Label taking head pressure monitoring device and label taking device for chip heat dissipation paster

Abstract

The embodiment of the utility model provides a label taking head pressure monitoring device and a label taking device for a chip heat dissipation paster. The pressure monitoring device comprises a pressing piece, a monitoring assembly and an elastic piece, and the monitoring assembly comprises a monitoring cavity and a pressure monitor arranged in the monitoring cavity; the first end of the pressing piece is used for being detachably connected with the label taking head; the first end of the elastic piece is fixedly connected with the second end of the pressing piece, and the second end of the elastic piece abuts against the pressure monitor, so that the pressing piece is telescopically inserted into the monitoring cavity; and the pressure monitor is used for measuring a pressure signal of the label taking head so as to monitor the pressure applied to the chip by the label taking head in real time. According to the pressure monitoring device, manpower consumption is reduced in the heat dissipation pasting process, and efficiency is improved; the operation process is standardized, deviation caused by human factors in production is reduced, and the product yield is improved; real-time monitoring of products in the production process is achieved, abnormity is found in the first time, continuous production of abnormal products is avoided, and the quality is improved.

Description

Technical Field

[0001] The disclosed embodiments belong to the field of semiconductor technology, and specifically relate to a labeling head pressure monitoring device and a labeling device for a chip heat sink. Background Art

[0002] COF (Chip on film) products are a chip structure with slender silicon crystals and a thin and bendable substrate, mostly used for display driver chips. Due to its special structural characteristics, COF products generate a lot of heat during operation, so a flexible and extensible heat dissipation paste needs to be attached to the substrate side during packaging to enhance the heat dissipation effect of COF products.

[0003] In the process of heat dissipation, in order to ensure that the heat dissipation can be attached normally, the industry will calibrate the height and position of the label picker during the assembly of the heat dissipation, so that the label picker can be as close to the COF product as possible when carrying the heat dissipation, but not in contact with the COF product. In the existing technology, the height calibration of the label picker is manually calibrated by engineers, which is time-consuming, low-precision, has no quantitative standards, and is overly dependent on the technical ability and personal experience of engineers.

[0004] In the prior art, the principle of calibrating the height of the header in the step of assembling the heat sink is as follows: Figure 1 As shown, 1 is the label taking head, 2 is the heat sink, 3 is the COF product, 4 is the receiving platform, and 5 is the thickness scale. During height calibration, the receiving platform 4 fixes a COF product 3, and the operator places the thickness scale 5 on the COF product 3, and lets the label taking head 1 suck up a piece of heat sink 2 and gradually descend from a high place until the heat sink 2 comes into contact with the thickness scale 5. Then the operator will pull the thickness scale 5 slightly, and judge whether the position of the label taking head 1 is appropriate by feeling the friction when the thickness scale 5 moves.

[0005] In fact, the thickness of the thickness scale 5 is extremely small and cannot be identified by the naked eye. After the setting is completed, there is no accurate feedback on the height of the label picker. The personnel can only judge whether the pressure of the label picker is appropriate and whether further adjustment is required based on the attachment effect of the heat sink patch. This results in excessive manpower consumption when debugging the heat sink patch machine, which reduces production efficiency. At the same time, since the label picker height cannot provide a quantitative label picker height value during the calibration, the pressure of the label picker on the heat sink patch and COF product cannot be accurately controlled. During production, the personnel can only rely on regular spot checks and observe the product appearance to confirm the production status. It is impossible to ensure that the abnormality is detected at the first time, resulting in unstable yield of heat sink patch COF products.

[0006] In view of the above problems, it is necessary to propose a labeling head pressure monitoring device and a labeling device for chip heat sink that are reasonably designed and can effectively improve the above problems. Utility Model Content

[0007] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art, and provide a labeling head pressure monitoring device and a labeling device for a chip heat sink.

[0008] One aspect of an embodiment of the present disclosure provides a label taking head pressure monitoring device, comprising: a pressing member, a monitoring assembly and an elastic member, wherein the monitoring assembly comprises a monitoring chamber and a pressure monitor disposed in the monitoring chamber;

[0009] The first end of the pressing member is used to be detachably connected to the label taking head;

[0010] The first end of the elastic member is fixedly connected to the second end of the pressing member, and the second end of the elastic member is in contact with the pressure monitor, so that the pressing member can be retractably inserted into the monitoring chamber; wherein,

[0011] The pressure monitor is used to measure the pressure signal of the label taking head to monitor the pressure applied to the chip by the label taking head in real time.

