Electronic equipment heat dissipation plate device

Abstract

The utility model discloses an electronic equipment heat dissipation plate device which comprises a heat dissipation plate, a containing groove is formed in the upper surface of the heat dissipation plate, a water storage box is fixedly installed in the heat dissipation plate, a water pump and a check valve are fixedly installed on one side of the water storage box, and an annular pipe is fixedly arranged at the upper end of the water storage box. By arranging the water storage box, the water pump, the check valve, the annular pipe, the heat insulation plate and the semiconductor chilling plate, a user places a notebook computer in the placing groove in the heat dissipation plate, so that the bottom surface of the computer is attached to the surface of the placing groove, and the heat dissipation effect is improved. During heat dissipation, a water pump passes through the annular pipe, cooling liquid in the water storage box flows into the annular pipe through the check valve, the liquid passes through the annular pipe, and the annular pipe is attached to the top end of the interior of the heat dissipation plate, so that heat generated during operation of the computer can be absorbed, the interior of the containing groove is in a low-temperature state, and then the computer is cooled and dissipated.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation plates for electronic equipment, and in particular relates to a heat dissipation plate device for electronic equipment. Background Art

[0002] Electronic equipment refers to equipment composed of electronic components such as integrated circuits, transistors, and electron tubes, and which uses electronic technology including software to function. It includes electronic computers and robots controlled by electronic computers, numerical control or program control systems, etc., and electrical equipment composed of microelectronic devices. Common electronic equipment includes laptops.

[0003] When a laptop is in use, the internal cooling fan will cool the computer. If this effect is not achieved, an external heat sink will be placed at the bottom of the computer to further cool the computer and ensure its normal operation.

[0004] Most of the existing heat sinks use fans to dissipate heat from computers, but this method is relatively traditional and has poor heat dissipation effect, causing the computer to remain at a high temperature. When the heat sink is placed on a desktop for heat dissipation, it is easy to slide or fall due to collision, thereby causing damage to the heat sink and the computer. There is a lack of a fixing mechanism. Therefore, we provide an electronic device heat sink device with good heat dissipation effect and a fixing mechanism. Utility Model Content

[0005] The purpose of the utility model is to provide a heat dissipation plate device for electronic equipment to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat sink device for electronic equipment, comprising a heat sink, a placement groove is provided on the upper surface of the heat sink, a water storage box is fixedly installed inside the heat sink, a water pump and a check valve are fixedly installed on one side of the water storage box, an annular pipe is fixedly provided on the upper end of the water storage box, and the two ends of the annular pipe are respectively fixedly connected to the water pump and the check valve, an insulation board is fixedly connected inside the water storage box, a semiconductor refrigeration plate is fixedly installed on one side of the water storage box, a water outlet pipe is fixedly installed on one side of the water storage box, and a valve is fixedly installed on the outside of the water outlet pipe.

[0007] As a preferred embodiment, a support frame is fixedly mounted on the upper end of the water storage box.

[0008] As a preferred implementation, a water level alarm is fixedly mounted on one side of the water storage box.

[0009] As a preferred embodiment, a heat dissipation hole is opened on one side of the heat dissipation plate, and three drive boxes are fixedly installed inside the heat dissipation plate. A heat dissipation fan is rotatably arranged on the outside of the drive box, and a motor for driving the heat dissipation fan is fixedly installed inside the drive box.

[0010] As a preferred embodiment, the lower end of the heat sink is fixedly connected to a fixing mechanism, an air pump is fixedly installed inside the fixing mechanism, one side of the air pump is connected to a branch pipe, and the lower end of the branch pipe is fixedly connected to a fixed suction cup, the outer side of the branch pipe is fixedly connected to a fixing seat for fixing, and an air outlet is opened on one side of the fixing mechanism.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model is provided with a water storage box, a water pump, a check valve, an annular tube, a heat insulation board and a semiconductor cooling sheet. The user places the laptop computer in the placement groove on the heat dissipation board so that the bottom surface of the computer fits with the surface of the placement groove. When heat is dissipated, the water pump passes through the annular tube to let the coolant in the water storage box flow into the annular tube through the check valve. The liquid passes through the annular tube and the annular tube fits with the top of the inner part of the heat dissipation board, so as to absorb the heat generated when the computer is running, so that the placement groove is in a low temperature state, thereby cooling and dissipating the computer, and the liquid that absorbs the heat flows back to the water storage box through the annular tube and the water pump. The water storage box is provided with a heat insulation board for limiting the flow of the liquid and preventing the refluxed liquid from directly contacting and mixing with the original liquid over a large area, thereby reducing the heat dissipation rate of the liquid in the water storage box, resulting in excessively high liquid temperature and affecting the heat dissipation effect. The liquids flow through the opening on one side of the heat insulation board so that the liquid flowing out of the check valve is all liquid that has been cooled for a period of time, thereby ensuring the heat dissipation effect of the heat dissipation board, and a semiconductor cooling sheet is provided on one side of the water storage box for accelerating the cooling rate of the liquid in the water storage box.

