Grinding jig

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a grinding jig. The grinding jig comprises a first loading plate and a second loading plate, the first loading plate is provided with a hollow area and a first mounting hole; the hollow area penetrates through the first carrying plate, and the first mounting holes are formed along the first carrying plate at intervals; the second carrying plate is detachably connected with the first carrying plate in a clamped mode, and the second carrying plate is arranged in the hollowed-out area. Second mounting holes are formed in the second carrying plate, and the second mounting holes are formed along the second carrying plate at intervals; wherein the area size of the first mounting hole is not equal to the area size of the second mounting hole. The first carrying plate and the second carrying plate which are clamped with each other are arranged, and the area sizes of the first mounting holes and the second mounting holes are different, so that the first carrying plate and the second carrying plate can be used for respectively fixing wafers of different specifications, the synchronous grinding operation of the wafers of different specifications is further realized, and the grinding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a grinding fixture. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. In the semiconductor manufacturing process, the wafer needs to be ground to a specified thickness before subsequent processing steps.

[0003] During the grinding process of the wafer, a grinding jig is required. During grinding, the grinding jig is first installed on the double-sided polishing machine, and then the wafer to be ground is fixed in the mounting hole of the grinding jig to grind the wafer. However, the existing grinding jig can only grind wafers of the same specification. When there is a need to grind wafers of different specifications, only one specification of wafer can be ground first. After grinding, the grinding jig needs to be replaced before grinding wafers of other specifications, resulting in poor grinding efficiency. Utility Model Content

[0004] The technical problems to be solved by the utility model are:

[0005] The grinding jig can only perform grinding operations on wafers of a single specification, and the grinding efficiency is poor.

[0006] In order to solve the above technical problems, the utility model provides a grinding tool, comprising:

[0007] a first loading plate, wherein a hollow area and first mounting holes are provided on the first loading plate; the hollow area passes through the first loading plate, and the first mounting holes are arranged at intervals along the first loading plate; and

[0008] A second loading plate, the second loading plate and the first loading plate can be detachably connected, the second loading plate is arranged in the hollow area; the second loading plate is provided with second mounting holes, and the second mounting holes are arranged at intervals along the second loading plate;

[0009] The first mounting hole and the second mounting hole are used to fix the wafer to be ground, and the area size of the first mounting hole is not equal to the area size of the second mounting hole.

[0010] In one embodiment, the area size of the first mounting hole is larger than the area size of the second mounting hole.

[0011] In one embodiment, the first carrier plate is in a circular ring-shaped plate structure, the hollow area is arranged at the center of the first carrier plate, the first mounting hole is in a circular through hole shape, and the first mounting holes are evenly spaced around the hollow area.

[0012] In one of the embodiments, a guide groove is provided on the first carrier plate; the guide groove is in the shape of a long strip groove and is provided on one side of the first carrier plate, one end of the guide groove passes through the outer edge of the first carrier plate, and the other end of the guide groove is connected to the hollow area.

[0013] In one of the embodiments, the number of the guide grooves is the same as the number of the first mounting holes, and the guide grooves are correspondingly arranged between two adjacent first mounting holes.

[0014] In one of the embodiments, a slot is provided on the side wall of the hollow area, and a block is provided at the outer edge of the second carrier plate; the block is correspondingly mounted in the slot.

[0015] In one embodiment, the card slot is in the shape of a rectangular groove, and the card slot is arranged at intervals around the hollow area; the card block is in the shape of a rectangular protrusion, and the number of the card blocks is the same as the number of the card slots, and the card blocks are respectively inserted into the card slots one by one.

[0016] In one embodiment, a drainage hole is provided on the second carrier plate; the second carrier plate is in a circular plate-shaped structure, the drainage hole is in a circular through-hole shape, and the drainage hole is provided at the center of the second carrier plate.

[0017] In one embodiment, the second mounting hole is in the shape of a circular through hole, and the second mounting holes are evenly spaced around the drainage hole.

[0018] In one embodiment, the first carrier plate is provided with meshing teeth; the meshing teeth are extended along the outer edge of the first carrier plate.

[0019] Compared with the prior art, the above-mentioned grinding jig has the following beneficial effects:

[0020] By setting a first carrier plate and a second carrier plate that are interlocked, setting a first mounting hole on the first carrier plate, setting a second mounting hole on the second carrier plate, and the area sizes of the first mounting hole and the second mounting hole are different, the first carrier plate and the second carrier plate can respectively fix wafers of different specifications, thereby achieving synchronous grinding operations of wafers of different specifications and improving grinding efficiency. In addition, the same grinding jig meets the fixing requirements for wafers of different specifications, and the grinding jig and the wafer are no longer in a one-to-one correspondence, which greatly reduces the production cost of the grinding jig. In the process of later maintenance of the grinding jig, the first carrier plate or the second carrier plate can be independently maintained and serviced, respectively, to reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of a grinding tool according to one embodiment of the utility model;

[0022] Figure 2 for Figure 1 A schematic diagram of the structure of the grinding fixture from another angle;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure of the first loading plate;

[0024] Figure 4 for Figure 1 Schematic diagram of the structure of the second loading plate.

