Wafer collecting device for optoelectronic device production

Abstract

The utility model belongs to the technical field of photoelectronic devices, and particularly relates to a wafer collecting device for photoelectronic device production, which comprises a conveying table and a supporting column, the supporting column is fixedly mounted at the bottom end of the conveying table, and a pushing mechanism and a collecting mechanism are arranged on the side edge of the conveying table. According to the wafer collecting device for photoelectronic device production, by arranging the pushing mechanism, when the wafers are collected, the wafers can be automatically pushed to the top end of the conveying belt, the labor intensity of workers is relieved, and the problems that in the background technology, when the wafers are placed through the device, the wafers need to be manually placed at the top end of the conveying belt, and the work efficiency is high are solved. According to the device, the problem that the labor intensity of workers is increased due to the fact that the device is provided with the collecting mechanism, wafers can be rapidly collected during production of optoelectronic devices, the collecting mechanism can also collect the wafers at different positions, and the collecting efficiency of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic devices, in particular to a wafer collecting device for producing optoelectronic devices. Background Art

[0002] Optoelectronic devices are the key and core components of optoelectronic technology, the frontier research field of modern optoelectronic technology and microelectronic technology, and an important part of information technology. Through the integration process of micro-optical mechanical and electronic technology, the size of optoelectronic devices is getting smaller and smaller, and the integration is getting higher and higher. Various new solid-state imaging devices are continuously developed and successfully replaced traditional vacuum optoelectronic devices in many aspects. With the demand for optical information technology, the frequency response of detectors is constantly being improved.

[0003] When traditional optoelectronic component chips are produced and collected, they need to be manually screened and unqualified optoelectronic component chips need to be removed. However, the placement of traditional optoelectronic component chips is relatively chaotic, and it is easy to need to pick them up and put them down multiple times when removing them, which is very troublesome and has low work efficiency.

[0004] A patent document with publication number CN208960434U proposes a wafer collection device for the production of optoelectronic devices, the device includes a table, a first cabinet is connected to the bottom side of the table by bolts, and a motor is connected to the inner wall of the first cabinet by bolts, and a soundproof cover is connected to the outer wall of the motor by bolts, and two first through holes are opened on both sides of the table, which are symmetrically distributed about the central axis of the table, and the driving wheel and the driven wheel are connected to the inside of the first through holes by bearings. In the utility model, the optoelectronic component wafer is placed on the conveyor belt by providing a motor, a soundproof cover, a driving wheel, a driven wheel, a conveyor belt, and a partition plate, and the motor is controlled by a foot switch to drive the driving wheel to rotate through the belt, thereby driving the driven wheel to rotate, so that the optoelectronic component wafer can be transported, and a partition plate is installed on the conveyor belt, so that the discarded wafers and the finished wafers can be placed to avoid multiple hot work, thereby improving the work efficiency.

[0005] However, when the device places the wafer, the wafer needs to be placed manually on the top of the conveyor belt, thereby increasing the labor intensity of the staff.

[0006] Therefore, we urgently need to provide a wafer collection device for producing optoelectronic devices. Utility Model Content

[0007] The utility model aims to provide a wafer collecting device for producing optoelectronic devices, so as to solve the problem that when placing the wafers in the device mentioned in the background technology, the wafers need to be placed manually on the top of the conveyor belt, thereby increasing the labor intensity of the staff.

[0008] To achieve the above objectives, the utility model provides the following technical solutions: a wafer collection device for producing optoelectronic devices, comprising a conveying platform and a support column, wherein the support column is fixedly installed at the bottom end of the conveying platform, and a pushing mechanism and a collecting mechanism are arranged on the side of the conveying platform.

[0009] The material pushing mechanism comprises a storage unit and a pushing unit.

[0010] The pushing unit comprises a connecting rod, an electric push rod and a push plate, wherein the connecting rod is fixedly mounted on one end of the placement plate, the electric push rod is mounted on the top end of the connecting rod, and the push plate is connected to the mounting end of the electric push rod.

[0011] Preferably, the storage unit includes a guard plate, a support rod, a placement plate, a chip box and a glass plate, the guard plate is fixedly installed on the side of the support column, the support rod is fixedly installed on one side of the guard plate, the placement plate is fixedly installed on the top of the support rod, the chip box is fixedly installed on the top of the placement plate, and the glass plate is movably installed on one side of the chip box.

