Scribing machine for NTC temperature sensor production

Abstract

The utility model discloses a scribing machine for NTC temperature sensor production, which comprises a rack, a scribing mechanism and a positioning mechanism are arranged on the rack, the positioning mechanism comprises a fixing seat, at least two first positioning columns for fixing a cutting plate are arranged on the fixing seat upwards, and the cutting plate is arranged on the fixing seat. First positioning holes matched with the first positioning columns are formed in the circumferential direction of the cutting plate, the cutting plate is upwards provided with second positioning columns used for fixing the wafer, and a bonding adhesive tape used for integrally bonding the bottom of the wafer is further fixedly laid at the upper end of the cutting plate. Second positioning grooves matched with the second positioning columns are formed in the periphery of the lower end of the wafer, by arranging the positioning mechanism, the wafer is pasted to the cutting plate in the cutting process, then the cutting plate is fixed to the fixing base, fixing and positioning of the wafer are completed, and the wafer is prevented from deviating in the cutting process. And through the arrangement of the cutting plate, the wafer can be pasted on the cutting plate in advance and then placed on the fixed seat, so that the working procedure time is saved, and the efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of resistor production equipment production, in particular to a dicing machine for producing NTC temperature sensors. Background Art

[0002] When producing NTC temperature sensors, one of the steps requires dicing the wafer into chips, but the current wafer dicing machine cannot fix the wafer well during the wafer cutting process.

[0003] For example, the patent with patent number CN 211762655 U discloses a wafer dicing machine for chip manufacturing, including a machine base, an X-axis transmission base and a Y-axis transmission base, the machine base is provided with a telescopic platform, a groove and a first motor, the telescopic platform is fixed to the front end of the machine base by bolts, a wafer placement table is fixed to the top of the telescopic platform by bolts, the groove is opened at the rear end of the top of the machine base, a lower screw is connected in the groove by a bearing interference fit, the first motor is fixed to the right rear end of the machine base by bolts, and the first motor is connected to the lower screw pin, the X-axis transmission base is placed on the top of the groove, and the Y-axis transmission base is placed on the top of the X-axis transmission base. During the wafer cutting process, the wafer is directly placed on the cutting table, and the wafer is easily offset during the cutting process, affecting the cutting effect of the wafer. Utility Model Content

[0004] Purpose of the utility model:

[0005] In order to overcome the problems existing in the prior art, the utility model provides a dicing machine for the production of NTC temperature sensors. By setting a positioning mechanism, a wafer is adhered to a cutting board during the cutting process, and the cutting board is then fixed on a fixing seat, so that the wafer is fixedly positioned and the wafer is prevented from shifting during the cutting process. By setting a cutting board, the wafer can be adhered to the cutting board in advance and then placed on the fixing seat, which saves the time of the process and improves the efficiency.

[0006] In order to solve the above problems, the utility model adopts the following technical solutions:

[0007] A dicing machine for producing NTC temperature sensors comprises a frame, on which a dicing mechanism and a positioning mechanism are installed, the dicing mechanism comprises a translation assembly, the translation assembly is fixedly connected to a first mounting seat, the upper end of the first mounting seat is fixedly connected to a rotating motor, the output end of the rotating motor is connected to a cutting motor seat, a cutting motor is installed in the cutting motor seat, and the output end of the cutting motor is connected to a grinding wheel cutting blade; the positioning mechanism comprises a fixed seat, the fixed seat is upwardly provided with at least two first positioning columns for fixing a cutting plate, the circumference of the cutting plate is provided with first positioning holes adapted to the first positioning columns, the cutting plate is upwardly provided with second positioning columns for fixing a wafer, the upper end of the cutting plate is also fixedly provided with an adhesive tape for bonding the bottom of the wafer as a whole, and the outer circumference of the lower end of the wafer is provided with a second positioning groove adapted to the second positioning column.