[0013] 2. The utility model is provided with a fixing mechanism. When the heat sink is in use, the fixing mechanism at the lower end of the heat sink is placed on the desktop. At this time, the fixing suction cup is in contact with the desktop, and the air pump draws the air in the fixing suction cup through the branch pipe, so that the fixing mechanism can be fixed on the smooth horizontal desktop, thereby fixing the heat sink, thereby preventing the heat sink from sliding due to external collision or arm thrust when the user is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 For the utility model structure Figure 1 Bottom view;

[0016] Figure 3 This is a schematic diagram of the internal structure of the heat sink of the utility model;

[0017] Figure 4 This is a schematic diagram of the internal structure of the water storage box of the utility model;

[0018] Figure 5The figure is a schematic diagram of the internal structure of the fixing mechanism of the utility model.

[0019] In the figure: 1. heat sink; 2. placement slot; 3. heat dissipation hole; 4. fixing mechanism; 41. air pump; 42. branch pipe; 43. fixing seat; 5. fixing suction cup; 6. air outlet; 7. water storage box; 71. insulation board; 8. water pump; 9. check valve; 10. annular pipe; 11. support frame; 12. water outlet pipe; 13. valve; 14. water level alarm; 15. semiconductor refrigeration plate; 16. drive box; 17. cooling fan. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the embodiments.

[0021] The following examples are used to illustrate the present invention, but cannot be used to limit the scope of protection of the present invention. The conditions in the examples can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0022] See also Figure 1-4 The utility model provides a heat sink device for an electronic device, comprising a heat sink 1, a placement groove 2 is provided on the upper surface of the heat sink 1, a water storage box 7 is fixedly installed inside the heat sink 1, a water pump 8 and a check valve 9 are fixedly installed on one side of the water storage box 7, an annular pipe 10 is fixedly arranged on the upper end of the water storage box 7, and the two ends of the annular pipe 10 are respectively fixedly connected to the water pump 8 and the check valve 9, an insulation board 71 is fixedly connected inside the water storage box 7, a semiconductor refrigeration sheet 15 is fixedly installed on one side of the water storage box 7, a water outlet pipe 12 is fixedly installed on one side of the water storage box 7, and a valve 13 is fixedly installed on the outer side of the water outlet pipe 12.

[0023] By adopting the above technical solution: the user places the laptop computer in the placement groove 2 on the heat sink 1, so that the bottom surface of the computer fits with the surface of the placement groove 2. When dissipating heat, the water pump 8 passes through the annular tube 10, and the coolant in the water storage box 7 flows into the annular tube 10 through the check valve 9. The liquid passes through the annular tube 10, and the annular tube 10 fits with the top of the inner part of the heat sink 1, which can absorb the heat generated by the computer when it is running, so that the placement groove 2 is in a low temperature state, thereby cooling the computer, and the liquid that absorbs heat passes through the annular tube 10 and the water pump 8. It flows back into the water storage box 7, and a heat insulation plate 71 is provided in the water storage box 7 to limit the flow of the liquid and prevent the reflux liquid from directly contacting and mixing with the original liquid over a large area, thereby reducing the heat dissipation rate of the liquid in the water storage box 7, causing the liquid temperature to be too high, affecting the heat dissipation effect. The liquid flows through the opening on one side of the heat insulation plate 71, so that the liquid flowing out of the check valve 9 is the liquid that has been cooled for a period of time, thereby ensuring the heat dissipation effect of the heat sink 1, and a semiconductor refrigeration sheet 15 is provided on one side of the water storage box 7 to accelerate the cooling rate of the liquid in the water storage box 7.

[0024] In this embodiment, a support frame 11 is fixedly installed on the upper end of the water storage box 7; the support frame 11 is provided to support and fix the annular tube 10, making the annular tube 10 more stable. At the same time, the annular tube 10 is fitted with the inner top surface of the heat sink 1, thereby more effectively absorbing the heat in the placement groove 2.

[0025] In this embodiment, a water level alarm 14 is fixedly installed on one side of the water storage box 7; by providing the water level alarm 14, when the water storage box 7 leaks sideways and the internal liquid level is lower than a certain height, the water level alarm 14 will sound an alarm.

