Wafer bearing device and machine table

Abstract

The utility model relates to a wafer bearing device and a machine table, and the device comprises a bearing part which comprises a fixed end, a free end and a bearing body located between the fixed end and the free end, the bearing body is used for bearing a plurality of wafers which are sequentially distributed at intervals in the extension direction of the bearing body, the fixed end of the bearing body is fixed to a supporting object, and the free end of the bearing body is fixed to the supporting object; a sliding groove extending in the extending direction is formed in the bearing body, the mass compensation sliding block is located in the sliding groove, the receiver is arranged on the side surface, close to a supporting object, of the mass compensation sliding block and provided with a signal receiving face intersecting with the extending direction, the transmitter is arranged on the side, close to the supporting object, of the sliding groove, and the moving device is connected with the receiver. And the emitter is used for driving the mass compensation sliding block to move towards a target balance position under the condition that the mass compensation sliding block deviates from the target balance position, and when the mass compensation sliding block is located at the target balance position, an emitting signal of the emitter is irradiated to the target center position of the signal receiving surface in the extending direction, so that the gravity center of the wafer bearing device is changed, and the wafer bearing effect is improved. Therefore, the deformation is improved.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a wafer carrier and a machine. Background Art

[0002] In the semiconductor process, wafers often need to be processed in batches. For example, in a wet etching process or a cleaning process, a carrier device is required to vertically arrange multiple wafers so as to better process the surfaces of the multiple wafers.

[0003] However, due to the differences in the number and weight of the wafers carried, the existing wafer carrying devices are prone to deformation, which in turn affects the position of the wafer in the carrying device, causing friction between the wafer and the carrying device, resulting in wear or even damage to the wafer. Utility Model Content

[0004] Based on this, it is necessary to provide a wafer carrying device and a machine to address the problem that the wafer carrying device in the prior art is prone to deformation.

[0005] In order to achieve the above-mentioned purpose, on the one hand, the present application provides a wafer carrying device, including: a carrying member, a mass compensation slider, a receiver, a transmitter, and a moving device, wherein the carrying member includes a fixed end, a free end and a carrying body located between the fixed end and the free end, the carrying body is used to carry a plurality of wafers distributed in sequence along its extension direction; the fixed end of the carrying body is fixed to a support; the carrying body includes a slide groove extending along the extension direction; the mass compensation slider is located in the slide groove; the receiver is arranged on the side surface of the mass compensation slider close to the support, and has a signal receiving surface intersecting with the extension direction; the transmitter is arranged on a side of the slide groove close to the support; the moving device is connected to the receiver, and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position; when the mass compensation slider is at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction.

[0006] In one embodiment, the signal receiving surface may include a strip-shaped receiving surface or a planar receiving surface.

[0007] In one embodiment, the shape of the output port of the transmitter for outputting the output signal may include at least one of a point-shaped output port, a line-shaped output port, and a cross-shaped output port.

[0008] In one embodiment, the moving device includes: a control valve and a cylinder; wherein the control valve is connected to the receiver, and is used to inflate when the mass compensation slider deviates from the target balance position in a direction close to the support, and to deflate when the mass compensation slider deviates from the target balance position in a direction away from the support; the cylinder is connected to the mass compensation slider and the control valve, and is used to extend in a direction away from the support when the control valve is inflated, and to contract in a direction close to the support when the control valve is deflated, and to drive the mass compensation slider to move toward the target balance position.

[0009] In one embodiment, the moving device includes: a transmission bar and a motor; wherein the transmission bar is connected to the mass compensation slider, and is used to drive the mass compensation slider to move toward the target balance position; the motor is connected to the receiver and the transmission bar, and is used to rotate when the mass compensation slider deviates from the target balance position, and drive the transmission bar to rotate.

[0010] In one of the embodiments, the transmission bar is a gear bar; the bottom of the mass compensation slider is a toothed structure engaged with the gear bar.

[0011] In one embodiment, the moving device includes: a linear motor, configured to drive the mass compensation slider to move toward the target equilibrium position when the mass compensation slider deviates from the target equilibrium position.

[0012] In one embodiment, the moving device includes: a screw and a motor; wherein the screw is connected to the mass compensation slider and is used to drive the mass compensation slider to move toward the target balance position; the motor is connected to the receiver and the screw and is used to work when the mass compensation slider deviates from the target balance position and drive the screw to rotate.

