Semiconductor wire bonding jig

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor wire bonding jig, which comprises a base, two clamping plates and an adjusting part, the clamping plates are movably arranged on the base, the two clamping plates can be relatively close to or far away from each other, each clamping plate is provided with a locking piece, the locking pieces are arranged on the clamping plates in a penetrating manner and abut against the base, and the adjusting part is arranged on the base. The adjusting part is provided with two movable ends and an adjusting end connected with the two movable ends in a sliding mode, each movable end is connected with one clamping plate, and the adjusting ends can adjust the two clamping plates to be close to or away from each other. According to the technical scheme, a worker pulls the adjusting part to enable the distance between the two clamping plates to be widened, then places a product between the two clamping plates, adjusts the two clamping plates to the proper positions where the two clamping plates make contact with the side portions of the product, and adjusts the locking pieces on the clamping plates to lock the clamping plates on the base. And according to the products of different sizes, adaptive adjustment can be achieved, so that the clamping function is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor wire bonding fixture. Background Art

[0002] Semiconductor wire bonding jig is an important equipment used in the field of semiconductor packaging, which is used to make wire connections during the chip packaging process. It usually includes positioning fixtures, wires, solder heads and other components to ensure that the wires are accurately connected to the chip pins. Semiconductor wire bonding jigs can improve production efficiency and ensure welding quality. Through precise welding operations, semiconductor wire bonding jigs help ensure the reliability and stability of chip packaging products.

[0003] In the existing wire bonding operations in the semiconductor packaging industry, wire bonding jigs for different products, i.e. chips of different sizes, need to be designed and manufactured separately, and one jig cannot meet the fixed functions of different products.

[0004] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Utility Model Content

[0005] The main purpose of the utility model is to provide a semiconductor wire bonding jig, aiming to provide a wire bonding jig that can be suitable for products of different sizes.

[0006] To achieve the above-mentioned purpose, the semiconductor wire bonding fixture proposed by the utility model comprises:

[0007] Pedestal;

[0008] Two clamping plates, the two clamping plates are movably arranged on the base, the two clamping plates can be relatively close to or away from each other, each clamping plate is provided with a locking member, the locking member is passed through the clamping plate and abuts against the base; and

[0009] The adjusting part has two movable ends and an adjusting end slidably connected to the two movable ends, each movable end is connected to a clamping plate, and the adjusting end can adjust the two clamping plates to move closer to or farther away from each other.

[0010] In an embodiment of the present invention, a clamping space is formed between the two clamping plates, and a vacuum adsorption hole is formed on the base, and the vacuum adsorption hole is located on the bottom wall of the clamping space.

[0011] In one embodiment of the utility model, the semiconductor wire bonding jig further comprises an elastic reset portion, which is arranged along the moving direction of the clamping plate, and the elastic reset portion abuts against the base and the clamping plate respectively, and is used to bring the two clamping plates closer together.

[0012] In one embodiment of the utility model, the base is formed with two accommodating grooves, each of which is located below a clamping plate, and a sleeve is provided on the lower bottom wall of the clamping plate, and the opening of the sleeve faces away from the clamping space, and the two ends of the elastic reset portion are elastically abutted against the side walls of the accommodating groove and the sleeve respectively.

[0013] In an embodiment of the present invention, the semiconductor wire bonding fixture further includes a fixing column, and the fixing column is extended along the moving direction of the clamping plate.

[0014] In one embodiment of the present invention, each of the movable ends comprises:

[0015] A transmission arm, one end of which is connected to the clamping plate, and the other end of which is formed with a waist-shaped groove; and

[0016] A connecting rod is used to connect the transmission arm and the clamping plate respectively.

[0017] In an embodiment of the utility model, the adjustment end comprises an adjustment plate, and two ends of the adjustment plate are respectively provided with a movable pin and an adjustment button, and the movable pin is movable and limited in the waist-shaped groove.

[0018] In an embodiment of the present invention, teeth are formed on one side of each clamping plate facing the clamping space.

[0019] In an embodiment of the present invention, each of the clamping plates is provided with two locking members, and the two locking members are respectively provided on two sides of the clamping plate.

