Circuit board assembly and electronic equipment

Abstract

The utility model provides a circuit board assembly and electronic equipment, relates to the technical field of electronic equipment, and is used for solving the problem that the impedance of an internal metal functional layer is increased when an existing circuit board is miniaturized. The circuit board assembly provided by the utility model comprises a circuit board, a component and a structural member. The circuit board is provided with a first surface, and the first surface comprises a first area and a second area. The component is located in the first area, and the component is electrically connected with the circuit board. The structural member is located in the second area and comprises an inner core and an insulating layer, the inner core is electrically connected with the circuit board, and the insulating layer wraps the inner core. According to the circuit board assembly provided by the invention, on the premise that the size of the circuit board is not changed, the inner core of the structural member can reduce the impedance of the metal functional layer in the circuit board to a certain extent, so that the electrical performance index of the metal functional layer can be improved. And the insulating layer wrapping the outer side of the inner core can prevent short circuit caused by direct contact between the inner core and surrounding components.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the development of electronic devices, electronic devices are increasingly pursuing thinness and miniaturization, and the realization of thinness and miniaturization mainly depends on the reduction of the volume of various components inside electronic devices. For example, the area and thickness of the circuit board in the electronic device are decreasing, which causes the area and thickness of each metal functional layer (such as power layer, wire layer, etc.) in the circuit board to decrease, which in turn leads to an increase in the impedance of the circuit board. Utility Model Content

[0003] The embodiments of the present application provide a circuit board assembly and an electronic device, which are used to solve the problem that the impedance of the internal metal functional layer of the existing circuit board increases when the circuit board is miniaturized.

[0004] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0005] In a first aspect, an embodiment of the present application provides a circuit board assembly, including a circuit board, components and structural parts.

[0006] The circuit board has a first surface, and the first surface includes a first area and a second area. The components are located in the first area, and the components are electrically connected to the circuit board. The structural parts are located in the second area, and the structural parts include an inner core and an insulating layer. The inner core is electrically connected to the circuit board, and the insulating layer wraps the inner core.

[0007] The circuit board assembly provided in the first aspect of the present application is provided with a structural member on the second area of ​​the first surface of the circuit board, and the inner core of the structural member is electrically connected to the circuit board, wherein the inner core of the structural member can be electrically connected to any metal functional layer (such as a power layer, a conductor layer, etc.) on the circuit board, which is equivalent to making the inner core of the structural member a part of the metal functional layer connected thereto, and increasing the area and thickness of the corresponding metal functional layer by using the inner core of the structural member, thereby reducing the impedance of the metal functional layer in the circuit board to a certain extent under the premise that the volume of the circuit board remains unchanged, and thus improving the electrical performance index of the metal functional layer. In addition, the insulating layer wrapped around the outer side of the inner core can prevent the inner core from directly contacting the surrounding components and causing a short circuit.

[0008] In combination with the first aspect, in a possible implementation, the second area is located between two adjacent components. Among them, the above-mentioned components can be active devices (such as CPU, GPU, LPDDR, etc.) or passive devices (such as resistors, capacitors, inductors, filters, etc.). In this way, it is equivalent to setting the structural parts in the blank area between adjacent components on the circuit board, thereby optimizing the impedance of the metal functional layer through the structural parts, and at the same time, it can also improve the surface utilization of the circuit board, which is conducive to the miniaturization of the circuit board.

[0009] In combination with the first aspect, in another possible implementation, the second area is located at the edge of the circuit board. In this way, it is equivalent to setting the structural member at the blank area at the edge of the circuit board where no components are set, thereby using the structural member to reduce the impedance of the metal functional layer in the circuit board while also improving the surface utilization rate of the circuit board, which is conducive to the miniaturization of the circuit board.

[0010] In combination with the first aspect, in another possible implementation, the structural strength of the portion of the circuit board corresponding to the second area is less than the structural strength of the portion corresponding to the first area. This arrangement is equivalent to using the structural member to strengthen the relatively weak portion of the circuit board, that is, the structural member has the dual functions of "reducing impedance" and "structural reinforcement" for the circuit board.

[0011] In combination with the first aspect, in another possible implementation, the component includes a first electronic device and a second electronic device, the first electronic device is disposed on a first surface, the second electronic device is disposed on a surface of the first electronic device away from the first surface, the first electronic device is electrically connected to the circuit board, and the second electronic device is electrically connected to the first electronic device. A vertical projection of the second electronic device on the first surface covers at least a portion of a vertical projection of the structural component on the first surface.

[0012] Among them, after the second electronic device is connected to the first electronic device, there is a gap formed between the second electronic device and the circuit board around the first electronic device. The height of the gap is relatively small, and most of the components are standard parts, and their height is much greater than the height of the gap, and they cannot be arranged in the gap. The height of the above-mentioned structural member can be set arbitrarily according to needs, so the structural member can be set in the gap between the second electronic device and the circuit board. In this way, the structural member does not need to occupy other areas on the circuit board where components can be normally arranged, thereby improving the surface utilization rate of the circuit board and facilitating the miniaturization of the circuit board.

[0013] In combination with the first aspect, in another possible implementation, the first electronic device is a connector, the second electronic device is a flexible circuit board, and the other end of the flexible circuit board is used to connect the electronic component. For example, the first electronic device can be a female socket of a board-to-board connector, and one end of the flexible circuit board is provided with a male socket of the connector, and the electrical connection between the flexible circuit board and the circuit board can be achieved by docking the male socket and the female socket.

[0014] In combination with the first aspect, in another possible implementation, a plurality of structural members are provided, and the plurality of structural members are arranged at intervals around the first electronic device. In this arrangement, the gap formed around the first electronic device and between the second electronic device and the circuit board can be fully utilized, and the plurality of structural members can further reduce the impedance of the metal functional layer in the circuit board. The plurality of structural members can be electrically connected to the same metal functional layer, or respectively to different metal functional layers.

[0015] In combination with the first aspect, in another possible implementation, a plurality of openings are provided on the circuit board, the openings penetrate the circuit board along the thickness direction of the circuit board, and the second area is located between two adjacent openings. In other words, it is equivalent to that the structural member is arranged on the narrow strip portion between the two openings on the circuit board, so that the structural member can reduce the impedance of the metal functional layer in the circuit board while also enhancing the structural strength of the narrow strip portion, thereby reducing the risk of the narrow strip portion breaking when the circuit board is impacted or vibrated, thereby ensuring the reliability and stability of the circuit board.

