Coating protective cover, sputter coating device and sputter coating system

Abstract

The utility model relates to the technical field of vacuum equipment, and discloses a coating protective cover, a sputter coating device and a sputter coating system. The coating protective cover comprises a protective table, a top protective cover and a bottom protective cover. The protection table is hollow and comprises an upper opening, a lower opening and a side face. The area of the lower opening is larger than that of the upper opening. The side face extends from the upper opening to the lower opening and comprises a plurality of through holes, and the through holes are used for blocking particulate matter. The top shield is arranged at the upper end of the protection table and comprises a top shield through hole communicated with the upper opening of the protection table and a top shield flange extending outwards from the top shield through hole. The bottom shield is arranged at the lower end of the protection table and comprises a bottom shield through hole communicated with the lower opening of the protection table and a bottom shield flange extending outwards from the bottom shield through hole.

Description

Technical Field

[0001] The present disclosure relates to the technical field of vacuum equipment, and in particular to a coating protective cover, a sputtering coating device and a sputtering coating system. Background Art

[0002] In the field of industrial manufacturing, wafer magnetron sputtering is a commonly used sputtering coating technology. The traditional technology uses a top-down sputtering method, with the target gun installed on the top and the substrate placed at the bottom. In this way, particles are easily accumulated on the surface of the silicon wafer, thereby contaminating the film and seriously affecting the quality and yield of the device. Utility Model Content

[0003] The present disclosure provides a coating protective cover, comprising:

[0004] A protective platform, which is hollow and comprises:

[0005] Upper opening;

[0006] The lower opening has an area greater than that of the upper opening;

[0007] A side surface extends from the upper opening to the lower opening and includes a plurality of through holes, wherein the plurality of through holes are used to block particles;

[0008] A top guard cover is arranged at the upper end of the protection platform, the top guard cover comprises a top guard cover through hole communicating with the upper opening of the protection platform and a top guard cover flange extending outward from the top guard cover through hole; and

[0009] The bottom shield is arranged at the lower end of the protection platform, and comprises a bottom shield through hole communicated with the lower opening of the protection platform and a bottom shield flange extending outward from the bottom shield through hole.

[0010] In some embodiments of the present disclosure, the diameter of the through hole on the side of the protection platform is less than or equal to 2 mm.

[0011] In some embodiments of the present disclosure, the distance from the outer edge of the top guard cover flange to the central axis of the protection platform is greater than or equal to the distance from the edge of the lower opening of the protection platform to the central axis of the protection platform.

[0012] In some embodiments of the present disclosure, a distance from an outer edge of the bottom shield flange to a central axis of the protection platform is greater than or equal to a distance from an outer edge of the top shield flange to the central axis of the protection platform.

[0013] In some embodiments of the present disclosure, the cross-section of the protection platform includes one of a square, a circle, an ellipse, and a polygon.

[0014] The present disclosure provides a sputtering coating device, comprising:

[0015] Vacuum chamber;

[0016] A target material carrying device is located at the bottom of the vacuum chamber and is used to carry the target material;

[0017] A substrate carrying mechanism, located in the vacuum chamber and arranged opposite to the target material carrying device, for carrying the substrate; and

[0018] According to the coating protective cover in any one of the embodiments of the present disclosure, the upper opening of the protective platform is used to face the substrate, and the lower opening of the protective platform is used to face the target.

[0019] In some embodiments of the present disclosure, the sputtering coating device further includes a tray, the tray is a circular ring structure, and the inner ring of the tray is provided with an inwardly extending flange for supporting the substrate;

[0020] The area of ​​the upper opening of the protective platform matches the area of ​​the inner circle of the tray, and the centers of the circles are aligned;

[0021] The distance from the outer edge of the top guard flange to the central axis of the protection platform is greater than or equal to the distance from the edge of the tray to the central axis of the protection platform.

