Lead device for integrated circuit

Abstract

The utility model relates to the technical field of integrated circuits, and provides a lead device for an integrated circuit, which comprises a lead frame body, chip grooves are formed in the top end of the lead frame body at equal intervals, glue overflow assemblies are arranged in the lead frame body around the chip grooves at equal angles, and each glue overflow assembly comprises a glue storage groove. The glue storage grooves are formed in the upper end, around the chip groove, of the interior of the lead frame body at equal angles, reinforcing blocks are fixedly connected to the inner walls of the glue storage grooves at equal intervals, and glue overflowing grooves extending to the upper end of the interior of the chip groove are formed in the upper end of one side of each glue storage groove. When the chip is installed, redundant glue in the chip groove can flow into the glue storage groove from the glue overflowing groove, so that the glue can be prevented from overflowing at the top end of the lead frame body to cause inconvenience in subsequent cleaning of workers or influence on normal work of a final integrated circuit, and the practicability of the lead frame is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a lead device for integrated circuits. Background Art

[0002] Integrated circuits are microelectronic devices or components that play a very important role in all walks of life today. They are the cornerstone of modern information society and play a significant role in the development of society. The lead frame, as the chip carrier of the integrated circuit, serves as a bridge connecting to external wires and is an important basic material in the electronic information industry.

[0003] After searching, the existing patent (Announcement No.: CN212365960U) discloses a multi-leg semiconductor integrated circuit lead frame, including a frame body and a base island, the base island is installed at the middle end of the frame body, and the chip is usually welded in the middle area of ​​the chip seat during packaging. After welding, the packaging material can be poured into the plastic sealing hole for packaging. The packaging material inside the plastic sealing hole is a mixture of epoxy resin and polyurethane material. After plastic sealing, it is cured and sealed by the plastic sealing film, which can enhance the overall sealing while being waterproof and moisture-proof to prevent the chip from being damaged after installation. The baffle can separate the pins, so that the pins of the frame body are not easily deformed and offset after installation, so that the pins can be stably connected and used. The applied heat-conducting layer is made of thermal conductive silicone grease material, which has the characteristics of high thermal conductivity and good filling property. The chip can be heat-conducted during use, and the introduced heat is concentrated and discharged through the heat dissipation holes on the upper side of the baffle to prevent the discharged heat from connecting with the chip again.

[0004] However, in the above scheme, the existing chip and the lead frame are usually fixed with glue. If there is too little glue, a good and stable fixing effect cannot be achieved, while if there is too much glue, glue overflow and residue will occur, which will increase the corresponding labor and production costs. In severe cases, it will affect the normal operation of the integrated circuit, thereby causing inconvenience in its use.

[0005] In view of this, the utility model provides a lead device for an integrated circuit. Utility Model Content

[0006] The utility model provides a lead wire device for an integrated circuit, which solves the problem in the related art that it is inconvenient to prevent glue from overflowing.

[0007] The technical solution of the utility model is as follows: a lead device for integrated circuits, comprising a lead frame body, the top of the lead frame body is provided with chip slots at equal intervals, and overflow glue components are arranged at equal angles inside the lead frame body around the chip slots.

[0008] The overflow glue component includes a glue storage groove, which is arranged at equal angles on the upper end of the lead frame body around the chip slot. The inner wall of the glue storage groove is fixedly connected with reinforcement blocks at equal intervals. An overflow glue groove extending to the upper end of the chip slot is arranged on the upper end of one side of the glue storage groove. When the chip is installed into the chip slot, excess glue will be squeezed and flow into the overflow glue groove and the glue storage groove. Then, the glue storage grooves around can effectively reduce the glue from overflowing the top of the lead frame body, causing inconvenience for subsequent staff to clean up or affecting the normal operation of the integrated circuit, thereby improving its practicality.

[0009] Preferably, the overflow glue groove has an inclination angle of thirty degrees to the horizontal direction, and the length of the overflow glue groove is equal to the length of the glue storage groove, so that some small amount of glue inside the overflow glue groove can flow back again, further improving the adhesion stability between the chip and the inner wall of the chip groove after installation.