[0016] In combination with the first aspect, in another possible implementation, the circuit board assembly further includes a fastener, and the structural member is fixed to the circuit board by the fastener. In this configuration, the fastener can not only fix the structural member more firmly, but also simplify the assembly process between the structural member and the circuit board (for example, the fastener is a screw, a screw hole is provided on the circuit board, and a through hole is provided on the structural member, and one end of the screw passes through the through hole and is tightened in the screw hole to complete the fixing of the structural member).

[0017] In combination with the first aspect, in another possible implementation manner, in a thickness direction of the circuit board, a height of the structural component is H, where H≤0.25 mm.

[0018] In combination with the first aspect, in another possible implementation, in the thickness direction of the circuit board, the height of the inner core is h, wherein 0.15 mm ≤ h ≤ 0.2 mm. Thus, when the structural member is located in the gap formed between the second electronic device and the circuit board around the first electronic device, the structural member can obtain a higher inner core thickness gain, and the greater the inner core thickness, the more conducive it is to reducing the impedance of the metal functional layer electrically connected thereto.

[0019] In combination with the first aspect, in another possible implementation manner, the material of the inner core is copper.

[0020] In combination with the first aspect, in another possible implementation, the insulating layer is made of EMC insulating material. In this way, the insulating layer can not only prevent the inner core from directly contacting with surrounding components and causing a short circuit, but the insulating layer made of EMC insulating material also has good mechanical strength, which can provide a certain support for the entire structural member, thereby improving the impact resistance of the structural member.

[0021] In a second aspect, the present application provides an electronic device, which includes a housing and the circuit board assembly provided in the first aspect, wherein a receiving cavity is formed inside the housing, and the circuit board assembly is disposed in the receiving cavity.

[0022] It can be understood that the beneficial effects that can be achieved by the electronic device described in the second aspect and any possible implementation thereof provided above can refer to the beneficial effects in the first aspect and any possible implementation thereof, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0024] Figure 2 for Figure 1 Structural explosion diagram of electronic equipment;

[0025] Figure 3 for Figure 2 A front view of the components arranged on the circuit board;

[0026] Figure 4 for Figure 3 Schematic diagram of the cross section at AA in the middle;

[0027] Figure 5 A front view of a circuit board assembly provided in an embodiment of the present application;

[0028] Figure 6 for Figure 5 Schematic diagram of the cross section at BB;

[0029] Figure 7 A cross-sectional view of a structural member provided in an embodiment of the present application;

[0030] Figure 8 A cross-sectional view of another structural member provided in an embodiment of the present application;

[0031] Fig. 9 A front view of another circuit board assembly provided in an embodiment of the present application;

[0032] Fig.10 for Fig. 9 Schematic diagram of the cross section at CC;

[0033] Fig.11 A front view of another circuit board assembly provided in an embodiment of the present application;

[0034] Fig.12 for Fig.11 Schematic diagram of the cross section at EE;

[0035] Fig.13 A front view of another circuit board assembly provided in an embodiment of the present application;

[0036] Fig.14 for Fig.13 Schematic diagram of the cross section at FF;

[0037] Fig.15 for Fig.13 Schematic diagram of the cross section at GG;

[0038] Fig.16 A front view of another circuit board assembly provided in an embodiment of the present application;

[0039] Fig.17 for Fig.16 Schematic diagram of the cross section at JJ;

[0040] Fig.18 A front view of another circuit board assembly provided in an embodiment of the present application;

[0041] Fig.19 for Fig.18 Schematic diagram of the cross section at KK;

[0042] Fig. 20 A front view of another circuit board assembly provided in an embodiment of the present application;

[0043] Fig.21 for Fig. 20 A partial enlarged view of the M in the middle;

[0044] Fig. 22 for Fig.21 Schematic diagram of the cross section at NN in the middle;

[0045] Fig.23 A front view of another circuit board assembly provided in an embodiment of the present application;

[0046] Fig.24 for Fig.23 A partial enlarged view of the P in the middle;

[0047] Fig.25 for Fig.23 Schematic diagram of the cross section at QQ;

[0048] Fig.26A schematic diagram of the manufacturing process of a structural part Figure 1 ;

[0049] Fig. 27 A schematic diagram of the manufacturing process of a structural part Figure 2 ;

[0050] Fig.28 A schematic diagram of the manufacturing process of a structural part Figure 3 ;

[0051] Fig.29 A schematic diagram of the manufacturing process of a structural part Figure 4 ;

[0052] Fig.30 A schematic diagram of the manufacturing process of a structural part Figure 5 ;

[0053] Fig.31 Schematic diagram of the manufacturing process of another structural part Figure 1 ;

[0054] Fig.32 Schematic diagram of the manufacturing process of another structural part Figure 2 ;

[0055] Fig.33 Schematic diagram of the manufacturing process of another structural part Figure 3 ;

[0056] Fig.34 The manufacturing process of another structural part is shown in Figure 2. Figure 4 ;

[0057] Fig.35 The manufacturing process of another structural part is shown in Figure 2. Figure 5 ;

[0058] Fig.36 Schematic diagram of the manufacturing process of another structural part Figure 6 ;

[0059] Fig.37 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 1 ;

[0060] Fig.38 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 2 ;

[0061] Fig.39 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 3 ;

[0062] Fig.40 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 1;

[0063] Fig.41 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 2 ;

[0064] Fig.42 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 3 ;

[0065] Fig.43 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 4 ;

[0066] Fig.44 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 5 ;

[0067] Fig.45 This is a schematic diagram of the manufacturing process and installation process of another structural component. Figure 6 .

[0068] Reference numerals:

[0069] 01. electronic device; 10. display module; 11. transparent cover plate; 12. display screen; 20. housing; 21. battery cover; 22. frame; 23. middle plate; 30. camera module; 40. circuit board assembly; 41. circuit board; 411. substrate; 411a. first part; 411b. second part; 411c. third part; 411d. narrow strip part; 4111. first narrow strip part; 4112. second narrow strip part; 401. first surface; 401a. first area; 401b. second area; 4011. second area on the left; 4012. second area on the right; 4013. second area on the upper part; 4014. second area on the lower part; 412. metal functional layer; 4121. wire layer; 4122. power layer; 42. components; 42a. first components; 4 2b, second component; 42c, third component; 421, first electronic device; 422, second electronic device; 43, structural member; 43a, first structural member; 43b, second structural member; 43c, third structural member; 43d, fourth structural member; 43e, fifth structural member; 43f, sixth structural member; 431, inner core; 4311, solder joint; 432, insulating layer; 44, fastener; 44a, first fastener; 44b, second fastener; 50, camera decorative cover; 60, battery; 100, via; 200, opening; 200a, first opening; 200b, second opening; 200c, third opening; 300, through hole; 300a, first through hole; 300b, second through hole; 400, screw hole; 400a, first screw hole; 500, gap; 600, groove. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solution and advantages of the application more clear, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0071] In the description of the present application, it should be clarified that the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application, and do not mean that the devices or elements referred to must have a specific direction or position, and therefore cannot be understood as limiting the present application. The "quantity" mentioned above cannot be understood as limiting the present application.

