Semiconductor packaging equipment

Abstract

The utility model discloses semiconductor packaging equipment which comprises a shell, a lower die is fixedly connected to the inner wall of the bottom of the shell, a hydraulic cylinder is fixedly connected to the inner wall of the top of the shell, a connecting plate is fixedly connected to one end of a hydraulic rod of the hydraulic cylinder, and an upper die is installed at the bottom of the connecting plate through two connecting assemblies. The connecting assembly comprises a supporting frame, the supporting frame is fixed to the upper surface of the connecting plate through bolts, an inserting opening is formed in one side of the connecting plate, a T-shaped block is movably connected into the inserting opening and makes contact with the supporting frame, and a spring is fixedly connected to one end of the T-shaped block. According to the upper die assembly and disassembly device, the supporting frame and the T-shaped block can be used in cooperation, a worker can conveniently disassemble and assemble the upper die, meanwhile, the position of the T-shaped block can be limited through the sliding rod, and the T-shaped block can stably move through the second multi-section telescopic rod.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, in particular to a semiconductor packaging device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. The core units of most electronic products today, such as computers, mobile phones, or digital recorders, are closely related to semiconductors, which need to be packaged during the production process.

[0003] Most packaging equipment requires regular inspection and maintenance of the packaging upper mold to ensure the quality of packaging. Since the packaging upper mold and the electric push rod are usually fixedly connected, their disassembly is relatively cumbersome. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and provides a semiconductor packaging device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor packaging device comprises a shell, a lower mold is fixedly connected to the bottom inner wall of the shell, a hydraulic cylinder is fixedly connected to the top inner wall of the shell, one end of the hydraulic rod of the hydraulic cylinder is fixedly connected to a connecting plate, an upper mold is installed at the bottom of the connecting plate through two connecting components, the connecting component comprises a support frame, the support frame is fixed to the upper surface of the connecting plate by bolts, a socket is provided on one side of the connecting plate, a T-block is movably connected in the socket, and the T-block is in contact with the support frame, one end of the T-block is fixedly connected to a spring, a fixed block is fixedly connected to the upper surface of the connecting plate, and the fixed block is fixed to the spring, and a limiting component is provided on the top of the fixed block.

[0007] As a further solution of the utility model, the limiting assembly includes a first multi-section telescopic rod, which is fixed to the top of the fixed block by bolts, and the top end of the first multi-section telescopic rod is fixedly connected to a sliding rod.

[0008] As a further solution of the utility model, a pressing block is fixedly connected to the top of the sliding rod.

[0009] As a further solution of the utility model, a second multi-section telescopic rod is fixedly connected to one side of the T-shaped block, and the second multi-section telescopic rod is fixed to the fixed block.

[0010] As a further solution of the utility model, both side outer walls of the lower mold are fixedly connected with an injection tube, and one end of the injection tube passes through the shell.

[0011] As a further solution of the utility model, a mounting opening is opened on one side of the shell, and two rotating doors are movably connected in the mounting opening.

[0012] As a further solution of the utility model, a handle is fixedly connected to one side of the rotating door.

[0013] The beneficial effects of the utility model are:

[0014] 1. The coordinated use of the support frame and the T-block makes it convenient for the staff to disassemble and install the upper mold, and facilitates the subsequent maintenance of the staff, thus improving the convenience of the device.

[0015] 2. Through the setting of the slide bar, the slide bar can limit the position of the T-block to prevent the spring rebound from resetting the T-block, which is convenient for the next installation and improves the limiting effect of the device.

[0016] 3. Through the provision of the second multi-section telescopic rod, the second multi-section telescopic rod can guide the T-block so that it can move stably, thereby preventing the T-block from tilting during movement, thereby improving the stability of the T-block movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor packaging device proposed by the utility model;

[0018] Figure 2 A schematic diagram of a cross-sectional structure of a shell of a semiconductor packaging device proposed by the utility model;

[0019] Figure 3 This is a schematic diagram of a fixing block assembly structure of a semiconductor packaging device proposed by the utility model;

[0020] Figure 4 This is a partial enlarged structural schematic diagram of a semiconductor packaging device proposed by the utility model;

[0021] Figure 5 The utility model is a schematic diagram of the support frame assembly structure of a semiconductor packaging device.

[0022] In the figure: 1. handle; 2. revolving door; 3. shell; 4. upper mold; 5. connecting plate; 6. support frame; 7. hydraulic cylinder; 8. lower mold; 9. sliding rod; 10. first multi-section telescopic rod; 11. fixing block; 12. spring; 13. injection molding tube; 14. T-block; 15. second multi-section telescopic rod; 16. pressing block; 17. socket. DETAILED DESCRIPTION