[0025] The meanings of the numbers in the accompanying drawings are:

[0026] 100. Grinding fixture;

[0027] 10. first loading plate; 11. hollow area; 12. slot; 15. first mounting hole; 16. guide groove; 17. meshing teeth;

[0028] 20. Second loading plate; 21. Clamping block; 25. Second mounting hole; 26. Drain hole. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0035] See also Figures 1 to 4 , is a grinding jig 100 according to an embodiment of the utility model, comprising a first carrier plate 10 and a second carrier plate 20. The first carrier plate 10 is provided with a hollow area 11 and a first mounting hole 15; the hollow area 11 penetrates the first carrier plate 10, and the first mounting holes 15 are arranged at intervals along the first carrier plate 10. The second carrier plate 20 and the first carrier plate 10 can be detachably snapped together, and the second carrier plate 20 is arranged in the hollow area 11; the second carrier plate 20 is provided with second mounting holes 25, and the second mounting holes 25 are arranged at intervals along the second carrier plate 20. Among them, the first mounting hole 15 and the second mounting hole 25 are used to fix the wafer to be ground, and the area size of the first mounting hole 15 is not equal to the area size of the second mounting hole 25. Through the first mounting holes 15 and the second mounting holes 25 of different sizes, wafers of different specifications are installed and fixed, so that synchronous grinding processing of wafers of different specifications is realized, and the grinding efficiency is improved.

[0036] Furthermore, the first carrier plate 10 is in the form of a circular plate structure, the hollow area 11 is arranged at the center of the first carrier plate 10, and the hollow area 11 runs through both sides of the first carrier plate 10. The first mounting hole 15 is in the form of a circular through hole, and the first mounting holes 15 are evenly spaced around the hollow area 11. By arranging the hollow area 11 at the center of the ring, and evenly spaced around the hollow area 11, it is ensured that the rotation linear speed of each first mounting hole 15 is equal during the rotation of the first carrier plate 10, that is, the rotation linear speed of the wafer installed in the first mounting hole 15 is equal, and the grinding effect on the wafer is uniform and stable. It can be understood that the shape of the first mounting hole 15 can be adaptively changed according to the shape of the wafer, and the specific shape of the first mounting hole 15 is not limited here, and it is sufficient to ensure that the first mounting hole 15 can fix the wafer.

[0037] Furthermore, a guide groove 16 is provided on the first carrier plate 10. The guide groove 16 is arranged on one side of the first carrier plate 10 in the shape of a long strip of groove, one end of the guide groove 16 passes through the outer edge of the first carrier plate 10, and the other end of the guide groove 16 is connected to the hollow area 11. The guide groove 16 is used to introduce the liquid medicine required in the process of grinding the wafer into the grinding fixture 100 to ensure the grinding operation of the wafer. In this embodiment, the number of the guide grooves 16 is the same as the number of the first mounting holes 15, and the guide grooves 16 are correspondingly arranged between two adjacent first mounting holes 15 to ensure that during the rotation of the first carrier plate 10, the guide grooves 16 evenly deliver the liquid medicine required for grinding into the first mounting hole 15 and the second mounting hole 25, thereby ensuring the grinding effect.

[0038] Furthermore, the first carrier plate 10 is provided with meshing teeth 17. The meshing teeth 17 are sawtooth-shaped and extend along the outer edge of the first carrier plate 10. The meshing teeth 17 are used to mesh with external equipment to transmit the torque required to drive the first carrier plate 10 to rotate.

[0039] Furthermore, the second carrier plate 20 is a circular plate-shaped structure, and the second carrier plate 20 is clamped in the hollow area 11. The second mounting hole 25 is a circular through hole, and the second mounting hole 25 is used to fix a wafer of a different size from the first mounting hole 15. In this embodiment, the area size of the first mounting hole 15 is larger than the area size of the second mounting hole 25. Since the first carrier plate 10 is arranged around the outside of the second carrier plate 20, the first carrier plate 10 drives the second carrier plate 20 to rotate synchronously, so the linear speed of the first mounting hole 15 is greater than the linear speed of the second mounting hole 25. Therefore, the first mounting hole 15 can grind a wafer with a larger area, ensuring that the machining accuracy of wafers of different specifications in the first mounting hole 15 and the second mounting hole 25 is the same, and ensuring the stability of wafer grinding.