[0072] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0073] The embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet computer, a personal digital assistant (PDA), a monitor, a camera, a notebook computer, a wearable device, etc. For the convenience of description, the following examples are all taken as an example of the electronic device being a mobile phone.

[0074] See also Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the overall structure of the electronic device 01 provided in the embodiment of the present application. Figure 2 For the above Figure 1 Exploded diagram of the structure of the electronic device 01. As can be seen from the above, in this embodiment, the electronic device 01 is a mobile phone, and the electronic device 01 can be in an approximately rectangular plate-shaped structure. The electronic device 01 can include a display module 10, a housing 20, a camera module 30, a camera decorative cover 50, a battery 60 and a circuit board 41.

[0075] Understandably, Figure 1 and Figure 2Only some components of the electronic device 01 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 restrictions.

[0076] The above-mentioned display module 10 is used to display images, videos, etc. The display module 10 may include a transparent cover plate 11 and a display screen 12 (English name: panel 1, also called a display panel), and the transparent cover plate 11 and the display screen 12 are stacked. The material of the transparent cover plate 11 includes but is not limited to glass. For example, the transparent cover plate 11 can adopt an ordinary transparent cover plate to protect the display screen to avoid damage to the display screen due to external force, and it can play a dust-proof role. Alternatively, the transparent cover plate 11 can also adopt a transparent cover plate with a touch function, so that the electronic device 01 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the transparent cover plate 11.

[0077] In addition, the display screen 12 may be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (LED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0078] The housing 20 is used to protect the electronic components inside the electronic device 01. The housing 20 may include a battery cover 21 and a frame 22. The battery cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and is stacked with the light-transmitting cover plate 11 and the display screen 12. The frame 22 is located between the light-transmitting cover plate 11 and the battery cover 21. The battery cover 21 is fixed to the frame 22. For example, the battery cover 21 may be fixed to the frame 22 by bonding, threading, welding, snapping, etc. The light-transmitting cover plate 11 may be fixed to the frame 22 by gluing, so that the light-transmitting cover plate 11, the battery cover 21, and the frame 22 form a receiving cavity inside the electronic device 01, and the display screen 12, the camera module 30, the battery 60, and the circuit board 41 are all arranged in the receiving cavity.

[0079] The camera module 30 is used to capture video or images and can achieve auto focus (AF, AutoFocus), so it can be applied to a variety of shooting scenes. Figure 1 As shown, the camera module 30 is arranged near the edge of one side of the battery cover 21. Alternatively, the camera module 30 may be located at the middle position of the upper part of the battery cover 21 (not shown in the figure). Therefore, the specific position of the camera module 30 is not particularly limited in this application.

[0080] The camera decorative cover 50 is used to prevent foreign objects such as dust from outside from entering the electronic device 01 or the camera module 30, and to prevent the camera module 30 from being scratched or hit by external objects.

[0081] The circuit board 41 is used to set the components 42 of the electronic device 10 and realize the electrical connection between the components 42. Figure 3 As shown, Figure 3 for Figure 2 The components 42 are arranged on the circuit board 41 in a front view (along the negative direction of the Z axis). The components 42 may be active devices (such as a central processing unit (CPU), a graphics control chip (GPU), a low power double data rate memory (LPDDR), a universal storage (UFS), etc.), or passive devices (such as resistors, capacitors, inductors, filters, etc.).

[0082] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the circuit board 41 is defined as the X-axis direction, the length direction of the circuit board 41 is defined as the Y-axis direction, and the thickness direction of the circuit board 41 is defined as the Z-axis direction. Among them, the thickness direction of the circuit board 41 is the thickness direction of the electronic device 01, the length direction of the circuit board 41 can be the length direction of the electronic device 01, and the width direction of the circuit board 41 is the width direction of the electronic device 01.

[0083] Please continue to see Figure 3 , and combined with Figure 4 As shown, Figure 4 for Figure 3 Schematic diagram of the cross section at AA (parallel to the XZ plane). The above-mentioned circuit board 41 may include a substrate 411 and a plurality of metal functional layers 412, and the plurality of metal functional layers 412 may include a wire layer 4121 and a power layer 4122. Among them, the substrate 411 has a first surface 401, the wire layer 4121 and the components 42 are both arranged on the first surface 401, and the components 42 and the wire layer 4121 are electrically connected, and the wire layer 4121 is used to transmit current and signals between the components 42. The power layer 4122 is arranged in the substrate 411 and is electrically connected to the above-mentioned battery 60. The active devices in the components 42 are electrically connected to the power layer 4122 through the corresponding vias 100 on the substrate 411, and the power layer 4122 is used to provide a stable power supply for the active devices.

[0084] It can be understood that the metal functional layer 412 can cover the entire cross-section of the substrate 411 parallel to the XY plane (for example, the power layer 4122), or can cover a portion of the cross-section of the substrate 411 parallel to the XY plane. Within the cross-section of the substrate 411 parallel to the XY plane, the metal functional layer 412 can also be a mesh structure (for example, the wire layer 4121).

[0085] As the electronic device 01 develops towards miniaturization and thinness, the area and thickness of the circuit board 41 in the electronic device 01 are getting smaller and smaller, which causes the area and thickness of various metal functional layers 412 on the circuit board 41 to also become smaller and smaller, thereby increasing the impedance of each metal functional layer 412.

[0086] In order to solve the above technical problems, the present application embodiment provides a circuit board assembly 40, see Figure 5 , Figure 6 As shown, Figure 5 A front view (along the negative direction of the Z axis) of a circuit board assembly 40 provided in an embodiment of the present application is shown in FIG. Figure 6 for Figure 5 Schematic diagram of the cross section at BB (parallel to the XZ plane).

[0087] The circuit board assembly 40 includes a structural member 43, the circuit board 41 and the components 42. The circuit board 41 includes a substrate 411 and a plurality of metal functional layers 412, and the plurality of metal functional layers 412 may include a wire layer 4121 and a power layer 4122. The substrate 411 has a first surface 401, and the wire layer 4121 and the components 42 are both arranged on the first surface 401, and the components 42 and the wire layer 4121 are electrically connected. The power layer 4122 is arranged in the substrate 411, and the active devices in the components 42 are electrically connected to the power layer 4122 through the corresponding vias 100 on the substrate 411.