[0022] In some embodiments of the present disclosure, the target material carrier is sealed and fixedly connected to the vacuum chamber, and the target material carrier includes at least one buckle; the bottom shield includes at least one slot, which cooperates with the at least one buckle to limit the movement of the bottom shield on the target material carrier, but allows the bottom shield to move upward; and / or

[0023] The vacuum chamber includes a mounting maintenance shutter through which the coating protection cover can be installed and / or replaced; and / or

[0024] The coating protective cover is grounded.

[0025] The present disclosure provides a sputtering coating system, comprising:

[0026] Vacuum transfer chamber;

[0027] At least one sputtering coating device according to any one of the embodiments of the present disclosure, wherein the vacuum chamber of the sputtering coating device is connected to the vacuum transfer chamber;

[0028] A sample transfer arm mechanism is disposed in the vacuum transfer chamber; and

[0029] The driving mechanism is connected to the sample transfer arm mechanism and is used to drive the sample transfer arm mechanism to transfer the substrate or transfer the tray between at least one sputtering coating device to transfer the substrate.

[0030] In some embodiments of the present disclosure, at least one sputtering coating device includes:

[0031] A first sputtering coating device, used for performing a first sputtering coating process;

[0032] A second sputtering coating device, used for performing a second sputtering coating process;

[0033] a third sputtering coating device, used for performing a third sputtering coating process; and

[0034] A plurality of fourth sputtering coating devices are used to perform a fourth sputtering coating process, wherein the time required for the fourth sputtering process exceeds twice the sum of the time required for the first sputtering process, the second sputtering process and the third sputtering process.

[0035] In response to the problems in the prior art, some embodiments of the present disclosure adopt a sputtering method from bottom to top for coating, but there will be a problem of particles falling on the target material and contaminating the target material. The coating protective cover, sputtering coating device and sputtering coating system according to some embodiments of the present disclosure can solve these problems and bring beneficial technical effects. For example, the coating protective cover, sputtering coating device and sputtering coating system of some embodiments of the present disclosure can effectively prevent particles from falling and contaminating the target material without affecting the sputtering coating. For another example, the coating protective cover, sputtering coating device and sputtering coating system of some embodiments of the present disclosure can realize coating by sputtering from bottom to top without contaminating the substrate, thereby improving the device quality and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 A schematic structural diagram of a coating protective cover according to some embodiments of the present disclosure is shown.

[0038] Figure 2 A schematic structural diagram of a protection platform according to some embodiments of the present disclosure is shown.

[0039] Figure 3 A schematic structural diagram of a sputtering coating device according to some embodiments of the present disclosure is shown.

[0040] Figure 4 A partial structural schematic diagram of a sputtering coating device according to some embodiments of the present disclosure is shown.

[0041] Figure 5 A schematic structural diagram of a tray according to some embodiments of the present disclosure is shown.

[0042] Figure 6 A partial structural schematic diagram of a sputtering coating device performing a coating process according to some embodiments of the present disclosure is shown.

[0043] Figure 7 A schematic structural diagram of a sputtering coating system according to some embodiments of the present disclosure is shown.

[0044] In the above drawings, the reference numerals represent:

[0045] 10000-Sputtering Coating System

[0046] 1000, 1000a, 1000b, 1000c, 1000d, 1000e, 1000f - Sputtering coating device

[0047] 100-Coating protective cover

[0048] 110-Protection platform

[0049] 111-Upper opening

[0050] 112-lower opening

[0051] 113-Side

[0052] 1131-Through hole

[0053] 120-Top guard

[0054] 121-Top guard flange

[0055] 130-Bottom guard

[0056] 131-Card slot

[0057] 132-bottom guard flange

[0058] 200-Vacuum Chamber

[0059] 210-Installation and maintenance shutter

[0060] 300-Target Carrying Device

[0061] 310-Snap

[0062] 400-Base bearing mechanism

[0063] 500-Pallet

[0064] 510-Tray flange

[0065] 600-Base

[0066] 700-Heating device

[0067] 800-Drive Mechanism

[0068] 2000-Vacuum transfer chamber DETAILED DESCRIPTION

[0069] Some embodiments of the present disclosure will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only exemplary embodiments of the present disclosure, rather than all embodiments.

