Spacing adjusting device and semiconductor equipment

Abstract

The utility model relates to a spacing adjusting device and semiconductor equipment. The interval adjusting device is used for being placed in an interval between a first target structure and a second target structure which are to be concentrically installed and comprises a rotating shaft, a first rotating telescopic mechanism and a second rotating telescopic mechanism, wherein the rotating shaft is sleeved with the first rotating telescopic mechanism and the second rotating telescopic mechanism. The axis of the rotating shaft coincides with the target axis, to be concentrically aligned, of the first target structure and the second target structure. The first rotating telescopic mechanism is used for contracting inwards and making contact with the outer side wall of the first target structure when rotating in the anticlockwise direction and expanding outwards when rotating in the clockwise direction; the second rotating telescopic mechanism is used for expanding outwards and making contact with the inner side wall of the second target structure when rotating in the anticlockwise direction and contracting inwards when rotating in the clockwise direction. By adjusting the distance between the first target structure and the second target structure, the problem of position offset is solved, contact between the first target structure and the second target structure is avoided, and the process yield is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a spacing adjustment device and a semiconductor device. Background Art

[0002] In the current physical vapor deposition (PVD) process, a cover ring and a shield are required to be installed outside the equipment chamber to block the metal material deposited outside the wafer and prevent the metal from being deposited on the equipment chamber wall. In the process of preventive maintenance (PM) of semiconductor equipment, the cover ring and the shield need to be regularly maintained and replaced to ensure the yield of wafer products.

[0003] During the installation of the cover ring and the retaining ring and the operation of the equipment, it is necessary to strictly ensure that the cover ring and the retaining ring are concentric and keep the distance between them consistent. If the position of the cover ring is offset, it is easy to cause the cover ring and the retaining ring to contact, resulting in arc discharge (Arcing), which will have an adverse effect on the physical vapor deposition process (such as the coating process) and reduce the yield of the wafer product. Utility Model Content

[0004] Based on this, an embodiment of the present application provides a spacing adjustment device and a semiconductor device, which solves the position offset problem by adjusting the spacing between the first target structure and the second target structure to avoid contact between the first target structure and the second target structure, thereby facilitating ensuring the process yield.

[0005] In order to achieve the above-mentioned purpose, in the first aspect, some embodiments of the present application provide a spacing adjustment device. The spacing adjustment device is used to be placed in the interval between the first target structure and the second target structure to be concentrically installed. The spacing adjustment device includes a rotating shaft and a first rotating telescopic mechanism and a second rotating telescopic mechanism sleeved on the rotating shaft. The axis of the rotating shaft coincides with the target axis of the first target structure and the second target structure to be concentrically aligned. Among them, the first rotating telescopic mechanism is used to shrink inward and contact the outer side wall of the first target structure when rotating in a counterclockwise direction, and expand outward when rotating in a clockwise direction; the second rotating telescopic mechanism is used to expand outward and contact the inner side wall of the second target structure when rotating in a counterclockwise direction, and shrink inward when rotating in a clockwise direction.

[0006] In some embodiments, the first rotating telescopic mechanism and / or the second rotating telescopic mechanism comprises at least one gear, and a pair of rack transmission assemblies located on opposite sides of each gear. The gear is sleeved on the rotating shaft; the rack transmission assembly comprises a rack and a contact member. The rack is connected to the gear in a transmission manner; one end of the contact member is connected to the rack, and the other end extends at least in a direction from the rack to the gear, so as to contact the corresponding target structure.

[0007] In some embodiments, the contact member includes a first support rod, a second support rod and a contact head. The first support rod is connected to the rack and extends in a direction away from the gear; the second support rod is connected to the first support rod and extends in a direction parallel to the axis of the rotating shaft; the contact head is arranged at the end of the second support rod away from the first support rod, and is used to contact the corresponding target structure.

[0008] In some embodiments, the first rotating telescopic mechanism and the second rotating telescopic mechanism each include a plurality of gears, and the plurality of gears are arranged at equal intervals along the axis of the rotating shaft, wherein along the axis of the rotating shaft, the gears of the first rotating telescopic mechanism are arranged below the gears of the second rotating telescopic mechanism.