[0013] In one of the embodiments, the carrier further includes: a plurality of grooves, which are located on the contact surface between the carrier body and the wafer and are sequentially spaced apart and distributed in a direction toward the free end, for supporting the wafer.

[0014] In a second aspect, the present application further provides a machine, comprising a wafer carrying device as described in any one of the embodiments of the present application.

[0015] The wafer carrier and machine of the present application have the following unexpected beneficial effects:

[0016] The wafer carrier and the machine platform of the present application are provided with a carrier, a mass compensation slider, a receiver, a transmitter and a moving device, wherein the carrier comprises a fixed end, a free end and a carrier body located between the fixed end and the free end, the carrier body is used to carry a plurality of wafers distributed in sequence along its extension direction, the fixed end of the carrier body is fixed to a support, the carrier body comprises a slide groove extending along the extension direction, the mass compensation slider is located in the slide groove and can be horizontally displaced relative to the slide groove, the receiver is arranged on the side surface of the mass compensation slider close to the support, and has a signal receiving surface intersecting with the extension direction, the transmitter is arranged on a side of the slide groove close to the support, wherein the transmitter is used to transmit a signal such as a laser signal, the receiver is used to receive the signal emitted by the transmitter, the moving device is connected to the receiver, and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position, wherein when the mass compensation slider is located at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction, thereby changing the center of gravity of the wafer carrier and improving the deformation of the wafer carrier.

[0017] The present application arranges a mass compensation slider in the slide groove of the carrier body, and arranges a transmitter and a receiver in the slide groove and on the mass compensation slider respectively. When the wafer carrier device is not deformed, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction, and when the carrier body is bent downward, the outgoing signal of the transmitter will be irradiated to above the target center position of the signal receiving surface along the extension direction. By moving the position of the mass compensation slider in the direction close to the fixed end, the position where the outgoing signal irradiates the signal receiving surface can be made to approach the target center position, thereby achieving the purpose of improving the deformation of the wafer carrier device. Similarly, when it is determined that the carrier body is bent upward according to the position where the outgoing signal irradiates the signal receiving surface, the purpose of improving the deformation of the wafer carrier device can also be achieved by changing the position of the mass compensation slider. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 is a schematic structural diagram of a wafer carrying device in an embodiment;

[0020] Figure 2 is a schematic structural diagram of a wafer carrying device in another embodiment;

[0021] Figure 3aA schematic diagram of the structure of a wafer supporting device in a deformed state in an embodiment;

[0022] Figure 3b A schematic diagram of a route for an outgoing signal when a wafer supporting device is in a deformed state in one embodiment;

[0023] Figure 4a It is a structural schematic diagram of a wafer supporting device in another embodiment in a deformed state;

[0024] Figure 4b A schematic diagram of a route for an outgoing signal when the wafer supporting device is in a deformed state in another embodiment;

[0025] Figure 5 Schematic diagram of the structure of a moving device for a wafer carrier in one embodiment.

[0026] Description of reference numerals:

[0027] 100, wafer; 200, wafer carrier; 210, carrier; 211, groove; 220, mass compensation slider; 230, receiver; 231, target center position; 240, transmitter; 250, moving device; 251, control valve; 252, cylinder; 260, support. DETAILED DESCRIPTION

[0028] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0031] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0032] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0033] When used herein, the singular forms "a", "an" and "the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0035] Please refer to Figure 1As mentioned in the background technology, in the semiconductor process, it is often necessary to process the wafers 100 in batches. For example, in the wet etching process or the cleaning process, a wafer carrier 200 is required to vertically arrange multiple wafers 100 so as to better process the surfaces of the multiple wafers 100. However, due to the differences in the number and weight of the wafers 100 carried, the existing wafer carrier 200 is prone to deformation, which in turn affects the position of the wafer 100 in the wafer carrier 200, causing friction between the wafer 100 and the wafer carrier 200, resulting in wear or even damage to the wafer 100. In some related technologies, the operator can judge the position of the wafer 100 by naked eye observation, and manually adjust the position of the displaced wafer 100, but naked eye observation or manual operation has limitations and cannot solve the problem of wafer 100 wear.