[0040] Furthermore, a drainage hole 26 is provided on the second carrier plate 20. The drainage hole 26 is in the shape of a circular through hole, and is provided at the center of the second carrier plate 20. The drainage hole 26 is used to discharge the overflowed grinding liquid transported by the guide groove 16, and the overflowed grinding liquid is collected and then introduced into the guide groove 16, so as to realize the circulation of the grinding liquid. In this embodiment, the second mounting holes 25 are evenly spaced around the drainage hole 26 to ensure that the rotational linear speed of each second mounting hole 25 is the same during the rotation process, thereby improving the grinding effect, and at the same time ensuring that the grinding liquid entering each second mounting hole 25 is uniform, thereby ensuring the grinding accuracy.

[0041] Furthermore, a slot 12 is provided on the side wall of the hollow area 11, and the slot 12 is in the shape of a rectangular groove. A block 21 is provided on the second carrier plate 20, and the block 21 is in the shape of a rectangular convex block. The block 21 is arranged at the outer edge of the second carrier plate 20, and the block 21 is correspondingly arranged in the slot 12 to realize the detachable connection between the second carrier plate 20 and the first carrier plate 10. In this embodiment, the number of the slots 12 is multiple, and the slots 12 are arranged at intervals around the hollow area 11; the number of the blocks 21 is the same as the number of the slots 12, and the blocks 21 are respectively correspondingly inserted into the slots 12 to ensure that the torque transmitted from the first carrier plate 10 to the second carrier plate 20 is more uniform, avoiding stress concentration causing deformation of the second carrier plate 20, thereby ensuring the grinding quality.

[0042] In summary, the present invention provides a grinding tool 100, which has the following beneficial effects:

[0043] By setting a first carrier plate 10 and a second carrier plate 20 that are mutually engaged, setting a first mounting hole 15 on the first carrier plate 10, setting a second mounting hole 25 on the second carrier plate 20, and the area sizes of the first mounting hole 15 and the second mounting hole 25 are different, the first carrier plate 10 and the second carrier plate 20 can be respectively fixed to wafers of different specifications, thereby achieving synchronous grinding operations of wafers of different specifications and improving grinding efficiency. In addition, the same grinding jig 100 meets the fixing requirements for wafers of different specifications, and the grinding jig 100 and the wafer are no longer in a one-to-one correspondence, which greatly reduces the production cost of the grinding jig 100. In the process of later maintenance of the grinding jig 100, the first carrier plate 10 or the second carrier plate 20 can be independently maintained and serviced, respectively, to reduce maintenance costs.

[0044] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A grinding tool, characterized in that: include: A first loading plate, wherein a hollow area and first mounting holes are provided on the first loading plate; the hollow area passes through the first loading plate, and the first mounting holes are arranged at intervals along the first loading plate; and A second loading plate, the second loading plate and the first loading plate can be detachably connected, the second loading plate is arranged in the hollow area; the second loading plate is provided with second mounting holes, and the second mounting holes are arranged at intervals along the second loading plate; The first mounting hole and the second mounting hole are used to fix the wafer to be ground, and the area size of the first mounting hole is not equal to the area size of the second mounting hole.

2. The grinding tool according to claim 1, characterized in that: The area size of the first mounting hole is larger than the area size of the second mounting hole.

3. The grinding tool according to claim 1, characterized in that: The first carrier plate is in a circular plate-like structure, the hollow area is arranged at the center of the first carrier plate, the first mounting holes are in a circular through-hole shape, and the first mounting holes are evenly spaced around the hollow area.

4. The grinding tool according to claim 3, characterized in that: The first carrier plate is provided with a guide groove; the guide groove is in the shape of a long strip groove and is arranged on one side of the first carrier plate, one end of the guide groove passes through the outer edge of the first carrier plate, and the other end of the guide groove is connected to the hollow area.

5. The grinding tool according to claim 4, characterized in that: The number of the guide grooves is the same as the number of the first mounting holes, and the guide grooves are correspondingly arranged between two adjacent first mounting holes.

6. The grinding tool according to claim 1, characterized in that: A clamping slot is provided on the side wall of the hollow area, and a clamping block is provided at the outer edge of the second object carrier plate; the clamping block is correspondingly clamped in the clamping slot.

7. The grinding tool according to claim 6, characterized in that: The card slot is in the shape of a rectangular groove, and is arranged at intervals around the hollow area; the card block is in the shape of a rectangular convex block, and the number of the card blocks is the same as the number of the card slots, and the card blocks are respectively inserted into the card slots one by one.

8. The grinding tool according to claim 1, characterized in that: The second carrier plate is provided with a drainage hole; the second carrier plate is in a circular plate-shaped structure, the drainage hole is in a circular through-hole shape, and the drainage hole is arranged at the center of the second carrier plate.

9. The grinding tool according to claim 8, characterized in that: The second mounting holes are in the shape of circular through holes, and the second mounting holes are evenly spaced around the drainage hole.

10. The grinding tool according to any one of claims 1 to 9, characterized in that: The first carrier plate is provided with meshing teeth; the meshing teeth are extended along the outer edge of the first carrier plate.

Images