Wax liquid heating device for waxing wafer

Abstract

The utility model discloses a wax liquid heating device for wafer wax pasting, relates to the technical field of wafer wax pasting, and aims to solve the problems that wax on the surface is melted, multiple transmission is realized, time and resources are wasted, the heat of a ceramic plate is high, and the service life of the ceramic plate is prolonged due to the fact that most of the existing wax liquid heating is realized by heating the ceramic plate through bottom heating and heat transmission. And people are easy to be hurt when the device is taken down. A connecting seat is arranged at the upper end of the base, and a heating disc is arranged at the upper end of the connecting seat; the charging groove is formed in the upper surface of the heating disc, and the upper end of the charging groove is in an opening form; the heating groove is formed in the center of the heating disc, and a heating rod is arranged in the heating groove; and the heat conduction columns are arranged on the periphery of the heating rod, a penetrating groove is formed between the heating groove and the charging groove, the heat conduction columns are inserted into the penetrating groove, a connecting piece is arranged at one end of each heat conduction column, and the connecting pieces and the heat conduction columns are of an integrated structure.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer waxing, in particular to a wax liquid heating device used for wafer waxing. Background Art

[0002] Waxing of wafers is a process of melting wax and fixing the wafer to the ceramic plate through the wax liquid.

[0003] For example, the Chinese authorized patent with announcement number CN210058835U (waxing device for silicon carbide wafers): includes a control box on the machine and a mechanical arm and a cylinder electrically connected to the control box. The cylinder is installed above the machine through a support column. The free end of the piston rod of the cylinder is fixed to the punch head, and the ceramic disc is correspondingly arranged under the punch head; the mechanical arm is connected to the adsorption device through a telescopic cylinder, and a plurality of vacuum adsorption pads are arranged on the lower surface of the adsorption device. The adsorption device is provided with a vacuum adsorption pipeline connected to a vacuum pump, and the vacuum pump is electrically connected to the control box; the ceramic disc is placed in a placement slot, and a heating ring is installed at the bottom of the placement slot, and the ceramic disc is placed on the heating ring; a wafer placement table is also arranged on the machine. The waxing device adopts overall patch heating, changing the traditional single-chip heating method, which can greatly improve the processing efficiency, and the patch temperature consistency is higher, ensuring the high-quality processing of silicon carbide wafers.

[0004] However, most of the existing wax liquid heating is done by heating the bottom, and heating the ceramic plate by heat transfer, so that the wax on the surface melts. The multiple transfers are time-consuming and resource-consuming, and the ceramic plate has high heat and is easy to cause harm to people when removing it. Therefore, it does not meet the existing needs. We have proposed a wax liquid heating device for wafer waxing. Utility Model Content

[0005] The purpose of the utility model is to provide a wax liquid heating device for wafer waxing, so as to solve the problems proposed in the above background technology that most of the existing wax liquid heating is carried out by bottom heating, and the ceramic plate is heated by heat transfer to melt the wax on the surface, which is time-consuming and resource-consuming, and the ceramic plate has high heat and is easy to cause harm to people when being removed.

[0006] To achieve the above object, the utility model provides the following technical solution: a wax liquid heating device for wafer waxing, comprising: a base, a connecting seat is arranged at the upper end of the base, and a heating plate is arranged at the upper end of the connecting seat;

[0007] Also includes:

[0008] A charging trough, which is arranged on the upper surface of the heating plate, and the upper end of the charging trough is in an open form;

[0009] A heating groove is arranged at the center of the heating plate, and a heating rod is arranged inside the heating groove;

[0010] The heat-conducting column is arranged around the heating rod, a through groove is arranged between the heating groove and the charging groove, and the heat-conducting column is inserted into the through groove.

[0011] Preferably, a connecting piece is provided at one end of the heat-conducting column, and the connecting piece and the heat-conducting column are an integral structure, fixing screws are provided at both ends of the connecting piece, and the connecting piece is threadably fixed to the heating rod through the fixing screws.

[0012] Preferably, a connecting ring seat is provided at the opening at the upper end of the heating groove, and the connecting ring seat and the heating plate are an integrated structure.

[0013] Preferably, the outer wall of the connecting ring seat is provided with a connecting thread, and the connecting thread and the connecting ring seat are an integrated structure, the upper end of the connecting ring seat is provided with an insulation cover plate, the interior of the insulation cover plate is provided with a threaded connecting groove, and the insulation cover plate is threadedly fixed to the connecting ring seat through the threaded connecting groove.