[0020] In an embodiment of the present invention, the clamping plate is formed with two adjustment slots extending along the moving direction of the clamping plate, and the locking member is movably disposed in the adjustment slots.

[0021] In the technical solution of the utility model, a semiconductor wire bonding jig is proposed, including a base, two clamping plates and an adjusting part. The two clamping plates are movably arranged on the base, and the two clamping plates can be relatively close to or far away from each other. Each clamping plate is provided with a locking piece. When the wire bonding operation is to be performed on the product, the staff pulls the adjusting part to widen the spacing between the two clamping plates, and then places the product between the two clamping plates, and then adjusts the two clamping plates to a suitable position in contact with the side of the product, and adjusts the locking piece on the clamping plate to lock the clamping plate to the base, thereby achieving clamping of the product. For products of different sizes, adaptive adjustments can be made to achieve the clamping function. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of the semiconductor wire bonding fixture provided by the utility model;

[0024] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0025] Figure 3 It is a cross-sectional view of the semiconductor wire bonding fixture of the utility model;

[0026] Figure 4 for Figure 1 Schematic diagram of the internal structure of the middle adjustment part;

[0027] Figure 5 Schematic diagram of the movement for workers to operate the clamping plate to open.

[0028] Description of Figure Numbers:

[0029] Label name Label name 1000 Semiconductor wire bonding fixture 311 Transmission arm 1 Base 311a Waist groove 11 Fixed column 312 Connecting rod 1a Vacuum adsorption hole 32 Adjustment end 1b Receiving slot 321 Adjustment plate 2 Clamping plate 322 Event Pin 21 Locking parts 323 Adjustment knob 22 Sleeve 4 Elastic reset part 22a Sleeve opening 41 spring 23 Teeth F Workers apply tension 2a Adjustment slot S Movement direction of movable pin 201 First clamping plate X1 Movement direction of the first clamping plate 202 Second clamping plate X2 Movement direction of the second clamping plate 3 Adjustment Department 2000 Chip products 31 Activity side

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0034] Semiconductor wire bonding jig is an important equipment used in the field of semiconductor packaging, which is used to make wire connections during the chip packaging process. It usually includes positioning fixtures, wires, solder heads and other components to ensure that the wires are accurately connected to the chip pins. Semiconductor wire bonding jigs can improve production efficiency and ensure welding quality. Through precise welding operations, semiconductor wire bonding jigs help ensure the reliability and stability of chip packaging products.

[0035] In the existing wire bonding operations in the semiconductor packaging industry, wire bonding jigs for different products, i.e. chips of different sizes, need to be designed and manufactured separately, and one jig cannot meet the fixed functions of different products.

[0036] In order to solve the above problems, the utility model proposes a semiconductor wire bonding fixture, which aims to provide a wire bonding fixture that can be applied to products of different sizes. Figures 1 to 5 The present invention is a schematic structural diagram of an embodiment of a semiconductor wire bonding fixture provided by the present invention.

[0037] Please refer to Figures 1 to 5 The utility model proposes a semiconductor wire bonding jig 1000, including a base 1, two clamping plates and an adjusting portion 3. The clamping plate is movably arranged on the base 1, and the two clamping plates can be relatively close to or far away from each other. Each clamping plate is provided with a locking member 21, and the locking member 21 is penetrated through the clamping plate and abuts against the base 1. The adjusting portion 3 has two movable ends 31 and an adjusting end 32 slidably connected to the two movable ends 31. Each movable end 31 is connected to a clamping plate, and the adjusting end 32 can adjust the two clamping plates to be close to or far away from each other.

[0038] In the technical solution of the utility model, a semiconductor wire bonding jig 1000 is proposed, including a base 1, two clamping plates and an adjusting part 3. The two clamping plates are movably arranged on the base 1. The two clamping plates can be relatively close to or far away from each other. Each clamping plate is provided with a locking piece 21. When the product is to be wired, the staff pulls the adjusting part 3 to widen the spacing between the two clamping plates, and then places the product between the two clamping plates, and then adjusts the two clamping plates to a suitable position in contact with the side of the product. The locking piece 21 on the clamping plate is adjusted to lock the clamping plate on the base 1, thereby achieving the clamping of the product. For products of different sizes, it can be adaptively adjusted to achieve the clamping function.

