LDS antenna assembly and communication device

Abstract

The embodiment of the utility model relates to the technical field of antennas, in particular to an LDS antenna assembly and a communication device, which comprises an injection molding part, an LDS circuit, a component and a circuit board assembly, the LDS circuit is arranged on one side of the injection molding part, the component is arranged on the other side of the injection molding part, the circuit board assembly is embedded in the injection molding part, and the circuit board assembly is embedded in the injection molding part. One side of the circuit board assembly is electrically connected with the LDS circuit, and the other side of the circuit board assembly is electrically connected with the component. Through the above mode, the embodiment of the utility model can reduce the possibility that external water, dust and other impurities enter the LDS antenna assembly on the basis of satisfying the electrical communication of the LDS circuit and the components.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of antenna technology, and in particular to an LDS antenna component and communication equipment. Background Art

[0002] With the development of communication technology, antennas tend to be miniaturized and diversified. With the maturity of LDS (Laser-Direct-structuring) technology, LDS antennas have gradually emerged. LDS antennas refer to metal antennas formed by chemical plating (chemical plating) directly on a molded plastic bracket using laser technology. LDS antennas are widely loved by the industry for their small size and flexible design.

[0003] However, in the process of implementing the utility model, the inventor found that: Figure 1-2 The LDS antenna assembly 1 currently on the market mainly includes an injection molded part 2, an LDS circuit 3 and components 4. The LDS circuit 3 and components 4 are respectively arranged on opposite sides of the injection molded part 2. Please refer to Figure 3-4 The existing LDS antenna assembly 1 mainly realizes electrical connection between the LDS circuit 3 and the component 4 by setting a guide hole 5 on the injection molded part 2, laser engraving (laser carving) on ​​the side wall of the guide hole 5 and chemically plating an LDS coating 6. However, under this scheme, impurities such as water and dust from the outside can easily enter the interior of the LDS antenna assembly 1 through the guide hole 5, thereby affecting the performance of the LDS antenna assembly 1. Utility Model Content

[0004] In view of the above problems, the embodiments of the present utility model provide an LDS antenna assembly and a communication device, which overcome the above problems or at least partially solve the above problems.

[0005] According to one aspect of the embodiment of the utility model, an LDS antenna assembly is provided, comprising an injection molded part, an LDS circuit, components and a circuit board assembly, wherein the LDS circuit is arranged on one side of the injection molded part, the components are arranged on the other side of the injection molded part, the circuit board assembly is embedded in the injection molded part, one side of the circuit board assembly is electrically connected to the LDS circuit, and the other side of the circuit board assembly is electrically connected to the components. In this way, the LDS circuit and the components are electrically connected.

[0006] In some embodiments, the circuit board assembly and the injection molded part are an integrated structure, so that the connection between the circuit board assembly and the injection molded part is more stable.

[0007] In some embodiments, the circuit board assembly includes several circuit boards, which are stacked in sequence and electrically connected, one side of the circuit boards is electrically connected to the LDS circuit, and the other side of the circuit boards is electrically connected to the components.

[0008] In some embodiments, the circuit board includes a plurality of conductor layers and a plurality of substrate layers, wherein the substrate layer is disposed between any two adjacent conductor layers, the plurality of conductor layers and the plurality of substrate layers are electrically connected, the conductor layers on one side of the plurality of circuit boards are electrically connected to the LDS circuit, and the conductor layers on the other side of the plurality of circuit boards are electrically connected to the components. In this way, the conductor layer can electromagnetically shield the substrate layer.

[0009] In some embodiments, the circuit board assembly is provided with a through hole, the circuit board assembly includes a conductive member, the conductive member is provided in the through hole, and the plurality of conductor layers and the plurality of substrate layers are electrically connected to the conductive member respectively.

[0010] In some embodiments, a groove is provided on one side of the injection molded part, the bottom of the groove is connected to the conductor layer on one side of the plurality of circuit boards, and at least part of the LDS circuit extends into the groove and is electrically connected to the conductor layer on one side of the plurality of circuit boards.

[0011] In some embodiments, the LDS antenna assembly further includes a plating layer, the plating layer being disposed in the groove, the plating layer being electrically connected to the LDS circuit and the conductor layer on one side of the plurality of circuit boards, respectively, so as to improve the conductivity between the LDS circuit and the conductor layer on one side of the plurality of circuit boards.