[0009] In some embodiments, the lengths of the multiple first support rods corresponding to the gears in the first rotating and telescopic mechanism are the same; the lengths of the multiple first support rods corresponding to the gears in the second rotating and telescopic mechanism are the same. The length of the first support rod in the first rotating and telescopic mechanism is less than the length of the first support rod in the second rotating and telescopic mechanism.

[0010] In some embodiments, the lengths of the second support rods corresponding to different gears in the first rotating telescopic mechanism are different, and the lengths of the second support rods gradually increase along the arrangement direction of the corresponding gears from bottom to top; the lengths of the second support rods corresponding to different gears in the second rotating telescopic mechanism are different, and the lengths of the second support rods gradually increase along the arrangement direction of the corresponding gears from bottom to top. The maximum length of the second support rod in the first rotating telescopic mechanism is less than the minimum length of the second support rod in the second rotating telescopic mechanism.

[0011] In some embodiments, the length of the rack of the first rotating and telescopic mechanism is the same as the length of the rack of the second rotating and telescopic mechanism.

[0012] In some embodiments, the contact heads in the first rotating and telescopic mechanism and the second rotating and telescopic mechanism are distributed on the same reference plane; and the axis of the rotating shaft is perpendicular to the reference plane.

[0013] In some embodiments, the contact head is an arc-shaped structure. The contact heads in the first rotating telescopic mechanism are evenly spaced on the first virtual ring contour; the contact heads in the second rotating telescopic mechanism are evenly spaced on the second virtual ring contour. The axis center lines of the first virtual ring contour and the second virtual ring contour both coincide with the axis center line of the rotation axis.

[0014] In a second aspect, the present application further provides a semiconductor device according to some embodiments. The semiconductor device includes a spacing adjustment device as described in any one of the embodiments of the first aspect of the present application, wherein the axis of the rotating shaft coincides with the axis of the cavity of the semiconductor device.

[0015] The embodiments of the present application may or at least have the following advantages:

[0016] In the embodiment of the present application, during the process of adjusting the spacing, the spacing adjustment device is placed in the interval between the first target structure and the second target structure; the rotating shaft is rotated counterclockwise to drive the first rotating telescopic mechanism to shrink inward to contact the outer side wall of the first target structure and adjust its position, and the second rotating telescopic mechanism is driven to expand outward to contact the inner side wall of the second target structure and adjust its position, so as to adjust the spacing between the first target structure and the second target structure. And after the spacing adjustment is completed, the rotating shaft is rotated clockwise to drive the first rotating telescopic mechanism to expand outward to separate from the first target structure, and the second rotating telescopic mechanism is driven to shrink inward to separate from the second structure, so as to remove the spacing adjustment device. In this way, the spacing adjustment between the first target structure and the second target structure is achieved by cooperating with the first rotating telescopic mechanism and the second rotating telescopic mechanism that are concentrically arranged and synchronously linked with the rotating shaft, and the spacing between the two is ensured to be equal at all places, thereby solving the problem of position offset, effectively avoiding the adverse effects (such as arc discharge) caused by the contact between the two, and thus improving the process yield.

[0017] The details of one or more embodiments of the present application are set forth in the following drawings and description. Other features, objects, and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 is a schematic structural diagram of a spacing adjustment device provided in some embodiments;

[0020] Figure 2 is a schematic top view of a rotating and telescopic mechanism provided in some embodiments;

[0021] Figure 3 A schematic diagram of the positional relationship of a gear and rack transmission assembly provided in some embodiments;

[0022] Figure 4 A schematic diagram of the positional relationship between a contact head, a first target structure and a second target structure provided in some embodiments;

[0023] Figure 5 A schematic diagram of the positional relationship between another contact head, a first target structure and a second target structure provided in some embodiments;

[0024] Figure 6 A schematic top view of a spacing adjustment device provided in some embodiments.