[0070] In the description of the present disclosure, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "coupled" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements. In the description of the present disclosure, the distal end or the distal side refers to an end or a side that penetrates into a vacuum environment (e.g., a vacuum chamber), and the proximal end or the proximal side refers to an end or a side opposite to the distal end or the distal side (e.g., an end or a side that is away from the vacuum chamber, or an end or a side that is close to the vacuum chamber wall in the vacuum chamber, etc.). Alternatively, the end or the side that is close to the driving device is the proximal end or the proximal side, and the end or the side that is away from the driving device is the distal end or the distal side. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0071] Figure 1 A schematic structural diagram of a coating protective cover 100 according to some embodiments of the present disclosure is shown. Figure 2 A schematic structural diagram of a protection platform 110 according to some embodiments of the present disclosure is shown.

[0072] like Figure 1 and Figure 2As shown, in some embodiments of the present disclosure, the coating protective cover 100 may include a protective platform 110, a top protective cover 120 and a bottom protective cover 130. The protective platform 110 is hollow and may include an upper opening 111, a lower opening 112 and a side 113. The area of ​​the lower opening 112 is larger than the area of ​​the upper opening 111. The side 113 extends from the upper opening 111 to the lower opening 112 and includes a plurality of through holes 1131. The plurality of through holes 1131 are used to block particulate matter. The top protective cover 120 is disposed at the upper end of the protective platform 110, and the top protective cover 120 may include a top protective cover through hole (not shown in the figure) connected to the upper opening 111 of the protective platform 110 and a top protective cover flange 121 extending outward from the top protective cover through hole. The bottom protective cover 130 is disposed at the lower end of the protective platform 110. The bottom shield 130 may include a bottom shield through hole (not shown) communicating with the lower opening 112 of the protection platform 110 and a bottom shield flange 132 extending outward from the bottom shield through hole. Those skilled in the art will appreciate that the size of the top shield through hole of the top shield 120 may be equal to or smaller than the upper opening 111, and the size of the bottom shield through hole of the bottom shield 130 may be equal to or smaller than the lower opening 112.

[0073] In some embodiments of the present disclosure, the coating protective cover 100 can be used inside a coating device (for example, Figure 3 and Figure 4 The hollow structure inside the protective platform 110 can be used as sputtering particles (such as molecules, atoms, plasma, etc.) to be transferred to the material to be coated (such as Figure 4 Some sputtered particles (e.g., molecules, atoms, plasma, etc.) of the coating material transferred to the periphery of the material to be coated will be deposited on the lower surface of the top shield flange 121. If particles are formed, they will fall on the bottom shield flange 132 or roll down along the side 113 of the protective platform 110 to the bottom shield flange 132, thereby avoiding contamination of the coating material.

[0074] In some embodiments of the present disclosure, the diameter of the through hole 1131 of the side surface 113 of the protection platform 110 is less than or equal to 2 mm.

[0075] In some embodiments of the present disclosure, the diameter of the through hole 1131 of the side 113 of the protective platform 110 can be selected to be less than or equal to any numerical range within 2 mm, such as 0.1 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 0.1 mm-0.5 mm, 0.1 mm-1.5 mm, 0.5 mm-1 mm, 1 mm-1.5 mm, 1.5 mm-2 mm, and the like.

[0076] In some embodiments of the present disclosure, the through holes 1131 of the side surface 113 of the protection platform 110 allow the sputtered particles to pass through but do not allow particulate matter (such as sputtered slag formed after the sputtered particles are deposited for a long time) to pass through.

[0077] like Figure 1 As shown, in some embodiments of the present disclosure, the distance L1 from the outer edge of the top shield flange 121 to the central axis of the protective platform 110 is greater than or equal to the distance L2 from the edge of the lower opening 112 of the protective platform 110 to the central axis of the protective platform 110. In this way, it is possible to better prevent sputtered particles from being deposited on the structure above the substrate 600, such as depositing on the structure of the substrate 600. Figure 5 On the tray 500 shown.