[0012] Optionally, a protruding shaft is provided in the central area of ​​the second end of the pressing member, and the protruding shaft is fixedly connected to the first end of the elastic member so that the protruding shaft can be telescopically inserted into the monitoring chamber.

[0013] Optionally, a first limiting portion is provided at the end of the protruding shaft facing the monitoring chamber;

[0014] The bottom of the monitoring chamber is provided with a support limit portion extending from the inner side wall of the monitoring chamber toward the protruding shaft; wherein,

[0015] When the protruding shaft moves downward, the first limiting portion is limited by the top wall of the supporting limiting portion.

[0016] Optionally, a second limiting portion is provided at the end of the protruding shaft facing the label taking head; wherein,

[0017] When the protrusion moves in the axial direction, the second limiting portion is limited by the bottom wall of the supporting limiting portion.

[0018] Optionally, a positioning column is provided at the first end of the pressing member, and the positioning column is used to be inserted into a corresponding positioning groove of the label taking head.

[0019] Optionally, the elastic member is a spring.

[0020] Optionally, the pressure monitor is a pressure sensor.

[0021] Another aspect of the embodiment of the present disclosure provides a label removal device for a chip heat sink, including a label removal head and a label removal head pressure monitoring device, wherein the label removal head pressure monitoring device adopts the label removal head pressure monitoring device described above; wherein,

[0022] The first end of the label taking head is provided with a plurality of adsorption holes for adsorbing the heat dissipation sticker, and the second end of the label taking head is detachably connected to the first end of the pressing member.

[0023] Optionally, a plurality of fasteners are also included;

[0024] A plurality of first through holes are disposed at an edge area of ​​the first end of the pressing member, and a plurality of second through holes corresponding to the first through holes are disposed at the second end of the label taking head;

[0025] The fastener passes through the first through hole and the second through hole in sequence to fix the pressing member and the label taking head.

[0026] The label removal head pressure monitoring device and the label removal device for chip heat sink paste of the disclosed embodiment, the first end of the pressing member in the label removal head pressure monitoring device is used for detachable connection with the label removal head, which can be easily adapted to different label removal heads to meet the attachment of different types of heat sink pastes.

[0027] In the label taking head pressure monitoring device of the disclosed embodiment, the first end of the elastic member is fixedly connected to the second end of the pressing member, and the second end of the elastic member is in contact with the pressure monitor, so that the pressing member can be telescopically inserted into the monitoring chamber. The pressing member can move up and down in the monitoring chamber. When pressing down, the downward pressure is provided by the elastic force of the elastic member, the weight of the label taking head and the weight of the pressing member. Under the action of the elastic member, the downward pressure of the label taking head can be controlled to increase smoothly, and the pressure of the label taking head can be controlled to change smoothly.

[0028] The pressure monitoring device for the label taking head of the disclosed embodiment uses a pressure monitor to measure the pressure signal of the label taking head to monitor the pressure applied by the label taking head to the chip in real time. The pressure applied by the label taking head to the chip can be fed back in real time and accurately during the process of attaching the heat sink to the chip to ensure that the pressure applied by the label taking head to the chip is within a safe range during operation.

[0029] The labeling head pressure monitoring device of the disclosed embodiment can reduce manpower consumption and improve efficiency when automatically measuring the height in the heat sink process; standardize the operating process, reduce deviations caused by human factors in production, and improve product yield; realize real-time monitoring of products during the production process, discover abnormalities at the first time, avoid continuous production of abnormal products, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the height calibration of a header in the prior art;

[0031] Figure 2 It is a cross-sectional view of a pressure monitoring device for a labeling head according to one embodiment of the present disclosure;

[0032] Figure 3 It is a three-dimensional diagram of a labeling head pressure monitoring device according to another embodiment of the present disclosure;

[0033] Figure 4 This is a structural schematic diagram of a labeling device for a chip heat dissipation sticker according to another embodiment of the present disclosure;

[0034] Figure 5 This is a schematic diagram of the structure of taking a header according to another embodiment of the present disclosure;

[0035] Figure 6 It is a schematic diagram of the working principle of the label head pressure monitoring device in the debugging of the heat dissipation sticker machine before production according to another embodiment of the disclosed embodiment;

[0036] Figure 7 This is a schematic flow chart of the working principle of a header pressure monitoring device in actual production according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] like Figure 2 and Figure 3 As shown, one aspect of the embodiment of the present disclosure provides a labeling head pressure monitoring device 100, comprising: a pressing member 110, a monitoring assembly 120 and an elastic member 130. The monitoring assembly 120 comprises a monitoring chamber 121 and a pressure monitor 122 disposed in the monitoring chamber 121.