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, so that the embodiments of the application described here, based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0024] Reference Figure 1-Figure 5 A semiconductor packaging device includes a housing 3, a lower mold 8 is fixed to the bottom inner wall of the housing 3 by bolts, a hydraulic cylinder 7 is fixed to the top inner wall of the housing 3 by bolts, a connecting plate 5 is fixed to one end of the hydraulic rod of the hydraulic cylinder 7 by bolts, an upper mold 4 is installed at the bottom of the connecting plate 5 by two connecting components, a semiconductor is placed in the lower mold 8, and packaging material is injected into the lower mold 8, the hydraulic cylinder 7 is started, the hydraulic cylinder 7 is extended to make the upper mold 4 move downward and overlap with the lower mold 8 for packaging, the connecting component includes a support frame 6, the support frame 6 is fixed to the upper surface of the connecting plate 5 by bolts, and one side of the connecting plate 5 is opened A socket 17 is provided, in which a T-block 14 is slidably connected, and the T-block 14 is in contact with the support frame 6. A spring 12 is welded at one end of the T-block 14. A fixing block 11 is fixed to the upper surface of the connecting plate 5 by bolts, and the fixing block 11 is fixed to the spring 12. The staff pulls the T-block 14 to pull it outward along the socket 17, and the spring 12 contracts. At this time, the T-block 14 is separated from the support frame 6, and the upper mold 4 loses its restriction. The staff can directly remove the upper mold 4 from the bottom of the connecting plate 5. A limit assembly is provided on the top of the fixed block 11 to limit the moved T-block 14.

[0025] In the present invention, it should be noted that the limiting assembly includes a first multi-section telescopic rod 10, which is fixed to the top of a fixed block 11 by bolts, a slide bar 9 is fixed to the top of the first multi-section telescopic rod 10 by bolts, and a pressure block 16 is fixed to the top of the slide bar 9 by bolts. When the position of the T-block 14 moving laterally exceeds the vertical rod part of the slide bar 9, the pressure block 16 is pressed downward to shrink the first multi-section telescopic rod 10 and shorten it. At this time, the vertical rod part of the slide bar 9 can limit the position of the T-block 14, and the T-block 14 A second multi-section telescopic rod 15 is fixed to one side by bolts, and the second multi-section telescopic rod 15 is fixed to the fixed block 11. The second multi-section telescopic rod 15 can guide the T-block 14 so that it can move stably. The outer walls on both sides of the lower mold 8 are fixed with injection tubes 13 by bolts, and one end of the injection tube 13 passes through the shell 3, which is convenient for the staff to inject packaging materials into the lower mold 8. An installation port is opened on one side of the shell 3, and two revolving doors 2 are rotatably connected in the installation port. A handle 1 is fixed to one side of the revolving door 2 by bolts.

[0026] Working principle: When the upper mold 4 needs to be disassembled, the staff first pulls the T-block 14 to pull it backward along the socket 17, and the spring 12 contracts. At this time, the T-block 14 is separated from the support frame 6, and the upper mold 4 loses its restriction. The staff can directly remove the upper mold 4 from the bottom of the connecting plate 5.

[0027] The present invention has been described through the above-mentioned embodiments. Those skilled in the art will appreciate that the present invention is not limited to the above-mentioned embodiments, and more modifications may be made according to the teachings of the present invention. These modifications are all within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor packaging device, comprising a housing (3), wherein a lower mold (8) is fixedly connected to the bottom inner wall of the housing (3), characterized in that: A hydraulic cylinder (7) is fixedly connected to the inner wall of the top of the housing (3); one end of the hydraulic rod of the hydraulic cylinder (7) is fixedly connected to a connecting plate (5); an upper mold (4) is installed at the bottom of the connecting plate (5) via two connecting assemblies; the connecting assembly comprises a support frame (6); the support frame (6) is fixed to the upper surface of the connecting plate (5) via bolts; a socket (17) is provided on one side of the connecting plate (5); a T-shaped block (14) is movably connected in the socket (17), and the T-shaped block (14) is in contact with the support frame (6); one end of the T-shaped block (14) is fixedly connected to a spring (12); a fixed block (11) is fixedly connected to the upper surface of the connecting plate (5), and the fixed block (11) is fixed to the spring (12); a limiting assembly is provided on the top of the fixed block (11).

2. A semiconductor packaging device according to claim 1, characterized in that: The position limiting assembly comprises a first multi-section telescopic rod (10), which is fixed to the top of a fixing block (11) by means of bolts, and the top end of the first multi-section telescopic rod (10) is fixedly connected to a sliding rod (9).

3. A semiconductor packaging device according to claim 2, characterized in that: A pressing block (16) is fixedly connected to the top of the sliding rod (9).

4. The semiconductor packaging device according to claim 1, characterized in that: A second multi-section telescopic rod (15) is fixedly connected to one side of the T-shaped block (14), and the second multi-section telescopic rod (15) is fixed to the fixed block (11).

5. The semiconductor packaging device according to claim 1, characterized in that: The outer walls on both sides of the lower mold (8) are fixedly connected with an injection tube (13), and one end of the injection tube (13) passes through the shell (3).

6. The semiconductor packaging device according to claim 1, characterized in that: A mounting opening is provided on one side of the housing (3), and two rotating doors (2) are movably connected in the mounting opening.

7. The semiconductor packaging device according to claim 6, characterized in that: A handle (1) is fixedly connected to one side of the rotating door (2).

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