[0078] like Figure 1 As shown, in some embodiments of the present disclosure, the distance L3 from the outer edge of the bottom shield flange 132 to the central axis of the hollow protective platform 110 is greater than or equal to the distance L1 from the outer edge of the top shield flange 121 to the central axis of the protective platform 110. In this way, particles falling from the lower surface of the top shield flange 121 can fall onto the bottom shield flange 132, which can not only avoid contamination of the target material and the vacuum chamber 200, but also facilitate the collection and cleaning of the particles.

[0079] like Figure 1 As shown, in some embodiments of the present disclosure, the cross-section of the protection platform 110 includes any one of square, circle, ellipse, polygon, etc. It can be understood by those skilled in the art that although Figure 2 The cross section of the protection stage 110 is shown as a circle, but this is only exemplary.

[0080] Figure 3 A schematic structural diagram of a sputtering coating device 1000 according to some embodiments of the present disclosure is shown. Figure 4 A partial structural schematic diagram of a sputtering coating device 1000 according to some embodiments of the present disclosure is shown.

[0081] like Figure 3 and Figure 4 As shown, in some embodiments of the present disclosure, the sputtering coating device 1000 may include a vacuum chamber 200, a target material carrying device 300, a substrate carrying mechanism 400, and a coating protective cover 100 according to any embodiment of the present disclosure. Those skilled in the art may understand that for the sake of clarity, Figure 4Only a part of the coating shield 100 is shown in the figure, and it is separated from other structures. The target material carrying device 300 is located at the bottom of the vacuum chamber 200, and is used to carry the target material. The substrate carrying mechanism 400 is located in the vacuum chamber 200 and is arranged opposite to the target material carrying device 300, and is used to carry the substrate 600. The upper opening 111 of the protective stage 110 of the coating shield 100 is used to face the substrate 600, and the lower opening 112 of the protective stage 110 is used to face the target material.

[0082] In some embodiments of the present disclosure, when the sputtering coating device 1000 performs a coating process, the target material is sputtered from the lower opening 112 of the protective stage 110 to the upper opening 111 of the protective stage 110. The upper opening 111 of the protective stage 110 faces the substrate 600 material. A portion of the sputtered material will be deposited on the substrate 600, and another portion of the material sputtered upward will pass through the through hole 1131 of the side 113 of the protective stage 110. Due to the presence of the top shield 120, the material will not directly hit, for example, the tray 500, but will hit the top shield flange 121. If the sputtered material forms particles on the lower surface of the top shield flange 121, it will be intercepted by the through hole 1131 of the side 113 of the protective stage 110, and fall on the bottom shield flange 132 or roll down along the side 113 of the protective stage 110 to the bottom shield flange 132, thereby avoiding contamination of the target material.

[0083] like Figure 3 and Figure 4 As shown, in some embodiments of the present disclosure, the target material supporting device 300 may include a cathode target device.

[0084] Figure 5 A schematic structural diagram of a tray 500 according to some embodiments of the present disclosure is shown.

[0085] like Figure 4 and Figure 5 As shown, in some embodiments of the present disclosure, the sputtering coating device 1000 may further include a tray 500. The tray 500 is a circular ring structure, and the inner ring of the tray 500 is provided with a tray flange 510 extending inwardly for supporting the substrate 600. The area of ​​the upper opening 111 of the protective platform 110 matches (e.g., is equal to or slightly smaller than) the area of ​​the inner ring of the tray 500 (e.g., inside the tray flange 510), and the centers of the circles are aligned. The distance from the outer edge of the top shield flange 121 to the central axis of the protective platform 110 is greater than or equal to the distance from the edge of the tray 500 to the central axis of the protective platform 110.

[0086] In some embodiments of the present disclosure, in order to realize the sputtering process from bottom to top, a tray 500 or a similar structure is required to support the substrate 600, but the tray 500 is also the mechanism that is most likely to accumulate particles and thus contaminate the target material. By setting the coating protective cover 100, it is possible to effectively reduce the situation where particles are formed on the tray 500 to contaminate the target material.