[0010] Preferably, the top view of the reinforcement block is in the shape of a triangle, and the two sides of the reinforcement block are fixedly connected to the inner wall of the glue storage slot to support and reinforce the inside of the glue storage slot, and the reinforcement block itself has good thermal conductivity to prevent excessive glue inside the glue storage slot from affecting the heat dissipation around the chip slot.

[0011] Preferably, a groove is provided on the inner bottom wall of the chip slot, and the shape of the groove in a plan view is a field shape, which increases the bonding area between the chip and the inside of the chip slot and improves the bonding firmness and stability between the chip and the inner wall of the chip slot after installation.

[0012] Preferably, reserved grooves are provided at equal intervals on the surface of the lead frame body, rubber sheets are fixedly connected at equal intervals around the bottom end of the lead frame body, and a heat sink is fixedly connected at the middle position of the bottom end of the lead frame body. The reserved grooves are used to increase the passive heat dissipation area on the surface of the lead frame body, and the heat sink and the rubber sheet are used to ensure that there is a certain gap at the bottom end of the lead frame body after installation, so that the heat transferred from the surface of the heat sink can be ventilated and dissipated more quickly, thereby improving the heat dissipation effect of the lead frame body itself.

[0013] Preferably, the shape of the reserved groove in a top view is an arc, and the reserved grooves are evenly spaced and distributed around the surface of the lead frame body, thereby increasing the passive heat dissipation area of ​​the surface of the lead frame body.

[0014] Preferably, the height of the rubber sheet is equal to the thickness of the heat sink, and the cross-section of the rubber sheet is O-shaped, so as to achieve flexible buffering contact after the bottom end of the lead frame body is installed, and cooperate with the heat sink so that there is a certain gap at the bottom end of the lead frame body after installation, which is convenient for ventilation and heat dissipation at the bottom end of the lead frame body.

[0015] Preferably, heat dissipation grooves are formed at equal intervals on the bottom of the heat sink, and the cross-section of the heat dissipation grooves is triangular, so that the passive heat dissipation area of ​​the heat sink surface is larger, thereby allowing the heat sink to dissipate heat more quickly.

[0016] The working principle and beneficial effects of the utility model are:

[0017] 1. In the utility model, by providing the overflow glue assembly and the groove, when the chip is installed in the chip slot, the excess glue will be squeezed and flow upward to the overflow glue groove and the glue storage groove, and then the glue storage grooves around can effectively reduce the glue overflowing the top of the lead frame body, which will cause inconvenience for subsequent staff to clean up or affect the normal operation of the integrated circuit. In addition, the triangular reinforcement block is used to support and reinforce the inside of the glue storage groove, and the reinforcement block itself has good thermal conductivity, which prevents excessive glue in the glue storage groove from affecting the heat dissipation around the chip slot. At the same time, the inclined overflow glue groove allows a small amount of glue to flow back again, and the field-shaped groove is combined to increase the bonding area between the chip and the chip slot, further improving the bonding firmness and stability of the chip and the inner wall of the chip slot after installation, thereby improving its practicality.

[0018] 2. In the utility model, the reserved groove, heat sink, rubber sheet and heat sink are set, and the arc-shaped reserved groove is used to increase the passive heat dissipation area on the surface of the lead frame body, and the rubber sheet is used to achieve flexible buffer contact after the bottom end of the lead frame body is installed, and the heat sink is used to make a certain gap at the bottom end of the lead frame body after installation, and the triangular heat sink is used to make the heat transferred from the surface of the heat sink be ventilated and dissipated more quickly, thereby improving the heat dissipation effect of the lead frame body itself, avoiding excessive heat accumulation at the chip to affect its normal work, and improving its practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the overall structure of the utility model when viewed from above;

[0022] Figure 3 It is a schematic diagram of the overall cross-sectional structure of the utility model;

[0023] Figure 4 It is a schematic diagram of the top view structure of the utility model;

[0024] Figure 5 It is a schematic diagram of the enlarged structure of a local section of the chip slot of the utility model.