[0036] See also Figure 2 The present application provides a wafer carrying device, comprising: a carrying member 210, a mass compensation slider 220, a receiver 230, a transmitter 240 and a moving device 250; wherein the carrying member 210 comprises a fixed end, a free end and a carrying body located between the fixed end and the free end, the carrying body being used to carry a plurality of wafers distributed sequentially along its extension direction; the fixed end of the carrying body is fixed to a support 260; the carrying body comprises a slide groove 270 extending along the extension direction; the mass compensation slider 220 is located in the slide groove 270; the receiver 230 is arranged A signal receiving surface (not shown) intersecting with the extension direction is provided on the side surface of the mass compensation slider 220 close to the support 260; the transmitter 240 is arranged on the side of the slide groove 270 close to the support 260; the moving device 250 is connected to the receiver 230, and is used to drive the mass compensation slider 220 to move toward the target balance position when the mass compensation slider 220 deviates from the target balance position; when the mass compensation slider 220 is located at the target balance position, the outgoing signal of the transmitter 240 is irradiated to the target center position of the signal receiving surface along the extension direction.

[0037] As an example, the contact surface between the carrier body and the wafer may include multiple guide components, which are used to accommodate multiple wafers. For example, the guide components may be grooves, clamps, etc., and each guide component extends along the Y-axis direction. The wafers are arranged in sequence along the extension direction (parallel to the X-axis) on the carrier body. The fixed end of the carrier 210 is fixed to the support 260, and the length of the support 260 in the direction parallel to the Y-axis may be less than or equal to the length of the carrier 210 in the direction parallel to the Y-axis.

[0038] As an example, the slide groove 270 may be located at the bottom of the support body, or on the side of the support body in the Y-axis direction, and the width of the slide groove 270 in the Z-axis direction is equal to or greater than the thickness of the mass compensation slider 220 in the Z-axis direction, so that the mass compensation slider 220 can move horizontally relative to the slide groove 270; in addition, the width of the slide groove 270 in the Y-axis direction may be greater than the width of the mass compensation slider 220 in the Y-axis direction, and less than or equal to the width of the support body in the Y-axis direction.

[0039] As an example, the signal receiving surface may be perpendicular to the extension direction of the support body (the direction parallel to the X-axis). The transmitter 240 may include a laser transmitter, an infrared transmitter, a light emitting diode (LED) transmitter, etc., and the type of the receiver 230 corresponds to the type of the transmitter 240. In other embodiments, the transmitter 240 may be disposed on the side surface of the mass compensation slider 220 close to the support 260, and the receiver 240 may be disposed on one side of the slide groove 270 close to the support 260.

[0040] The target equilibrium position is the position of the mass compensation slider 220 in the slide slot 270 when the wafer support device is not deformed. As an example, the target center position can be the center of the signal receiving surface or the middle line of the signal receiving surface perpendicular to the Z-axis direction.

[0041] Please refer to Figure 4a , Figure 4b , Figure 5 As an example, when the wafer carrier is not deformed, the outgoing signal of the transmitter 240 is irradiated to the target center position 231 of the signal receiving surface along the extension direction; when the carrier body is bent downward, the outgoing signal of the transmitter 240 will be irradiated to the upper side of the target center position 231 of the signal receiving surface along the extension direction, and by moving the position of the mass compensation slider 220 in a direction close to the fixed end, the position where the outgoing signal irradiates the signal receiving surface can be made to tend to the target center position 231, thereby achieving the purpose of improving the deformation of the wafer carrier; similarly, when the carrier body is bent upward, the outgoing signal of the transmitter 240 will be irradiated to the lower side of the target center position 231 of the signal receiving surface along the extension direction, and by moving the position of the mass compensation slider 220 in a direction away from the fixed end, the position where the outgoing signal irradiates the signal receiving surface can be made to tend to the target center position 231, thereby also achieving the purpose of improving the deformation of the wafer carrier.

[0042] In the above embodiment, a carrier, a mass compensation slider, a receiver, a transmitter and a moving device are provided, wherein the carrier includes a fixed end, a free end and a carrier body located between the fixed end and the free end, the carrier body is used to carry a plurality of wafers distributed in sequence along its extension direction, the fixed end of the carrier body is fixed to a support, the carrier body includes a slide groove extending along the extension direction, the mass compensation slider is located in the slide groove and can be horizontally displaced relative to the slide groove, the receiver is provided on the side surface of the mass compensation slider close to the support, and has a signal receiving surface intersecting with the extension direction, the transmitter is provided on a side of the slide groove close to the support, wherein the transmitter is used to transmit a signal such as a laser signal, the receiver is used to receive the signal emitted by the transmitter, the moving device is connected to the receiver, and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position, wherein when the mass compensation slider is located at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction, thereby changing the center of gravity of the wafer carrier and improving the deformation of the wafer carrier.