[0087] In some embodiments of the present disclosure, the tray 500 supports the substrate 600 to perform a coating process together. The contact area between the tray 500 and the substrate 600 is larger than the point contact area between the traditional supporting claws and the tray 500. It also has the function of making the temperature of the substrate 600 more uniform and improving the coating quality.

[0088] Those skilled in the art will understand that Figure 3 and Figure 4 As shown, the sputtering coating device 1000 may further include a heating device 700 and a driving mechanism 800. The heating device 700 is disposed in the vacuum chamber 200, and the substrate 600 is located between the heating device 700 and the coating protective cover 100. The heating device 700 is used to heat the substrate 600 on the substrate supporting mechanism 400. The driving mechanism 800 is used to drive the substrate supporting mechanism 400 and the heating device 700 to rise and fall together. The driving mechanism 800 may also be used to drive the substrate supporting mechanism 400 to rotate relative to the heating device 700. The lifting and lowering of the substrate supporting mechanism 400 and the heating device 700, as well as the rotational movement of the substrate supporting mechanism 400 disclosed in the present invention can be achieved by existing technologies, which will not be described in detail herein.

[0089] Figure 6 A partial structural schematic diagram of a sputtering coating device 1000 performing a coating process according to some embodiments of the present disclosure is shown.

[0090] In some embodiments of the present disclosure, the area of ​​the upper opening 111 of the protection platform 110 may be equal to the area of ​​the inner circle of the tray 500, and the centers of the circles are aligned. Figure 4 As shown in the figure). Figure 6 As shown, the driving mechanism 800 drives the substrate supporting mechanism 400 to descend. When the coating process is carried out, the substrate 600 is as close as possible to the top protective cover 120 of the coating protective cover 100 to better carry out the coating process and enable the coating protective cover 100 to better play a protective role.

[0091] like Figure 3 and Figure 4 As shown, in some embodiments of the present disclosure, the target material carrying device 300 is sealed and fixedly connected to the vacuum chamber 200. Figure 6As shown, the target material carrier 300 includes at least one buckle 310; the bottom shield 130 includes at least one slot 131, which cooperates with the at least one buckle 310 to limit the movement of the bottom shield 130 on the target material carrier 300, but allows the bottom shield 130 to move upward.

[0092] like Figure 6 As shown, in some embodiments of the present disclosure, at least one buckle 310 may be, for example, a bolt. At least one slot 131 may be, for example, an arc-shaped slot 131 disposed at the edge of the bottom shield flange 132. When installing the protective cover, the protective cover is placed from above the target material carrier 300, and the buckle 310 on the target material carrier 300 falls into the slot 131 on the bottom shield 130. The fit between the buckle 310 and the slot 131 is not a tight fit. The fit between the buckle 310 and the slot 131 is mainly to limit the movement of the coating protective cover 100 in the horizontal direction, while allowing the coating protective cover 100 to move upward relative to the slot 131, so as to facilitate the installation and replacement of the coating protective cover 100.

[0093] In some embodiments of the present disclosure, at least one clip 310 may include eight clips 310 evenly distributed on the target material carrying device 300 and distributed in a circular pattern, and at least one slot 131 may include a slot 131 arranged on the edge of the bottom shield flange 132 and corresponding to at least one of the eight clips 310, but this is merely exemplary, and other suitable numbers of clips and slots 131 may also be selected.

[0094] like Figure 3 As shown, in some embodiments of the present disclosure, the vacuum chamber 200 includes an installation and maintenance shutter 210, and the coating protection cover 100 can be installed and / or replaced by installing the protection shutter.

