Copper bar structure, motor controller and vehicle

Abstract

The utility model relates to the technical field of vehicles, and discloses a copper bar structure, a motor controller and a vehicle, a plurality of direct current pins of two pin units are integrated on the same direct current copper bar, and six groups of direct current pins of the two pin units are electrically connected with six half-bridge structures of two three-phase full-bridge driving modules in a one-to-one correspondence manner. According to the motor controller, only two copper bar structures are needed to realize the two three-phase full-bridge driving modules, and compared with twelve direct-current terminals adopted in the prior art, the number of parts is reduced, the structure of a bus capacitor is simplified, the cost of the motor controller is reduced, the size of the motor controller is reduced, and therefore the occupied space of the motor controller is reduced. The two polarity terminals of the motor controller are electrically connected with the positive electrode and the negative electrode of the direct-current power supply through the bus capacitors respectively, and connection is simplified. The two motors are electrically connected with the two three-phase full-bridge driving modules in a one-to-one correspondence mode, the motor controller integrates the controllers of the two motors, and the occupied space of the motor controller on the whole vehicle is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of motors, and in particular to a copper busbar structure, a motor controller and a vehicle. Background Art

[0002] The motor controller of a hybrid vehicle is generally a dual-motor controller, which has two control modules. The current control modules include three-phase full-bridge, half-bridge and bridge-arm types. For a dual-motor controller, two three-phase full-bridge modules, three half-bridge modules, or six bridge-arm modules can be configured.

[0003] Taking a dual-motor controller using two three-phase full-bridge modules as an example, each three-phase full-bridge module requires six DC terminals, and two three-phase full-bridge modules require twelve DC terminals, which will increase the size and cost of the motor controller. Utility Model Content

[0004] The utility model aims to provide a copper busbar structure, a motor controller and a vehicle, which can simplify the structure of the motor controller, occupy a small space and have low cost.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A copper busbar structure, comprising a DC copper busbar extending along a first direction, and two pin units, each of the pin units comprising a plurality of DC pins distributed along the first direction and divided into three groups, one end of the DC pin being connected to the DC copper busbar;

[0007] The DC copper busbar is connected to a polarity terminal at one end in the first direction for connecting to a bus capacitor.

[0008] As a possible implementation method of the copper busbar structure, the two pin units are respectively arranged on two opposite sides of the DC copper busbar in the second direction;

[0009] Or, the two pin units are arranged on the same side of the DC copper busbar in the second direction and are spaced apart along the first direction;

[0010] The first direction and the second direction are perpendicular.

[0011] In order to achieve the above object, the utility model also provides a motor controller, including two three-phase full-bridge drive modules, and two copper busbar structures as described in any of the above solutions;

[0012] In each of the copper busbar structures, the two pin units are arranged in one-to-one correspondence with the two three-phase full-bridge drive modules;

[0013] Each of the three-phase full-bridge drive modules includes three half-bridge structures. In each of the pin units, three groups of DC pins are electrically connected to the three half-bridge structures of the three-phase full-bridge drive module.

[0014] As an implementable manner of the above-mentioned motor controller, the two pin units of any copper busbar structure are respectively arranged on opposite sides of the DC copper busbar in a second direction, the two three-phase full-bridge drive modules are distributed along the second direction, and the two copper busbar structures are located between the two three-phase full-bridge drive modules along the second direction; the first direction and the second direction are perpendicular.

[0015] As an implementable manner of the above motor controller, the two three-phase full-bridge drive modules are symmetrically arranged about a preset plane, and the preset plane is perpendicular to the second direction and parallel to the first direction.

[0016] As an implementable manner of the above motor controller, the two DC copper bars are arranged opposite to each other and spaced apart along a third direction, and the third direction is perpendicular to the first direction and the second direction;

[0017] and\or,

[0018] The two polarity terminals are located at the same end of the DC copper busbar in the first direction, and the two polarity terminals are spaced apart along the second direction.

[0019] As an implementable manner of the above-mentioned motor controller, the motor controller further includes a heat dissipation substrate and a heat dissipation housing, the two three-phase full-bridge drive modules are both bonded and connected to the same heat dissipation substrate, the heat dissipation substrate is arranged between the three-phase full-bridge drive module and the heat dissipation housing along a third direction, and the third direction is perpendicular to the first direction and the second direction;

[0020] A cooling channel is formed between the heat dissipation substrate and the heat dissipation housing;

[0021] A support member is provided in the cooling channel, one end of the support member is connected to or abuts against the heat dissipation housing, and the other end of the support member is connected to or abuts against the heat dissipation substrate.

[0022] As an implementable manner of the above motor controller, the support member is a strip structure extending along the first direction, and the support member is arranged along the third direction facing the copper busbar structure;

[0023] and / or,

[0024] Two groups of forced convection structures are arranged in the cooling channel, and the forced convection structures are connected to the heat dissipation housing or the heat dissipation substrate; the two groups of forced convection structures are arranged along the third direction facing the two three-phase full-bridge drive modules respectively.