[0043] In one embodiment, please continue to refer to Figure 2 The carrier also includes: a plurality of grooves 211, which are located on the contact surface between the carrier body and the wafer, and are distributed in sequence along the direction toward the free end, for carrying the wafer.

[0044] As an example, the grooves 211 extend along the Y-axis direction and are spaced in sequence along the X-axis direction. The shape of the projection of the grooves 211 on the XOZ plane may include regular shapes such as an inverted triangle, an equilateral triangle, a rectangle, a trapezoid, etc., and may also include irregular shapes. The shapes of the above grooves 211 are only examples. In actual embodiments, grooves 211 of other shapes may also be selected according to requirements.

[0045] In one embodiment, the signal receiving surface may include a strip-shaped receiving surface; the shape of the output port of the transmitter for outputting the outgoing signal may include a point-shaped output port, a line-shaped output port, or a cross-shaped output port.

[0046] The shape of the outgoing signal is the same as the shape of the output port of the transmitter. As an example, the strip receiving surface can extend along the Z-axis direction, and the extension direction of the linear output port can be perpendicular to the Z-axis direction. In the case where the signal receiving surface is a strip receiving surface, the target center position can be the midpoint of the strip receiving surface in the Z-axis direction. Whether the support body is deformed can be determined based on the straight-line distance between the point-shaped outgoing signal, the midpoint of the linear outgoing signal, the cross center of the cross outgoing signal and the target center position.

[0047] In the above embodiment, the accuracy of determining the deformation of the supporting body can be improved by setting the shape of the output port of the emitter.

[0048] In one embodiment, the signal receiving surface may include a planar receiving surface; the shape of the output port of the transmitter for outputting the outgoing signal may include a point-shaped output port, a line-shaped output port, or a cross-shaped output port.

[0049] As an example, the plane receiving surface is a plane parallel to the YOZ plane, the extension direction of the linear output port can be perpendicular to the Z-axis direction, and when the signal receiving surface is a plane receiving surface, the target center position can be the center of the plane receiving surface, and the support body can be judged whether it is deformed according to the distance component of the point-shaped emission signal, the midpoint of the linear emission signal, the straight-line distance between the cross center of the cross emission signal and the target center position in the Z-axis direction. In addition, it is also possible to judge whether the support body is deformed according to the distance component of the point-shaped emission signal, the midpoint of the linear emission signal, the cross center of the cross emission signal and the target center position in the Y-axis direction.

[0050] In the above embodiment, when the signal receiving surface includes a planar receiving surface, in addition to being able to determine the bending of one end of the supporting body parallel to the Y-axis, the bending of one end of the supporting body parallel to the X-axis can also be determined, further expanding the adjustment range of the deformation of the supporting body.

[0051] In one embodiment, the wafer carrier device also includes: a control circuit, which is connected to the receiver and the moving device respectively, and is used to output a first control signal when the position of the signal receiving surface irradiated by the outgoing signal is upwardly offset relative to the target center position, and output a second control signal when the position of the signal receiving surface irradiated by the outgoing signal is downwardly offset relative to the target center position; the moving device is used to drive the mass compensation slider to move in a direction approaching the support when the first control signal is received, and to drive the mass compensation slider to move in a direction away from the support when the second control signal is received.

[0052] As an example, the first control signal may include a high level signal, and the second control signal may include a low level signal; conversely, the first control signal may include a low level signal, and the second control signal may include a high level signal. In other embodiments, the first control signal and the second control signal may also be other signal types.

[0053] Please refer to Figure 5In one embodiment, the moving device includes: a control valve 251 and a cylinder 252; wherein the control valve 251 is connected to the receiver 240, and is used to inflate when the mass compensation slider 220 deviates from the target equilibrium position in a direction close to the support 260, and to deflate when the mass compensation slider 220 deviates from the target equilibrium position in a direction away from the support 260; the cylinder 252 is connected to the mass compensation slider 220 and the control valve 251, and is used to extend in a direction away from the support 260 when the control valve 251 is inflated, and to contract in a direction close to the support 260 when the control valve 251 is deflated, and drive the mass compensation slider 220 to move toward the target equilibrium position.