[0088] The first surface 401 includes a first area 401a and a second area 401b, and the components 42 are located in the first area 401a. The structural member 43 is located in the second area 401b ( Figure 5 The dotted line box area, and the area on the first surface 401 except the second area 401b belongs to the first area 401a), the structural member 43 includes an inner core 431 and an insulating layer 432, and the inner core 431 is electrically connected to one of the metal functional layers 412 of the circuit board 41 (for example Figure 6 The inner core 431 is electrically connected to the power layer 4122 through corresponding vias 100 on the substrate 411 , and the insulating layer 432 wraps the inner core 431 .

[0089] It should be noted that the above-mentioned structural member 43 may be provided in one or more forms. When there are multiple structural members 43, the multiple structural members 43 may be electrically connected to the same metal functional layer 412, or the multiple structural members 43 may be electrically connected to different metal functional layers 412 respectively.

[0090] Correspondingly, one or more second regions 401b may be provided, and one or more structural members 43 may be provided in one second region 401b, which is not particularly limited in the present application.

[0091] See also Figure 7 As shown, Figure 7 A cross-sectional view of a structural member 43 provided in an embodiment of the present application. Figure 7 In the embodiment, one side surface of the inner core 431 can be completely exposed. During installation, the exposed surface is attached to the circuit board 41, and the inner core 431 is electrically connected to the corresponding metal functional layer 412 through the exposed surface, and the remaining surface of the inner core 431 is covered by the insulating layer 432.

[0092] Alternatively, see Figure 8 As shown, Figure 8 A cross-sectional view of another structural member 43 provided in an embodiment of the present application. Figure 8In the embodiment, a raised welding spot 4311 may be provided on the surface of the inner core 431 facing the substrate 411, and the insulating layer 432 completely wraps the inner core 431 other than the welding spot 4311. During installation, the inner core 431 is electrically connected to the corresponding metal functional layer 412 through the welding spot 4311. Of course, the inner core 431 may also be electrically connected to the corresponding metal functional layer 412 in other ways, which will not be described in detail here.

[0093] The material of the inner core 431 can be metal or non-metal with good conductivity such as copper, aluminum, silver, graphite, etc.

[0094] The insulating layer 432 may be formed by one-time injection molding on the outer side of the inner core 431 , or may be an insulating film attached to the outer surface of the inner core 431 , and the present application does not impose any special limitation on this.

[0095] The material of the insulating layer 432 can be organic polymer materials such as EMC (Epoxy Molding Compound), PI (Polyimide), PTFE (Polytetrafluoroethylene), etc.

[0096] In this way, by arranging a structural component 43 on the second area 401b of the first surface 401 of the circuit board 41, and the inner core 431 of the structural component 43 is electrically connected to the circuit board 41, wherein the inner core 431 of the structural component 43 can be electrically connected to any metal functional layer 412 (for example, the power layer 4122, the wire layer 4121, etc.) on the circuit board 41, which is equivalent to making the inner core 431 of the structural component 43 a part of the metal functional layer 412 connected thereto, and utilizing the inner core 431 of the structural component 43 to increase the area and thickness of the corresponding metal functional layer 412, thereby, under the premise that the volume of the circuit board 41 remains unchanged, the impedance of the metal functional layer 412 on the circuit board 41 can be reduced to a certain extent, thereby improving the electrical performance indicators of the metal functional layer 412.

[0097] Furthermore, the insulating layer 432 wrapped around the inner core 431 can prevent the inner core 431 from directly contacting the surrounding components 42 and causing a short circuit. When the insulating layer 432 is made of EMC insulating material, the insulating layer 432 made of EMC insulating material also has good mechanical strength, which can play a certain supporting role for the entire structural member 43, thereby improving the impact resistance of the structural member 43.

[0098] For ease of understanding, the following description is based on an example in which one side surface of the inner core 431 is completely exposed and attached to the circuit board 41 , and the rest of the surface of the inner core 431 is covered by the insulating layer 432 .

[0099] In some embodiments, see Fig. 9 and Fig.10 As shown, Fig. 9 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.10 for Fig. 9 Schematic diagram of the cross section (parallel to the XZ plane) at CC in the figure. There are multiple components 42, and the second area 401b can be located between two adjacent components 42. This arrangement is equivalent to arranging the structural member 43 in the blank area between adjacent components 42 on the substrate 411, thereby optimizing the impedance of the metal functional layer 412 through the structural member 43, and at the same time, improving the surface utilization rate of the substrate 411, which is conducive to the miniaturization of the circuit board 41.

[0100] For example, see Fig. 9 , Fig.10 As shown. There are three components 42, namely, a first component 42a, a second component 42b and a third component 42c, wherein the first component 42a is a capacitor, the second component 42b is a GPU, and the third component 42c is a filter. In the illustrated position, the first component 42a, the second component 42b and the third component 42c are sequentially spaced from left to right along the width direction of the circuit board 41, and are electrically connected to the wire layer 4121 respectively. Since the CPU is an active device, the second component 42b is also electrically connected to the power layer 4122 through the corresponding via 100 on the substrate 411.

[0101] Two structural members 43 are arranged on the circuit board 41, namely, a first structural member 43a and a second structural member 43b. The blank area between the first component 42a and the second component 42b is the left second area 4011, the first structural member 43a is arranged in the left second area 4011, the blank area between the second component 42b and the third component 42c is the right second area 4012, the second structural member 43b is arranged in the right second area 4012, and the first structural member 43a and the second structural member 43b are respectively connected to the power layer 4122 through corresponding vias 100 on the substrate 411. Thus, two structural members 43 are arranged in the blank areas between the three spaced components 42, and the two structural members 43 are electrically connected to the power layer 4122, which can not only reduce the impedance of the power layer 4122, but also improve the utilization rate of the first surface 401 of the substrate 411.

[0102] In some embodiments, see Fig.11 , Fig.12 As shown, Fig.11 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.12 for Fig.11Schematic diagram of the cross section at EE in FIG. 4 (parallel to the XZ plane). The second region 401b may also be located at the edge of the circuit board 41. In this way, it is equivalent to setting the structural member 43 at the blank area at the edge of the circuit board 41 where no components 42 are set, thereby using the structural member 43 to reduce the impedance of the metal functional layer 412 in the circuit board 41, and at the same time, it can also improve the surface utilization rate of the circuit board 41, which is conducive to the miniaturization of the circuit board 41.

