Packaging film for flexible electronic device

Abstract

The utility model discloses a packaging film for a flexible electronic device, which belongs to the technical field of electronic device packaging and comprises an AG layer, an ultraviolet blocking layer, a base material layer, a water blocking layer and a water absorbing layer which are sequentially stacked. Wherein the waterproof layer is a layered silicate coating; and the water absorption layer faces the contents. According to the packaging film provided by the utility model, a multi-layer packaging film structure is provided, so that the electronic device can be effectively protected, water, oxygen and ultraviolet rays are prevented from invading, and the service life of the electronic device is prolonged. The water absorbing layer is coated, so that water vapor permeating from the outside environment can be absorbed, water vapor on the content side can also be absorbed, the problem that the water vapor on the content side cannot be treated after packaging is solved, and meanwhile, the water blocking performance of the packaging film is further improved; the packaging film solves the problems that an inorganic layer lacks flexibility and cracks are prone to being generated, has the anti-dazzle and anti-fingerprint effects, and can be applied to flexible packaging of electronic products such as electronic tags and OLEDs.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device packaging, in particular to a packaging film for flexible electronic devices. Background Art

[0002] The substrate materials of flexible electronic devices usually have excellent flexibility and ductility, but the density of such materials is often poor, which causes the electronic devices to be exposed to harmful environments, and easily causes various reactions such as oxidation and corrosion of the functional layer, which eventually causes the device to fail. Therefore, for the preparation of flexible electronic devices, after completing the functional construction of the device, the device needs to be packaged to achieve selective blocking or transmission of external environmental factors such as water, oxygen and ultraviolet rays.

[0003] In the existing technology, the water vapor barrier capacity of the encapsulation film is mainly achieved by depositing an inorganic layer on the substrate layer through coating technologies such as vacuum evaporation, chemical vapor deposition and sputtering. These inorganic layers can block the entry of water vapor and protect the internal electronic devices. At the same time, the ultraviolet blocking ability is achieved through the ultraviolet blocking functional layer to prevent ultraviolet damage to electronic devices. However, although the existing technology has solved the problem of blocking water vapor and ultraviolet rays to a certain extent, there are still some disadvantages. First, the cost of film preparation using coating technologies such as vacuum evaporation, chemical vapor deposition and sputtering is high, which increases the manufacturing cost of the product; secondly, the inorganic layer lacks flexibility and is prone to cracks, which leads to the failure of the water vapor barrier capacity; in addition, the existing technology only focuses on blocking water vapor in the external environment, and does not take into account the water vapor on the content side after packaging, which may cause the internal devices after packaging to still be affected by water vapor, thereby affecting their performance and life.

[0004] In summary, although the existing technology has achieved certain results in water vapor and UV blocking of encapsulation films, there are still some problems and shortcomings. Therefore, it is necessary to find a new solution to prepare flexible encapsulation films with better water vapor and UV blocking capabilities and lower costs to improve the stability and service life of flexible electronic devices. Summary of the invention

[0005] In order to overcome the deficiencies in the prior art, the utility model provides a packaging film for a flexible electronic device, which can effectively reduce the contact of the device with water, oxygen and ultraviolet rays and extend the life of the device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A packaging film for flexible electronic devices, characterized in that it comprises an AG layer, an ultraviolet blocking layer, a substrate layer, a water-blocking layer and a water-absorbing layer stacked in sequence; wherein the water-blocking layer is a layered silicate coating; and the water-absorbing layer faces the contents.

[0008] Preferably, the substrate layer includes one or more of PET, PE, BOPP, and PI, and the thickness of the substrate layer is 30 to 300 microns.

[0009] Preferably, the layered silicate coating is obtained by coating a water-blocking coating liquid containing layered silicate and then curing it, and has a thickness of 2 to 6 microns; in terms of mass percentage, the water-blocking coating liquid includes the following components:

[0010] Acrylate oligomer 5%-40%, acrylic acid monomer 1-8%, photoinitiator 0.5%-2%, auxiliary agent 0.05%-2%, solvent 60%-80%, layered silicate 2%-10%.