[0008] Preferably, the translation assembly includes a second mounting seat and an X-axis control motor slidably connected to two X-axis sliding rods, the output end of the X-axis control motor is connected to an X-axis screw threadedly connected to the second mounting seat, two Y-axis sliding rods and a Y-axis control motor are fixedly connected to the second mounting seat, the two Y-axis screw rods are slidably connected to a first mounting seat, and the output end of the Y-axis control motor is connected to a Y-axis screw threadedly connected to the first mounting seat.

[0009] Preferably, a liquid storage chamber for storing wafer cutting liquid is fixed to the upper end of the mounting seat, and an electric nozzle for spraying wafer cutting liquid on the wafer being cut is connected to the bottom of the liquid storage chamber.

[0010] Preferably, the longitudinal cross-sections of the upper ends of the first positioning column and the second positioning column are both trapezoidal in shape, narrow at the top and wide at the bottom.

[0011] Preferably, a dust chamber is installed at the upper end of the first mounting seat, a suction fan is installed in the dust chamber, and an air inlet is opened at the bottom of the mounting seat, which is connected to the dust chamber.

[0012] Working principle: First, fix the wafer through the second positioning column and stick it to the cutting seat through adhesive tape, and then fix the cutting seat to the fixing seat through the first positioning column to complete the positioning and fixing of the wafer. Then, the first mounting seat is controlled to move along the X-axis and Y-axis through the translation component. At the same time, the cutting motor controls the grinding wheel cutting blade to cut the wafer in all directions. During this process, the electric nozzle sprays the wafer cutting fluid on the cutting position, and the vacuum cleaner collects the generated dust.

[0013] Beneficial effects: Compared with the prior art, the utility model has the following advantages:

[0014] By setting up a positioning mechanism, the wafer is adhered to the cutting board during the cutting process, and then the cutting board is fixed on the fixing seat to complete the fixed positioning of the wafer and prevent the wafer from shifting during the cutting process; by setting up a cutting board, the wafer can be adhered to the cutting board in advance and then placed on the fixing seat, which saves the process time and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model is a three-dimensional Figure 1 ;

[0016] Figure 2 The utility model is a three-dimensional Figure 2 ;

[0017] Figure 3 It is a partially enlarged three-dimensional view of the dicing mechanism of the utility model. Figure 1 ;

[0018] Figure 4 It is a partially enlarged three-dimensional view of the dicing mechanism of the utility model. Figure 2 ;

[0019] Figure 5 This is the installation diagram of the positioning mechanism of the utility model. Figure 1 ;

[0020] Figure 6 This is the installation diagram of the positioning mechanism of the utility model. Figure 2 ;

[0021] Description of figure markings:

[0022] 1. Frame; 2. Slicing mechanism; 21. Translation assembly; 211. X-axis slide bar; 212. Second mounting seat; 213. X-axis control motor; 214. X-axis lead screw; 215. Y-axis slide bar; 216. Y-axis control motor; 217. Y-axis lead screw; 22. Rotating motor; 23. First mounting seat; 24. Cutting motor seat; 25. Grinding wheel cutting disc; 26. Liquid storage chamber; 27. Electric nozzle; 28. Dust chamber; 3. Positioning mechanism; 31. Fixed seat; 32. First positioning column; 33. Cutting plate; 34. First positioning hole; 35. Second positioning column; 36. Wafer; 37. Second positioning groove; 38. Adhesive tape. DETAILED DESCRIPTION

