Mini LED COB and display module capable of solving problem of assembly gaps

Abstract

The utility model provides a mini LED COB and display module solving splicing gaps, comprising a PCB substrate, the PCB substrate is provided with more than two light-emitting units, each light-emitting unit comprises more than two mini LED chips, the mini LED chips are externally provided with optical adhesive layers, the optical adhesive layers are provided with reticulate pattern film layers, the reticulate pattern film layers are provided with more than two hollow holes, and the hollow holes are communicated with the mini LED chips. A reticulated film layer is arranged on the surface layer of the mini LED COB, hollowed-out holes are formed in the reticulated film layer, the distance between every two adjacent light-emitting units is smaller than or equal to the distance between every two adjacent light-emitting units, the color of the reticulated film layer is the same as the overall color of the optical adhesive layer, the PCB substrate and the mini LED chip, or the similarity of the colors reaches a preset value, the reticulated film layer is additionally arranged on the surface layer of the mini LED COB, and the hollowed-out holes are formed in the reticulated film layer. The problem of black edges generated by splicing seams when the mini LED COB modules are spliced into the mini LED COB direct display module can be solved, and the mini LED COB direct display module is simple in structure.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display, and in particular to a mini LED COB and a display module for solving assembly gap problems. Background Art

[0002] Mini LED is between traditional LED and Micro LED, so for existing manufacturers, many traditional LED processes and equipment can continue to be used, so there is no need to introduce too many new equipment. In particular, the combination of Mini LED technology with flexible substrates can be made into high-curved backlight modules, which will have the opportunity to be first introduced into mobile phones, TVs, car panels, gaming laptops and other applications. Compared with Micro LED, Mini LED is relatively larger in size, making it easier to achieve mass production.

[0003] The size of the backlight module is directly related to the machine equipment, so large equipment must be invested in the production of large-size backlight modules. In order to ensure a certain production efficiency and save production costs, existing manufacturers usually use multiple Mini LED backlight modules to assemble large-size ultra-thin backlight modules. However, since the fluorescent film is also spliced, each fluorescent film mixes light independently, and there is no light mixing at the splicing gap, resulting in black lines or black edges, which makes the overall product effect poor, thereby reducing the competitiveness of the product.

[0004] In order to solve the above problems, Chinese patent application number is 202222812707.5, and the announcement date is 2023.04.11, which discloses a seamless splicing screen backlight structure, including a main bracket, a LCD screen module, and a backlight module. The backlight module is fixed in the main bracket, and the LCD screen module includes optical glass and a liquid crystal display component. The two ends of the optical glass are fixed on the main bracket, and the middle part of the optical glass is suspended in front of the backlight module. The liquid crystal display component is attached to the optical glass, which has a large-screen seamless screen display effect.

[0005] The above structure improves the utilization rate of the light source by arranging a porous reflective film above the backlight module, collecting stray light and light reflected by the liquid crystal for reuse. However, the structure collects scattered light by arranging the LED lamp beads and the porous reflective film in correspondence, which requires high precision of the film and a complex process. At the same time, if the reflective film is white and the color of the bottom module is dark, the seam position can be easily seen from the outside, resulting in a poor display effect. Utility Model Content

[0006] The utility model provides a mini LED COB and a display module for solving the problem of assembly gaps, which has a simple structure and can better solve the problem of assembly gaps after the mini LED COB is spliced.

[0007] In order to achieve the above-mentioned purpose, a mini LED COB for solving assembly gaps includes a PCB substrate, on which are arranged more than two light-emitting units, each light-emitting unit includes more than two mini LED chips, an optical adhesive layer is arranged outside the miniLED chip, a textured film layer is arranged on the optical adhesive layer, and more than two hollow holes are arranged on the textured film layer, the spacing between the hollow holes is less than or equal to the spacing between two adjacent light-emitting units, and the color of the textured film layer is the same as the overall color of the optical adhesive layer, the PCB substrate and the mini LED chip, or the color familiarity reaches a preset value.