[0039] The first end of the pressing member 110 is used to be detachably connected to the label removal head 210, which can be easily adapted to different label removal heads to meet the requirements of attaching different types of heat dissipation stickers. Specifically, the bottom of the pressing member 110 is detachably connected to the top of the label removal head 210.

[0040] The first end of the elastic member 130 is fixedly connected to the second end of the pressing member 110, and the second end of the elastic member 130 abuts against the pressure monitor 122, so that the pressing member 110 can be retractably inserted into the monitoring chamber 121. Specifically, in this embodiment, the second end of the elastic member 130 abuts against the pressure monitor 122 located on the top wall of the monitoring chamber 121.

[0041] The elastic part can make the pressing part move up and down within a certain range in the monitoring chamber. When the pressing part is pressed down, the elastic force of the elastic part, the weight of the label removal head and the weight of the pressing part provide pressure on the chip. The elastic part can achieve the effect of controlling the pressure to increase or decrease smoothly. Due to the existence of the elastic part, when the machine is pressed down, the pressure of the label removal head can be smoothly controlled, ensuring that when the machine is over-pressed, the machine can stop in time before the product is seriously damaged, thereby improving product quality.

[0042] It should be noted that, in this embodiment, the elastic member 130 may be a spring or other structures, as long as it can limit the relative movement of the pressing member 110 relative to the monitoring chamber 121 to a certain extent and can control the pressure of the label taking head 210 on the chip to change smoothly.

[0043] The pressure monitor 122 is used to measure the pressure signal of the label taking head 210 to monitor the pressure applied to the chip by the label taking head 210 in real time.

[0044] Specifically, in this embodiment, the heat sink patch for COF products is used as an example for explanation. The heat sink patch is a multi-layer sheet structure composed of a PI layer, a metal layer, and a glue layer, and has the characteristics of being thin, bendable, and having excellent thermal conductivity. The glue layer is located at the bottom, so the bottom is sticky. In other words, during the process of mounting the heat sink patch on the COF product, the pressure monitor 122 can provide real-time feedback of the pressure applied by the label taking head 210 to the COF product.

[0045] It should be noted that, in this embodiment, the pressure monitor 122 may be a pressure sensor or other devices, which are not specifically limited in this embodiment and can be selected according to actual needs. In addition, this embodiment does not specifically limit the relative position of the pressure monitor 122, and only needs to accurately collect the pressure applied by the label taking head 210 to the COF product without interfering with the operation of the machine.

[0046] It should be further explained that the pressure monitor 122 is electrically connected to the processor of the machine through a signal transmission line, wherein the signal transmission line is electrically connected to the processor of the machine through the accommodating chamber 123. The pressure signal measured by the pressure monitor 122 can be transmitted to the processor in real time, and the processor is used to attach the heat dissipation sticker adsorbed by the label removal head to the chip according to the pressure of the label removal head 210.

[0047] In the label taking head pressure monitoring device of the disclosed embodiment, the pressing piece is used for detachably connecting with the label taking head, which can be easily adapted to different label taking heads to meet the attachment of different types of heat sinks; the pressing piece is retractably inserted into the monitoring chamber through an elastic piece, and can move up and down in the monitoring chamber within a certain range, and can control the label taking head pressure to change steadily under the action of the elastic piece; the pressure monitor can provide real-time and accurate feedback on the pressure of the label taking head on the chip during the process of attaching the heat sink to the chip, ensuring that the pressure of the label taking head on the chip (COF product) is within a safe range during operation; the pressure monitoring device can reduce manpower consumption and improve efficiency during the automatic height measurement of the heat sink process; standardize the operating procedures, reduce deviations caused by human factors in production, and improve product yield; realize real-time monitoring of products during the production process, discover abnormalities at the first time, avoid continuous production of abnormal products, and improve product quality.

[0048] For example, Figure 2 As shown, a protruding shaft 111 is disposed in the central area of ​​the second end of the pressing member 110, and the protruding shaft 111 is fixedly connected to the first end of the elastic member 130, so that the protruding shaft 111 can be retractably inserted into the monitoring chamber 121, and can move up and down in the monitoring chamber 121 and abut against the pressure monitor 122. When the label taking head 210 is pressed down, the pressure applied to the lower surface of the label taking head 210 can be calculated by the elastic force of the elastic member 130 on the monitoring chamber 121.