[0103] For example, see Fig.11 and Fig.12 As shown. The substrate 411 is rectangular, and the first area 401a where the components 42 are arranged occupies the middle position of the first surface 401 on the substrate 411. A blank area extending around the first area 401a is formed at the edge of the first surface 401, and the blank area can be used as the second area 401b. An annular structure 43 is arranged on the rectangular annular second area 401b, and the structure 43 extends around the first area 401a. The structure 43 is connected to the power layer 4122 through the corresponding via 100 on the substrate 411, so that the area of ​​the first surface 401 is maximized without occupying the space for arranging the components 42, and the impedance of the power layer 4122 can be reduced.

[0104] For another example, see Fig.13 As shown, Fig.13 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application. The substrate 411 is rectangular, and the first area 401a where the components 42 are arranged occupies the middle position of the first surface 401 on the substrate 411. A blank area extending around the first area 401a is formed at the edge of the first surface 401, and the blank area can be used as the second area 401b. The second area 401b includes a left second area 4011 and a right second area 4012 parallel to the Y-axis direction, and an upper second area 4013 and a lower second area 4014 parallel to the X-axis direction.

[0105] There are four structural members 43 on the circuit board 41, namely, a first structural member 43a, a second structural member 43b, a third structural member 43c and a fourth structural member 43d. Fig.13 , and combined with Fig.14 As shown, Fig.14 for Fig.13 The first structure member 43a and the third structure member 43c are respectively disposed in the left second region 4011 and the right second region 4012, and the first structure member 43a and the third structure member 43c are both electrically connected to the wire layer 4121, thereby reducing the impedance of the wire layer 4121.

[0106] Please continue to see Fig.13 , and combined with Fig.15 As shown, Fig.15 for Fig.13 The second structural member 43b and the fourth structural member 43d are respectively arranged in the upper second region 4013 and the lower second region 4014, and the second structural member 43b and the fourth structural member 43d are respectively electrically connected to the power layer 4122 through corresponding vias 100, so as to reduce the impedance of the power layer 4122.

[0107] On the basis of the above, the structural strength of the portion corresponding to the second area 401b on the circuit board 41 is less than the structural strength of the portion corresponding to the first area 401a. Thus, the structural member 43 can be used to strengthen the relatively weak portion of the circuit board 41, that is, the structural member 43 has the dual functions of "reducing impedance" and "structural reinforcement" for the circuit board 41.

[0108] For example, see Fig.16 , Fig.17 As shown, Fig.16 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.17 for Fig.16 Schematic diagram of the cross section (parallel to the XZ plane) at JJ in the figure. Among them, there is one first area 401a on the substrate 411, and two second areas 401b are provided. The two second areas 401b are respectively the left second area 4011 and the right second area 4012. In the illustrated orientation, the left second area 4011 and the right second area 4012 are respectively located on the left and right sides of the first area 401a.

[0109] The portion of the substrate 411 corresponding to the first region 401a is the first portion 411a, and the thickness of the first portion 411a is D1. The portion of the substrate 411 corresponding to the left second region 4011 is the second portion 411b, and the thickness of the second portion 411b is D2. The portion of the substrate 411 corresponding to the right second region 4012 is the third portion 411c, and the thickness of the third portion 411c is D3.

[0110] from Fig.17It can be seen that D3<D2<D1. Since the density of the substrate 411 is uniform everywhere, the strength of the second part 411b and the third part 411c are both less than the strength of the first part 411a. At this time, two structural members 43 are arranged on the substrate 411, and the two structural members 43 are respectively the first structural member 43a and the second structural member 43b. Among them, the first structural member 43a is arranged in the second area 4011 on the left to structurally reinforce the second part 411b of the substrate 411. The second structural member 43b is arranged in the second area 4012 on the right to structurally reinforce the third part 411c of the substrate 411. And the inner core 431 of the first structural member 43a and the inner core 431 of the second structural member 43b are electrically connected to the power layer 4122 through the corresponding vias 100, so that the impedance of the power layer 4122 can also be reduced.

[0111] In some embodiments, see Fig.18 and Fig.19 As shown, Fig.18 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.19 for Fig.18 Schematic diagram of the cross section at KK (parallel to the XZ plane).

[0112] Among them, there are three components 42 arranged on the circuit board 41, namely, the first component 42a, the second component 42b and the third component 42c, and the first component 42a, the second component 42b and the third component 42c are electrically connected to the wire layer 4121 respectively. Among them, the first component 42a may include a first electronic device 421 and a second electronic device 422, the first electronic device 421 is arranged on the first surface 401, the second electronic device 422 is arranged on the surface of the first electronic device 421 away from the first surface 401, the first electronic device 421 is electrically connected to the circuit board 41, and the second electronic device 422 is electrically connected to the first electronic device 421. The second component 42b is a capacitor, and the third component 42c is a general-purpose memory.

[0113] When the second electronic device 422 is connected to the first electronic device 421, a gap 500 is formed between the second electronic device 422 and the substrate 411 around the first electronic device 421. The height of the gap 500 is relatively small. Since the component 42 is generally a standard part, its height is much greater than the height of the gap 500. For example, the first electronic device 421 is a board-to-board connector (BTB), the second electronic device 422 is a flexible printed circuit (FPC), and the component is a 0603 chip capacitor. A board-to-board connector is also provided at one end of the flexible circuit board, and the other end of the flexible circuit board is used to connect other electronic components (such as a camera module, a microphone, a receiver, etc.). When the board-to-board connector on the flexible circuit board is docked with the board-to-board connector on the substrate 411, the height of the gap 500 between the flexible circuit board and the substrate 411 is generally around 0.35 mm, while the thickness of the 0603 chip capacitor is generally 0.8 mm, which is much larger than 0.35 mm. This results in the 0603 chip capacitor (component 42) being unable to be arranged in the gap 500, thereby causing a waste of the area of ​​the first surface 401.

[0114] The structural member 43 is generally a non-standard member, so the height of the structural member 43 can be set arbitrarily according to the requirements during manufacturing. Therefore, the structural member 43 can be set in the gap 500, that is, the vertical projection of the second electronic device 422 on the first surface 401 can cover at least part of the vertical projection of the structural member 43 on the first surface 401. In this way, the structural member 43 will not only not occupy other areas on the substrate 411 where the components 42 can be normally arranged, but also effectively utilize the areas on the first surface 401 where the components 42 cannot be normally arranged, thereby improving the surface utilization rate of the substrate 411, which is conducive to the miniaturization of the circuit board 41.