[0095] In some embodiments of the present disclosure, in order to facilitate the placement or removal of the coating protective cover 100 from the installation protective shutter, the bottom protective cover flange 132 of the coating protective cover 100 can be adaptively adjusted, for example, Figure 6 As shown, the bottom shield 130 of the circular coating protective cover 100 is symmetrically cut off a part of the arc on both sides to form a symmetrical truncated circle. Accordingly, the at least one slot 131 may include six slots 131 arranged on the edge of the bottom shield flange 132 and distributed in a circumference.

[0096] In some embodiments of the present disclosure, the coating shield 100 can be grounded to stabilize the potential in the sputtering coating device 1000. When the sputtering coating device 1000 is used to sputter insulating materials, the grounded coating shield 100 can effectively alleviate the accumulation of potential, thereby making the plasma distribution more uniform. In this way, the target material can be more uniform when being sputtered, further improving the uniformity of the film and achieving a batch stable coating effect.

[0097] In some embodiments of the present disclosure, the target material carrying device 300 may be grounded. Both the coating protective cover 100 and the target material carrying device 300 are made of conductive materials. The coating protective cover 100 is grounded by grounding the target material carrying device 300.

[0098] Figure 7 A schematic structural diagram of a sputtering coating system 10000 according to some embodiments of the present disclosure is shown.

[0099] like Figure 7 As shown, in some embodiments of the present disclosure, the sputtering coating system 10000 may include a vacuum transfer chamber 2000, at least one sputtering coating device 1000 according to any one of the embodiments of the present disclosure, a sample transfer arm mechanism and a sample transfer arm driving mechanism (not shown in the figure). The vacuum chamber 200 of the sputtering coating device 1000 is connected to the vacuum transfer chamber 2000. The sample transfer arm mechanism is arranged in the vacuum transfer chamber 2000. The sample transfer arm driving mechanism is connected to the sample transfer arm mechanism, and is used to drive the sample transfer arm mechanism to transfer the substrate 600 or transfer the tray 500 between at least one sputtering coating device 1000 to transfer the substrate 600.

[0100] like Figure 7 As shown, in some embodiments of the present disclosure, at least one sputter coating device 1000 may include a first sputter coating device 1000a, a second sputter coating device 1000b, a third sputter coating device 1000c, and a plurality of fourth sputter coating devices (e.g., 1000d, 1000e, 1000f). The first sputter coating device 1000a is used to perform a first sputter coating process. The second sputter coating device 1000b is used to perform a second sputter coating process. The third sputter coating device 1000c is used to perform a third sputter coating process. The plurality of fourth sputter coating devices (e.g., 1000d, 1000e, 1000f) are respectively used to perform a fourth sputter coating process, wherein the time required for the fourth sputter coating process exceeds twice the sum of the time required for the first sputter coating process, the second sputter coating process, and the third sputter coating process. Such a layout of the sputtering coating device 1000 is conducive to performing three groups of sputtering process operations simultaneously, thereby improving the efficiency of the coating process.

[0101] like Figure 7As shown, in some embodiments, at least one sputter coating device 1000 includes six sputter coating devices (e.g., 1000a, 1000b, 1000c, 1000d, 1000e, 1000f). Those skilled in the art will appreciate that this is merely exemplary, and the number of sputter coating devices in at least one sputter coating device 1000 may also be less than six or greater than six. Similarly, although in some embodiments, the six sputter coating devices 1000 are designed as a first sputter coating device 1000a, a second sputter coating device 1000b, a third sputter coating device 1000c, and three fourth sputter coating devices 1000d, 1000e, 1000f, the six sputter coating devices 1000 may also be allocated to process different sputter coating processes according to actual needs.

[0102] In some embodiments, the coating time of the first sputtering coating process may be 7.5 minutes, the coating time of the second sputtering coating process may be 7.5 minutes, the coating time of the third sputtering coating process may be 15 minutes, and the coating time of the fourth sputtering coating process may be 120 minutes. Those skilled in the art will appreciate that this is only exemplary, and the coating time of the first sputtering coating process, the coating time of the second sputtering coating process, the coating time of the third sputtering coating process, and the coating time of the fourth sputtering coating process may be selected according to actual needs.