[0025] As an implementable manner of the above-mentioned motor controller, the motor controller further includes a packaging frame, the three-phase full-bridge drive module is packaged in the packaging frame, and each of the half-bridge structures is connected to a three-phase terminal for connecting to a phase terminal of the motor;

[0026] The DC copper busbar is injection-molded and packaged on the packaging frame, and / or the three-phase terminal is injection-molded and packaged on the packaging frame.

[0027] In order to achieve the above-mentioned purpose, the utility model also provides a vehicle, including a DC power supply, two motors and the motor controller described in any of the above-mentioned schemes, the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence, one polarity terminal of the copper bus structure is connected to the positive pole of the DC power supply through a bus capacitor, and the other polarity terminal of the copper bus structure is connected to the negative pole of the DC power supply through a bus capacitor.

[0028] Beneficial effects of the utility model:

[0029] The copper busbar structure and motor controller provided by the utility model integrate multiple DC pins of two pin units into the same DC copper busbar, and electrically connect the six groups of DC pins of the two pin units to the six half-bridge structures of two three-phase full-bridge drive modules in a one-to-one correspondence. Only two copper busbar structures are needed to realize two three-phase full-bridge drive modules. Compared with the prior art that uses twelve DC terminals, the number of parts is greatly reduced, and only the polarity terminals of the two copper busbar structures need to be connected to the bus capacitor, which can simplify the structure of the bus capacitor, reduce the cost of the motor controller, and reduce the size of the motor controller, thereby reducing the occupied space of the motor controller.

[0030] The vehicle provided by the utility model includes a DC power supply, two motors and the above-mentioned motor controller. The two polarity terminals of the two copper busbar structures are electrically connected to the positive and negative poles of the DC power supply through bus capacitors, respectively, which simplifies the connection between the DC power supply and the motor controller; the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence, and the above-mentioned motor controller integrates the controllers of the two motors, reducing the space occupied by the motor controller on the whole vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0032] Figure 1 It is a structural schematic diagram of a motor controller provided by an embodiment of the utility model;

[0033] Figure 2 is a top view of a motor controller provided by an embodiment of the utility model;

[0034] Figure 3 is a cross-sectional view of a motor controller provided by an embodiment of the utility model;

[0035] Figure 4 It is a structural schematic diagram of two copper busbar structures provided by an embodiment of the utility model;

[0036] Figure 5 It is a partial cross-sectional view of a motor controller provided by an embodiment of the utility model;

[0037] Figure 6 It is a structural schematic diagram of a phase terminal provided by an embodiment of the utility model;

[0038] Figure 7 yes Figure 5 A local enlarged schematic diagram of the middle A;

[0039] Figure 8 It is a cross-sectional view of a heat dissipation housing provided by an embodiment of the utility model.

[0040] In the figure:

[0041] 11. heat dissipation substrate; 111. first mounting hole; 12. packaging frame; 120. opening window; 121. first insulating mounting portion; 122. second insulating mounting portion; 13. forced convection structure;

[0042] 2. heat dissipation housing; 21. cooling medium inlet; 22. cooling medium outlet; 23. slot; 24. support member;

[0043] 3. Half-bridge structure; 31. Circuit board; 311. Ceramic substrate; 312. Upper copper plate; 313. Lower copper plate; 32. Power semiconductor; 33. Drive terminal;

[0044] 4. Copper busbar structure; 41. DC copper busbar; 42. Polarity terminal; 43. DC pin;

[0045] 5. three-phase terminal; 51. terminal body; 511. phase electrical connection part; 52. phase pin;

[0046] 6. Cover plate;

[0047] 100. Cooling chamber. DETAILED DESCRIPTION

[0048] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0049] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0052] It should be noted that in the embodiment of the present utility model, the first direction refers to Figures 1 to 8 The X direction is shown in Figures 1 to 8 The Y direction shown in the figure, the third direction see Figures 1 to 8 In the Z direction shown in , the first direction, the second direction and the third direction are perpendicular to each other.

[0053] like Figure 1 and Figure 2As shown, an embodiment of the utility model provides a copper busbar structure, which includes a DC copper busbar 41 extending along a first direction, and two pin units, each pin unit includes a plurality of DC pins 43 distributed along the first direction and divided into three groups, and the DC copper busbar 41 is connected to a polarity terminal 42 at one end in the first direction for connecting a bus capacitor.

[0054] An embodiment of the utility model also provides a motor controller, including two three-phase full-bridge drive modules, and the two copper busbar structures 4 mentioned above; in each copper busbar structure 4, two pin units are arranged in a one-to-one correspondence with the two three-phase full-bridge drive modules; each three-phase full-bridge drive module includes three half-bridge structures 3, and in each pin unit, three groups of DC pins 43 are electrically connected to the three half-bridge structures 3 of the three-phase full-bridge drive module.

[0055] The copper busbar structure 4 provided in the embodiment of the utility model integrates multiple DC pins 43 of two pin units into the same DC copper busbar 41, and electrically connects the six groups of DC pins 43 of the two pin units to the six half-bridge structures 3 of the two three-phase full-bridge drive modules in a one-to-one correspondence. Only two copper busbar structures 4 are needed to realize two three-phase full-bridge drive modules. Compared with the twelve DC terminals used in the prior art, the number of parts is greatly reduced, and only the polarity terminals 42 of the two copper busbar structures 4 need to be connected to the bus capacitor, which can simplify the structure of the bus capacitor, reduce the cost of the motor controller, and reduce the size of the motor controller, thereby reducing the occupied space of the motor controller.