[0039] It should be noted that the adjustment part 3 can be a manual adjustment part 3 or an electric adjustment part 3. The electric adjustment part 3 is to install the two clamping plates on the base 1 through a screw rod, a guide rail, etc., install a driving motor in the base 1, and set a start-stop knob on the outer wall of the base 1. The operator controls the driving motor through the start-stop knob to drive the two clamping plates on the base 1 to gradually move away from each other, thereby making the clamping space larger and being able to place the chip product 2000. By rotating the knob in the opposite direction, the two clamping plates can be brought close to each other to produce a clamping effect on both sides of the chip product 2000 placed in the clamping space. In one embodiment of the utility model, in order to further reduce the cost of the semiconductor wire bonding fixture 1000 and simplify the internal structure, the adjustment part 3 adopts a manual adjustment method, and the operator pulls or pushes the adjustment end 32 to adjust the two clamping plates. In the process of adjusting the distance between the two clamping plates, the operator can observe the position of the clamping plates, thereby improving the clamping efficiency.

[0040] In order to prevent the chip product 2000 from being damaged due to excessive clamping force of the clamping plate during the wire bonding operation of the chip product 2000, the base 1 is provided with a vacuum adsorption hole 1a in the technical solution of the utility model. Figure 2 The other end of the vacuum adsorption hole 1a is connected to a vacuum pump, which produces a vacuum effect inside the vacuum adsorption hole 1a, thereby ensuring that the vacuum adsorption hole 1a can stably adsorb the small chip product 2000 located at its hole mouth. At this time, the operator uses a microscope to observe the position of the small chip product 2000, moves the chip product 2000 to the wire bonding position, and then performs the wire bonding operation on it.

[0041] In order to provide the clamping force generated by the two clamping plates approaching each other, the semiconductor wire bonding fixture 1000 further includes an elastic reset portion 4. For details, please refer to Figure 3The axial direction of the elastic reset portion 4 is parallel to the moving direction of the clamping plate. The elastic reset portion 4 is located in the receiving groove 1b as a whole. The two ends of the elastic reset portion 4 are respectively in contact with the lower structure of the clamping plate and the inner side wall of the receiving groove 1b. Under the elastic force of the elastic reset portion 4, the two clamping plates will be close to each other until they are in contact with the two ends of the chip product 2000. It should be noted that the elastic reset portion 4 can be a spring 41 or an elastic pressure block. The utility model does not limit this. In one embodiment of the utility model, the elastic reset portion 4 adopts a spring 41. The spring 41 has a simple structure, reliable performance, efficient reset function and long service life. The spring 41 has the characteristics of elastic recovery, can provide a stable and reliable reset force, and enhances the clamping force and clamping efficiency of the device.

[0042] In order to adapt to the structure of the spring 41 and prevent the spring 41 from bending and deforming to the side under pressure, the base 1 is provided with a receiving groove 1b matching the outer dimensions of the spring 41. Correspondingly, the lower bottom wall of the clamping plate is provided with a sleeve. For details, please refer to Figure 3 and Figure 4 The two sleeves are back to back to form an opening, and part of the structure of each spring 41 is accommodated in the sleeve and elastically abuts against the bottom wall of the sleeve. A fixing column 11 is provided on the side wall of the accommodating groove 1b, and the fixing column 11 is extended along the movement direction of the clamping plate. The spring 41 is sleeved on the fixing column 11, and the sleeve and the fixing column 11 jointly limit it to ensure that the elastic force of the spring 41 acts in the movement direction of the clamping plate. The accommodating groove 1b and the bottom wall of the clamping plate together enclose a relatively closed space. If the spring 41 is twisted and popped out, it will also be confined in the closed space, and will not splash to cause harm to the operator.