[0012] Preferably, the collecting mechanism comprises a fixed column, a motor, a rotating rod, a connecting piece and a collecting box, the fixed column is fixedly mounted on the side of the supporting column, the motor is mounted on one end of the fixed column, the rotating rod is connected to the rotating end of the motor, the connecting piece is connected to the outer wall of the rotating rod, and the collecting box is movably mounted on the top of the connecting piece.

[0013] Preferably, the push plate connecting end is threadedly connected to the electric push rod mounting end, so as to facilitate installation and removal of the push plate, and a soft pad is sleeved on the side of the push plate, which protects the wafer.

[0014] Preferably, one side of the placement plate is an inclined surface, so that the wafer can be better pushed onto the conveyor belt, and the bottom end of the wafer box is hollow, which is convenient for the push plate to push the wafer.

[0015] Preferably, the collecting mechanism is distributed below the conveyor belt of the conveyor table, so that the wafers can be better collected. The other end of the rotating rod is rotatably connected to the inner wall of the fixed column, so that the rotating rod rotates more stably, thereby improving the stability of the collection.

[0016] Preferably, the inner wall of the connecting piece is threadedly connected to the outer wall of the rotating rod, and the connecting piece moves on the outer wall of the rotating rod by rotating the rotating rod, thereby adjusting the position of the collection box within a certain range, thereby improving the collection efficiency. The connecting end of the collection box is snap-connected with the top of the connecting piece, thereby facilitating the installation and disassembly of the collection box.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] 1. The wafer collection device for the production of optoelectronic devices is provided with a pushing mechanism. When collecting wafers, the wafers can be automatically pushed to the top of the conveyor belt, thereby reducing the labor intensity of the staff and solving the problem that the device proposed in the background technology needs to manually place the wafers on the top of the conveyor belt when placing the wafers, thereby increasing the labor intensity of the staff.

[0019] 2. The chip collection device for producing optoelectronic devices can quickly collect chips when optoelectronic devices are produced by setting up a collection mechanism, and the collection mechanism can also collect chips at different positions, thereby improving the collection efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the appearance structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the oblique structure of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the pusher mechanism of the utility model;

[0023] Figure 4 It is a schematic diagram of the structure of the collecting mechanism of the utility model.

[0024] In the figure: 1, conveying platform; 2, supporting column; 301, guard plate; 302, supporting rod; 303, placing plate; 304, wafer box; 305, glass plate; 306, connecting rod; 307, electric push rod; 308, pushing plate; 401, fixing column; 402, electric motor; 403, rotating rod; 404, connecting piece; 405, collecting box. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-Figure 4 , the utility model provides a technical solution: Embodiment 1:

[0027] A wafer collecting device for producing optoelectronic devices comprises a conveying platform 1 and a supporting column 2. The supporting column 2 is fixedly mounted on the bottom end of the conveying platform 1. A pushing mechanism and a collecting mechanism are arranged on the side of the conveying platform 1. The collecting mechanism is distributed under the conveyor belt of the conveying platform 1, so that the wafers can be better collected.

[0028] The material pushing mechanism comprises a storage unit and a pushing unit.

[0029] The pushing unit includes a connecting rod 306, an electric push rod 307 and a push plate 308. The connecting rod 306 is fixedly installed at one end of the placement plate 303, the electric push rod 307 is installed at the top of the connecting rod 306, and the push plate 308 is connected to the mounting end of the electric push rod 307. The connecting end of the push plate 308 is threadedly connected to the mounting end of the electric push rod 307, so that the push plate 308 can be installed and disassembled, and a soft pad is sleeved on the side of the push plate 308, which protects the chip. Embodiment 2:

[0030] On the basis of Example 1: the storage unit includes a guard plate 301, a support rod 302, a placement plate 303, a chip box 304 and a glass plate 305. The guard plate 301 is fixedly installed on the side of the support column 2, the support rod 302 is fixedly installed on one side of the guard plate 301, the placement plate 303 is fixedly installed on the top of the support rod 302, one side of the placement plate 303 is an inclined surface, so that the chip can be better pushed onto the conveyor belt, the chip box 304 is fixedly installed on the top of the placement plate 303, the bottom of the chip box 304 is hollow, which is convenient for the push plate 308 to push the chip, and the glass plate 305 is movably installed on one side of the chip box 304.