[0056] It should be noted that, in the two copper busbar structures 4 , one of the two polarity terminals 42 is a positive terminal, and the other is a negative terminal.

[0057] In some embodiments, the copper busbar structure 4 is an integrally formed structural component, and the DC copper busbar 41, DC pins 43 and polarity terminals 42 can be formed by bending, stamping, cutting and other processes, so that the polarity terminals 42 and the DC pins 43 of the two pin units are integrated into the same DC copper busbar 41, which has a simple structure, low cost and is easy to form.

[0058] In some embodiments, the motor controller further includes a packaging frame 12, which is divided into two full-bridge packaging spaces distributed along the second direction, and each full-bridge packaging space is encapsulated with a three-phase full-bridge drive module. This arrangement enables two three-phase full-bridge drive modules to share one packaging frame 12, thereby simplifying the structure of the motor controller.

[0059] In some embodiments, Figure 1 and Figure 2As shown, each full-bridge packaging space is divided into three windows 120 along the first direction, and each window 120 encapsulates a corresponding half-bridge structure 3. The six windows 120 of the two full-bridge packaging spaces are distributed on the packaging frame 12 in the form of three rows along the first direction and two columns along the second direction, which can not only realize that the six half-bridge structures 3 share one packaging frame 12, but also realize that the six half-bridge structures 3 are independently encapsulated, and the encapsulation effect is better.

[0060] It should be noted that the half-bridge structure 3 is encapsulated in the corresponding window 120 by pouring insulating potting glue into the window 120. The insulating potting glue can be silicone gel or other types of insulating potting glue.

[0061] In other embodiments, only two windows may be provided on the packaging frame 12, each of which forms a full-bridge packaging space, and two three-phase full-bridge drive modules are packaged in the two windows one by one, that is, the two full-bridge packaging spaces are not divided, and no windows may be provided, in which case the packaging frame 12 is only used to fix the copper busbar structure 4. It should be noted that, regardless of whether windows are provided, the packaging frame 12 has the function of fixing the copper busbar structure 4, and the connection between the packaging frame 12 and the copper busbar structure 4 is described below.

[0062] In some embodiments, Figure 3 As shown, the motor controller further includes a heat dissipation substrate 11, which is disposed on one side of the packaging frame 12 in the third direction, and the two three-phase full-bridge drive modules are both bonded and connected to the same heat dissipation substrate 11. In this arrangement, the two three-phase full-bridge drive modules share one heat dissipation substrate 11, and only one heat dissipation substrate 11 is required, thereby reducing the number of components of the motor controller and improving the integration of the motor controller.

[0063] In some embodiments, each half-bridge structure 3 includes a circuit board 31 , and the circuit board 31 is electrically connected to a plurality of power semiconductors 32 and a driving terminal 33 . The circuit boards 31 are bonded and connected to the heat dissipation substrate 11 .

[0064] The power semiconductor 32 is the core heat generating component of the half-bridge structure 3. The heat generated by the power semiconductor 32 is transferred to the heat dissipation substrate 11 through the circuit board 31, and the heat is dissipated by the heat dissipation substrate 11. The drive terminal 33 is used to connect to an external drive circuit. The drive signal sent by the external drive circuit controls the working state of the power semiconductor 32 through the drive terminal 33, thereby controlling the corresponding three-phase full-bridge drive module to achieve control of the corresponding motor.

[0065] In some embodiments, in each half-bridge structure 3, the number of power semiconductors 32 and the number of drive terminals 33 are both plural. Specifically, each half-bridge structure 3 includes at least two groups of power semiconductors 32 arranged in parallel, and each group of power semiconductors 32 includes at least two power semiconductors 32 arranged in series. Such an arrangement not only ensures that when the motor controller is working, the current of the circuit where each group of power semiconductors 32 is located will not exceed the maximum allowable current carrying value; and can also reduce the number of groups of power semiconductors 32 arranged in parallel as much as possible while meeting the use requirements of the motor controller.

[0066] The power semiconductor 32 and the drive terminal 33 are electrically connected to the corresponding reserved positions on the circuit board 31, and the power semiconductors 32 and the circuit board 31 are connected through leads, metal busbars, etc., so as to form a half-bridge structure 3. The power semiconductor 32 is mainly a power semiconductor element such as IGBT (Insulated Gate Bipolar Transistor), MOSFET (Metal Oxide Semiconductor Field Effect Transistor), diode, etc., which is the existing technology in this field and will not be described in detail here.

[0067] In some embodiments, Figure 3 As shown, the circuit board 31 is a DBC (Direct Bonding Copper) substrate, which is a copper-clad ceramic substrate. Specifically, the DBC substrate includes a ceramic substrate 311 and a circuit layer electrically connected to both sides of the ceramic substrate 311 in the thickness direction, wherein the circuit layer is formed of copper or copper alloy, the circuit layer on the side of the ceramic substrate 311 facing away from the heat dissipation substrate 11 forms an upper copper plate 312, and the circuit layer on the side of the ceramic substrate 311 facing the heat dissipation substrate 11 forms a lower copper plate 313.