[0049] For example, Figure 2 As shown, a first limiting portion 111 a is provided at the end of the protruding shaft 111 facing the monitoring chamber 121 . Specifically, the first limiting portion 111 a is located at the periphery of the top of the protruding shaft 111 .

[0050] The bottom of the monitoring chamber 121 is provided with a support stopper 121a extending from the inner wall of the monitoring chamber 121 to the protruding shaft 111, and the support stopper 121a guides and supports the movement of the protruding shaft 111. Specifically, the support stopper 121a is located around the bottom opening of the monitoring chamber 121.

[0051] When the protruding shaft 111 moves downward, the first limiting portion 111a is limited by the top wall of the supporting limiting portion 121a, so as to prevent the protruding shaft 111 from moving downward out of the monitoring chamber 121.

[0052] For example, Figure 2 As shown, the end of the protruding shaft 111 facing the label taking head 210 is provided with a second limiting portion 111b. Specifically, the second limiting portion 111b is located at the periphery of the bottom of the protruding shaft 111.

[0053] When the protruding shaft 111 moves upward, the second limiting portion 111 b is limited by the bottom wall of the supporting limiting portion 121 a, so as to limit the moving distance of the protruding shaft 111 in the monitoring chamber 121 .

[0054] Specifically, in this embodiment, the robot arm is connected to the top of the monitoring chamber 121 to drive the label head pressure monitoring device to move. Specifically, the top of the monitoring chamber 121 is connected to the end of the machine robot arm, and the end of the robot arm can move and rotate within a certain range in the x, y, and z directions. The bottom of the robot arm is installed on a guide rail, so that the robot arm can move between the heat dissipation paste conveying track and the COF product conveying track.

[0055] For example, Figure 2 and Figure 3 As shown, a positioning column 112 is provided at the first end of the pressing member 110, and the positioning column 112 is used to be inserted into the corresponding positioning groove of the label removal head 210. Specifically, a cylindrical positioning column 112 is provided at the bottom of the pressing member 110, and a cylindrical positioning groove corresponding to the positioning column 112 is provided at the top of the label removal head 210. The positioning column 122 is provided in the positioning groove, which can play a positioning role when the pressing member 110 and the label removal head 210 are assembled and fixed.

[0056] like Figure 4 As shown, another aspect of the embodiment of the present disclosure provides a labeling device 200 for a chip heat sink, including a labeling head 210 and a labeling head pressure monitoring device, wherein the labeling head pressure monitoring device adopts the labeling head pressure monitoring device 100 described above. The specific structure of the labeling head pressure monitoring device 100 has been described in detail above and will not be repeated here.

[0057] The first end of the label removal head 210 is provided with a plurality of adsorption holes 211 for adsorbing the heat dissipation sticker, and the second end of the label removal head 210 is detachably connected to the first end of the pressing member 110 .

[0058] Specifically, in this embodiment, Figure 5 As shown, the interior of the label taking head 210 is hollow, and the side wall of the label taking head 210 is provided with a vent hole 212, which is connected to the vacuum tube of the machine. Among them, the adsorption hole 211 is a vacuum adsorption hole. When adsorbing the heat sink, the interior of the label taking head 210 is evacuated through the vacuum tube, and the heat sink is adsorbed to the first end of the label taking head 210 through the adsorption hole 211 under the action of air pressure. After the heat sink is attached to the chip, stop evacuating the label taking head 210, so that the heat sink is separated from the label taking head 210.

[0059] It should be noted that the present embodiment does not specifically limit the structure of the tag acquisition header 210 , and a corresponding type of tag acquisition header 210 may be selected according to actual needs.

[0060] The label picking device for chip heat sinks of the disclosed embodiment has a label picking head and a pressing piece that are detachably connected, and can be easily adapted to different label picking heads to meet the attachment requirements of different types of heat sinks. The label picking device can provide real-time and accurate feedback on the pressure of the label picking head on the chip during the process of attaching the heat sink to the chip, ensuring that the pressure of the label picking head on the chip (COF product) is within a safe range during operation. The label picking device can reduce manpower consumption and improve efficiency when automatically measuring the height in the heat sink process; standardize operating procedures, reduce deviations caused by human factors in production, and improve product yield; realize real-time monitoring of products during the production process, discover abnormalities at the first time, avoid continuous production of abnormal products, and improve product quality.

