth positioning hole 34. The fourth positioning hole 14, the fifth positioning hole 26 and the sixth positioning hole 34 are directly opposite to each other. Preferably, the fourth positioning hole 14, the fifth positioning hole 26 and the sixth positioning hole 34 are each provided with three.

[0034] In this embodiment, by aligning the first positioning hole 11, the second positioning hole 21, and the third positioning hole 31 set at the bleeding position, as well as the fourth positioning hole 14, the sixth positioning hole 34 set on the substrate, and the fifth positioning hole 26 set on the FPCB board electronic circuit module 22, it can be ensured that the components on the FPCB board are aligned with the display area or the logo area of the printed layer without any relative position offset, thereby reducing the scrap rate of the contactless smart card packaging lamination and improving the yield rate of the packaging lamination.

[0035] like Figure 3As shown, a slot 27 is provided in the second substrate 24, the FPCB board electronic circuit module 22 is provided in the slot 27, and the wound high-frequency antenna 23 is wound on the second substrate 24 and arranged around the slot 27. The wound high-frequency antenna 23 reserves a first antenna tap welding point 28, and the FPCB board electronic circuit module 22 reserves a second antenna tap welding point 29, and the first antenna tap welding point 28 is connected to the second antenna tap welding point 29, such as welding and fixing. The FPCB board electronic circuit module 22 also reserves a capacitor position 30, and the capacitor position 30 is reserved adjacent to the second antenna tap welding point 29. The resonant frequency of the wound high-frequency antenna 23 is adjusted by matching the capacitor.

[0036] In this embodiment, the wound high-frequency antenna 23 of the non-contact smart card with FPCB board is wound on the second substrate 24 by using enameled wire, and then a groove is made on the second substrate 24, and the FPCB board electronic circuit module 22 is placed therein, and the first antenna tap welding point 28 of the wound high-frequency antenna 23 is welded to the reserved second antenna tap welding point 29 of the FPCB board electronic circuit module 22 by reserving welding points on the FPCB board electronic circuit module 22. By combining the wound high-frequency antenna 23 in the form of enameled wire and the FPCB board electronic circuit module 22, the whole card function of the non-contact smart card with FPCB board is realized. At the same time, a reserved capacitor position 30 is reserved near the second antenna tap welding point 29 on the FPCB board electronic circuit module 22, and the resonant frequency of the wound high-frequency antenna 23 is adjusted by matching the capacitor, thereby achieving the optimal resonant frequency of the wound high-frequency antenna 23.

[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging structure of a contactless smart card with an FPCB, characterized in that: The invention comprises a first covering film (1), an intermediate layer (2) and a second covering film (3) which are arranged in sequence, wherein the first covering film (1) is provided with a first positioning hole (11), the intermediate layer (2) is provided with a second positioning hole (21), and the second covering film (3) is provided with a third positioning hole (31); the first positioning hole (11), the second positioning hole (21) and the third positioning hole (31) are arranged vertically aligned; the intermediate layer (2) comprises an FPCB board electronic circuit module (22) and a wound high-frequency antenna (23); the wound high-frequency antenna (23) is connected to the FPCB board electronic circuit module (22), and the wound high-frequency antenna (23) is an enameled wire.

2. The packaging structure of the contactless smart card with FPCB board according to claim 1 is characterized in that: The first coating (1) comprises a first substrate (12) and a first bleeding site (13), wherein the first bleeding site (13) is located at two opposite sides of the first substrate (12), and the first positioning hole (11) is provided on the first bleeding site (13).

3. The packaging structure of the contactless smart card with FPCB board according to claim 1, characterized in that: The intermediate layer (2) further comprises a second substrate (24) and a second bleeding site (25), wherein the second bleeding site (25) is located at two opposite sides of the second substrate (24), and the second positioning hole (21) is provided on the second bleeding site (25).

4. The packaging structure of the contactless smart card with FPCB board according to claim 2, characterized in that: The second coating (3) comprises a third substrate (32) and a third bleeding site (33), wherein the third bleeding site (33) is located at two opposite sides of the third substrate (32), and the third positioning hole (31) is provided on the third bleeding site (33).

5. The packaging structure of the contactless smart card with FPCB board according to claim 4 is characterized in that: The first substrate (12) is provided with a fourth positioning hole (14), the FPCB board electronic circuit module (22) is provided with a fifth positioning hole (26), and the third substrate (32) is provided with a sixth positioning hole (34).

6. The packaging structure of the contactless smart card with FPCB board according to claim 5, characterized in that: The fourth positioning hole (14), the fifth positioning hole (26) and the sixth positioning hole (34) are arranged vertically opposite to each other.

7. The packaging structure of the contactless smart card with FPCB board according to claim 3, characterized in that: A slot hole (27) is provided in the second substrate (24), and the FPCB electronic circuit module (22) is arranged in the slot hole (27).

8. The packaging structure of the contactless smart card with FPCB board according to claim 7, characterized in that: The wound high-frequency antenna (23) is arranged on the second substrate (24) and around the slot (27).

9. The packaging structure of a contactless smart card with an FPCB according to any one of claims 1 to 8, characterized in that: The wound high-frequency antenna (23) is provided with a first antenna tap welding point (28), the FPCB board electronic circuit module (22) is provided with a second antenna tap welding point (29), and the first antenna tap welding point (28) is connected to the second antenna tap welding point (29).

10. The packaging structure of the contactless smart card with FPCB board according to claim 9, characterized in that: The FPCB board electronic circuit module (22) is also provided with a capacitor position (30), and the capacitor position (30) is arranged adjacent to the second antenna tap welding point (29).