[0012] In some embodiments, the plating layer covers the conductor layer on one side of the plurality of circuit boards at the bottom of the groove, so as to improve the conductivity between the LDS circuit and the conductor layer on one side of the plurality of circuit boards and reduce the possibility of the conductor layer being corroded.

[0013] In some embodiments, the LDS antenna assembly further includes a connector, which is disposed on the other side of the injection molded part, one end of the connector is electrically connected to a component, and the other end of the connector is electrically connected to a conductor layer on the other side of the plurality of circuit boards.

[0014] According to one aspect of the embodiments of the present utility model, a communication device is provided, including the above-mentioned LDS antenna assembly.

[0015] The beneficial effects of the embodiments of the utility model are as follows: Different from the prior art, the embodiments of the utility model provide an LDS antenna assembly, including an injection molded part, an LDS circuit, components and a circuit board assembly, wherein the LDS circuit is arranged on one side of the injection molded part, the components are arranged on the other side of the injection molded part, the circuit board assembly is embedded in the injection molded part, and is electrically connected to the LDS circuit through one side of the circuit board assembly, and is electrically connected to the components on the other side of the circuit board assembly, thereby reducing the possibility of external impurities such as water and dust entering the interior of the LDS antenna assembly while ensuring electrical connectivity between the LDS circuit and the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.

[0017] Figure 1 is a perspective view of a prior art LDS antenna assembly;

[0018] Figure 2 is a perspective view of an LDS antenna assembly of the prior art from another perspective;

[0019] Figure 3 yes Figure 1 A cross-sectional view of an LDS antenna assembly;

[0020] Figure 4 yes Figure 3 A schematic diagram of a guide hole;

[0021] Figure 5 is a cross-sectional view of an LDS antenna assembly provided by an embodiment of the utility model;

[0022] Figure 6 yes Figure 5 Schematic diagram of antenna signal transmission of the LDS antenna assembly;

[0023] Figure 7 is a cross-sectional view of another LDS antenna assembly provided by an embodiment of the utility model;

[0024] Figure 8 It is a cross-sectional view of another LDS antenna assembly provided by an embodiment of the utility model.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 1. LDS antenna assembly; 2. Injection molded parts; 21. Groove; 3. LDS circuit; 4. Components; 5. Guide hole; 6. LDS coating;

[0027] 30. Circuit board assembly; 31. Circuit board; 311. Conductor layer; 312. Base material layer; 32. Through hole; 33. Conductive member; 40. Plating layer; 50. Connector; 60. Insulating member; 70. Insulating layer. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in this specification are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0030] LDS antenna refers to a metal antenna formed by chemical plating (chemical plating) directly on a molded plastic bracket using laser technology. Chemical plating, also known as electroless plating or autocatalytic plating, is a plating method that uses a suitable reducing agent without an external current to reduce metal ions in the plating solution to metal and deposit them on the surface of the part.

[0031] See also Figure 1-2 The existing LDS antenna assembly 1 mainly includes an injection molded part 2, an LDS circuit 3 and components 4. The LDS circuit 3 and components 4 are respectively arranged on two opposite sides of the injection molded part 2. Please refer to Figure 3-4In order to achieve electrical connection between the LDS circuit 3 and the components 4 on both sides of the injection molded part 2, the existing LDS antenna assembly 1 mainly achieves the connection between the LDS circuit 3 and the components 4 by setting a guide hole 5 on the injection molded part 2, laser engraving (laser engraving) on ​​the side wall of the guide hole 5 and chemically plating an LDS coating 6. However, under this scheme, impurities such as water and dust from the outside can easily enter the interior of the LDS antenna assembly 1 through the guide hole 5, thereby affecting the performance of the LDS antenna assembly 1. The LDS circuit 3 refers to a three-dimensional circuit pattern directly engraved on the injection-molded plastic bracket using laser technology, and then electroplating the pattern to form a three-dimensional metal circuit, so that the plastic bracket has certain electrical properties.

[0032] An LDS antenna assembly provided in an embodiment of the present application has the circuit board assembly embedded in an injection molded part, and the LDS circuits and components on both sides of the injection molded part are electrically connected through the circuit board assembly. While ensuring the electrical connectivity between the LDS circuits and components, the possibility of external impurities such as water and dust entering the interior of the LDS antenna assembly is reduced.