[0008] The above setting is achieved by arranging a textured film layer on the optical adhesive layer, and the spacing between the hollow holes on the textured film layer is smaller than the spacing between the mini LED chips. Since the spacing between the mini LED chips is small, the spacing between the hollow holes is also relatively small, thereby forming an inclined texture structure on the surface, which is integrated with the seams between the mini LED COBs. In addition, since the color of the textured film layer is the same or similar to the color of the optical adhesive layer, the PCB substrate and the mini LED chips, the seams of the entire spliced ​​display module cannot be seen when the gap is small enough when it is not lit. This can be achieved by only setting a film layer on each mini LED COB, and the structure is simple and the implementation method is reliable.

[0009] Furthermore, the light-emitting unit includes a red mini LED chip, a green mini LED chip and a blue mini LED chip, the optical adhesive layer is an adhesive layer provided with black light-absorbing particles, and the textured film layer is a black adhesive layer.

[0010] The above setting forms a white light emitting unit through red, green and blue, and then uses black light-absorbing particles to form a black glue layer. On the one hand, it can absorb the excess light generated by some light-emitting units, and on the other hand, it can also block the colors on the mini LED chip and the PCB substrate, making the color of the optical glue layer similar to that of the textured film layer.

[0011] Furthermore, the light-emitting unit includes more than two mini LED blue light chips, the optical film layer is a yellow phosphor layer, and the textured film layer is a yellow glue layer.

[0012] The above arrangement can be applied to white light chips and achieve a good stitching effect.

[0013] Furthermore, the gap between adjacent hollow holes of the textured film layer is 10-50 μm, and the thickness of the textured film layer is 1-5 μm.

[0014] The above settings can make the textured film layer meet the spacing requirements of existing mini LED chips.

[0015] Furthermore, the textured film layer includes a PET layer and a glue layer, the glue layer is provided with hollow holes, and the hollow holes are formed by transfer or printing.

[0016] The above arrangement forms a network film layer of the adhesive layer by transfer and printing on the adhesive layer, and the implementation is simple and reliable.

[0017] Furthermore, the textured film layer is a hard material layer, and an adhesive layer is provided below the hard material layer, and a pattern with hollow holes is printed on the hard material layer.

[0018] The above arrangement can also be achieved by forming a hollow hole pattern on the hard material layer.

[0019] The utility model also provides a display module, including two or more mini LED COBs spliced ​​together, the miniLED COB including a PCB substrate, the PCB substrate is provided with two or more light-emitting units, each light-emitting unit includes two or more mini LED chips, an optical adhesive layer is provided outside the mini LED chip, a textured film layer is provided on the optical adhesive layer, the textured film layer is provided with two or more hollow holes, the spacing between the hollow holes is less than or equal to the spacing between two adjacent light-emitting units, the color of the textured film layer is the same as the overall color of the optical adhesive layer, the PCB substrate and the mini LED chip, or the color familiarity reaches a preset value.

[0020] In the above arrangement, the display module is formed by splicing more than two mini LED COBs. Since a textured film layer is provided on the mini LED COB, and the spacing between the hollow holes on the textured film layer is smaller than the spacing between the mini LED chips, and since the spacing between the mini LED chips is small, the spacing between the hollow holes is also relatively small, thereby forming an inclined texture structure on the surface, which is integrated with the seams between the mini LED COBs. In addition, since the color of the textured film layer is the same or similar to the color of the optical adhesive layer, the PCB substrate and the mini LED chip, the seams of the entire spliced ​​display module cannot be seen when the gap is small enough when it is not lit, and it can be achieved by only providing a film layer on each mini LED COB, the structure is simple and the implementation method is reliable.

[0021] Furthermore, a textured film layer is disposed on each mini LED COB, and the arrangement of the hollow holes on the textured film layer is the same.

[0022] The above setting forms a textured film layer on a single mini LED COB, so that it is convenient to use small equipment to form a textured film layer on a single mini LED COB, which is simple to implement, and the hollow holes of the textured film layer are arranged in the same way, so that the overall effect looks good.

[0023] Furthermore, two or more mini LED COBs share a textured film layer.