[0103] It should be pointed out that the above are only exemplary embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A coating protective cover, characterized in that: include: A protective platform, the protective platform being hollow and comprising: Upper opening; A lower opening, wherein the area of ​​the lower opening is greater than the area of ​​the upper opening; A side surface extending from the upper opening to the lower opening and comprising a plurality of through holes, wherein the plurality of through holes are used to block particles; A top guard cover is disposed at the upper end of the protection platform, the top guard cover comprising a top guard cover through hole communicating with the upper opening of the protection platform and a top guard cover flange extending outward from the top guard cover through hole; and A bottom shield is arranged at the lower end of the protection platform, and the bottom shield comprises a bottom shield through hole communicated with the lower opening of the protection platform and a bottom shield flange extending outward from the bottom shield through hole.

2. The coating protective cover according to claim 1, characterized in that: The diameter of the through hole on the side of the protective platform is less than or equal to 2 mm.

3. The coating protective cover according to claim 1, characterized in that: The distance from the outer edge of the top guard cover flange to the central axis of the protection platform is greater than or equal to the distance from the edge of the lower opening of the protection platform to the central axis of the protection platform.

4. The coating protective cover according to any one of claims 1 to 3, characterized in that: The distance from the outer edge of the bottom guard cover flange to the central axis of the protection platform is greater than or equal to the distance from the outer edge of the top guard cover flange to the central axis of the protection platform.

5. The coating protective cover according to any one of claims 1 to 3, characterized in that: The cross section of the protection platform includes one of square, circle, ellipse and polygon.

6. A sputtering coating device, characterized in that: include: Vacuum chamber; A target material carrying device, located at the bottom of the vacuum chamber, and used for carrying the target material; A substrate carrying mechanism, located in the vacuum chamber and arranged opposite to the target material carrying device, for carrying a substrate; as well as According to the coating protective cover according to any one of claims 1-5, the upper opening of the protective platform is used to face the substrate, and the lower opening of the protective platform is used to face the target.

7. The sputtering coating device according to claim 6, characterized in that: It also includes a tray, which is a circular ring structure, and an inner ring of the tray is provided with an inwardly extending flange for supporting the substrate; The area of ​​the upper opening of the protection platform matches the area of ​​the inner circle of the tray, and the centers of the circles are aligned; The distance from the outer edge of the top guard flange to the central axis of the protection platform is greater than or equal to the distance from the edge of the tray to the central axis of the protection platform.

8. The sputtering coating device according to claim 6 or 7, characterized in that: The target material carrying device is sealed and fixedly connected to the vacuum chamber, and the target material carrying device includes at least one buckle; the bottom shield includes at least one slot, which cooperates with the at least one buckle to limit the movement of the bottom shield on the target material carrying device, but allows the bottom shield to move upward; and / or The vacuum chamber comprises an installation and maintenance shutter, and the coating protective cover can pass through the installation and maintenance shutter to be installed and / or replaced; and / or The coating protection cover is grounded.

9. A sputtering coating system, characterized in that: include: Vacuum transfer chamber; At least one sputtering coating device according to any one of claims 6 to 8, wherein the vacuum chamber of the sputtering coating device is connected to the vacuum transfer chamber; A sample transfer arm mechanism is arranged in the vacuum transfer chamber; as well as The driving mechanism is connected to the sample transfer arm mechanism and is used to drive the sample transfer arm mechanism to transfer the substrate or transfer the tray between the at least one sputtering coating device to transfer the substrate.

10. The sputtering coating system according to claim 9, characterized in that: The at least one sputtering coating device comprises: A first sputtering coating device, used for performing a first sputtering coating process; A second sputtering coating device, used for performing a second sputtering coating process; a third sputtering coating device, used for performing a third sputtering coating process; and A plurality of fourth sputtering coating devices are used to perform a fourth sputtering coating process, wherein the time required for the fourth sputtering coating process exceeds twice the sum of the time required for the first sputtering coating process, the second sputtering coating process and the third sputtering coating process.

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