Thermal evaporation and magnetron sputtering integrated equipment

Abstract

The utility model belongs to the field of film coating, and particularly relates to thermal evaporation and magnetron sputtering integrated equipment. Comprising a film coating cabin, a thermal evaporation film coating mechanism and a magnetron sputtering film coating mechanism, the interior of the film coating cabin is used for containing workpieces, and the thermal evaporation film coating mechanism and the magnetron sputtering film coating mechanism are installed in the film coating cabin; the magnetron sputtering coating mechanism is provided with a baffle, and the baffle is movably installed, so that the magnetron sputtering coating mechanism can be shielded or exposed. The utility model provides thermal evaporation and magnetron sputtering integrated equipment, and aims to overcome the defects caused by mutual independence of a thermal evaporation plating machine and a magnetron sputtering machine in the conventional technology.

Description

Technical Field

[0001] The utility model belongs to the field of film coating, and in particular relates to a thermal evaporation and magnetron sputtering integrated device. Background Art

[0002] Thermal evaporation coating technology uses a resistance evaporation source to provide heat source, gasifies the coating material, and volatilizes and deposits on the substrate surface to form a film layer. It has the advantages of fast film formation rate and low production cost. The device for coating using thermal evaporation technology is a thermal evaporation coating machine.

[0003] Magnetron sputtering technology uses the principle of cathode sputtering for coating, that is, argon ions bombard the surface of the target material, and the sputtered atoms are deposited on the surface of the substrate to form a film. The device that uses magnetron sputtering technology for coating is a magnetron sputtering machine.

[0004] In the prior art, thermal evaporation coating machines and magnetron sputtering machines are independent devices, which are used in different usage scenarios. However, since thermal evaporation coating machines and magnetron sputtering machines are independent devices, this brings some shortcomings. For example: when the material requires magnetron sputtering coating and thermal evaporation coating at the same time, the prior art can only load the material into the thermal evaporation coating machine and magnetron sputtering machine in turn, which is more cumbersome; in addition, it is obviously more expensive to purchase a thermal evaporation coating machine and a magnetron sputtering machine at the same time. Utility Model Content

[0005] The utility model provides a thermal evaporation and magnetron sputtering integrated device, which aims to solve the defects caused by the mutual independence of a thermal evaporation coating machine and a magnetron sputtering machine in conventional technology.

[0006] In order to achieve the above-mentioned object, the utility model provides a thermal evaporation and magnetron sputtering integrated equipment, comprising a coating cabin, a thermal evaporation coating mechanism and a magnetron sputtering coating mechanism, wherein the coating cabin is used to accommodate workpieces, and the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism are installed in the coating cabin;

[0007] The magnetron sputtering coating mechanism is provided with a baffle, and the baffle is movably installed so that the magnetron sputtering coating mechanism can be shielded or exposed.

[0008] In this solution, the interior of the coating chamber can be used for magnetron sputtering coating and thermal evaporation coating, which solves the shortcomings of the prior art caused by the independence of magnetron sputtering coating and thermal evaporation coating. At the same time, in order to solve the impact of thermal evaporation coating on the magnetron sputtering coating device, a baffle is configured in the magnetron sputtering coating mechanism in this solution to block impurities. At the same time, when magnetron sputtering coating is required, the magnetron sputtering coating mechanism can be exposed by moving the baffle to ensure the normal progress of magnetron sputtering coating.

[0009] Preferably, in order to realize the automation of the movement of the baffle, the present solution preferably connects the baffle to a driving mechanism, and the driving mechanism is used to drive the rotational movement so that the magnetron sputtering coating mechanism is shielded or exposed.

[0010] In this solution, the baffle is connected to the driving mechanism, and when the driving mechanism is working, the baffle can be driven to move. The baffle moves to cover and expose the magnetron sputtering coating mechanism.

[0011] Preferably, in order to drive the baffle, the driving mechanism preferably includes a driver and a connecting shaft, the baffle is mounted on one end of the connecting shaft, the driver is transmission-connected to the connecting shaft, and the driver drives the baffle to move via the connecting shaft.

[0012] In this solution, the baffle is connected to the drive through a connecting shaft. When the drive drives the connecting shaft to rotate, the baffle can rotate. The rotation of the baffle realizes the shielding and exposure of the magnetron sputtering coating mechanism.

[0013] Preferably, the driver drives the connecting shaft to rotate and ensures that the connecting shaft can move telescopically so that the baffle is separated from the magnetron sputtering coating mechanism. In this solution, the driver is preferably a rotary telescopic motor.