[0068] It should be noted that the size of the DBC substrate is determined by the number of power semiconductors 32 to be connected, and is not specifically limited here. The circuit board 31 is not limited to the DBC substrate, and other types of circuit boards 31 may also be used, such as DPC (Direct Plating Copper) substrates, etc. The DPC substrate is a direct copper ceramic substrate, which is not listed here one by one.

[0069] Optionally, the electrically connected power semiconductors 32 are bonded by solder, metal nanoparticles, metal diffusion, or ultrasound. The drive terminals 33 and the DBC substrate are bonded by solder, metal nanoparticles, metal diffusion, or ultrasound. The power semiconductors 32 and the DBC substrate are bonded by solder, metal nanoparticles, metal diffusion, or ultrasound. It should be noted that the bonding process using solder, the bonding process using metal nanoparticles, the metal diffusion, and the ultrasound are all prior arts in the art and will not be described in detail here.

[0070] In some embodiments, the driving terminal 33 is a pin-shaped terminal, which facilitates the bonding of the driving terminal 33 with the DBC substrate and has a lower cost.

[0071] In some embodiments, Figures 1 to 4 As shown, the DC pin 43 is electrically connected to the DBC substrate to electrically connect the DC pin 43 to the half-bridge structure 3, thereby electrically connecting the bus capacitor to the half-bridge structure 3 through the copper bus structure 4.

[0072] In some embodiments, the DC copper busbar 41 is injection-molded and packaged on the packaging frame 12 , and the connection method is simple and the connection is firm.

[0073] In some embodiments, the two DC copper bars 41 are arranged opposite to each other and spaced apart in the third direction. Such an arrangement can fully utilize the space in the third direction, reduce the space occupied by the two DC copper bars 41 in the second direction, and thus reduce the length of the motor controller in the second direction; and the two DC copper bars 41 are arranged spaced apart to avoid short circuit caused by contact between the two DC copper bars 41.

[0074] In some embodiments, the two pin units are respectively arranged on opposite sides of the DC copper busbar 41 in the second direction, the two three-phase full-bridge drive modules are distributed along the second direction, and the copper busbar structure 4 is located between the two three-phase full-bridge drive modules along the second direction. In this way, it is possible to arrange two copper busbar structures 4 using the space between the two three-phase full-bridge drive modules while ensuring that each copper busbar structure 4 is respectively connected to the two three-phase full-bridge drive modules.

[0075] Specifically, the packaging frame 12 includes a first insulating mounting portion 121 located between two three-phase full-bridge drive modules along the second direction, and the DC copper bus 41 is injection-molded and packaged in the first insulating mounting portion 121 .

[0076] For example, Figure 4As shown, each pin unit includes three groups of DC pins 43, that is, each copper busbar structure 4 has six groups of DC pins 43, and the six groups of DC pins 43 are electrically connected to the six half-bridge structures 3 of the two three-phase full-bridge drive modules respectively.

[0077] In some embodiments, the two three-phase full-bridge drive modules are symmetrically arranged about a preset plane, and the preset plane is perpendicular to the second direction and parallel to the first direction. Such an arrangement can reduce installation requirements, improve the integration of the motor controller, and reduce the processing cost of the three-phase full-bridge drive module.

[0078] In some other embodiments, two pin units may be arranged on the same side of the DC copper busbar 41 in the second direction, the two pin units may be spaced apart along the first direction, the two three-phase full-bridge drive modules may be distributed along the first direction, and the copper busbar structure 4 may be located on either side of the three-phase full-bridge drive module in the second direction. In this way, two three-phase full-bridge drive modules may share two copper busbar structures 4.

[0079] In some embodiments, the two polarity terminals 42 are located at the same end of the DC copper busbar 41 in the first direction, and the two polarity terminals 42 are spaced apart along the second direction. The two polarity terminals 42 are arranged at the same end of the DC copper busbar 41 in the first direction, so as to facilitate connecting the two polarity terminals 42 to the bus capacitor; the two polarity terminals 42 are spaced apart along the second direction, so as to provide sufficient installation space for connecting the two polarity terminals 42 and the bus capacitor, and avoid interference when the two polarity terminals 42 and the bus capacitor are connected.

[0080] In some other embodiments, the two polarity terminals 42 can also be arranged on opposite sides of the packaging frame 12 in the first direction; when the two pin units are arranged on the same side of the DC copper bus 41 in the second direction, the polarity terminal 42 can also be arranged on the side of the DC copper bus 41 in the second direction that is away from the three-phase full-bridge drive module.

[0081] In some embodiments, the polarity terminal 42 is provided with a first through hole for connecting the bus capacitor. In other embodiments, a nut may be welded or riveted on the polarity terminal 42 to connect the nut to the bus capacitor. It should be noted that the methods of connecting the bus capacitor by providing a through hole on the polarity terminal 42, or welding a nut, or riveting a nut are all commonly used connection methods in the art and will not be described in detail here.