[0026] In this embodiment, a heat dissipation hole 3 is opened on one side of the heat dissipation plate 1, and three drive boxes 16 are fixedly installed inside the side of the heat dissipation plate 1, a heat dissipation fan 17 is rotatably arranged on the outside of the drive box 16, and a motor for driving the heat dissipation fan 17 is fixedly installed inside the drive box 16; by setting up the drive box 16 and the heat dissipation fan 17, the heat dissipation fan 17 is driven by the motor to rotate, thereby accelerating the air flow around the semiconductor refrigeration plate 15.

[0027] In this embodiment, a fixing mechanism 4 is fixedly connected to the lower end of the heat sink 1, an air pump 41 is fixedly installed inside the fixing mechanism 4, one side of the air pump 41 is connected to a branch pipe 42, and the lower end of the branch pipe 42 is fixedly connected to a fixing suction cup 5, the outer side of the branch pipe 42 is fixedly connected to a fixing seat 43 for fixing, and one side of the fixing mechanism 4 is provided with an air outlet 6; by setting the air pump 41, the branch pipe 42 and the fixing suction cup 5, the heat sink 1 is placed on a smooth horizontal table top, at this time, the fixing suction cup 5 at the lower end of the fixing mechanism 4 fits with the table top, and the air pump 41 draws the air in the fixing suction cup 5 through the branch pipe 42, so that the fixing mechanism 4 can be fixed to the smooth horizontal table top, and then the heat sink 1 is fixed, to prevent the heat sink 1 from sliding due to external collision or arm thrust when the user is in use.

[0028] The working principle and use process of the utility model are as follows: when in use, the heat sink 1 is placed on a smooth horizontal table top. At this time, the fixed suction cup 5 is in contact with the table top, and then the air pump 41 extracts the air in the fixed suction cup 5 through the branch pipe 42, so that the fixing mechanism 4 can be fixed on the smooth horizontal table top, thereby fixing the heat sink 1 to prevent sliding during use. After that, the laptop computer is placed in the placement groove 2, and the coolant in the water storage box 7 is extracted by the water pump 8. At this time, the coolant flows into the annular tube 10 through the check valve 9. During the flow of the liquid in the annular tube 10, the heat in the placement groove 2 is absorbed, thereby ensuring the temperature in the placement groove 2, thereby achieving the effect of cooling and heat dissipation to ensure the temperature of the computer, and the liquid finally flows back to the water storage box 7 through the water pump 8.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink device for electronic equipment, comprising a heat sink (1), characterized in that: The upper surface of the heat sink (1) is provided with a placement groove (2), a water storage box (7) is fixedly installed inside the heat sink (1), a water pump (8) and a check valve (9) are fixedly installed on one side of the water storage box (7), an annular tube (10) is fixedly arranged on the upper end of the water storage box (7), and the two ends of the annular tube (10) are respectively fixedly connected to the water pump (8) and the check valve (9), a heat insulation board (71) is fixedly connected inside the water storage box (7), a semiconductor refrigeration plate (15) is fixedly installed on one side of the water storage box (7), a water outlet pipe (12) is fixedly installed on one side of the water storage box (7), and a valve (13) is fixedly installed on the outside of the water outlet pipe (12).

2. The heat sink device for electronic equipment according to claim 1, characterized in that: A support frame (11) is fixedly mounted on the upper end of the water storage box (7).

3. The heat sink device for electronic equipment according to claim 1, characterized in that: A water level alarm (14) is fixedly mounted on one side of the water storage box (7).

4. The electronic equipment heat sink device according to claim 1, characterized in that: A heat dissipation hole (3) is provided on one side of the heat dissipation plate (1), and three drive boxes (16) are fixedly installed inside the heat dissipation plate (1), a heat dissipation fan (17) is rotatably arranged outside the drive box (16), and a motor for driving the heat dissipation fan (17) is fixedly installed inside the drive box (16).

5. The heat sink device for electronic equipment according to claim 1, characterized in that: The lower end of the heat sink (1) is fixedly connected to a fixing mechanism (4), an air pump (41) is fixedly installed inside the fixing mechanism (4), one side of the air pump (41) is connected to a branch pipe (42), and the lower end of the branch pipe (42) is fixedly connected to a fixing suction cup (5), the outer side of the branch pipe (42) is fixedly connected to a fixing seat (43) for fixing, and one side of the fixing mechanism (4) is provided with an air outlet hole (6).

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