[0031] The collecting mechanism comprises a fixed column 401, a motor 402, a rotating rod 403, a connecting piece 404 and a collecting box 405. The fixed column 401 is fixedly installed on the side of the supporting column 2, the motor 402 is installed at one end of the fixed column 401, the rotating rod 403 is connected to the rotating end of the motor 402, and the other end of the rotating rod 403 is rotatably connected to the inner wall of the fixed column 401, so that the rotating rod 403 can rotate more stably, thereby improving the stability of collection; the connecting piece 404 is connected to the outer wall of the rotating rod 403, and the inner wall of the connecting piece 404 is threadedly connected to the outer wall of the rotating rod 403. Through the rotation of the rotating rod 403, the connecting piece 404 is moved on the outer wall of the rotating rod 403, thereby adjusting the position of the collecting box 405 within a certain range, thereby improving the collecting efficiency; the collecting box 405 is movably installed on the top of the connecting piece 404, and the connecting end of the collecting box 405 is engaged with the inner part of the top of the connecting piece 404, thereby facilitating the installation and disassembly of the collecting box 405.

[0032] When in use, the wafers are stacked one by one inside the wafer box 304, and the wafers at the bottom of the wafer box 304 are quickly pushed to the conveyor belt of the conveyor table 1 by extending and contracting the electric push rod 307, and are pushed one by one from bottom to top, thereby realizing automatic delivery of the wafers and accelerating the collection rate of the wafers. The operation of the motor 402 causes the rotating rod 403 to rotate, and the inner wall of the connecting piece 404 is threadedly connected to the outer wall of the rotating rod 403, and then the rotating rod 403 is rotated to make the connecting piece 404 move on the outer wall of the rotating rod 403, and then the position of the collection box 405 can be adjusted within a certain range, thereby improving the collection efficiency of the device for the wafers.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A wafer collection device for producing optoelectronic devices, comprising a conveying platform (1) and a support column (2), wherein the support column (2) is fixedly mounted on the bottom end of the conveying platform (1), characterized in that: The conveying platform (1) is provided with a material pushing mechanism and a collecting mechanism on the side thereof; The material pushing mechanism comprises a storage unit and a pushing unit; The pushing unit comprises a connecting rod (306), an electric push rod (307) and a push plate (308); the connecting rod (306) is fixedly mounted on one end of the placement plate (303); the electric push rod (307) is mounted on the top end of the connecting rod (306); and the push plate (308) is connected to the mounting end of the electric push rod (307).

2. The wafer collecting device for producing optoelectronic devices according to claim 1, characterized in that: The storage unit comprises a protective plate (301), a support rod (302), a placement plate (303), a wafer box (304) and a glass plate (305); the protective plate (301) is fixedly mounted on the side of the support column (2); the support rod (302) is fixedly mounted on one side of the protective plate (301); the placement plate (303) is fixedly mounted on the top of the support rod (302); the wafer box (304) is fixedly mounted on the top of the placement plate (303); and the glass plate (305) is movably mounted on one side of the wafer box (304).

3. The wafer collecting device for producing optoelectronic devices according to claim 1, characterized in that: The collecting mechanism comprises a fixed column (401), a motor (402), a rotating rod (403), a connecting piece (404) and a collecting box (405); the fixed column (401) is fixedly mounted on the side of the supporting column (2); the motor (402) is mounted on one end of the fixed column (401); the rotating rod (403) is connected to the rotating end of the motor (402); the connecting piece (404) is connected to the outer wall of the rotating rod (403); and the collecting box (405) is movably mounted on the top end of the connecting piece (404).

4. The wafer collecting device for producing optoelectronic devices according to claim 1, characterized in that: The connection end of the push plate (308) is threadedly connected to the mounting end of the electric push rod (307), and a soft cushion is sleeved on the side of the push plate (308).

5. The wafer collecting device for producing optoelectronic devices according to claim 2, characterized in that: One side of the placement plate (303) is an inclined surface, and the bottom end of the wafer box (304) is hollow.

6. The wafer collecting device for producing optoelectronic devices according to claim 3, characterized in that: The collecting mechanism is distributed below the conveyor belt of the conveying platform (1), and the other end of the rotating rod (403) is rotatably connected to the inner wall of the fixed column (401).

7. The wafer collecting device for producing optoelectronic devices according to claim 3, characterized in that: The inner wall of the connecting piece (404) is threadedly connected to the outer wall of the rotating rod (403), and the connecting end of the collecting box (405) is snap-fitted and connected to the inside of the top end of the connecting piece (404).

Images