[0082] In some embodiments, Figure 1 and Figure 4 As shown, the plurality of DC pins 43 electrically connected to any three-phase full-bridge drive module are arranged at intervals along the first direction, so as to avoid contact between two adjacent DC pins 43 electrically connected to the same three-phase full-bridge drive module and cause a short circuit.

[0083] In some embodiments, Figure 1 and Figure 6 As shown, each half-bridge structure 3 is connected to a three-phase terminal 5 for connecting to the phase terminal of the motor. Specifically, a group of three-phase terminals 5 are provided on both sides of the packaging frame 12 along the second direction, and the two three-phase full-bridge drive modules are located between the two groups of three-phase terminals 5 along the second direction, and the two groups of three-phase terminals 5 are symmetrically arranged about the preset plane. Each group of three-phase terminals 5 includes three three-phase terminals 5 arranged along the first direction, and one end of each three-phase terminal 5 is electrically connected to a half-bridge structure 3, and the other end is used to connect to the phase terminal of the motor.

[0084] When the motor controller is applied to a hybrid vehicle, especially a hybrid vehicle using a distributed motor, two three-phase full-bridge drive modules are arranged between two groups of three-phase terminals 5 along the second direction, and the two groups of three-phase terminals 5 are symmetrically arranged about a preset plane, which is convenient for wiring the distributed motor. It should be noted that the motor controller is not limited to hybrid vehicles, but can be used in any vehicle with two motors.

[0085] It should be noted that the three three-phase terminals 5 located on the same side of the packaging frame 12 are respectively used to connect the U-phase terminal, the V-phase terminal and the W-phase terminal of the same motor.

[0086] In some embodiments, the three-phase terminals 5 are injection-molded and packaged on the packaging frame 12 , which has a simple connection method, good connection firmness, and can insulate the three-phase terminals 5 .

[0087] Specifically, Figure 1 and Figure 6 As shown, the packaging frame 12 also includes two second insulating mounting portions 122, and the two three-phase full-bridge drive modules are located between the two second insulating mounting portions 122 along the second direction. The three three-phase terminals 5 located on the same side of the packaging frame 12 are injection-molded and encapsulated in the same second insulating mounting portion 122, and the three three-phase terminals 5 are separated by the second insulating mounting portion 122 to avoid short circuit caused by contact between two adjacent three-phase terminals 5.

[0088] Specifically, each three-phase terminal 5 includes a terminal body 51 extending along the second direction, and a plurality of phase pins 52 connected to one end of the terminal body 51, and the other end of the terminal body 51 passes through the second insulating mounting portion 122 along the second direction to form a phase electrical connection portion 511, and the phase electrical connection portion 511 is used to connect the phase terminal of the motor, and the phase pin 52 is electrically connected to the DBC substrate.

[0089] Exemplarily, the three-phase terminal 5 is an integrally formed structural component, and the terminal body 51 and the phase pin 52 can be formed by bending and other processes, which has a simple structure, low cost and is easy to form.

[0090] Exemplarily, a second through hole is provided on the phase electrical connection portion 511 for connecting the phase terminal of the motor. In other embodiments, a nut may be welded or riveted on the phase electrical connection portion 511 to connect the nut to the phase terminal of the motor.

[0091] Optionally, the phase pins 52 and the DBC substrate are bonded using solder, or bonding using metal nanoparticles, or bonding based on metal diffusion, or bonding based on ultrasonic waves.

[0092] Optionally, the packaging frame 12 can be made of insulating materials such as plastic or nylon, which is not specifically limited here.

[0093] Alternatively, the DBC substrate and the heat dissipation substrate 11 are bonded using solder, bonding using metal nanoparticles, bonding based on metal diffusion, or bonding based on ultrasonic waves.

[0094] In some embodiments, the packaging frame 12 is detachably connected to the heat dissipation substrate 11 for easy disassembly and assembly. Exemplarily, the packaging frame 12 is connected to the heat dissipation substrate 11 by fasteners such as bolts. In other embodiments, the packaging frame 12 can also be clamped to the heat dissipation substrate 11.

[0095] In some embodiments, Figure 5 and Figure 7 As shown, a heat dissipation shell 2 is provided on the side of the heat dissipation substrate 11 facing away from the packaging frame 12, and a cooling channel is formed between the heat dissipation substrate 11 and the heat dissipation shell 2. The cooling channel is used to circulate cooling medium to dissipate heat for the two three-phase full-bridge drive modules, so that the two three-phase full-bridge drive modules share one cooling channel, which has a simple structure and low cost.

[0096] Specifically, the cooling channel includes a chamber 100 formed between the heat dissipation substrate 11 and the heat dissipation housing 2, a cooling medium inlet 21 is formed at one end of the cooling channel, and a cooling medium outlet 22 is formed at the other end, and the cooling medium inlet 21 and the cooling medium outlet 22 are both provided on the heat dissipation housing 2. In other embodiments, the cooling medium inlet 21 and the cooling medium outlet 22 can also be provided on the heat dissipation substrate 11, or one of the cooling medium inlet 21 and the cooling medium outlet 22 can be provided on the heat dissipation housing 2, and the other can be provided on the heat dissipation substrate 11.