[0025] In the figure: 1. overflow glue component; 101. overflow glue groove; 102. glue storage groove; 103. reinforcement block; 2. chip groove; 3. lead frame body; 4. reserved groove; 5. groove; 6. heat sink; 7. rubber sheet; 8. heat sink. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Example 1

[0028] The preferred embodiment of the integrated circuit lead device provided by the utility model is as follows Figures 1 to 5 As shown: a lead device for integrated circuits, including a lead frame body 3, the top of the lead frame body 3 is provided with chip slots 2 at equal intervals, and the inside of the lead frame body 3 around the chip slots 2 is provided with overflow glue components 1 at equal angles.

[0029] The overflow glue component 1 includes a glue storage groove 102, which is opened at equal angles on the upper end of the lead frame body 3 around the chip slot 2. The inner wall of the glue storage groove 102 is fixedly connected with reinforcement blocks 103 at equal intervals. An overflow glue groove 101 extending to the upper end of the chip slot 2 is opened on the upper end of one side of the glue storage groove 102. When the chip is installed into the chip slot 2, excess glue will be squeezed and flow into the overflow glue groove 101 and the glue storage groove 102, and then the glue storage grooves 102 around can effectively reduce the glue from overflowing the top of the lead frame body 3, thereby realizing anti-overflow glue action.

[0030] In this embodiment, the overflow glue groove 101 is inclined at an angle of thirty degrees to the horizontal direction, and the length of the overflow glue groove 101 is equal to the length of the glue storage groove 102. By using the inclined overflow glue groove 101, a small amount of glue can flow back again, further improving the adhesion stability between the chip and the inner wall of the chip slot 2 after installation.

[0031] In this embodiment, the top view of the reinforcement block 103 is in the shape of a triangle, and the two sides of the reinforcement block 103 are fixedly connected to the inner wall of the glue storage slot 102. The triangular reinforcement block 103 is used to support and reinforce the inside of the glue storage slot 102, and the reinforcement block 103 itself has good thermal conductivity to prevent excessive glue inside the glue storage slot 102 from affecting the heat dissipation around the chip slot 2.

[0032] In this embodiment, a groove 5 is provided on the inner bottom wall of the chip slot 2, and the shape of the groove 5 in the top view is a field shape. The field-shaped groove 5 is used to increase the bonding area between the chip and the inside of the chip slot 2, thereby improving the bonding firmness and stability of the chip and the inner wall of the chip slot 2 after installation.

[0033] Example 2

[0034] On the basis of Example 1, a preferred embodiment of the integrated circuit lead device provided by the utility model is as follows: Figures 1 to 5 As shown: reserved grooves 4 are provided at equal intervals on the surface of the lead frame body 3, rubber sheets 7 are fixedly connected at equal intervals around the bottom of the lead frame body 3, and a heat sink 6 is fixedly connected at the middle position of the bottom of the lead frame body 3. The reserved grooves 4 are used to increase the passive heat dissipation area on the surface of the lead frame body 3, and the heat sink 6 and the rubber sheet 7 are used to ensure that there is a certain gap at the bottom of the lead frame body 3 after installation, so that the heat transferred from the surface of the heat sink 6 can be ventilated and dissipated more quickly, thereby improving the heat dissipation effect of the lead frame body 3 itself.

[0035] In this embodiment, the reserved grooves 4 are arc-shaped in a top view, and are evenly spaced around the surface of the lead frame body 3 . The arc-shaped reserved grooves 4 are used to increase the passive heat dissipation area of ​​the surface of the lead frame body 3 .

[0036] In this embodiment, the height of the rubber sheet 7 is equal to the thickness of the heat sink 6, and the cross-sectional shape of the rubber sheet 7 is O-shaped. The O-shaped rubber sheet 7 is used to achieve flexible buffering contact after the bottom end of the lead frame body 3 is installed, and cooperates with the heat sink 6 so that there is a certain gap at the bottom end of the lead frame body 3 after installation.