[0061] For example, Figure 4 As shown, the labeling device 200 for chip heat dissipation stickers also includes a plurality of fasteners 220. A plurality of first through holes are provided at the edge area of ​​the first end of the pressing member 110, and a plurality of second through holes corresponding to the first through holes are provided at the second end of the labeling head 210. The fasteners 220 pass through the first through holes and the second through holes in sequence to fix the pressing member 110 and the labeling head 210.

[0062] Specifically, in this embodiment, the fastener 120 can be a screw, and correspondingly, the first through hole and the second through hole are both threaded holes. That is, the screw passes through the threaded holes on the pressing member 110 and the label removal head 210 in sequence to fix the pressing member 110 and the label removal head 210.

[0063] It should be noted that the number of fasteners 220 is not specifically limited in this embodiment and can be selected according to actual needs. In addition to the screws in this embodiment, other fasteners can also be used for the type of fasteners 220, which is not specifically limited in this embodiment.

[0064] Exemplarily, the labeling device 200 for chip heat sink further includes a plurality of horizontal adjustment members. The first end of the pressing member 110 is provided with a plurality of first adjustment through holes, and the second end of the labeling head 210 is provided with a plurality of second adjustment through holes corresponding to the first adjustment through holes. The horizontal adjustment member passes through the first adjustment through holes and the second adjustment through holes in sequence to adjust the pressing member 110 to a horizontal position.

[0065] Specifically, in this embodiment, the horizontal adjustment member can be a screw, and the first adjustment through hole and the second adjustment through hole can both be threaded holes. In this embodiment, the horizontal adjustment member includes 4 screws, and the four first adjustment through holes and the four second adjustment through holes are respectively arranged in four directions of the pressing member 110 and the label taking head 210. The 4 screws are respectively inserted into the threaded holes of the pressing member 110 and the label taking head 210 in sequence, and the pressing member 110 can be adjusted to a horizontal position by selectively tightening or loosening the screws. Among them, the number of horizontal adjustment members is not specifically limited and can be selected according to actual needs.

[0066] In this embodiment, the pressing member is adjusted to be horizontal by the horizontal adjustment member, so that pressure can be better applied to the label removal head to improve the mounting quality of the heat dissipation sticker.

[0067] like Figure 6 As shown, during the debugging of the heat dissipation sticker machine, the label taking head pressure monitoring device of the embodiment of the present disclosure can be used to measure the most suitable height of the label taking head at the adsorption position and the assembly position. The working principle is as follows:

[0068] In order to ensure that the heat sink can be attached normally, it is necessary to calibrate the height of the label removal head to assemble the heat sink before attaching the heat sink to the COF product. Since COF products and heat sinks are thin and easy to bend, the height of the label removal head needs to be set accurately enough. Therefore, in the prior art, the label removal head is limited to a height that allows the heat sink to be as close to the COF product as possible through a thickness ruler. When the label removal head pressure monitoring device of this embodiment is used, because this device can effectively avoid crushing the COF product by providing real-time feedback on the COF surface pressure, in the step of assembling the heat sink with the label removal head, the label removal head can be further downward on the basis of the original height to allow the heat sink to initially fit with the COF product. In this way, the position of the heat sink attached to the COF product can be more accurately controlled to avoid displacement of the heat sink position.

[0069] When automatically measuring the height of the position where the label picker adsorbs the heat sink, the label picker will gradually move down according to the preset program. When the label picker contacts the heat sink, it will start to measure the pressure on the heat sink until the pressure reaches the preset value. The label picker stops and records the height at this time. This step will be performed multiple times, and the final adsorption height is the average of multiple height measurement results. The automatic height measurement of the heat sink assembly position is similar. The label picker gradually descends and starts to measure the pressure when it contacts the COF product. When the preset pressure value is reached, it stops and records the label picker height at this time. The average of multiple measurements is the assembly height. Among them, in the automatic height measurement process, cyclic height measurement and averaging are not necessary. This process only increases the accuracy of height measurement.