[0097] The power semiconductor 32 generates heat during operation, and the heat is transferred to the heat dissipation substrate 11 through the DBC substrate. The heat dissipation substrate 11 transfers the heat to the cooling medium in the cooling chamber 100. The cooling medium enters the cooling chamber 100 through the cooling medium inlet 21 and flows out through the cooling medium outlet 22. The circulating cooling medium takes away the heat on the heat dissipation substrate 11. For example, the cooling medium is water, ethanol, etc.

[0098] It should be noted that the heat dissipation substrate 11 is a heat-conducting structural component. The heat dissipation substrate 11 is a heat-conducting structural component made of metals with good thermal conductivity such as copper, copper alloy, aluminum, or aluminum alloy, which is beneficial for the heat dissipation substrate 11 to conduct the heat generated by the power semiconductor 32 to the cooling medium in the cooling chamber 100.

[0099] Exemplarily, the heat dissipation housing 2 is symmetrically arranged with respect to a preset plane. Specifically, the packaging frames 12 located on opposite sides of the first insulating mounting portion 121 in the second direction are symmetrically arranged with respect to the preset plane.

[0100] Exemplarily, the cooling medium inlet 21 and the cooling medium outlet 22 are respectively arranged on opposite sides of the cooling chamber 100 in the first direction, so as to extend the flow path of the cooling medium in the cooling chamber 100 and improve the heat dissipation effect on the power semiconductor 32. In other embodiments, the cooling medium inlet 21 and the cooling medium outlet 22 can also be respectively arranged on opposite sides of the cooling chamber 100 in the first direction.

[0101] In some embodiments, Figure 1 , Figure 7 and Figure 8 As shown, a slot 23 is provided on the side of the heat dissipation housing 2 facing the heat dissipation substrate 11, a portion of the opening of the slot 23 is arranged facing one of the three-phase full-bridge drive modules, and another portion of the opening is arranged facing another three-phase full-bridge drive module, and the heat dissipation substrate 11 blocks the opening of the slot 23, so that the above-mentioned cooling channel is formed between the heat dissipation housing 2 and the heat dissipation substrate 11. In other embodiments, the slot 23 can also be provided on the side of the heat dissipation substrate 11 facing the heat dissipation housing 2, and a slot 23 can also be provided on each of the heat dissipation housing 2 and the heat dissipation substrate 11, and the openings of the two slots 23 are arranged opposite to each other.

[0102] In some embodiments, Figure 2 and Figure 5 As shown, the heat dissipation substrate 11 and the heat dissipation housing 2 are connected by a plurality of fasteners arranged at intervals in the circumferential direction. Specifically, the heat dissipation substrate 11 is provided with a plurality of first mounting holes 111 arranged at intervals along its circumferential edge, and the heat dissipation housing 2 is provided with a plurality of second mounting holes, and the plurality of first mounting holes 111 are coaxially arranged with the plurality of second mounting holes in a one-to-one correspondence, and one of the first mounting holes 111 and the corresponding second mounting holes is a mounting through hole set through along the thickness direction of the heat dissipation substrate 11, and the other is a threaded hole, and the heat dissipation substrate 11 and the heat dissipation housing 2 are connected by fasteners passing through the mounting through hole and being threadedly connected to the threaded hole. Exemplarily, the first mounting hole 111 is a threaded hole, and the second mounting hole is a mounting through hole.

[0103] In some embodiments, Figure 7As shown, a forced convection structure 13 is provided in the cooling channel, and the forced convection structure 13 is connected to the heat dissipation substrate 11. The heat dissipation substrate 11 transfers part of the heat directly to the cooling medium, and transfers the other part of the heat to the cooling medium through the forced convection structure 13, and the heat conduction efficiency is high. The forced convection structure 13 can use heat dissipation fins, or other types of forced convection structures in the prior art. When the forced convection structure 13 uses heat dissipation fins, commonly used pin fins or sheet fins can be used. One end of the forced convection structure 13 can be inserted into the heat dissipation substrate 11 or the heat dissipation housing 2 with an interference fit, and the forced convection structure 13 can also be a structural member integrally formed with the heat dissipation substrate 11; the forced convection structure 13 can also be connected to the heat dissipation housing 2; the forced convection structure 13 can also be sandwiched between the heat dissipation substrate 11 and the heat dissipation housing 2 along a third direction.

[0104] Exemplarily, two groups of heat dissipation fins are provided, and the two groups of heat dissipation fins are respectively arranged along the third direction facing the two three-phase full-bridge drive modules. Such an arrangement can improve the forced convection effect of the heat dissipation fins.

[0105] In some embodiments, Figure 1 , Figure 7 and Figure 8 As shown, a support member 24 is provided in the cooling channel, one end of the support member 24 is connected to the heat dissipation housing 2, and the other end abuts against the heat dissipation substrate 11. The support member 24 is used to support the heat dissipation substrate 11 to prevent the heat dissipation substrate 11 from sinking toward the side where the heat dissipation housing 2 is located.

[0106] Exemplarily, the support member 24 is convexly disposed on the bottom wall of the slot 23, and the support member 24 and the heat dissipation housing 2 are integrally formed. In other embodiments, one end of the support member 24 may be connected to the heat dissipation substrate 11, and the other end may abut against the bottom wall of the slot 23; the support member 24 may also be independently disposed and sandwiched between the heat dissipation substrate 11 and the bottom wall of the slot 23.