[0014] Preferably, a heat-insulating liner is provided inside the threaded connection groove, and the heat-insulating liner is made of stainless steel.

[0015] Preferably, a control panel is provided on one side of the connecting seat, and the connecting seat is fixed to the base and the heating plate by welding.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. The utility model provides a through groove between the heating groove and the charging groove, and the heat-conducting column is inserted into the through groove, and one end of the heat-conducting column is fixed to the heating rod by an external fixing screw of the connecting piece, so that the heat-conducting column is easy to disassemble, and the ceramic plate is placed in the charging groove, and the heat is generated by the heating rod, and then the heat is transferred to the inside of the charging groove through the heat-conducting column, and the wax on the surface of the ceramic plate is heated and melted. At this time, the heating is directly heated from top to bottom, and the wax is directly heated, rather than from bottom to top, through the ceramic plate to heat the wax, so that there is no need for multi-layer heat transfer, the wax melting efficiency is improved, and the temperature of the ceramic plate is also reduced. When the wax is melted into wax liquid and fixed with the wafer and removed, it is not easy to cause harm to personnel, thereby improving safety, and solving the problem that most of the existing wax liquid heating is heated by bottom heating, and the ceramic plate is heated by heat transfer, so that the surface wax is melted, multiple transfers are time-consuming and resource-consuming, and the ceramic plate has high heat and is easy to cause harm to people when it is removed.

[0018] 2. A connecting ring seat with connecting threads is arranged at the upper opening of the heating groove, and an insulating liner is arranged inside the insulating cover. After the heat-conducting column is fixed, the insulating cover is covered. The insulating cover is fixed to the connecting ring seat through the threaded connecting groove, and the insulating liner is used for insulation to avoid rapid heat loss and save energy loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the top view of the heating plate of the utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the heating plate of the utility model;

[0022] Figure 4 This is a bottom view of the structure of the thermal insulation cover plate of the utility model;

[0023] In the figure: 1. Base; 2. Heating plate; 3. Connecting seat; 4. Control panel; 5. Loading trough; 6. Heating trough; 7. Connecting ring seat; 8. Insulation cover; 9. Heating rod; 10. Heat-conducting column; 11. Through slot; 12. Connecting piece; 13. Fixing screw; 14. Threaded connecting slot; 15. Insulation liner; 16. Connecting thread. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] See also Figure 1-4 The utility model provides an embodiment: a wax liquid heating device for wafer waxing, comprising: a base 1, a connecting seat 3 is arranged at the upper end of the base 1, and a heating plate 2 is arranged at the upper end of the connecting seat 3;

[0026] Also includes:

[0027] A charging trough 5 is provided on the upper surface of the heating plate 2, and the upper end of the charging trough 5 is in an open form;

[0028] A heating groove 6 is arranged at the center of the heating plate 2, and a heating rod 9 is arranged inside the heating groove 6;

[0029] The heat-conducting column 10 is arranged around the heating rod 9 . A through groove 11 is arranged between the heating groove 6 and the charging groove 5 , and the heat-conducting column 10 is inserted into the through groove 11 .

[0030] The ceramic disc is placed into the loading trough 5, and heat is generated by the heating rod 9. Then, heat is transferred to the loading trough 5 through the heat-conducting column 10 to heat and melt the wax on the surface of the ceramic disc. At this time, the heating is directly from top to bottom, and the wax is directly heated, rather than from bottom to top, through the ceramic disc to heat the wax. In this way, there is no need for multi-layer heat transfer, which improves the melting efficiency of the wax and also reduces the temperature of the ceramic disc. When the wax is melted into wax liquid and fixed to the chip and removed, it is not easy to cause harm to personnel, thereby improving safety.

[0031] See also Figure 3 A connecting piece 12 is provided at one end of the heat-conducting column 10, and the connecting piece 12 and the heat-conducting column 10 are an integral structure. Fixing screws 13 are provided at both ends of the connecting piece 12, and the connecting piece 12 is threadedly fixed to the heating rod 9 through the fixing screws 13, which facilitates the fixing and disassembly of the heat-conducting column 10.

[0032] See also Figure 1 A connecting ring seat 7 is provided at the upper opening of the heating groove 6, and the connecting ring seat 7 and the heating plate 2 are an integral structure for fixing with the heat preservation cover plate 8.