[0033] In order to facilitate readers to understand the inventive concept of the present application, the specific structure of the LDS antenna assembly provided in the embodiment of the present application is described below:

[0034] Please also read Figure 5 The LDS antenna assembly 1 provided in the embodiment of the present application comprises an injection molded part 2, an LDS circuit 3, a component 4 and a circuit board assembly 30, wherein the LDS circuit 3 is arranged on one side of the injection molded part 2, the component 4 is arranged on the other side of the injection molded part 2, the circuit board assembly 30 is embedded in the injection molded part 2, one side of the circuit board assembly 30 is electrically connected to the LDS circuit 3, and the other side of the circuit board assembly 30 is electrically connected to the component 4, so that the LDS circuit 3 and the component 4 on both sides of the injection molded part 2 can be electrically connected through the circuit board assembly 30, and the possibility of external impurities such as water and dust entering the interior of the LDS antenna assembly 1 is reduced. It can be understood that the component 4 can be an LDS circuit, and the positions of the LDS circuit 3 and the component 4 can be interchanged. The component 4 is generally an electronic component (such as a filter) at the front end of the antenna; the component 4 can also be a connector for transmitting the antenna signal to the motherboard chip.

[0035] In some embodiments, the circuit board assembly 30 and the injection molded part 2 are formed into an integrated structure through an injection molding process, so that the connection between the circuit board assembly 30 and the injection molded part 2 is more stable without adding additional design space, which is beneficial to reducing the design space of the LDS antenna assembly 1 and making the LDS antenna assembly 1 lightweight.

[0036] For the above-mentioned circuit board assembly 30, the circuit board assembly 30 includes a plurality of circuit boards 31, which are stacked in sequence, and any two adjacent circuit boards 31 can be connected together by welding or gluing, etc. The circuit boards 31 are electrically connected, one side of the circuit boards 31 is electrically connected to the LDS circuit 3, and the other side of the circuit boards 31 is electrically connected to the components 4. Before the circuit board assembly 30 is embedded in the injection molded part 2, the circuit board 31 is welded with electronic components (not shown) by conventional SMT (Surface Mounted Technology) process to make a finished circuit board 31, so as to avoid the high temperature required for welding in the later process, and the injection molded part 2 is selected as a high temperature resistant plastic, thereby increasing the cost; SMT mainly refers to the process technology of using a mounting machine to mount some miniature parts on a PCB board. The circuit board 31 includes a plurality of conductor layers 311 and a plurality of substrate layers 312, wherein the substrate layer 312 is disposed between any two adjacent conductor layers 311, and the plurality of conductor layers 311 and the plurality of substrate layers 312 are electrically connected, the conductor layer 311 on one side of the plurality of circuit boards 31 is electrically connected to the LDS circuit 3, and the conductor layer 311 on the other side of the plurality of circuit boards 31 is electrically connected to the component 4, so that the conductor layer 311 can be used as an electromagnetic shielding layer to reduce the possibility that the circuit of the substrate layer 312 (not shown) is subject to electromagnetic interference; the conductor layer 311 is preferably a copper layer so that the conductor layer 311 has better conductivity.

[0037] In some embodiments, the circuit board assembly 30 is provided with a through hole 32, and the through hole 32 passes through the plurality of circuit boards 31. The circuit board assembly 30 also includes a conductive member 33, and the conductive member 33 is provided in the through hole 32. The plurality of conductor layers 311 and the plurality of substrate layers 312 are respectively electrically connected to the conductive member 33 so that the plurality of conductor layers 311 and the plurality of substrate layers 312 can be electrically connected. It can be understood that the number of the through holes 32 can be multiple, and the conductive member 33 can be a metal plating attached to the side wall of the through hole 32 or a metal column inserted into the through hole 32.