[0115] For example, please see Fig.18 , Fig.19 As shown, the first electronic device 421 is a female socket of a board-to-board connector, the first electronic device 421 is connected to the wire layer 4121, and the second electronic device 422 is a flexible circuit board. One end of the flexible circuit board is provided with a male socket of a board-to-board connector, and the electrical connection between the flexible circuit board and the circuit board 41 can be achieved by docking the male socket and the female socket. After the male socket and the female socket are docked, a gap 500 is formed between the flexible circuit board (the second electronic device 422) and the substrate 411. Fig.19In the orientation shown, the second structural member 43b and the first structural member 43a are arranged in the gap 500 and are respectively located on the left and right sides of the first electronic device 421. The vertical projections of the first structural member 43a and the second structural member 43b on the first surface 401 are completely covered by the vertical projection of the flexible circuit board (second electronic device 422) on the first surface 401, so that the first surface 401 of the substrate 411 can be fully utilized, which is conducive to the miniaturization of the circuit board 41.

[0116] With the development of packaging technology, after the male and female sockets of the connector are connected, the height d of the gap 500 between the flexible circuit board (the second electronic device 422) and the substrate 411 is gradually controlled to be less than or equal to 0.25 mm. Therefore, in order to ensure that the structural member 43 can be smoothly arranged in the gap 500, please continue to refer to Fig.19 As shown, in the thickness direction of the circuit board 41, the height H of the first structural member 43a also needs to be less than or equal to 0.25 mm, so as to avoid the first structural member 43a affecting the docking of the connector. For example, the height H of the first structural member 43a can be 0.25 mm, 0.2 mm, 0.15 mm, etc. At the same time, the heights of the remaining structural members 43 in the gap 500 also need to meet the above requirements, which will not be repeated here.

[0117] For further information, please see Fig.19 As shown. In the thickness direction of the circuit board 41, the height of the inner core 431 of the first structural member 43a is h, wherein 0.15mm≤h≤0.2mm. Thus, when the first structural member 43a is located in the gap 500 formed between the flexible circuit board (the second electronic device 422) and the substrate 411 around the female seat (the first electronic device 421), the first structural member 43a can obtain a higher thickness gain of the inner core 431. The greater the thickness of the inner core 431 in a limited space, the more conducive it is to reduce the impedance of the metal functional layer 412 electrically connected thereto. For example, the height h of the inner core 431 of the first structural member 43a can be 0.2mm, 0.17mm, 0.15mm, etc. And when the height of the inner core 431 of the first structural member 43a takes the maximum value of 0.2mm, the maximum thickness of the insulating layer 432 of the first structural member 43a is 0.05mm. At the same time, the height of the inner core 431 of the remaining structural members 43 in the gap 500 also needs to meet the above requirements, which will not be repeated here.

[0118] In some embodiments, see Fig.18 As shown. A plurality of structural members 43 may be provided, and the plurality of structural members 43 are arranged at intervals around the first electronic device 421. In this arrangement, the gap 500 formed between the second electronic device 422 and the substrate 411 around the first electronic device 421 can be fully utilized, and the plurality of structural members 43 can further reduce the impedance of the metal functional layer 412 in the circuit board 41.

[0119] Among them, the multiple structural members 43 can be electrically connected to the same metal functional layer 412, or can be electrically connected to different metal functional layers 412 respectively, and this application does not make any special limitation on this.

[0120] For example, see Fig.18 , Fig.19 As shown, there are four structural members 43, which are respectively a first structural member 43a, a second structural member 43b, a third structural member 43c and a fourth structural member 43d. In the illustrated orientation, the first structural member 43a, the fourth structural member 43d, the second structural member 43b and the third structural member 43c are sequentially distributed around the first electronic device 421 in a clockwise direction, and are electrically connected to the power layer 4122 through corresponding vias 100. Moreover, the vertical projections of the first structural member 43a, the second structural member 43b, the third structural member 43c and the fourth structural member 43d on the first surface 401 are completely covered by the vertical projection of the second electronic device 422 on the first surface 401, thereby improving the utilization rate of the first surface 401 of the substrate 411 and further reducing the impedance of the power layer 4122.

[0121] See also Fig. 20 , Fig.21 and Fig. 22 As shown, Fig. 20 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.21 for Fig. 20 A partial enlarged view of the M in the middle. Fig. 22 for Fig.21 Schematic diagram of the cross section (parallel to the YZ plane) at NN in the figure. In some cases, a plurality of openings 200 penetrating along the thickness direction need to be provided on the circuit board 41 to avoid other electronic components (such as camera modules), which will result in the formation of a narrow strip portion 411d between two adjacent openings 200. Since the narrow strip portion 411d is relatively slender, the components 42 cannot be arranged normally here, and the structural strength of the narrow strip portion 411d is relatively low, and it is very easy to break when the circuit board 41 is impacted, thereby causing the metal functional layer 412 on the substrate 411 to break, resulting in failure of the circuit board 41.

[0122] Based on this, the embodiment of the present application sets the second area 401b between two adjacent openings 200. That is to say, the structural member 43 is set on the narrow strip portion 411d, so that the structural member 43 can reduce the impedance of the metal functional layer 412 in the circuit board 41 while enhancing the structural strength of the narrow strip portion 411d, thereby reducing the risk of the narrow strip portion 411d breaking when the circuit board 41 is impacted or vibrated, thereby ensuring the reliability and stability of the circuit board 41.

[0123] For example, see Fig. 20 , Fig.21 As shown, Fig. 20 The circuit board assembly 40 is equivalent to the circuit board assembly 40 in the aforementioned Fig.18 Three openings 200 are provided on the substrate 411 of the circuit board assembly 40, namely the first opening 200a, the second opening 200b and the third opening 200c. In the illustrated orientation, the first opening 200a, the second opening 200b and the third opening 200c are sequentially spaced from top to bottom, a first narrow strip portion 4111 is formed between the first opening 200a and the second opening 200b, and a second narrow strip portion 4112 is formed between the second opening 200b and the third opening 200c. The area of ​​the first surface 401 of the substrate 411 on the first narrow strip portion 4111 is the upper second area 4013, and the area of ​​the first surface 401 of the substrate 411 on the second narrow strip portion 4112 is the lower second area 4014.

[0124] Please refer to Fig.21 , Fig. 22 As shown, two structural members 43 are further provided on the substrate 411, namely the fifth structural member 43e and the sixth structural member 43f. The fifth structural member 43e is provided in the upper second region 4013, so as to provide structural reinforcement for the first narrow strip portion 4111. The sixth structural member 43f is provided in the lower second region 4014, so as to provide structural reinforcement for the second narrow strip portion 4112. Moreover, the fifth structural member 43e and the sixth structural member 43f are respectively electrically connected to the power supply layer 4122 in the substrate 411 through the corresponding vias 100 on the substrate 411, so as to further reduce the impedance of the power supply layer 4122.