[0025] Description of reference numerals:

[0026] a1-first target structure, a2-second target structure, S-rotation axis, A-first rotation and telescopic mechanism, B-second rotation and telescopic mechanism, 1a, 1b-gear, 2a, 2b-rack transmission assembly, 21a, 21b-rack, 22a, 22b-contact piece, 221a, 221b-first support rod, 222a, 222b-second support rod, 223a, 223b-contact head, R-overlapping area, c1-first virtual ring contour, c2-second virtual ring contour. DETAILED DESCRIPTION

[0027] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0029] It should be understood that when an element or layer is referred to as being "on," "adjacent to," or "connected to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion.

[0030] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0031] Embodiments of the utility model are described herein with reference to cross-sectional views which are schematic diagrams of ideal embodiments (and intermediate structures) of the present application, so that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Embodiments of the present application should not be limited to the specific shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing techniques. Therefore, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shapes of the regions of the device, and do not limit the scope of the present application.

[0032] The embodiments of the present application provide a spacing adjustment device and a semiconductor device, which solve the position offset problem by adjusting the spacing between the first target structure a1 and the second target structure a2 to avoid contact between the first target structure a1 and the second target structure a2, thereby facilitating ensuring the process yield.

[0033] In a first aspect, some embodiments of the present application provide a distance adjustment device, which is used to be placed in a gap between a first target structure a1 and a second target structure a2 to be concentrically installed.

[0034] For example, the shape of the first target structure a1 includes but is not limited to regular geometric shapes such as a ring, a square or a polygon.

[0035] For example, the shape of the second target structure a2 includes but is not limited to regular geometric shapes such as a ring, a square or a polygon.

[0036] For example, see Figure 4 , the first target structure a1 and the second target structure a2 are concentric. It should be explained that the concentricity mentioned here and below means that the axis lines of the two coincide.

[0037] In some embodiments, see Figure 1 The spacing adjustment device includes a rotating shaft S and a first rotating telescopic mechanism A and a second rotating telescopic mechanism B sleeved on the rotating shaft S. The axis of the rotating shaft S coincides with the target axis of the first target structure a1 and the second target structure a2 to be concentrically aligned. The first rotating telescopic mechanism A is used to shrink inward and contact the outer side wall of the first target structure a1 when rotating in the counterclockwise direction, and expand outward when rotating in the clockwise direction; the second rotating telescopic mechanism B is used to expand outward and contact the inner side wall of the second target structure a2 when rotating in the counterclockwise direction, and shrink inward when rotating in the clockwise direction.

[0038] For example, the axis center line of the first rotating and telescopic mechanism A, the axis center line of the second rotating and telescopic mechanism B and the axis center line of the rotation axis S coincide with each other.

[0039] It should be noted that the first rotating and telescopic mechanism A and the second rotating and telescopic mechanism B are both linked with the rotating shaft S synchronously.

[0040] For example, the contact manner between the first rotary telescopic machine and the first target structure a1 includes but is not limited to abutment.

[0041] For example, the contact manner between the second rotary telescopic machine and the second target structure a2 includes but is not limited to abutment.

[0042] In the embodiment of the present application, during the process of adjusting the spacing, the spacing adjustment device is placed in the interval between the first target structure a1 and the second target structure a2; the rotating shaft S is rotated counterclockwise to drive the first rotating telescopic mechanism A to shrink inward to contact the outer side wall of the first target structure a1 and adjust its position, and the second rotating telescopic mechanism B is driven to expand outward to contact the inner side wall of the second target structure a2 and adjust its position, so as to adjust the spacing between the first target structure a1 and the second target structure a2. And after the spacing adjustment is completed, the rotating shaft S is rotated clockwise to drive the first rotating telescopic mechanism A to expand outward to separate from the first target structure a1, and drive the second rotating telescopic mechanism B to shrink inward to separate from the second structure, so as to remove the spacing adjustment device. In this way, the spacing adjustment between the first target structure a1 and the second target structure a2 is achieved by cooperating with the first rotating telescopic mechanism A and the second rotating telescopic mechanism B, which are concentrically arranged and synchronously linked with the rotating shaft S, and ensure that the spacing between the two is equal at all places, thereby solving the problem of position offset, effectively avoiding the adverse effects (such as arc discharge) caused by the contact between the two, and thus improving the process yield.