[0011] Preferably, the substrate layer comprises one or more of PET, PE, BOPP and PI layers, and the thickness of the substrate layer is 30 to 300 microns.

[0012] Preferably, the thickness of the UV blocking layer is 2 to 6 microns.

[0013] Preferably, the AG layer is obtained by curing the AG coating liquid after coating, and has a thickness of 2 to 4 microns; the AG coating liquid includes the following components in terms of mass percentage:

[0014] The invention comprises 20%-50% of acrylate oligomer, 1%-3% of acrylic acid monomer, 0.2%-1% of photoinitiator, 0.01%-0.1% of auxiliary agent, 50%-80% of solvent and 0.5%-5% of silicon dioxide microspheres, wherein the silicon dioxide microspheres are obtained from TEOS through hydrolysis reaction.

[0015] Preferably, the water-absorbing layer is a cellulose ether-sodium polyacrylate composite coating with a thickness of 1 to 3 microns.

[0016] Preferably, the cellulose ether-sodium polyacrylate composite coating is obtained by coating a water-absorbing coating liquid containing cellulose ether and sodium polyacrylate and then curing the coating liquid; the water-absorbing coating liquid comprises the following components in terms of mass percentage:

[0017] Cellulose ether 1%-5%, sodium polyacrylate 1%-5%, water 90%-98%.

[0018] The beneficial effects produced by adopting the technical solution of the utility model are as follows:

[0019] (1) The packaging film of the utility model can effectively protect electronic devices, prevent the intrusion of water, oxygen and ultraviolet rays, and extend the service life of electronic devices by providing a multi-layer packaging film structure. By coating and setting a water-absorbing layer, it can not only absorb the water vapor that penetrates from the external environment, but also absorb the water vapor on the content side, solving the problem that the water vapor on the content side cannot be handled after packaging, and further improving the water barrier performance of the packaging film.

[0020] (2) The utility model adopts a coating method to prepare a water-blocking encapsulation film. Compared with vacuum evaporation, chemical vapor deposition and sputtering coating technologies, the cost is lower, and the resin is used as the matrix, which has a certain degree of flexibility, solving the problem that the inorganic layer lacks flexibility, is prone to cracking, and the water vapor barrier ability is easy to fail. The encapsulation film can reduce the exposure of electronic devices to water vapor and ultraviolet rays, extend the life of the device, and has anti-glare and anti-fingerprint effects. It can be used in the flexible packaging of electronic products such as electronic tags and OLEDs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the structure of the packaging film for the flexible electronic device of the utility model;

[0023] In the figure: 1. substrate layer, 2. UV blocking layer, 3. AG layer, 4. water blocking layer, 5. water absorbing layer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] Example 1

[0026] This embodiment provides a packaging film for a flexible electronic device of the present invention, comprising an AG layer 3, a UV blocking layer 2, a substrate layer 1, a water blocking layer 4 and a water absorbing layer 5 stacked in sequence; wherein the water blocking layer 4 is a layered silicate coating; and the water absorbing layer 5 faces the contents.

[0027] The material of the substrate layer 1 includes one or more of PET, PE, BOPP, and PI. In some preferred embodiments, the substrate layer may be primed or corona treated.

[0028] In this embodiment, the substrate layer 1 is made of PET with a polyurethane primer, and the film thickness is 125 microns.

[0029] The water-blocking layer 4 is formed on the upper surface of the substrate layer 1, and the film thickness is 3 microns. The water-blocking layer 4 is formed by curing a water-blocking coating liquid prepared by 5%-40% acrylate oligomer, 1%-8% acrylic acid monomer, 0.5%-2% photoinitiator, 0.05%-0.5% auxiliary agent, 60%-80% solvent, and 2%-10% layered silicate.