[0107] In some embodiments, the support member 24 is a strip structure extending along the first direction, and the support member 24 is arranged opposite to the copper bus structure 4 along the thickness direction of the heat dissipation substrate 11. Such an arrangement can improve the supporting effect of the support member 24 on the heat dissipation substrate 11, and realize that there is no need to set a heat dissipation fin between the two three-phase full-bridge drive modules, thereby reducing costs. It should be noted that the thickness direction of the heat dissipation substrate 11 is the third direction.

[0108] In some embodiments, the support member 24 is spaced apart from the inner wall of the cooling chamber 100 along both the second direction and the first direction. Such a configuration enables the support member 24 to also have a forced convection effect, thereby improving the heat dissipation effect of the two three-phase full-bridge drive modules.

[0109] In some embodiments, the support member 24 is located between the cooling medium inlet 21 and the cooling medium outlet 22 along the first direction, and is arranged opposite to the cooling medium inlet 21 and the cooling medium outlet 22. The cooling medium enters the cooling chamber 100 through the cooling medium inlet 21, and is diverted by the support member 24 to the two sides of the support member 24 in the second direction to cool the power semiconductors 32 of the two three-phase full-bridge drive modules, and then converges at the cooling medium outlet 22 and flows out through the cooling medium outlet 22. Such an arrangement can ensure that when both three-phase full-bridge drive modules are working, the power semiconductors 32 of the two three-phase full-bridge drive modules can be fully cooled. Exemplarily, the support member 24, the cooling medium inlet 21 and the cooling medium outlet 22 are all symmetrically arranged about the preset plane, so that the cooling effect of the cooling medium on the two three-phase full-bridge drive modules is basically the same.

[0110] In some embodiments, a seal such as a sealing ring is provided between the heat dissipation substrate 11 and the heat dissipation shell 2. The seal is a closed-loop structure and is arranged around the outer periphery of the cooling chamber 100 to prevent the cooling medium from leaking through the gap between the heat dissipation substrate 11 and the heat dissipation shell 2.

[0111] In some embodiments, Figure 3 As shown, a cover plate 6 is provided on the side of the packaging frame 12 facing away from the heat dissipation substrate 11, which is used to block the opening of the full-bridge packaging space to prevent dust from adhering to the potting glue during transportation of the motor controller. Specifically, a through hole for penetrating the drive terminal 33 is provided on the cover plate 6, so as to facilitate connecting the drive terminal 33 to the external drive circuit. It should be noted that the cover plate 6 can also be eliminated, and the three-phase full-bridge drive module can be sealed only by the insulating potting glue.

[0112] In some embodiments, the packaging frame 12 and the cover plate 6 are detachably connected, such as by fasteners.

[0113] The assembly process of the above motor controller is as follows:

[0114] (1) The power semiconductor 32 and the drive terminal 33 are joined to the reserved position on the DBC substrate, and the power semiconductors 32 and the circuit board 31 are connected through leads, metal busbars, etc. to form a half-bridge structure 3;

[0115] (2) six half-bridge structures 3 are connected to the heat dissipation substrate 11 in the form of three rows along the first direction and two columns along the second direction to form two three-phase full-bridge drive modules distributed along the second direction;

[0116] (3) Injection-molding two groups of three-phase terminals 5 on opposite sides of the packaging frame 12 along the second direction, and arrange the three three-phase terminals 5 in each group along the first direction;

[0117] (4) Injection-molding the DC copper busbars 41 of the two copper busbar structures 4 into the packaging frame 12 and position the two copper busbar structures 4 between the two three-phase full-bridge drive modules;

[0118] (5) Connect the package frame 12 with the DC copper busbar 41 and the three-phase terminal 5 encapsulated by injection molding to the heat dissipation base plate, so that the six half-bridge structures 3 are respectively located in the windows 120 of the six package frames 12;

[0119] (6) The DC pin 43 of the copper busbar structure 4 and the phase pin 52 of the three-phase terminal 5 are electrically connected to the corresponding reserved positions on the half-bridge structure 3 respectively;

[0120] (7) The six windows 120 of the packaging frame 12 are packaged by glue filling.

[0121] An embodiment of the utility model also provides a vehicle, which mainly refers to a hybrid vehicle. The vehicle includes a DC power supply, two motors and the above-mentioned motor controller, wherein the polarity terminal 42 of one copper bus structure 4 is electrically connected to the positive pole of the DC power supply through a bus capacitor, and the polarity terminal 42 of the other copper bus structure 4 is electrically connected to the negative pole of the DC power supply through a bus capacitor, and the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence.

[0122] Specifically, the three three-phase terminals 5 located on one side of the packaging frame 12 correspond to one motor, and the three three-phase terminals 5 located on the other side of the packaging frame 12 correspond to another motor. The three phase connection terminals of any motor are electrically connected to the corresponding three three-phase terminals 5 one by one. Each three-phase full-bridge drive module is correspondingly equipped with an external drive circuit, and each drive terminal 33 of any three-phase full-bridge drive module is electrically connected to the corresponding external drive circuit.