[0043] In some embodiments, please combine Figure 1 and Figure 2 It is understood that the first rotating telescopic mechanism A and / or the second rotating telescopic mechanism B comprises at least one gear 1, and a pair of rack transmission assemblies 2 respectively located on opposite sides of each gear 1. The gear 1 is sleeved on the rotating shaft S; the rack transmission assembly 2 comprises a rack 21 and a contact member 22. The rack 21 is in transmission connection with the gear 1; one end of the contact member 22 is connected to the rack 21, and the other end extends at least in the direction of the rack 21 away from the gear 1, so as to contact the corresponding target structure.

[0044] For example, the gear 1 rotates synchronously with the rotation axis S.

[0045] For example, a pair of rack 21 rotating assemblies on opposite sides of each gear 1 are centrally symmetrical with the axis of the gear 1 as the center.

[0046] What needs to be explained is that please combine Figure 2 and Figure 3 It is understood that the rack 21 is in transmission connection with the gear 1, specifically, that there is an overlapping area R between a pair of contact members 22 located on opposite sides of each gear 1. Taking the rack transmission assembly 2 corresponding to the second rotating telescopic mechanism B as an example, Figure 3As shown in FIG. (a), when the gear 1 rotates counterclockwise, the racks 21 on opposite sides of the gear 1 move in a direction away from the gear 1, driving the contact members 22 to also move in a direction away from the gear 1, so that the area of ​​the overlapping region R between the contact members 22 is reduced, thereby increasing the size L (i.e., L1) of a pair of contact members 22 in a direction parallel to the racks 21, thereby achieving outward expansion of the second rotating telescopic mechanism B; Figure 3 As shown in FIG. (b), when the gear 1 rotates in the clockwise direction, the racks 21 on the opposite sides of the gear 1 move in the direction close to the gear 1, driving the contact members 22 to also move in the direction close to the gear 1, so that the area of ​​the overlapping region R between the contact members 22 increases, thereby reducing the size L (i.e., L2) of the pair of contact members 22 in the direction parallel to the racks 21, and realizing the inward contraction of the second rotating telescopic mechanism B. For example, L1>L2.

[0047] For example, the connection method between the contact member 22 and the rack 21 includes but is not limited to embedding or bonding.

[0048] In some embodiments, see Figure 1 The contact member 22 includes a first support rod 221, a second support rod 222 and a contact head 223. The first support rod 221 is connected to the rack 21 and extends in a direction away from the gear 1; the second support rod 222 is connected to the first support rod 221 and extends in a direction parallel to the axis of the rotation axis S; the contact head 223 is arranged at the end of the second support rod 222 away from the first support rod 221, and is used to contact the corresponding target structure.

[0049] For example, the shape of the first support rod 221 and / or the second support rod 222 includes but is not limited to a rectangular parallelepiped or a cylindrical shape.

[0050] For example, please refer to Figure 1 The first support rod 221 is connected to the second support rod 222 on one side close to the gear 1, and the surface of the first support rod 221 that is away from the contact head 223 in a direction parallel to the axis of the rotation axis S is flush with the surface of the second support rod 222 that is away from the contact head 223 in a direction parallel to the axis of the rotation axis S.

[0051] For example, the first support rod 221 and the second support rod 222 may be an integral structure.

[0052] For example, the first support rod 221 and the second support rod 222 are perpendicular to each other.

[0053] For example, the rack 21 may be embedded in a side surface of the first support rod 221 close to the gear 1 .

[0054] In some embodiments, please refer to Figure 1The first rotating telescopic mechanism A and the second rotating telescopic mechanism B both include a plurality of gears 1, and the plurality of gears 1 are arranged at equal intervals along the axis of the rotating shaft S. In particular, along the axis of the rotating shaft S, the gears 1 of the first rotating telescopic mechanism A are arranged below the gears 1 of the second rotating telescopic mechanism B.

[0055] It should be noted that the number of the internal gears 1 of the first rotating and telescopic mechanism A and / or the second rotating and telescopic mechanism B can be one or more, and the present disclosure does not impose any limitation on this.