[0023] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0024] Any feature disclosed in this specification (including any additional claims, abstracts and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0026] like Figure 1-6 As shown, a dicing machine for producing NTC temperature sensors includes a frame 1, on which a dicing mechanism 2 and a positioning mechanism 3 are installed, the dicing mechanism includes a translation component 21, the translation component 21 is fixedly connected to a first mounting seat 23, the upper end of the first mounting seat 23 is fixedly connected to a rotating motor 22, the output end of the rotating motor 22 is connected to a cutting motor seat 24, a cutting motor is installed in the cutting motor seat 24, and the output end of the cutting motor is connected to a grinding wheel cutting blade 25; the positioning mechanism 3 includes a fixed seat 31, the fixed seat 31 is upwardly provided with at least two first positioning columns 32 for fixing a cutting plate 33, the circumference of the cutting plate 33 is provided with first positioning holes 34 adapted to the first positioning columns 32, the cutting plate 33 is upwardly provided with second positioning columns 35 for fixing a wafer 36, the upper end of the cutting plate 33 is also fixedly laid with an adhesive tape 38 for bonding the bottom of the wafer 36 as a whole, and the lower end periphery of the wafer 36 is provided with a second positioning groove 37 adapted to the second positioning column 35. By setting up a positioning mechanism, the wafer is adhered to the cutting board during the cutting process, and then the cutting board is fixed on the fixing seat to complete the fixed positioning of the wafer and prevent the wafer from shifting during the cutting process; by setting up a cutting board, the wafer can be adhered to the cutting board in advance and then placed on the fixing seat, which saves the process time and improves efficiency.

[0027] In this embodiment, the translation assembly 21 includes a second mounting seat 212 and an X-axis control motor 213 slidably connected to two X-axis slide bars 211, the output end of the X-axis control motor 213 is connected to an X-axis screw rod 214 threadedly connected to the second mounting seat, two Y-axis slide bars 215 and a Y-axis control motor 216 are fixedly connected to the second mounting seat 212, and the two Y-axis slide bars 215 are slidably connected to the first mounting seat 23, the output end of the Y-axis control motor 216 is connected to a Y-axis screw rod 217 threadedly connected to the first mounting seat, the X-axis control motor 213 drives the X-axis screw rod 214 to rotate, thereby driving the second mounting seat 212 to move along the X-axis, and the Y-axis control motor 213 drives the Y-axis screw rod 217 to rotate, thereby driving the first mounting seat 23 to move along the Y-axis, so as to facilitate X-axis and Y-axis cutting of the wafer.

[0028] In this embodiment, a liquid storage chamber 26 for storing wafer cutting fluid is also fixed at the upper end of the mounting seat 23, and an electric nozzle 27 for spraying wafer cutting fluid on the wafer 36 being cut is connected to the bottom of the liquid storage chamber 26. The electric nozzle is used to spray the wafer cutting fluid on the cutting position to reduce dust generation.

[0029] In the present embodiment, the longitudinal cross-sections of the upper ends of the first positioning column 32 and the second positioning column 35 are both trapezoidal in shape, narrow at the top and wide at the bottom. The longitudinal cross-section of the first positioning column 32 is a trapezoidal in shape, narrow at the top and wide at the bottom, which is convenient for fixing the fixing seat and the cutting plate. The longitudinal cross-section of the upper end of the second positioning column 35 is a trapezoidal in shape, narrow at the top and wide at the bottom, which is convenient for fixing the cutting plate and the wafer. Since an adhesive tape 38 is provided at the upper end of the cutting seat, once the bonding position is offset, the tape needs to be replaced for subsequent re-bonding. Therefore, adopting this structure can effectively improve the wafer fixing efficiency. When the wafer is installed mechanically, even if there is a slight deviation when placing the wafer or the cutting plate, it can be accurately installed.

[0030] In this embodiment, a dust chamber 28 is installed at the upper end of the first mounting seat 23, and a suction fan is installed in the dust chamber. An air inlet is opened at the bottom of the mounting seat, and the air inlet is connected to the dust chamber 28 for collecting dust generated during cutting.

[0031] In this embodiment, the top ends of the first positioning column and the second positioning column are located lower than the bottom end of the wafer after installation, and the grinding wheel cutting blade is placed to hit the first positioning column and the second positioning column during the cutting process. A cylinder may also be provided to control the lifting and lowering of the first mounting seat, so as to interrupt the cutting at any time.