[0030] The acrylate oligomer is selected from any one or more of polyurethane acrylate oligomer, epoxy acrylate oligomer, polyester acrylate oligomer, amino acrylate oligomer, and polyether acrylate oligomer; the acrylic monomer is selected from ethoxylated trimethylolpropane triacrylate, trimethylolpropane triacrylate, 1,6-hexanediol diacrylate, dicyclopentenyl acrylate, trimethylolpropane ethoxy triacrylate, tricyclodecane dimethanol diacrylate, dipentaerythritol hexaacrylate, pentaerythritol triacrylate, tri- The invention comprises one or more of propylene glycol diacrylate; the photoinitiator is selected from one or more of 1-hydroxycyclohexyl phenyl ketone, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 2-isopropylthioxanthone, 2,2-dimethoxy-2-phenylacetophenone, and camphorquinone; the auxiliary agent is selected from one or more of polysiloxane, polyether siloxane copolymer, styrene maleic anhydride copolymer, and polyacrylate; the solvent is selected from one or more of ethyl acetate, butyl acetate, acetone, ethanol, and isopropanol. In this embodiment, the water-blocking layer 4 is a water-blocking coating liquid prepared by 23% polyurethane acrylate oligomer, 2.2% ethoxylated trimethylolpropane triacrylate, 1.5% diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, 0.3% styrene maleic anhydride copolymer, 65% ethyl acetate, and 8% sodium montmorillonite. The water-blocking coating liquid is coated on the upper surface of the substrate 1 with a 25-micron wire rod and cured by irradiating with ultraviolet light with a power of 600 W for 15 seconds.

[0031] The water-absorbing layer 5 is formed on the water-blocking layer 4, and the film thickness is 2 microns. Specifically, a cellulose ether-sodium polyacrylate composite coating liquid obtained by mixing 3% cellulose ether, 3% sodium polyacrylate, and 94% deionized water can be evenly dispersed to obtain a water-absorbing coating liquid; the water-absorbing coating liquid is coated on the surface of the water-blocking layer 4 with a 25-micron wire rod, and cured in a 60° C. oven for 15 minutes to obtain the water-absorbing layer 5.

[0032] The UV blocking layer 2 is formed on the lower surface of the substrate layer 1, and the film thickness is 3 microns. The UV blocking layer 2 is formed by curing the UV blocking coating liquid prepared by the UV absorber; specifically, the UV blocking liquid can be coated on the lower surface of the substrate layer 1 with a 25 micron wire rod, and the UV blocking layer 2 can be obtained after curing at 60°C for 20 minutes.

[0033] The AG layer 3 is formed under the UV blocking layer 2, and the film thickness is 3 microns. The AG layer 3 is formed by curing an AG coating liquid prepared by 40% acrylic acid oligomer, 2% acrylic acid monomer, 0.5% photoinitiator, 0.02% auxiliary agent, 55.48% solvent, and 2% silica microspheres, wherein the silica microspheres are obtained by hydrolysis reaction of TEOS.

[0034] The packaging film for flexible electronic devices prepared by the utility model has a certain flexibility by adopting a flexible organic material as a coating, which solves the problems of lack of flexibility, easy cracking and easy failure of water vapor barrier ability of the inorganic layer, and greatly prolongs the effective service life of the flexible electronic devices; the water absorption layer 5 is set to face the content side, which can not only absorb the original water vapor in the air on the content side, but also absorb the water vapor infiltrated by the external environment, further improving the water vapor barrier ability of the barrier film and prolonging the life of the contents.

[0035] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A packaging film for flexible electronic devices, characterized in that: Including AG stacked in sequence layer, an ultraviolet blocking layer, a substrate layer, a water blocking layer and a water absorbing layer; wherein the water blocking layer is a layered silicate coating; the water absorbing layer faces the contents; The water-absorbing layer is a cellulose ether-sodium polyacrylate composite coating with a thickness of 1 to 3 microns.

2. The packaging film for flexible electronic devices according to claim 1, characterized in that: The layered silicate coating has a thickness of 2 to 6 microns.

3. The packaging film for flexible electronic devices according to claim 1, characterized in that: The thickness of the substrate layer is 30 to 300 microns.

4. The packaging film for flexible electronic devices according to claim 1, characterized in that: Said 10 The thickness of the UV blocking layer is 2 to 6 microns.

5. The packaging film for flexible electronic devices according to claim 1, characterized in that: The AG layer is obtained by coating the AG coating liquid and then curing it, and has a thickness of 2 to 4 microns.

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