[0014] In this solution, the baffle is driven to rotate by a rotating telescopic motor, so that the baffle shields or exposes the magnetron sputtering mechanism. At the same time, when the rotating telescopic motor is working, it can be rotated to a specific angle to shield the magnetron sputtering mechanism while meeting the needs of the magnetron sputtering mechanism when it is ignited.

[0015] Preferably, in order to control the baffle to move to a corresponding angle, the driving mechanism of this solution preferably further includes a controller, and the controller works with the rotary telescopic motor;

[0016] The controller controls the rotary telescopic motor to rotate to a 45° position, and the baffle is away from the magnetron sputtering coating mechanism and blocks the magnetron sputtering coating mechanism;

[0017] The controller controls the rotary telescopic motor to rotate to a 90° position, so that the baffle is away from the magnetron sputtering coating mechanism and the magnetron sputtering coating mechanism is completely exposed.

[0018] In this solution, when the baffle is in the initial state, the baffle shields the magnetron sputtering coating mechanism; when the baffle is driven to rotate to the 45° position, the baffle still shields the magnetron sputtering coating mechanism, but the baffle is separated from the magnetron sputtering coating mechanism to meet the use needs of the magnetron sputtering coating mechanism when it is glowing. When the baffle is driven to rotate to the 90° position, the baffle completely exposes the magnetron sputtering coating mechanism to ensure the normal coating operation of the magnetron sputtering coating device.

[0019] Preferably, since the magnetron sputtering coating mechanism is accommodated inside the coating chamber, in order to support the magnetron sputtering coating mechanism, the present solution preferably connects the magnetron sputtering coating mechanism to the driving mechanism so that the magnetron sputtering coating mechanism remains stable.

[0020] Preferably, in order to place the workpiece and avoid residual coating residue on the workpiece, the present solution preferably configures a planetary disk mechanism on the top of the coating cabin, and the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism are installed below the planetary disk mechanism.

[0021] In this solution, a planetary disk mechanism is used to fix the workpiece on the top, and then the thermal evaporation coating mechanism or magnetron sputtering coating mechanism below is used for coating. Therefore, the residue produced by the coating will not fall on the surface of the workpiece due to gravity, avoiding the residue from affecting the coating quality.

[0022] Preferably, since the working ranges of the magnetron sputtering coating mechanism and the thermal evaporation coating mechanism are inconsistent, the present solution preferably installs the magnetron sputtering coating mechanism at a position higher than the thermal evaporation coating mechanism.

[0023] Preferably, in order to reduce the mutual interference between the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism, the present solution preferably installs the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism on different sides of the coating cabin.

[0024] In this solution, since the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism are located on different sides, there is less interference between the thermal evaporation coating mechanism and the magnetron sputtering coating mechanism.

[0025] The beneficial effect of the utility model is that the interior of the coating chamber in the present solution can be used for magnetron sputtering coating and thermal evaporation coating, which solves the shortcomings of the prior art caused by the independence of magnetron sputtering coating and thermal evaporation coating. At the same time, in order to solve the influence of thermal evaporation coating on the magnetron sputtering coating device, a baffle is configured in the magnetron sputtering coating mechanism in the present solution, and the baffle is used to block the impurities. At the same time, when magnetron sputtering coating is required, the magnetron sputtering coating mechanism can be exposed by moving the baffle to ensure the normal progress of magnetron sputtering coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structure of a thermal evaporation and magnetron sputtering integrated device.

[0027] Figure 2 Schematic diagram of a baffle completely shielding a magnetron sputtering coating mechanism.

[0028] Figure 3 This is a schematic diagram when the baffle is rotated to the 45° position.

[0029] Figure 4 This is a schematic diagram when the baffle is rotated to the 90° position.

[0030] The reference numerals include: coating chamber 1 , thermal evaporation coating mechanism 2 , magnetron sputtering coating mechanism 3 , baffle 4 , connecting shaft 5 , rotary telescopic motor 6 , planetary disk mechanism 7 . DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are only examples of devices and methods consistent with some aspects of the present disclosure as detailed in the attached claims.

[0032] It should be noted that all actions to obtain signals, information or data in this application are carried out in compliance with the relevant data protection laws and policies of the country where they are located, and with the authorization given by the owner of the corresponding device.

[0033] In the present disclosure, unless otherwise stated, the directional words used, such as "inside" and "outside", are defined according to the corresponding parts' own contours. The terms used in the present disclosure, such as "first" and "second", etc., are used to distinguish one element from another element and do not have order and importance.