[0054] As an example, when the control valve 251 receives a high level signal, deflation may be performed; and when the control valve 251 receives a low level signal, inflation may be performed. Specifically, the control valve 251 may include a solenoid valve.

[0055] In one embodiment, the moving device includes: a transmission bar and a motor; wherein the transmission bar is connected to the mass compensation slider and is used to drive the mass compensation slider to move toward the target balance position; the motor is connected to the receiver and the transmission bar and is used to rotate when the mass compensation slider deviates from the target balance position and drive the transmission bar to rotate.

[0056] As an example, the transmission bar may include at least one of a gear bar, a conveyor belt, and a chain. In the case where the transmission bar is a gear bar, the bottom of the mass compensation slider is a toothed structure engaged with the gear bar, thereby reducing the relative displacement between the mass compensation slider and the transmission bar and improving the accuracy of the mobile device control.

[0057] In one embodiment, the moving device includes: a linear motor, and the linear motor is used to drive the mass compensation slider to move toward the target equilibrium position when the mass compensation slider deviates from the target equilibrium position.

[0058] In the above embodiment, the linear motor can directly convert the electrical energy into the mechanical energy of the linear motion, thereby improving the simplicity of the mobile device and reducing the volume of the wafer carrying device.

[0059] In one embodiment, the moving device includes: a screw and a motor; wherein the screw is connected to the mass compensation slider and is used to drive the mass compensation slider to move toward a target balance position; the motor is connected to the receiver and the screw and is used to rotate when the mass compensation slider deviates from the target balance position and drive the screw to rotate.

[0060] As an example, when the moving device includes a lead screw, the bottom of the mass compensation slider can be fixed to a threaded nut on the lead screw, so that when the lead screw rotates, the mass compensation slider moves following the movement of the threaded nut.

[0061] The present application also provides a machine, including a wafer carrying device, wherein the wafer carrying device includes: a carrying member, a mass compensation slider, a receiver, a transmitter and a moving device; the carrying member includes a fixed end, a free end and a carrying body located between the fixed end and the free end, the carrying body is used to carry a plurality of wafers distributed in sequence along its extension direction; the fixed end of the carrying body is fixed to a support; the carrying body includes a slide groove extending along the extension direction; the mass compensation slider is located in the slide groove; the receiver is arranged on the side surface of the mass compensation slider close to the support, and has a signal receiving surface intersecting with the extension direction; the transmitter is arranged on one side of the slide groove close to the support; the moving device is connected to the receiver, and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position; when the mass compensation slider is at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction.

[0062] In one embodiment, the signal receiving surface may include a strip-shaped receiving surface or a planar receiving surface.

[0063] In one embodiment, the shape of the output port of the transmitter for outputting the outgoing signal may include at least one of a point-shaped output port, a line-shaped output port, and a cross-shaped output port.

[0064] In one embodiment, the moving device includes: a control valve and a cylinder; wherein the control valve is connected to a receiver, and is used to inflate when the mass compensation slider deviates from the target balance position in a direction close to the support, and to deflate when the mass compensation slider deviates from the target balance position in a direction away from the support; the cylinder is connected to the mass compensation slider and the control valve, and is used to extend in a direction away from the support when the control valve is inflated, and to contract in a direction close to the support when the control valve is deflated, and to drive the mass compensation slider to move toward the target balance position.

[0065] In one embodiment, the moving device includes: a transmission bar and a motor; wherein the transmission bar is connected to the mass compensation slider and is used to drive the mass compensation slider to move toward a target balance position; the motor is connected to the receiver and the transmission bar and is used to rotate when the mass compensation slider deviates from the target balance position and drive the transmission bar to rotate.

[0066] In one embodiment, the transmission bar is a gear bar; the bottom of the mass compensation slider is a toothed structure engaged with the gear bar.

[0067] In one embodiment, the moving device includes: a linear motor, which is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position.

[0068] In one embodiment, the moving device includes: a screw and a motor; wherein the screw is connected to the mass compensation slider and is used to drive the mass compensation slider to move toward the target balance position; the motor is connected to the receiver and the screw and is used to work when the mass compensation slider deviates from the target balance position and drive the screw to rotate.

[0069] In one embodiment, the carrier further includes: a plurality of grooves, which are located on the contact surface between the carrier body and the wafer and are sequentially spaced apart in a direction toward the free end, for carrying the wafer.