[0033] See also Figure 1 , 4 The outer wall of the connecting ring seat 7 is provided with a connecting thread 16, and the connecting thread 16 and the connecting ring seat 7 are an integrated structure. The upper end of the connecting ring seat 7 is provided with a thermal insulation cover plate 8, and the interior of the thermal insulation cover plate 8 is provided with a threaded connecting groove 14, and the thermal insulation cover plate 8 is threadedly fixed to the connecting ring seat 7 through the threaded connecting groove 14, and the threaded connecting groove 14 is provided with a thermal insulation liner 15, and the thermal insulation liner 15 is made of stainless steel, covered with the thermal insulation cover plate 8, and the thermal insulation cover plate 8 is threadedly fixed to the connecting ring seat 7 through the threaded connecting groove 14, and is insulated by the thermal insulation liner 15 to avoid rapid heat loss and save energy loss.

[0034] See also Figure 1 A control panel 4 is provided on one side of the connecting seat 3, and the connecting seat 3 is welded and fixed to the base 1 and the heating plate 2 to control the start and stop of the heating rod 9.

[0035] Working principle: When in use, the heat-conducting column 10 is inserted into the through groove 11, and one end of the heat-conducting column 10 is fixed to the heating rod 9 through the connecting piece 12 and the external fixing screw 13. The heating rod 9 generates heat and the heat is transferred through the heat-conducting column 10. After fixing, the insulation cover 8 is covered. The insulation cover 8 is threadedly fixed to the connecting ring seat 7 through the threaded connection groove 14, and is insulated by the insulation liner 15 to avoid rapid heat loss and save energy loss. The ceramic plate is placed in the loading groove 5, and the heat is generated by the heating rod 9. Then, the heat is transferred to the inside of the loading groove 5 through the heat-conducting column 10 to heat and melt the wax on the surface of the ceramic plate. At this time, the heating is directly heated from top to bottom, and the wax is directly heated, rather than from bottom to top, through the ceramic plate to heat the wax, so that there is no need for multi-layer heat transfer, the wax melting efficiency is improved, and the temperature of the ceramic plate is also reduced. When the wax is melted into wax liquid and fixed to the chip and removed, it is not easy to cause harm to personnel, thereby improving safety.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A wax liquid heating device for wafer waxing, comprising a base (1), a connecting seat (3) being arranged at the upper end of the base (1), and a heating plate (2) being arranged at the upper end of the connecting seat (3); Features: Also includes: A charging trough (5) is arranged on the upper surface of the heating plate (2), and the upper end of the charging trough (5) is open; A heating groove (6) is arranged at the center of the heating plate (2), and a heating rod (9) is arranged inside the heating groove (6); The heat-conducting column (10) is arranged around the heating rod (9), a through groove (11) is arranged between the heating groove (6) and the charging groove (5), and the heat-conducting column (10) is inserted into the through groove (11).

2. The wax liquid heating device for wafer waxing according to claim 1, characterized in that: A connecting piece (12) is provided at one end of the heat-conducting column (10), and the connecting piece (12) and the heat-conducting column (10) are an integral structure. Fixing screws (13) are provided at both ends of the connecting piece (12), and the connecting piece (12) is threadedly fixed to the heating rod (9) via the fixing screws (13).

3. The wax liquid heating device for wafer waxing according to claim 1, characterized in that: A connecting ring seat (7) is provided at the upper opening of the heating groove (6), and the connecting ring seat (7) and the heating plate (2) are an integrated structure.

4. The wax liquid heating device for wafer waxing according to claim 3, characterized in that: The outer wall of the connecting ring seat (7) is provided with a connecting thread (16), and the connecting thread (16) and the connecting ring seat (7) are an integral structure. The upper end of the connecting ring seat (7) is provided with a heat-insulating cover plate (8), and the interior of the heat-insulating cover plate (8) is provided with a threaded connecting groove (14), and the heat-insulating cover plate (8) is threadedly fixed to the connecting ring seat (7) via the threaded connecting groove (14).

5. The wax liquid heating device for wafer waxing according to claim 4, characterized in that: A heat-insulating liner (15) is arranged inside the threaded connection groove (14), and the heat-insulating liner (15) is made of stainless steel.

6. The wax liquid heating device for wafer waxing according to claim 1, characterized in that: A control panel (4) is provided on one side of the connection seat (3), and the connection seat (3) is fixed to the base (1) and the heating plate (2) by welding.

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