[0037] In this embodiment, heat dissipation grooves 8 are evenly spaced at the bottom end of the heat sink 6, and the cross-section of the heat sink 8 is triangular. The triangular heat dissipation grooves 8 are used to increase the passive heat dissipation area of ​​the heat sink 6 surface, thereby allowing the heat transferred from the heat sink 6 surface to dissipate more quickly.

[0038] The working principle and use process of the utility model are as follows: first, when the chip is installed into the chip slot 2, the excess glue will be squeezed and flow upward to the overflowing glue slot 101 and then discharged into the glue storage slot 102, and then the glue storage slots 102 around can effectively reduce the glue from overflowing the top of the lead frame body 3, which will cause inconvenience for subsequent staff to clean up or affect the normal operation of the integrated circuit. At the same time, the triangular reinforcement block 103 is used to support and reinforce the inside of the glue storage slot 102, and the reinforcement block 103 itself has good thermal conductivity, so as to avoid excessive glue in the glue storage slot 102 and affect the heat dissipation around the chip slot 2;

[0039] At the same time, the arc-shaped reserved groove 4 is used to increase the passive heat dissipation area on the surface of the lead frame body 3, and the rubber sheet 7 is used to achieve flexible buffer contact after the bottom end of the lead frame body 3 is installed, and the heat sink 6 is used to ensure that there is a certain gap at the bottom end of the lead frame body 3 after installation, and the triangular heat dissipation groove 8 is used to ensure that the heat transferred from the surface of the heat sink 6 can be ventilated and dissipated more quickly, thereby improving the heat dissipation effect of the lead frame body 3 itself.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A lead device for an integrated circuit, comprising a lead frame body (3), characterized in that: The top of the lead frame body (3) is provided with chip slots (2) at equal intervals, and the lead frame body (3) around the chip slots (2) is provided with overflow glue components (1) at equal angles; The overflow glue component (1) comprises a glue storage groove (102), the glue storage groove (102) is arranged at equal angles on the upper end of the lead frame body (3) around the chip slot (2), the inner wall of the glue storage groove (102) is fixedly connected with reinforcement blocks (103) at equal intervals, and an overflow glue groove (101) extending to the upper end of the chip slot (2) is arranged on the upper end of one side of the glue storage groove (102).

2. The integrated circuit wiring device according to claim 1, characterized in that: The inclination angle of the overflow glue groove (101) to the horizontal direction is thirty degrees, and the length of the overflow glue groove (101) is equal to the length of the glue storage groove (102).

3. The integrated circuit wiring device according to claim 1, characterized in that: The shape of the reinforcement block (103) in a top view is a triangle, and two sides of the reinforcement block (103) are fixedly connected to the inner wall of the glue storage groove (102).

4. The integrated circuit wiring device according to claim 1, characterized in that: The inner bottom wall of the chip slot (2) is provided with a groove (5), and the shape of the groove (5) in a plan view is a field shape.

5. The integrated circuit wiring device according to claim 1, characterized in that: The surface of the lead frame body (3) is provided with reserved grooves (4) at equal intervals, rubber sheets (7) are fixedly connected at equal intervals around the bottom of the lead frame body (3), and a heat sink (6) is fixedly connected at the middle position of the bottom of the lead frame body (3).

6. The integrated circuit wiring device according to claim 5, characterized in that: The shape of the reserved groove (4) in a top view is an arc, and the reserved grooves (4) are distributed at equal intervals around the surface of the lead frame body (3).

7. The integrated circuit wiring device according to claim 5, characterized in that: The height of the rubber sheet (7) is equal to the thickness of the heat sink (6), and the cross-section of the rubber sheet (7) is in an O-shape.

8. The integrated circuit wiring device according to claim 5, characterized in that: The bottom end of the heat sink (6) is provided with heat dissipation grooves (8) at equal intervals, and the cross-section of the heat dissipation grooves (8) is in the shape of a triangle.

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