[0038] A groove 21 is provided on one side of the injection molded part 2, the bottom of the groove 21 is connected to the conductor layer 311 on one side of the plurality of circuit boards 31, and at least a portion of the LDS circuit 3 extends into the groove 21 and is electrically connected to the conductor layer 311 on one side of the plurality of circuit boards 31. In some embodiments, the LDS antenna assembly 1 further includes a plating layer 40, the plating layer 40 is provided in the groove 21, and the plating layer 40 is electrically connected to the LDS circuit 3 and the conductor layer 311 on one side of the plurality of circuit boards 31, respectively, so as to improve the conductivity between the LDS circuit 3 and the conductor layer 311 on one side of the plurality of circuit boards 31; the plating layer 40 may be an LDS plating layer or a metal plating layer such as solder, and the plating layer 40 may be formed during chemical plating of the LDS circuit 3 and the conductor layer 311 on one side of the plurality of circuit boards 31. In a preferred embodiment, the plating layer 40 covers the conductor layer 311 on one side of the plurality of circuit boards 31 at the bottom of the groove 21, thereby improving the conductivity between the LDS circuit 3 and the conductor layer 311 on one side of the plurality of circuit boards 31 and reducing the possibility of corrosion of the conductor layer 311.

[0039] In a preferred embodiment, please refer to Figure 6 In the partial circuit board assembly 30 near the groove 21, the ends of any two adjacent conductor layers 311 pass through the substrate layer 312 located therebetween, so that the conductor layers 311 in the partial circuit board assembly 30 are in contact with each other, and the component 4 directly contacts the conductor layer 311 on the other side of the partial circuit board assembly 30. In this way, the antenna signal of the LDS circuit 3 in the groove 21 can be sequentially transmitted to the component 4 (such as Figure 6 Of course, the signal of the component 4 can also be transmitted to the LDS line 3 through the plurality of conductor layers 311 in sequence.

[0040] In some embodiments, please refer to Figure 7 The LDS antenna assembly 1 also includes a connector 50, which is arranged on the other side of the injection molded part 2, one end of the connector 50 is electrically connected to the component 4, and the other end of the connector 50 is electrically connected to the conductor layer 311 on the other side of the plurality of circuit boards 31, so that when the component 4 is arranged on the other side of the injection molded part 2 and the component 4 cannot be electrically connected to the conductor layer 311 on the other side of the plurality of circuit boards 31, the component 4 can be electrically connected to the conductor layer 311 on the other side of the plurality of circuit boards 31 through the connector 50 to assist the component 4 in electrically connecting to the LDS circuit 3.

[0041] In some embodiments, please refer to Figure 8, the LDS antenna assembly 1 further includes an insulating member 60 and an insulating layer 70. The insulating member 60 is disposed in the through hole 32 to produce an insulating effect on the conductor layer 311, the substrate layer 312 and the conductive member 33, preventing an external conductor from passing through the through hole 32 and directly touching the conductor layer 311, the substrate layer 312 or the conductive member 33, thereby interfering with the normal operation of the circuit board 31; the insulating member 60 may be an insulating resin and fill the through hole 32, or the insulating member 60 may be an insulating paint layer and adhere to the surface of the through hole 32 or the conductive member 33. The insulating layer 70 is attached to the surface of the conductor layer 311 on the other side of the plurality of circuit boards 31 to produce an insulating effect on the conductor layer 311 on the other side of the plurality of circuit boards 31, thereby preventing external conductors from directly touching the conductor layer 311 on the other side of the plurality of circuit boards 31 and thereby interfering with the normal operation of the circuit boards 31; of course, the insulating layer 70 does not hinder the electrical connection between the connector 50 or the component 40 and the conductor layer 311 on the other side of the plurality of circuit boards 31; the insulating layer 70 may be an insulating paint layer or an insulating resin.

[0042] In order to facilitate readers to understand the inventive concept of the present application, the process flow of the LDS antenna assembly 1 is described below:

[0043] First, the circuit board 31 is made into a finished circuit board 31 by SMT welding of electronic components, and then the finished circuit board 31 is tested. After the test, the several circuit boards 31 are stacked in sequence to form a circuit board assembly 30, and then the circuit board assembly 30 is embedded in the injection molded part 2. After the embedding is completed, the circuit board assembly 30 is tested again. After the test is completed, LDS circuits 3 and components 4 are respectively arranged on both sides of the injection molded part 2 to form a preliminary LDS antenna assembly 1, and then the LDS antenna assembly 1 is chemically plated to form a coating 40, and finally the LDS antenna assembly 1 is tested for overall function.