[0024] The above settings can ensure the consistency of the textured film layer on multiple mini LED COBs.

[0025] Furthermore, the gap between adjacent hollow holes of the textured film layer is 10-50 μm, and the thickness of the textured structure is 1-5 μm.

[0026] The above settings can make the textured film layer meet the spacing requirements of existing mini LED chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a cross-sectional view of the mini LED COB of the present invention in one direction.

[0028] Figure 2 It is a cross-sectional view of the mini LED COB of the present invention in another direction.

[0029] Figure 3 It is a structural schematic diagram of the roller-pressed anilox of the utility model.

[0030] Figure 4 It is a partial view of the cross section of the upper roller of the utility model.

[0031] Figure 5 It is a partial view of the cross section of the lower roller of the utility model.

[0032] Figure 6 This is a surface diagram of a textured film layer in one embodiment of the present invention.

[0033] Figure 7 This is a surface diagram of a textured film layer in another embodiment of the present invention.

[0034] Figure 8 It is a top view of the display module in the present invention.

[0035] Fig. 9 This is the effect diagram after four mini LED COBs in this utility model are spliced ​​together. DETAILED DESCRIPTION

[0036] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] like Figure 1-7 As shown, the utility model provides a mini LED COB for solving assembly gaps, including a PCB substrate 21, on which are arranged more than two light-emitting units, each of which includes more than two mini LED chips 22, an optical adhesive layer 23 is arranged outside the mini LED chip 22, a textured film layer 24 is arranged on the optical adhesive layer 23, and more than two hollow holes 241 are arranged on the textured film layer 24, and a spacing between the hollow holes 241 is less than or equal to a spacing between two adjacent light-emitting units, and a color of the textured film layer 24 is the same as the overall color of the optical adhesive layer 23, the PCB substrate 21 and the mini LED chip 22, or the color familiarity reaches a preset value. In this embodiment, the overall color of the optical adhesive layer 23, the PCB substrate 21 and the mini LED chip 22 is based on the color with more overall colors. For example, if the optical adhesive layer 23 is transparent and most of the substrate area is gold, and the chip is also gold, then the overall color of the optical adhesive layer 23, the PCB substrate 21 and the mini LED chip 22 is based on the overall color of gold. The color of the optical adhesive layer 23 is set to gold or a color with a similarity of more than 90% to gold, such as dark gold, etc. A preset value is that the similarity value reaches 90%.

[0038] In one embodiment, the light-emitting unit includes a red mini LED chip, a green mini LED chip, and a blue mini LED chip, the optical adhesive layer 23 is an adhesive layer provided with black light-absorbing particles, and the textured film layer 24 is a black adhesive layer. The adhesive layer of black light-absorbing particles is an adhesive layer formed by mixing black particles in silica gel, and the textured film layer 4 is an adhesive layer made of materials such as melanin.

[0039] In another embodiment, the light-emitting unit includes more than two mini LED blue light chips, the optical film layer 23 is a yellow phosphor layer, and the textured film layer 24 is a yellow glue layer. Specifically, the textured film layer can be a glue layer formed by yellow phosphor.

[0040] The gap between adjacent hollow holes 241 of the textured film layer 24 is 10-50 μm, the thickness of the textured film layer is 1-5 μm, the textured film layer 24 includes a PET layer and a glue layer 242, the glue layer 242 is provided with hollow holes, the PET layer is a substrate layer, and then a glue layer is coated on the substrate layer, and the hollow holes are formed by transfer printing or printing. Figure 3-5 As shown, a glue layer is first coated on the PET layer, and then the glue layer 242 passes through an upper transfer roller 2411 and a lower transfer roller 2412, wherein the upper transfer roller is provided with a plurality of protrusions, so that hollow holes can be formed during the transfer process.

[0041] As shown in 6-7, the cross section of the hollow hole can be in a square or diamond shape.

[0042] In another embodiment, the textured film layer 24 is a hard material layer, such as a glass or hard plastic layer, and an adhesive layer is disposed below the hard material layer, and a pattern with hollow holes is printed on the hard material layer.

[0043] Example 2.