[0032] Working principle: First, fix the wafer through the second positioning column and stick it to the cutting seat through adhesive tape, and then fix the cutting seat to the fixing seat through the first positioning column to complete the positioning and fixing of the wafer. Then, the first mounting seat is controlled to move along the X-axis and Y-axis through the translation component. At the same time, the cutting motor controls the grinding wheel cutting blade to cut the wafer in all directions. During this process, the electric nozzle sprays the wafer cutting fluid on the cutting position, and the vacuum cleaner collects the generated dust.

[0033] The purpose of the above embodiments is to exemplarily reproduce and deduce the technical solution of the utility model, and to fully describe the technical solution, purpose and effect of the utility model. Its purpose is to make the public understand the disclosed content of the utility model more thoroughly and comprehensively, and it does not limit the protection scope of the utility model.

[0034] The above embodiments are not exhaustive enumerations based on the present invention, and there may be multiple other implementations not listed. Any replacement and improvement made without violating the concept of the present invention shall fall within the protection scope of the present invention.

Claims

1. A dicing machine for producing NTC temperature sensors, characterized in that: The invention comprises a frame (1), on which a slicing mechanism (2) and a positioning mechanism (3) are mounted, wherein the slicing mechanism comprises a translation assembly (21), wherein the translation assembly (21) is fixedly connected to a first mounting seat (23), wherein the upper end of the first mounting seat (23) is fixedly connected to a rotating motor (22), wherein the output end of the rotating motor (22) is connected to a cutting motor seat (24), wherein a cutting motor is mounted in the cutting motor seat (24), and wherein the output end of the cutting motor is connected to a grinding wheel cutting piece (25); wherein the positioning mechanism (3) comprises a fixed seat (31), wherein the The fixing seat (31) is provided with at least two first positioning posts (32) for fixing the cutting plate (33) upwardly, and the cutting plate (33) is provided with first positioning holes (34) adapted to the first positioning posts (32) in the circumference thereof, and the cutting plate (33) is provided with second positioning posts (35) for fixing the wafer (36) upwardly, and an adhesive tape (38) for integrally bonding the bottom of the wafer (36) is also fixedly laid on the upper end of the cutting plate (33), and a second positioning groove (37) adapted to the second positioning post (35) is provided on the outer circumference of the lower end of the wafer (36).

2. The dicing machine for producing NTC temperature sensors according to claim 1, characterized in that: The translation assembly (21) comprises a second mounting seat (212) and an X-axis control motor (213) slidably connected to two X-axis slide bars (211); an output end of the X-axis control motor (213) is connected to an X-axis lead screw (214) threadedly connected to the second mounting seat; two Y-axis slide bars (215) and a Y-axis control motor (216) are fixedly connected to the second mounting seat (212); the two Y-axis slide bars (215) are slidably connected to the first mounting seat (23); and an output end of the Y-axis control motor (216) is connected to a Y-axis lead screw (217) threadedly connected to the first mounting seat.

3. The dicing machine for producing NTC temperature sensors according to claim 1, characterized in that: A liquid storage chamber (26) for storing wafer cutting liquid is also fixed at the upper end of the mounting seat (23), and an electric spray head (27) for spraying wafer cutting liquid on the wafer (36) being cut is connected to the bottom of the liquid storage chamber (26).

4. The dicing machine for producing NTC temperature sensors according to claim 1, characterized in that: The longitudinal cross-sections of the upper ends of the first positioning column (32) and the second positioning column (35) are both trapezoidal in shape, narrow at the top and wide at the bottom.

5. The dicing machine for producing NTC temperature sensors according to claim 1, characterized in that: A dust chamber (28) is also installed at the upper end of the first mounting seat (23), a suction fan is installed in the dust chamber, and an air inlet is opened at the bottom of the mounting seat, which is connected to the dust chamber (28).

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