[0125] At the same time, in the X-axis direction, the length of the fifth structural member 43e is greater than the length of the upper second region 4013, and both ends of the fifth structural member 43e extend to the first region 401a. At this time, it is equivalent to that the fifth structural member 43e spans the entire first narrow strip portion 4111. When the circuit board 41 is impacted or vibrated, the fifth structural member 43e can not only reduce the risk of fracture in the middle of the first narrow strip portion 4111, but also reduce the risk of fracture at the connection between the two ends of the first narrow strip portion 4111 and the portion corresponding to the first region 401a on the substrate 411.

[0126] Similarly, in the X-axis direction, the length of the sixth structure member 43f is greater than the length of the lower second region 4014, and both ends of the sixth structure member 43f extend to the first region 401a, which will not be described in detail herein.

[0127] In some embodiments, see Fig.23 , Fig.24 As shown, Fig.23 A front view (along the negative direction of the Z axis) of another circuit board assembly 40 provided in an embodiment of the present application is shown. Fig.24 for Fig.23 The circuit board assembly 40 further includes a fastener 44, and the structural member 43 is fixed to the circuit board 41 through the fastener 44. Thus, the fastener 44 can not only fix the structural member 43 more firmly, but also simplify the assembly process between the structural member 43 and the circuit board 41.

[0128] For example, see Fig.23 , Fig.24 , and combined with Fig.25 As shown, Fig.25 for Fig.23 Schematic diagram of the cross section at QQ (parallel to the XZ plane). Fig.23 The circuit board assembly 40 is equivalent to the circuit board assembly 40 in the above Fig. 20 Two first fasteners 44a (both are screws) and two second fasteners 44b (both are screws) are added to the circuit board assembly 40. The fifth structural member 43e has first through holes 300a at both ends, and the substrate 411 has first screw holes 400a corresponding to the first through holes 300a. During assembly, the fifth structural member 43e can be fixed by passing one end of the first fastener 44a through the first through hole 300a and then tightening it in the first screw hole 400a.

[0129] Similarly, the second through holes 300b are respectively formed at both ends of the sixth structural member 43f, and the substrate 411 is provided with second screw holes ( Fig.25 During assembly, one end of the second fastener 44b is inserted into the second through hole 300b and then screwed into the second screw hole (omitted in this schematic diagram), thereby completing the fixing of the sixth structural member 43f.

[0130] The above embodiments illustrate the specific structure of the structural component 43, the location and quantity of the structural component 43 on the circuit board 41, and the manufacturing or installation process of the structural component 43 will be illustrated below (for ease of understanding, the process flow diagram of each step provides a front view of the semi-finished product / finished product obtained after the step and a cross-sectional view of the corresponding position).

[0131] The following is a description of the manufacturing process of a structural member 43 (taking as an example a case where one side surface of the inner core 431 of the structural member 43 is completely exposed, the remaining surface of the inner core 431 is covered by the insulating layer 432, the inner core 431 is copper, and the insulating layer 432 is one-time injection molding):

[0132] The first step, such as Fig.26 As shown, Fig.26A schematic diagram of a manufacturing process of a structural member 43 Figure 1 . Processing to obtain copper sheets of suitable thickness and size.

[0133] The second step is, Fig. 27 As shown, Fig. 27 A schematic diagram of a manufacturing process of a structural member 43 Figure 2 According to the size of the required structural member 43, a plurality of grooves 600 are etched on the surface of the copper sheet, and the plurality of grooves 600 divide the copper sheet into a plurality of inner cores 431 ( Fig. 27 The copper sheet is divided into 12 inner cores, and the 12 inner cores 431 are arranged in a rectangular array of three rows and four columns), and it is necessary to ensure that the bottom of the copper sheet is still connected.

[0134] The third step is Fig.28 As shown, Fig.28 A schematic diagram of a manufacturing process of a structural member 43 Figure 3 The etched copper sheet is injected with insulating material, so that the side and top of the copper sheet are covered with insulating material, and the groove 600 is filled with insulating material.

[0135] The fourth step is Fig.29 As shown, Fig.29 A schematic diagram of a manufacturing process of a structural member 43 Figure 4 The bottom of the copper sheet after injection molding is cut and thinned so that the bottom surface of each inner core 431 is flush with the bottom surface of the groove 600 .

[0136] Step 5: Fig.30 As shown, Fig.30 A schematic diagram of a manufacturing process of a structural member 43 Figure 5 The copper sheet after the bottom thinning is cut along the groove 600 to obtain a plurality of finished structural parts 43 .

[0137] The following is a description of the manufacturing process flow of another structural member 43 (taking as an example a structural member 43 having through holes 300 at both ends and fixed to a circuit board 41 by screws (fasteners 44). One side surface of the inner core 431 of the structural member 43 is completely exposed, and the rest of the surface of the inner core 431 is covered by an insulating layer 432, and the inner core 431 is copper and the insulating layer 432 is one-time injection molded):

[0138] The first step, such as Fig.31 As shown, Fig.31 Schematic diagram of the manufacturing process of another structural member 43 Figure 1 A copper sheet of suitable thickness and size is obtained by processing, and then a plurality of grooves 600 are etched on the surface of the copper sheet according to the size of the required structural member 43. The plurality of grooves 600 divide the copper sheet into a plurality of inner cores 431 ( Fig.31The copper sheet is divided into four inner cores, and the four inner cores 431 are arranged in parallel from left to right), and it is necessary to ensure that the bottom of the copper sheet is still connected.

[0139] The second step is, Fig.32 As shown, Fig.32 Schematic diagram of the manufacturing process of another structural member 43 Figure 2 Drill a hole in the etched copper sheet for the first time, and make sure that the hole diameter is larger than the outer diameter of the screw.

[0140] The third step is Fig.33 As shown, Fig.33 Schematic diagram of the manufacturing process of another structural member 43 Figure 3 The copper sheet after the first drilling is injected with insulating material, so that the side and top of the copper sheet are covered with insulating material, and the groove 600 and the drilled hole are filled with insulating material.

[0141] The fourth step is Fig.34 As shown, Fig.34 Schematic diagram of the manufacturing process of another structural member 43 Figure 4 The copper sheet after injection molding is drilled for the second time, and the diameter of the second drilling hole is equal to the diameter of the through hole 300 or the outer diameter of the screw.