[0056] In some embodiments, please refer to Figure 1 , the lengths of the multiple first support rods 221a corresponding to the gears 1a in the first rotating telescopic mechanism A are the same; the lengths of the multiple first support rods 221b corresponding to the gears 1b in the second rotating telescopic mechanism B are the same. The length of the first support rod 221a in the first rotating telescopic mechanism A is less than the length of the first support rod 221b in the second rotating telescopic mechanism B.

[0057] In the embodiment of the present application, the length of the first support rod 221 in the first rotating and telescopic mechanism A is smaller than the length of the first support rod 221 in the second rotating and telescopic mechanism B.

[0058] For some examples, see Figure 1 , in the first rotating telescopic mechanism A (or the second rotating telescopic mechanism B), among the multiple gears 1 arranged at equal intervals along the axis direction of the rotation axis S, the angles in the horizontal direction between the pairs of first support rods 221 (or the pairs of second support rods 222) corresponding to the gears 1 are all equal. For example, taking the first rotating telescopic mechanism A including two gears 1a (that is, two pairs of first support rods 221a), the angles between the pairs of first support rods 221a are 90°.

[0059] It should be noted that the length of the first support rods 221 refers to the dimension of each first support rod 221 in a direction parallel to the corresponding rack 21 .

[0060] In some embodiments, please refer to Figure 1 , the lengths of the second support rods 222a corresponding to different gears 1a in the first rotating telescopic mechanism A are different, and the lengths of the second support rods 222a gradually increase along the arrangement direction of the corresponding gears 1a from bottom to top; the lengths of the second support rods 222b corresponding to different gears 1b in the second rotating telescopic mechanism B are different, and the lengths of the second support rods 222b gradually increase along the arrangement direction of the corresponding gears 1b from bottom to top. Among them, the maximum length of the second support rods 222a in the first rotating telescopic mechanism A is less than the minimum length of the second support rods 222b in the second rotating telescopic mechanism B.

[0061] It should be noted that the length of the second support rod 222 refers to the dimension of the second support rod 222 in the direction parallel to the axis of rotation S.

[0062] In the embodiment of the present disclosure, by making the maximum length of the second support rod 222a in the first rotating and telescopic mechanism A smaller than the minimum length of the second support rod 222b in the second rotating and telescopic mechanism B, the contact heads 223a corresponding to the first rotating and telescopic mechanism A are located inside the contact heads 223b corresponding to the second rotating and telescopic mechanism B in the radial direction along the cross-section of the rotation axis S.

[0063] In some embodiments, the length of the rack 21 a of the first rotating and telescopic mechanism A is the same as the length of the rack 21 b of the second rotating and telescopic mechanism B.

[0064] It should be noted that the length of the rack 21 refers to the dimension of each rack 21 along a direction parallel to the corresponding first support rod 221 .

[0065] In some embodiments, the contact heads 223 in the first rotating and telescopic mechanism A and the second rotating and telescopic mechanism B are distributed on the same reference plane; the axis of the rotation axis S is perpendicular to the reference plane.

[0066] By way of example, the reference plane may be a horizontal plane, for example.

[0067] In some embodiments, please combine Figure 4 and Figure 5 It is understood that each contact head 223 is used to be placed in the interval between the first target structure a1 and the second target structure a2 to be concentrically installed, and each contact head 223, the first target structure a1 and the second target structure a2 are located on the same reference plane. Among them, each contact head 223a corresponding to the first rotating telescopic mechanism A is used to contact the outer side wall of the first target structure a1, and each contact head 223b corresponding to the second rotating telescopic mechanism B is used to contact the inner side wall of the second target structure a2.

[0068] In some embodiments, please combine Figure 1 and Figure 6 It is understood that the contact head 223 is an arc-shaped structure. The contact heads 223a in the first rotating telescopic mechanism A are evenly spaced on the first virtual ring contour c1; the contact heads 223b in the second rotating telescopic mechanism B are evenly spaced on the second virtual ring contour c2. The axis center lines of the first virtual ring contour c1 and the second virtual ring contour c2 both coincide with the axis center line of the rotation axis S.

[0069] For example, the radial dimension of the first virtual ring profile c1 is smaller than the radial dimension of the second virtual ring profile c2.