[0034] Example 1

[0035] Basically as attached Figure 1 As shown, a thermal evaporation and magnetron sputtering integrated device is mainly configured with an integrated magnetron sputtering coating mechanism 3 and a thermal evaporation coating mechanism 2, which meets the use needs of some special materials that require both magnetron sputtering coating and thermal evaporation coating. At the same time, compared with a separate magnetron sputtering coating mechanism 3 and a thermal evaporation coating mechanism 2, it is conducive to cost saving.

[0036] like Figure 1As shown, the integrated thermal evaporation and magnetron sputtering device in the embodiment of the present disclosure specifically includes a coating cabin 1, a magnetron sputtering coating mechanism 3 and a thermal evaporation coating mechanism 2. The coating cabin 1 is a cylindrical closed cabin, on the top of which is installed a planetary disk mechanism 7, which is used for installing workpieces that need to be coated, so that the workpieces remain stable in the coating cabin 1. The planetary disk mechanism 7, the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2 are all related equipment in the prior art, and the embodiments of the present disclosure are not described in detail. In the embodiment of the present disclosure, the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2 are installed below the planetary disk mechanism 7, and coating is performed from bottom to top, thereby solving the problem of coating impurities falling on the coating surface due to gravity, and the quality of the coating is better.

[0037] In order to reduce the interference between the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2, the present solution preferably places the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2 on different sides of the coating cabin 1, for example, the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2 can be installed on the left and right sides of the coating cabin 1. At the same time, since the working ranges of the magnetron sputtering coating mechanism 3 and the thermal evaporation coating mechanism 2 are different, in the present embodiment, the thermal evaporation coating mechanism 2 is preferably installed on the right side of the bottom end of the coating cabin 1, while the magnetron sputtering coating mechanism 3 is installed on the left waist area of ​​the coating cabin 1.

[0038] In order to prevent the impurities generated by the thermal evaporation coating mechanism 2 from adhering to the magnetron sputtering coating mechanism 3 and to prevent the coating accuracy of the magnetron sputtering coating mechanism 3 from being affected, a baffle 4 is arranged at the front end of the magnetron sputtering coating mechanism 3 in the disclosed embodiment, and the baffle 4 can shield the magnetron sputtering coating mechanism 3 during the thermal evaporation coating to prevent the impurities from falling on the surface of the magnetron sputtering coating mechanism 3. The baffle is in the shape of a fan-shaped plate.

[0039] The baffle 4 in the embodiment of the present disclosure is connected to the driving mechanism, and the driving mechanism is configured so that the baffle 4 can rotate and retract to achieve the exposure and shielding of the magnetron sputtering coating mechanism 3. The driving mechanism in the embodiment of the present disclosure specifically includes a driver, a connecting shaft 5 and a controller. In the embodiment of the present disclosure, the driver is preferably a rotary telescopic motor 6, and the rotary telescopic motor 6 is installed on the outer wall of the coating chamber 1, and the connecting shaft 5 is connected to the output shaft of the rotary telescopic motor 6. When the rotary telescopic motor 6 is working, the connecting shaft 5 can rotate and retract. In the embodiment of the present disclosure, the connecting shaft 5 extends to the interior of the coating chamber 1 by setting a flange. The baffle 4 is fixedly mounted at the front end of the connecting shaft 5, and can be directly connected by welding during implementation. In the embodiment of the present disclosure, the controller is electrically connected to the rotary telescopic motor 6, and the controller can control the rotary telescopic motor 6 to work. The controller can be a PLC control module or a single-chip microcomputer control module in the prior art.

[0040] Take an application scenario as an example: when the thermal evaporation coating mechanism 2 is working, the baffle 4 is in a state of completely shielding the magnetron sputtering coating mechanism 3 to prevent the magnetron sputtering coating mechanism 3 from adhering impurities, such as Figure 2 As shown in FIG. 1 ; when magnetron sputtering coating is required, the controller first controls the rotating telescopic motor 6 to work, so that the baffle 4 rotates to a 45° position. At this time, the baffle 4 is still in a state of shielding the magnetron sputtering coating mechanism 3, but due to the driving of the rotating telescopic motor 6, the baffle 4 is separated from the surface of the magnetron sputtering coating mechanism 3, as shown in FIG. Figure 3 As shown. In this state, the baffle 4 can block the uneven plating material released by the magnetron sputtering coating mechanism 3 during the glow stage to avoid affecting the coating quality on the substrate. After the glow is stable, the controller controls the rotary telescopic motor 6 to work, so that the baffle 4 rotates to the 90° position. At this time, the magnetron sputtering coating mechanism 3 is completely exposed, and the baffle 4 is also separated from the surface of the magnetron sputtering coating mechanism 3. The magnetron sputtering coating mechanism 3 can stably perform magnetron sputtering coating.