[0142] Step 5: Fig.35 As shown, Fig.35 Schematic diagram of the manufacturing process of another structural member 43 Figure 5 The bottom of the copper sheet after the second drilling is cut and thinned so that the bottom surface of each inner core 431 is flush with the bottom surface of the groove 600 .

[0143] Step 6: Fig.36 As shown, Fig.36 Schematic diagram of the manufacturing process of another structural member 43 Figure 6 The copper sheet after the bottom thinning is cut along the groove 600 to obtain a plurality of finished structural parts 43 .

[0144] The following is a description of the manufacturing process and installation process of another structural member 43 (taking as an example a case where one side surface of the inner core 431 of the structural member 43 is completely exposed, the remaining surface of the inner core 431 is covered by the insulating layer 432, and the inner core 431 is a copper sheet and the insulating layer 432 is a pasted insulating film):

[0145] The first step, such as Fig.37 As shown, Fig.37 Schematic diagram of another manufacturing process and installation process of a structural member 43 Figure 1 The copper sheet and various components 42 are surface mounted on the circuit board 41 using the SMT (Surface Mount Technology) process.

[0146] The second step is, Fig.38 As shown, Fig.38 Schematic diagram of another manufacturing process and installation process of a structural member 43 Figure 2 . Cut out the insulating film of appropriate size according to the size of the copper sheet, and attach the insulating film to the copper sheet.

[0147] The third step is Fig.39 As shown, Fig.39 Schematic diagram of another manufacturing process and installation process of a structural member 43 Figure 3 The insulating film is pressed together with the copper sheet attached to the circuit board 41 by a hot pressing process to ensure that the insulating film tightly covers the outer surface of the copper sheet. The laminated insulating film is then heated to a curing temperature and maintained for a certain period of time to completely cure the insulating film, thereby obtaining a finished structural component 43 and completing the installation.

[0148] The following is a description of the manufacturing process and installation process of another structural member 43 (taking as an example a structural member 43 having through holes 300 at both ends and fixed to a circuit board 41 by screws (fasteners 44). One side surface of the inner core 431 of the structural member 43 is completely exposed, and the rest of the surface of the inner core 431 is covered by an insulating layer 432, and the inner core 431 is a copper sheet and the insulating layer 432 is a pasted insulating film):

[0149] The first step, such as Fig.40 As shown, Fig.40 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 1 Screw holes 400 are formed at both ends of the narrow strip portion 411d between the two openings 200 on the circuit board 41, and the hole diameter of the screw hole 400 must be equal to the outer diameter of the screw.

[0150] The second step is, Fig.41 As shown, Fig.41 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 2 Drill holes at both ends of the copper sheet for the first time, and ensure that the hole diameter of the first hole is larger than the outer diameter of the screw. Then, the copper sheet after the first drilling and various components are surface mounted on the circuit board 41 using the SMT process.

[0151] The third step is Fig.42 As shown, Fig.42 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 3 . Cut out the insulating film of appropriate size according to the size of the copper sheet, and attach the insulating film to the copper sheet.

[0152] The fourth step is Fig.43 As shown, Fig.43 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 4The insulating film and the copper sheet that has been surface-mounted on the circuit board 41 are pressed together using a hot pressing process to ensure that the insulating film tightly covers the outer surface of the copper sheet and the inner wall of the first drilled hole. The laminated insulating film is then heated to a curing temperature and maintained for a certain period of time to completely cure the insulating film.

[0153] The fourth step is Fig.44 As shown, Fig.44 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 5 At the first drilling hole on the copper sheet, the cured insulating film is drilled for a second time to obtain a finished structural component 43. It is necessary to ensure that the diameter of the second drilling hole is equal to the diameter of the through hole 300 or the outer diameter of the screw, that is, to ensure that the insulating film can completely separate the screw from the inner wall of the copper sheet after the first drilling hole, so as to avoid short circuit caused by contact between the screw and the copper sheet.

[0154] Step 5: Fig.45 As shown, Fig.45 A schematic diagram of the manufacturing process and installation process of another structural member 43 Figure 6 The structural member 43 is fixed to the circuit board 41 by screws, and the installation is completed.

[0155] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0156] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board having a first surface, wherein the first surface includes a first area and a second area; Components, the components are located in the first area and are electrically connected to the circuit board; A structural component is located in the second area, the structural component comprises an inner core and an insulating layer, the inner core is electrically connected to the circuit board, and the insulating layer wraps the inner core.

2. The circuit board assembly according to claim 1, characterized in that: The second region is located between two adjacent components.

3. The circuit board assembly according to claim 1, characterized in that: The second area is located at an edge of the circuit board.

4. The circuit board assembly according to claim 1, characterized in that: The structural strength of the portion of the circuit board corresponding to the second area is smaller than the structural strength of the portion of the circuit board corresponding to the first area.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The components include a first electronic device and a second electronic device, the first electronic device is arranged on the first surface, the second electronic device is arranged on a surface of the first electronic device away from the first surface, the first electronic device is electrically connected to the circuit board, and the second electronic device is electrically connected to the first electronic device; The vertical projection of the second electronic device on the first surface covers at least a portion of the vertical projection of the structural component on the first surface.

6. The circuit board assembly according to claim 5, characterized in that: The first electronic device is a connector, and the second electronic device is a flexible circuit board. The other end of the flexible circuit board is used to connect electronic components.

7. The circuit board assembly according to claim 5, characterized in that: A plurality of the structural members are provided, and the plurality of the structural members are arranged at intervals around the first electronic component.

8. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The circuit board is provided with a plurality of openings, wherein the openings penetrate the circuit board along the thickness direction of the circuit board, and the second area is located between two adjacent openings.

9. The circuit board assembly according to claim 8, characterized in that: The circuit board assembly further comprises a fastener, and the structural member is fixed on the circuit board by the fastener.

10. The circuit board assembly according to any one of claims 1 to 4, characterized in that: In the thickness direction of the circuit board, the height of the structural component is H, where H≤0.25 mm.

11. The circuit board assembly according to any one of claims 1 to 4, characterized in that: In the thickness direction of the circuit board, the height of the inner core is h, wherein 0.15 mm ≤ h ≤ 0.2 mm.

12. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The material of the inner core is copper.

13. The circuit board assembly according to any one of claims 1 to 4, characterized in that: The insulating layer is made of EMC insulating material.

14. An electronic device, characterized in that: include: A housing, wherein a receiving cavity is formed inside the housing; The circuit board assembly is the circuit board assembly according to any one of claims 1 to 13, and the circuit board assembly is arranged in the accommodating cavity.

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