[0044] like Figure 1-9 As shown, a display module is formed by splicing two or more mini LED COBs in Example 1, and the specific mini LED COB structure is the same as that in Example 1.

[0045] In one embodiment, a textured film layer 24 is disposed on each mini LED COB, and the arrangement of the hollow holes 241 on the textured film layer 24 is the same.

[0046] In another embodiment, two or more mini LED COBs share a textured film layer 24 .

[0047] Working principle of the utility model: the display module is formed by splicing more than two mini LED COBs. Since a textured film layer 24 is provided on the mini LED COB, and the spacing between the hollow holes 241 on the textured film layer 24 is smaller than the spacing between the mini LED chips 22, and since the spacing between the mini LED chips 22 is small, the spacing between the hollow holes 241 is also relatively small, so that an inclined texture structure is formed on the surface, which is integrated with the seam between the mini LED COBs. In addition, since the color of the textured film layer 24 is the same or similar to the color of the optical adhesive layer 23, the PCB substrate 21 and the mini LED chip 22, the display module after splicing can be further made small enough that the seam cannot be seen when it is not lit (such as Fig. 9 As shown in the figure, it can be realized by only setting a film layer on each mini LED COB, which has a simple structure and a reliable implementation method.

Claims

1. A mini LED COB for solving assembly gaps, comprising a PCB substrate, characterized in that: More than two light-emitting units are arranged on the PCB substrate, each light-emitting unit includes more than two mini LED chips, an optical adhesive layer is arranged outside the mini LED chip, a textured film layer is arranged on the optical adhesive layer, and more than two hollow holes are arranged on the textured film layer. The spacing between the hollow holes is less than or equal to the spacing between two adjacent light-emitting units, and the color of the textured film layer is the same as the overall color of the optical adhesive layer, the PCB substrate and the mini LED chip, or the color familiarity reaches a preset value.

2. A mini LED COB for solving assembly gaps according to claim 1, characterized in that: The light-emitting unit includes a red mini LED chip, a green mini LED chip and a blue mini LED chip, the optical adhesive layer is an adhesive layer provided with black light-absorbing particles, and the textured film layer is a black adhesive layer.

3. A mini LED COB for solving assembly gaps according to claim 1, characterized in that: The light-emitting unit includes more than two mini LED blue light chips, the optical film layer is a yellow phosphor layer, and the textured film layer is a yellow glue layer.

4. A mini LED COB for solving assembly gaps according to claim 1, characterized in that: The gap between adjacent hollow holes of the textured film layer is 10-50 μm, and the thickness of the textured film layer is 1-5 μm.

5. The mini LED COB for solving assembly gap problem according to claim 1, characterized in that: The textured film layer comprises a PET layer and a glue layer, the glue layer is provided with hollow holes, and the hollow holes are formed by transfer or printing.

6. The mini LED COB for solving assembly gap problem according to claim 1, characterized in that: The textured film layer is a hard material layer, and an adhesive layer is arranged below the hard material layer, and a pattern with hollow holes is printed on the hard material layer.

7. A display module, comprising two or more mini LED COBs spliced ​​together, characterized in that: The mini LED COB includes a PCB substrate, on which are arranged two or more light-emitting units, each of which includes two or more mini LED chips, an optical adhesive layer is arranged outside the mini LED chip, a textured film layer is arranged on the optical adhesive layer, and two or more hollow holes are arranged on the textured film layer. The spacing between the hollow holes is less than or equal to the spacing between two adjacent light-emitting units, and the color of the textured film layer is the same as the overall color of the optical adhesive layer, the PCB substrate and the mini LED chip, or the color familiarity reaches a preset value.

8. A display module according to claim 7, characterized in that: A textured film layer is set on each mini LED COB, and the arrangement of the hollow holes on the textured film layer is the same.

9. The display module according to claim 7, characterized in that: Two or more mini LED COBs share a textured film layer.

10. The display module according to claim 7, characterized in that: The gap between adjacent hollow holes of the textured film layer is 10-50 μm, and the thickness of the textured film layer is 1-5 μm.

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