[0070] like Figure 7As shown, in the actual process of attaching heat dissipation stickers to COF products, the labeling device of the embodiment of the present disclosure can provide real-time and accurate feedback on the pressure of the labeling head on the COF product, which is convenient for detecting abnormalities at the first time. Its working principle is as follows:

[0071] When adsorbing the heat sink, the heat sink moves on the heat sink conveying track of the machine until it reaches a specific position, then the label removal head moves down to the adsorption position, the bottom of the label removal head contacts the heat sink, and the machine vacuums the inside of the label removal head. Through the several adsorption holes at the bottom of the label removal head, the heat sink will be adsorbed on the bottom of the label removal head under the action of air pressure. Then the robotic arm drives the entire device and the heat sink to move directly above the assembly position of the heat sink; at the same time, the COF product moves on the track until it reaches the assembly position of the COF product. Then the robotic arm carries the heat sink and gradually presses down on the COF product until the heat sink contacts the COF product. Under the viscosity of the glue at the bottom of the heat sink and the pressure of the label removal head on the heat sink, the heat sink is initially fixed on the COF product; after the heat sink and the COF product are attached, the machine cancels the vacuum, the label removal head is removed, and then further fixation is completed with the help of other equipment.

[0072] In the actual process of installing the heat sink, due to the thickness error of the heat sink, machine jitter, installation error and human misoperation, the actual pressure of the label removal head on the product may exceed the safe range. Therefore, in order to avoid such problems causing product defects, during the adsorption and bonding process of the heat sink, the label removal head pressure monitoring device can use the pressure monitor to provide real-time and accurate feedback on the label removal head pressure to ensure that the pressure is within the safe range; when the pressure exceeds the safe range, the machine will stop the operation and alarm, and the personnel will check the abnormality to ensure that the abnormality is detected at the first time. Among them, when the pressure exceeds the range, the method of checking the abnormality is not limited, and it can also be an automatic troubleshooting mechanism of the machine, or it can be manual troubleshooting. The alarm method can be a sound alarm signal or a light alarm signal. The alarm method is not specifically limited in this embodiment, and can be selected according to actual needs.

[0073] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of the present disclosure.

Claims

1. A label head pressure monitoring device, characterized in that: include: A pressing member, a monitoring assembly and an elastic member, wherein the monitoring assembly includes a monitoring chamber and a pressure monitor disposed in the monitoring chamber; The first end of the pressing member is used to be detachably connected to the label taking head; The first end of the elastic member is fixedly connected to the second end of the pressing member, and the second end of the elastic member is in contact with the pressure monitor, so that the pressing member can be retractably inserted into the monitoring chamber; wherein, The pressure monitor is used to measure the pressure signal of the label taking head to monitor the pressure applied to the chip by the label taking head in real time.

2. The device according to claim 1, characterized in that A protruding shaft is arranged in the central area of ​​the second end of the pressing member, and the protruding shaft is fixedly connected to the first end of the elastic member so that the protruding shaft can be telescopically inserted into the monitoring chamber.

3. The device according to claim 2, characterized in that The end of the protruding shaft facing the monitoring chamber is provided with a first limiting portion; The bottom of the monitoring chamber is provided with a support limit portion extending from the inner side wall of the monitoring chamber toward the protruding shaft; wherein, When the protruding shaft moves downward, the first limiting portion is limited by the top wall of the supporting limiting portion.

4. The device according to claim 3, characterized in that The end of the protruding shaft facing the label taking head is provided with a second limiting portion; wherein, When the protrusion moves in the axial direction, the second limiting portion is limited by the bottom wall of the supporting limiting portion.

5. The device according to any one of claims 1 to 4, characterized in that A positioning column is disposed at the first end of the pressing member, and the positioning column is used to be inserted into a positioning groove of the label taking head corresponding thereto.

6. The device according to any one of claims 1 to 4, characterized in that The elastic member is a spring.

7. The device according to any one of claims 1 to 4, characterized in that The pressure monitor is a pressure sensor.

8. A labeling device for chip heat dissipation stickers, characterized in that: It includes a label taking head and a label taking head pressure monitoring device, wherein the label taking head pressure monitoring device adopts the label taking head pressure monitoring device according to any one of claims 1 to 7; wherein, The first end of the label taking head is provided with a plurality of adsorption holes for adsorbing the heat dissipation sticker, and the second end of the label taking head is detachably connected to the first end of the pressing member.

9. The label taking device according to claim 8, characterized in that: Also included are a plurality of fasteners; A plurality of first through holes are disposed at an edge area of ​​the first end of the pressing member, and a plurality of second through holes corresponding to the first through holes are disposed at the second end of the label taking head; The fastener passes through the first through hole and the second through hole in sequence to fix the pressing member and the label taking head.

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