[0070] For explanation, see Figure 6In (a) of the figure, the first rotating telescopic mechanism A expands outwards, corresponding to the radial size of the first virtual ring profile c1 gradually increasing with the clockwise rotation of the rotating shaft S, and the first rotating telescopic mechanism A contracts inwards, corresponding to the radial size of the first virtual ring profile c1 gradually decreasing with the counterclockwise rotation of the rotating shaft S, that is, each of the contact heads 223a in the first rotating telescopic mechanism A moves outwards synchronously with the clockwise rotation of the rotating shaft S or moves inwards synchronously with the counterclockwise rotation of the rotating shaft S; please refer to Figure 6 In Figure (b), the outward expansion of the second rotating telescopic mechanism B corresponds to the radial size of the second virtual ring profile c2 gradually increasing with the counterclockwise rotation of the rotating shaft S, and the inward contraction of the second rotating telescopic mechanism B corresponds to the radial size of the second virtual ring profile c2 gradually decreasing with the clockwise rotation of the rotating shaft S, that is, each of the contact heads 223b in the second rotating telescopic mechanism B moves outward synchronously with the counterclockwise rotation of the rotating shaft S or moves inward synchronously with the clockwise rotation of the rotating shaft S.

[0071] It should be noted that Figure 1 , Figure 4 and Figure 6 The contact head 223 is taken as an arc-shaped structure for example, but it can be understood that the contact head 223 can also be other structures adapted to the shapes of the first target structure a1 and the second target structure a2, and the present application does not limit this.

[0072] In the embodiment of the present application, the first virtual ring profile c1 is an inner ring structure; the second virtual ring profile c2 is an outer ring structure. In this way, the spacing adjustment device provided in the embodiment of the present application can synchronously contact the first target structure a1 and the second target structure a2 to adjust the spacing between the first target structure a1 and the second target structure a2, and ensure that the spacing between the first target structure a1 and the second target structure a2 is equal at all locations, thereby solving the position offset problem.

[0073] It is worth mentioning that in the physical vapor deposition (PVD) process, a cover ring and a shield are provided outside the equipment chamber to block the metal material deposited outside the wafer, so as to avoid the adverse effect of metal deposition on the chamber wall on the process yield. In some embodiments, the spacing adjustment device provided in the embodiments of the present application can be used to adjust the spacing between the cover ring and the shield in the physical vapor deposition equipment.

[0074] For example, the first target structure a1 includes but is not limited to a cover ring or a baffle, etc. The baffle may be, for example, a shutter disk.

[0075] By way of example, the second target structure a2 includes but is not limited to a shield and the like.

[0076] In the second aspect, the present application also provides a semiconductor device according to some embodiments. The semiconductor device includes a spacing adjustment device as described in any one of the first aspects of the embodiments of the present application. The semiconductor device also has the technical advantages of the aforementioned spacing adjustment device. It should be noted that the parts that are the same or corresponding to the above embodiments can refer to the corresponding description of the above embodiments, and will not be described in detail below.

[0077] In some embodiments, the axis centerline of the rotation axis S coincides with the axis centerline of the chamber of the semiconductor device.

[0078] By way of example, semiconductor equipment includes, but is not limited to, physical vapor deposition (PVD) equipment.

[0079] For example, the first target structure a1 includes but is not limited to a cover ring or a baffle, and the baffle may be, for example, a shutter disk; the second target structure a2 includes but is not limited to a shield, and the like.

[0080] It should be noted that please combine Figure 4 and Figure 5 It is understood that when the spacing adjustment device provided in the embodiment of the present application is used to adjust the spacing between the cover ring and the shield in the physical vapor deposition equipment, the spacing adjustment device can contact the outer wall of the cover ring (Cover Ring) through the first rotating telescopic mechanism A, and contact the inner wall of the shield (Shield) through the second rotating telescopic mechanism B, so as to ensure that the axis line of the adjusted shield, the axis line of the cover ring and the axis line of the chamber of the semiconductor equipment are all coincident, and to ensure that the spacing between the shield and the cover ring is equal at all locations, so as to avoid the arc discharge (Arcing) phenomenon caused by the contact between the cover ring and the shield, thereby improving the stability of the physical vapor deposition equipment. In this way, the spacing adjustment device provided in the embodiment of the present application can effectively improve the process yield of the physical vapor deposition process (such as the coating process).