[0123] It should be noted that the above-mentioned motor controller is not limited to use in vehicles. For devices using an even number of motors greater than 2, multiple motors can be grouped in pairs, and each group of motors can be equipped with one of the above-mentioned motor controllers. In particular, for devices equipped with four or more motors, taking a device using four motors as an example, the heat dissipation substrates 11 of the two motor controllers can be integrally formed, and the packaging frames 12 of the two motor controllers can be integrally formed. At this time, the packaging frames 12 of the two motor controllers can be arranged symmetrically about a plane perpendicular to the first direction.

[0124] In addition, the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. Copper busbar structure, characterized in that: It comprises a DC copper busbar (41) extending along a first direction, and two pin units, each of the pin units comprising a plurality of DC pins (43) distributed along the first direction and divided into three groups, one end of the DC pin (43) being connected to the DC copper busbar (41); The DC copper busbar (41) is connected to a polarity terminal (42) at one end in the first direction, and is used for connecting a busbar capacitor.

2. The copper busbar structure according to claim 1, characterized in that: The two pin units are respectively arranged on two opposite sides of the DC copper busbar (41) in the second direction; Or, the two pin units are arranged on the same side of the DC copper busbar (41) in the second direction, and are spaced apart and distributed along the first direction; The first direction and the second direction are perpendicular.

3. A motor controller, characterized in that It comprises two three-phase full-bridge drive modules and two copper busbar structures (4) as claimed in claim 1 or 2; In each of the copper busbar structures (4), the two pin units are arranged in a one-to-one correspondence with the two three-phase full-bridge drive modules; Each of the three-phase full-bridge drive modules comprises three half-bridge structures (3), and in each of the pin units, three groups of DC pins (43) are electrically connected to the three half-bridge structures (3) of the three-phase full-bridge drive module.

4. The motor controller according to claim 3, characterized in that: The two pin units of any one of the copper busbar structures (4) are respectively arranged on opposite sides of the DC copper busbar (41) in a second direction, the two three-phase full-bridge drive modules are distributed along the second direction, and the two copper busbar structures (4) are located between the two three-phase full-bridge drive modules along the second direction; the first direction and the second direction are perpendicular.

5. The motor controller according to claim 4, characterized in that: The two DC copper bars (41) are arranged opposite to each other and spaced apart along a third direction, wherein the third direction is perpendicular to the first direction and the second direction; and\or, The two polarity terminals (42) are located at the same end of the DC copper busbar (41) in the first direction, and the two polarity terminals (42) are spaced apart along the second direction.

6. The motor controller according to claim 4, characterized in that: It also includes a heat dissipation substrate (11) and a heat dissipation housing (2), wherein the two three-phase full-bridge drive modules are both bonded and connected to the same heat dissipation substrate (11), and the heat dissipation substrate (11) is arranged between the three-phase full-bridge drive module and the heat dissipation housing (2) along a third direction, and the third direction is perpendicular to the first direction and the second direction; A cooling channel is formed between the heat dissipation substrate (11) and the heat dissipation housing (2); A support member (24) is provided in the cooling channel, one end of the support member (24) is connected to or abuts against the heat dissipation housing (2), and the other end of the support member (24) is connected to or abuts against the heat dissipation substrate (11).

7. The motor controller according to claim 6, characterized in that: The support member (24) is a strip-shaped structure extending along the first direction, and the support member (24) is arranged along the third direction facing the copper busbar structure (4); and / or, Two groups of forced convection structures (13) are provided in the cooling channel, and the forced convection structures (13) are connected to the heat dissipation housing (2) or the heat dissipation substrate (11); the two groups of forced convection structures (13) are respectively arranged along the third direction facing the two three-phase full-bridge drive modules.

8. The motor controller according to claim 4, characterized in that: It also comprises a packaging frame (12), the three-phase full-bridge drive module being packaged in the packaging frame (12), and each of the half-bridge structures (3) being connected to a three-phase terminal (5) for connection to a phase connection terminal of a motor; The DC copper busbar (41) is injection-molded and packaged on the packaging frame (12), and / or the three-phase terminal (5) is injection-molded and packaged on the packaging frame (12).

9. The motor controller according to claim 8, characterized in that: The two three-phase full-bridge drive modules are symmetrically arranged about a preset plane; And / or, a group of the three-phase terminals (5) are respectively arranged on both sides of the packaging frame (12) along the second direction, the two three-phase full-bridge drive modules are located between the two groups of the three-phase terminals (5) along the second direction, and the two groups of the three-phase terminals (5) are symmetrically arranged about the preset plane; The preset plane is perpendicular to the second direction and parallel to the first direction.

10. A vehicle, characterized in that It comprises a DC power supply, two motors and a motor controller as claimed in any one of claims 3 to 9, wherein the two motors are electrically connected to the two three-phase full-bridge drive modules in a one-to-one correspondence, wherein the polarity terminal (42) of one of the copper busbar structures (4) is connected to the positive electrode of the DC power supply through a bus capacitor, and the polarity terminal (42) of the other copper busbar structure (4) is connected to the negative electrode of the DC power supply through a bus capacitor.

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