[0043] In order to realize manual adjustment of the opening and closing of the two clamping plates, the movable end 31 includes a transmission arm 311 and a connecting rod 312. Each connecting rod 312 is arranged at one end of a transmission arm 311 and connected to a clamping plate. For details, please refer to Figure 4 and Figure 5 When the operator wants to open the two clamping plates, that is, to gradually move the two clamping plates away from each other to provide a larger clamping space, the operator only needs to pinch the adjustment button 323 and pull it away from the base 1, that is, Figure 5 As marked F, under the action of the pulling force F applied by the staff, the movable pin located at the other end of the adjustment plate 321 will also maintain movement in the same direction as the adjustment button 323. Since the movable pin is movably inserted into the two waist-shaped grooves 311a of the two transmission arms 311, and the transmission arms 311 and the adjustment plate 321 are set at a certain angle, the two transmission arms 311 will drive the first clamping plate and the second clamping plate to move away from each other under the drive of the movable pin. If, on the contrary, the operator pushes the adjustment button 323 in the direction close to the base 1, the two clamping plates will approach each other.

[0044] To further optimize the clamping effect, each clamping plate is provided with teeth 23 on one side facing the clamping space. Figure 4 The teeth 23 are evenly arranged, which can provide greater lateral friction when the chip product 2000 contacts, thereby preventing the chip from popping out from the side of the clamping space and causing damage. When the two clamping plates are pressed against the two sides of the chip product 2000, at this time, the two locking members 21 on each clamping plate are manually adjusted so that one end of the locking member 21 is pressed against the upper surface of the base 1. It should be noted that each clamping plate is formed with two adjustment slots 2a extending along the movement direction of the clamping plate. For details, please refer to Figure 1 The locking member 21 is slidably limited in the adjusting groove 2a and can be adjusted in position on the adjusting groove 2a. Furthermore, in order to achieve a better locking effect, multiple locking members 21 can also be set in one adjusting groove 2a, and the utility model does not impose any limitation on this.

[0045] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A semiconductor wire bonding fixture, characterized in that: include: Pedestal; Two clamping plates, the two clamping plates are movably arranged on the base, the two clamping plates can be relatively close to or away from each other, each clamping plate is provided with a locking member, the locking member is passed through the clamping plate and abuts against the base; as well as The adjusting part has two movable ends and an adjusting end slidably connected to the two movable ends, each movable end is connected to a clamping plate, and the adjusting end can adjust the two clamping plates to move closer to or farther away from each other.

2. The semiconductor wire bonding jig according to claim 1, wherein: A clamping space is formed between the two clamping plates, and a vacuum adsorption hole is formed on the base, and the vacuum adsorption hole is located on the bottom wall of the clamping space.

3. The semiconductor wire bonding jig according to claim 2, wherein: The semiconductor wire bonding fixture further comprises an elastic reset portion, which is arranged along the moving direction of the clamping plate, and the elastic reset portion abuts against the base and the clamping plate respectively, and is used to bring the two clamping plates closer together.

4. The semiconductor wire bonding jig according to claim 3, characterized in that: The base is formed with two receiving grooves, each of which is located below a clamping plate. A sleeve is provided on the lower bottom wall of the clamping plate, and the opening of the sleeve faces away from the clamping space. The two ends of the elastic reset part are elastically abutted against the side walls of the receiving groove and the sleeve respectively.

5. The semiconductor wire bonding jig according to claim 4, wherein: The semiconductor wire bonding fixture further includes a fixing column, and the fixing column is extended along the moving direction of the clamping plate.

6. The semiconductor wire bonding jig according to any one of claims 1 to 5, characterized in that: Each of the active terminals comprises: A transmission arm, one end of which is connected to the clamping plate, and the other end of which is formed with a waist-shaped groove; and A connecting rod is used to connect the transmission arm and the clamping plate respectively.

7. The semiconductor wire bonding jig according to claim 6, wherein: The adjusting end comprises an adjusting plate, and two ends of the adjusting plate are respectively provided with a movable pin and an adjusting button, and the movable pin is movable and limited in the waist-shaped groove.

8. The semiconductor wire bonding jig according to claim 2, wherein: A side of each clamping plate facing the clamping space is formed with teeth.

9. The semiconductor wire bonding jig according to any one of claims 1 to 5, characterized in that: Each of the clamping plates is provided with two locking members, and the two locking members are respectively arranged on two sides of the clamping plate.

10. The semiconductor wire bonding jig according to claim 9, wherein: The clamping plate is formed with two adjustment slots extending along the moving direction of the clamping plate, and the locking member is movably arranged in the adjustment slots.

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