[0041] It should be noted that when the baffle 4 rotates 45° from the initial position, the baffle 4 reaches the 45° position; when the baffle 4 rotates 90° from the initial position, the baffle 4 reaches the 90° position. The precise rotation of the baffle 4 is achieved by the controller controlling the telescopic rotating motor 6 to precisely rotate.

[0042] In the embodiment of the present disclosure, the magnetron sputtering coating mechanism 3 is located inside the coating chamber 1, and in order to make the magnetron sputtering coating mechanism 3 more stable inside the coating chamber 1, the embodiment of the present disclosure preferably configures a fixing hole on the top of the magnetron sputtering coating mechanism 3. At the same time, the connecting shaft 5 passes through the fixing hole, so that the connecting shaft 5 supports the magnetron sputtering coating mechanism 3, ensuring that the magnetron sputtering coating mechanism 3 is in a stable state.

[0043] The following is a further detailed description through a specific implementation method: In the embodiment of the present disclosure, the workpiece can be magnetron sputtering coated and thermal evaporation coated inside the coating chamber 1. When the thermal evaporation coating mechanism 2 is working, the baffle 4 blocks the magnetron sputtering coating mechanism 3 to prevent impurities from affecting the accuracy of the magnetron sputtering coating mechanism 3. When magnetron sputtering coating is required, the controller first controls the rotary telescopic motor 6 to rotate to a 45° position, so that the baffle 4 is separated from the magnetron sputtering coating mechanism 3 and still blocks the magnetron sputtering coating mechanism 3. After the glow stabilizes, the controller controls the rotary telescopic motor 6 to rotate to a 90° position, and the magnetron sputtering coating mechanism 3 is completely exposed to ensure the normal progress of the magnetron sputtering coating.

[0044] The above is only an embodiment of the utility model, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the utility model, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A thermal evaporation and magnetron sputtering integrated device, characterized in that: It comprises a coating chamber (1), a thermal evaporation coating mechanism (2) and a magnetron sputtering coating mechanism (3); the coating chamber (1) is used to accommodate a workpiece, and the thermal evaporation coating mechanism (2) and the magnetron sputtering coating mechanism (3) are installed in the coating chamber (1); The magnetron sputtering coating mechanism (3) is provided with a baffle (4), and the baffle (4) is movably installed so that the magnetron sputtering coating mechanism (3) can be shielded or exposed.

2. The thermal evaporation and magnetron sputtering integrated equipment according to claim 1, characterized in that: The baffle (4) is connected to a driving mechanism, and the driving mechanism is used to drive the baffle (4) to move so that the magnetron sputtering coating mechanism (3) is shielded or exposed.

3. The integrated thermal evaporation and magnetron sputtering device according to claim 2, characterized in that: The driving mechanism comprises a driver and a connecting shaft (5); the baffle (4) is mounted on one end of the connecting shaft (5); the driver is in transmission connection with the connecting shaft (5); and the driver drives the baffle (4) to move via the connecting shaft (5).

4. The thermal evaporation and magnetron sputtering integrated device according to claim 3, characterized in that: The driver is a rotary telescopic motor (6).

5. The integrated thermal evaporation and magnetron sputtering device according to claim 4, characterized in that: The driving mechanism further comprises a controller, and the controller works with the rotary telescopic motor (6); The controller controls the rotating telescopic motor (6) to rotate to a 45° position, and the baffle (4) moves away from the magnetron sputtering coating mechanism (3) and shields the magnetron sputtering coating mechanism (3); The controller controls the rotary telescopic motor (6) to rotate to a 90° position, so that the baffle (4) is away from the magnetron sputtering coating mechanism (3), and the magnetron sputtering coating mechanism (3) is completely exposed.

6. The integrated thermal evaporation and magnetron sputtering device according to claim 5, characterized in that: The magnetron sputtering coating mechanism (3) is connected to the driving mechanism, so that the magnetron sputtering coating mechanism (3) remains stable.

7. The integrated thermal evaporation and magnetron sputtering device according to any one of claims 1 to 6, characterized in that: A planetary disk mechanism (7) is arranged on the top of the coating chamber (1), and the thermal evaporation coating mechanism (2) and the magnetron sputtering coating mechanism (3) are installed below the planetary disk mechanism (7).

8. The thermal evaporation and magnetron sputtering integrated device according to claim 7, characterized in that: The installation position of the magnetron sputtering coating mechanism (3) is higher than the installation position of the thermal evaporation coating mechanism (2).

9. The integrated thermal evaporation and magnetron sputtering device according to claim 7, characterized in that: The thermal evaporation coating mechanism (2) and the magnetron sputtering coating mechanism (3) are installed on different sides of the coating cabin (1).

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