[0081] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A spacing adjustment device, characterized in that: for placement in a space between a first target structure and a second target structure to be concentrically mounted; The spacing adjustment device comprises: a rotating shaft and a first rotating and telescopic mechanism and a second rotating and telescopic mechanism sleeved on the rotating shaft; the axis of the rotating shaft coincides with the target axis of the first target structure and the second target structure to be concentrically aligned; wherein, The first rotating and telescopic mechanism is used to shrink inwards and contact the outer side wall of the first target structure when rotating in a counterclockwise direction, and expand outwards when rotating in a clockwise direction; The second rotating and telescopic mechanism is used to expand outward and contact the inner wall of the second target structure when rotating in a counterclockwise direction, and to contract inward when rotating in a clockwise direction.

2. The spacing adjustment device according to claim 1, characterized in that: The first rotating and telescopic mechanism and / or the second rotating and telescopic mechanism comprises: at least one gear, and a pair of rack transmission assemblies respectively located on opposite sides of each gear; wherein, The gear is sleeved on the rotating shaft; The rack transmission assembly comprises: A rack, drivingly connected to the gear; A contact piece has one end connected to the rack and the other end extending at least along the direction of the rack away from the gear, so as to contact the corresponding target structure.

3. The spacing adjustment device according to claim 2, characterized in that: The contact element comprises: A first support rod, connected to the rack and extending in a direction from the rack to the gear; A second support rod, connected to the first support rod, extending in a direction parallel to the axis of the rotating shaft; The contact head is arranged at the end of the second support rod away from the first support rod, and is used for contacting the corresponding target structure.

4. The spacing adjustment device according to claim 3, characterized in that: The first rotating and telescopic mechanism and the second rotating and telescopic mechanism each include a plurality of gears, and the plurality of gears are arranged at equal intervals along the axis direction of the rotating shaft; Wherein, along the axis direction of the rotating shaft, the gears of the first rotating and telescopic mechanism are arranged below the gears of the second rotating and telescopic mechanism.

5. The spacing adjustment device according to claim 4, characterized in that: The lengths of the plurality of first support rods corresponding to the gears in the first rotating and telescopic mechanism are the same; The lengths of the plurality of first support rods corresponding to the gears in the second rotating and telescopic mechanism are the same; Wherein, the length of the first support rod in the first rotating and telescopic mechanism is smaller than the length of the first support rod in the second rotating and telescopic mechanism.

6. The spacing adjustment device according to claim 4, characterized in that: The lengths of the second support rods corresponding to different gears in the first rotating and telescopic mechanism are different, and the length of each second support rod gradually increases along the arrangement direction of the corresponding gears from bottom to top; The second support rods corresponding to different gears in the second rotating and telescopic mechanism have different lengths, and the length of each second support rod gradually increases along the arrangement direction of the corresponding gears from bottom to top; Wherein, the maximum length of the second support rod in the first rotating and telescopic mechanism is smaller than the minimum length of the second support rod in the second rotating and telescopic mechanism.

7. The spacing adjustment device according to claim 3, characterized in that: The length of the rack of the first rotating and telescopic mechanism is the same as the length of the rack of the second rotating and telescopic mechanism.

8. The spacing adjustment device according to claim 3, characterized in that: The contact heads in the first rotating and telescopic mechanism and the second rotating and telescopic mechanism are distributed on the same reference plane; and the axis of the rotating shaft is perpendicular to the reference plane.

9. The spacing adjustment device according to claim 8, characterized in that: The contact head is in an arc-shaped structure; The contact heads in the first rotating and telescopic mechanism are distributed at equal intervals on the first virtual ring contour; The contact heads in the second rotating and telescopic mechanism are distributed at equal intervals on the second virtual ring contour; The axis center lines of the first virtual ring contour and the second virtual ring contour both coincide with the axis center line of the rotation axis.

10. A semiconductor device, characterized in that: include: The spacing adjustment device according to any one of claims 1 to 9; Wherein, the axis center line of the rotating shaft coincides with the axis center line of the cavity of the semiconductor device.

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