[0070] The wafer carrier and machine of the present application have the following unexpected beneficial effects:

[0071] The wafer carrier and the machine platform of the present application are provided with a carrier, a mass compensation slider, a receiver, a transmitter and a moving device, wherein the carrier comprises a fixed end, a free end and a carrier body located between the fixed end and the free end, the carrier body is used to carry a plurality of wafers distributed in sequence along its extension direction, the fixed end of the carrier body is fixed to a support, the carrier body comprises a slide groove extending along the extension direction, the mass compensation slider is located in the slide groove and can be horizontally displaced relative to the slide groove, the receiver is arranged on the side surface of the mass compensation slider close to the support, and has a signal receiving surface intersecting with the extension direction, the transmitter is arranged on a side of the slide groove close to the support, wherein the transmitter is used to transmit a signal such as a laser signal, the receiver is used to receive the signal emitted by the transmitter, the moving device is connected to the receiver, and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position, wherein when the mass compensation slider is located at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction, thereby changing the center of gravity of the wafer carrier and improving the deformation of the wafer carrier.

[0072] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A wafer carrying device, characterized in that: include: A carrier, comprising a fixed end, a free end and a carrier body located between the fixed end and the free end, wherein the carrier body is used to carry a plurality of wafers sequentially spaced and distributed along its extension direction; the fixed end of the carrier body is fixed to a support; and the carrier body comprises a slide groove extending along the extension direction; A mass compensation slider is located in the slide groove; a receiver, disposed on a side surface of the mass compensation slider close to the support, and having a signal receiving surface intersecting with the extension direction; A transmitter is arranged on a side of the slideway close to the support; A moving device is connected to the receiver and is used to drive the mass compensation slider to move toward the target balance position when the mass compensation slider deviates from the target balance position; when the mass compensation slider is located at the target balance position, the outgoing signal of the transmitter is irradiated to the target center position of the signal receiving surface along the extension direction.

2. The wafer carrier device according to claim 1, characterized in that: The signal receiving surface may include a strip-shaped receiving surface or a planar receiving surface.

3. The wafer carrier device according to claim 1, characterized in that: The shape of the output port of the transmitter for outputting the outgoing signal may include at least one of a point-shaped output port, a line-shaped output port, and a cross-shaped output port.

4. The wafer carrier according to any one of claims 1 to 3, characterized in that: The mobile device comprises: a control valve connected to the receiver, for inflating when the mass compensation slider deviates from the target equilibrium position in a direction close to the support, and for deflation when the mass compensation slider deviates from the target equilibrium position in a direction away from the support; The cylinder is connected to the mass compensation slider and the control valve, and is used to extend in a direction away from the support when the control valve is inflated, and to contract in a direction close to the support when the control valve is deflated, and to drive the mass compensation slider to move toward the target equilibrium position.

5. The wafer carrier according to any one of claims 1 to 3, characterized in that: The mobile device comprises: A transmission bar connected to the mass compensation slider and used to drive the mass compensation slider to move toward the target equilibrium position; The motor is connected to the receiver and the transmission bar, and is used for rotating when the mass compensation slider deviates from the target equilibrium position, and driving the transmission bar to rotate.

6. The wafer carrier device according to claim 5, characterized in that: The transmission bar is a gear bar; the bottom of the mass compensation sliding block is a toothed structure engaged with the gear bar.

7. The wafer carrier according to any one of claims 1 to 3, characterized in that: The mobile device comprises: The linear motor is used to drive the mass compensation slider to move toward the target equilibrium position when the mass compensation slider deviates from the target equilibrium position.

8. The wafer carrier device according to any one of claims 1 to 3, characterized in that: The mobile device comprises: A lead screw connected to the mass compensation slider and used to drive the mass compensation slider to move toward the target equilibrium position; The motor is connected to the receiver and the lead screw, and is used to work when the mass compensation slider deviates from the target equilibrium position and drive the lead screw to rotate.

9. The wafer carrier according to any one of claims 1 to 3, characterized in that: The carrier also includes: A plurality of grooves are located on the contact surface between the supporting body and the wafer and are sequentially spaced and distributed in a direction toward the free end for supporting the wafer.

10. A machine, characterized in that: A wafer carrier comprising the wafer carrier described in any one of claims 1 to 9.

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