[0044] In an embodiment of the utility model, the LDS antenna assembly 1 includes an injection molded part 2, an LDS circuit 3, components 4 and a circuit board assembly 30, wherein the LDS circuit 3 is arranged on one side of the injection molded part 2, the components 4 are arranged on the other side of the injection molded part 2, and the circuit board assembly 30 is embedded in the injection molded part 2; one side of the circuit board assembly 30 is electrically connected to the LDS circuit 3, and the other side of the circuit board assembly 30 is electrically connected to the components 4. On the basis of satisfying the electrical connectivity between the LDS circuit 3 and the components 4, the possibility of external impurities such as water and dust entering the interior of the LDS antenna assembly 1 is reduced. In addition, compared with the prior art solution of laser engraving and chemically plating the LDS coating 6 on the side wall of the guide hole 5, the embodiment of the utility model does not increase the process cost of opening the guide hole 5, nor does it increase the cost of the LDS process; the conductor layer 311 of the circuit board assembly 30 can also be used to electromagnetically shield the circuit of the substrate layer 312; the circuit board assembly 30 is embedded in the injection molded part 2 by injection molding or the like, without adding additional design space, which is beneficial to reducing the design space of the LDS antenna assembly 1, making the LDS antenna assembly 1 lightweight.

[0045] The utility model further provides an embodiment of a communication device, wherein the communication device comprises the above-mentioned LDS antenna assembly 1. The function and structure of the LDS antenna assembly 1 may refer to the above-mentioned embodiment, which will not be described in detail here.

[0046] It should be noted that the preferred embodiments of the utility model are given in the specification and drawings of the utility model, but the utility model can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional restrictions on the content of the utility model. The purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the utility model; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the utility model.

Claims

1. An LDS antenna assembly, characterized in that: include: Injection molded parts; An LDS circuit is arranged on one side of the injection molded part; Components, arranged on the other side of the injection molded part; A circuit board assembly is embedded in the injection molded part, one side of the circuit board assembly is electrically connected to the LDS circuit, and the other side of the circuit board assembly is electrically connected to the component.

2. The LDS antenna assembly according to claim 1, characterized in that: The circuit board assembly and the injection molded part are an integrated structure.

3. The LDS antenna assembly according to claim 1, characterized in that: The circuit board assembly includes a plurality of circuit boards, the plurality of circuit boards are stacked in sequence, and the plurality of circuit boards are electrically connected; One side of the plurality of circuit boards is electrically connected to the LDS circuit, and the other side of the plurality of circuit boards is electrically connected to the components.

4. The LDS antenna assembly according to claim 3, characterized in that: The circuit board comprises a plurality of conductor layers and a plurality of substrate layers, wherein one substrate layer is arranged between any two adjacent conductor layers, and the plurality of conductor layers and the plurality of substrate layers are electrically connected; The conductor layers on one side of the plurality of circuit boards are electrically connected to the LDS circuits, and the conductor layers on the other side of the plurality of circuit boards are electrically connected to the components.

5. The LDS antenna assembly according to claim 4, characterized in that: The circuit board assembly is provided with a through hole, and the circuit board assembly includes a conductive member, the conductive member is arranged in the through hole, and the plurality of conductor layers and the plurality of substrate layers are electrically connected to the conductive member respectively.

6. The LDS antenna assembly according to claim 4, characterized in that: A groove is provided on one side of the injection molded part, the bottom of the groove is connected to the conductor layer on one side of the plurality of circuit boards, and at least part of the LDS circuit extends into the groove to be electrically connected to the conductor layer on one side of the plurality of circuit boards.

7. The LDS antenna assembly according to claim 6, characterized in that: The LDS antenna assembly further includes a plating layer, which is disposed in the groove and electrically connects the LDS circuit and the conductor layer on one side of the plurality of circuit boards.

8. The LDS antenna assembly according to claim 7, characterized in that: The plating layer covers the conductor layer on one side of the plurality of circuit boards at the bottom of the groove.

9. The LDS antenna assembly according to claim 4, characterized in that: The LDS antenna assembly also includes a connector, which is arranged on the other side of the injection molded part, one end of the connector is electrically connected to the component, and the other end of the connector is electrically connected to the conductor layer on the other side of the plurality of circuit boards.

10. A communication device, characterized in that: The invention comprises the LDS antenna assembly as claimed in any one of claims 1 to 9.

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