Cleaning structure for SMT solder paste printing machine

Abstract

The utility model relates to the technical field of solder paste printing machines, in particular to a cleaning structure for an SMT solder paste printing machine. Comprising a main shell and a numerical control screen, the numerical control screen is fixedly arranged outside the main shell, a steel mesh is fixedly arranged in the main shell, steel mesh cleaning mechanisms for cleaning residual solder paste in meshes of the steel mesh are arranged on the upper side and the lower side of the steel mesh, and a solder paste collecting box for collecting the residual solder paste on the steel mesh is further arranged in the main shell. The solder paste collecting box is arranged at the bottom of the steel mesh, and a clamping assembly for limiting the position of the solder paste collecting box is arranged in the main shell. According to the cleaning structure for the SMT solder paste printing machine, solder paste blocked in the meshes of the steel mesh is cleaned through the design of the steel mesh cleaning mechanism, so that the phenomenon that the solder paste is solidified in the meshes of the steel mesh and blocks the meshes is avoided, normal work of the SMT solder paste printing machine is effectively guaranteed, and the practical performance of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste printers, in particular to a cleaning structure for SMT solder paste printers. Background Art

[0002] SMT solder paste printer is a main machine used in SMT patch technology, and SMT patch refers to a circuit assembly technology in which surface mounted components are installed on the surface of a printed circuit board or other substrate, and then soldered and assembled by methods such as flow soldering or dip soldering.

[0003] The SMT solder paste printer in the prior art is generally composed of mechanisms such as plate loading, solder paste adding, stamping, and circuit board feeding. Its working principle is: first, the circuit board to be printed is fixed on the printing positioning table, and then the left and right scrapers of the printer print the solder paste or red glue through the steel mesh on the corresponding pads. The PCB board with uniform leakage printing is input to the placement machine through the transmission table for automatic placement. However, in the actual production process, we found that after the SMT solder paste printer leaks the solder paste through the steel mesh to the corresponding circuit board pad, it is unable to clean up the excess solder paste on the steel mesh in time. Due to the short solidification time of the solder paste itself, the solder paste accumulated in the mesh holes of the steel mesh is very easy to solidify and clog the mesh holes, resulting in the subsequent printed solder paste being unable to leak through the mesh holes to the circuit board, thereby affecting the normal operation of the SMT solder paste printer, and the practical performance of the device is poor.

[0004] To this end, we design a cleaning structure for an SMT solder paste printer to provide another technical solution to the above technical problems. Utility Model Content

[0005] Based on this, it is necessary to provide a cleaning structure for an SMT solder paste printer that is convenient for cleaning the solder paste accumulated inside the mesh holes of the steel mesh in order to solve the above-mentioned technical problems.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A cleaning structure for an SMT solder paste printer comprises a main shell and a numerical control screen, wherein the numerical control screen is fixedly mounted on the outside of the main shell, a steel mesh is fixedly mounted inside the main shell, and steel mesh cleaning mechanisms are arranged on the upper and lower sides of the steel mesh for cleaning residual solder paste in the mesh holes of the steel mesh, a solder paste collection box is also arranged inside the main shell for collecting residual solder paste on the steel mesh, the solder paste collection box is arranged at the bottom of the steel mesh, and a clamping assembly is arranged inside the main shell for limiting the position of the solder paste collection box.

[0008] Preferably, the steel mesh cleaning mechanism includes a steel mesh cleaning component, a fixing component and a driving component, the steel mesh cleaning component includes a mesh cleaning rod and a solder paste scraping rod, the mesh cleaning rod and the solder paste scraping rod are respectively arranged on the upper and lower sides of the steel mesh and are in contact with the surface of the steel mesh, the mesh cleaning rod is provided with a plurality of anti-blocking means matching the meshes of the steel mesh, the mesh cleaning rod is provided with a plurality of mounting holes one matching the anti-blocking means, the anti-blocking outer sleeve is provided with a compression spring one, the anti-blocking means is fixedly provided with a limiting ring abutting against one end of the compression spring one, and the other end of the compression spring one is fixedly connected to the inner wall of the mounting hole one.

[0009] Preferably, the fixing assembly includes a positioning rod movably inserted on both sides of the mesh cleaning rod and the solder paste scraper rod, the mesh cleaning rod and the solder paste scraper rod are provided with positioning holes matching the positioning rod, a plurality of slide rails are symmetrically provided inside the main shell, a plurality of sliders are movably connected to the slide rails, a plurality of positioning mounting blocks matching the positioning rod are fixed on the top ends of the plurality of sliders, a second mounting hole matching the positioning rod is provided inside the positioning mounting block, a second compression spring is fixed inside the second mounting hole, one end of the positioning rod away from the mesh cleaning rod and the solder paste scraper rod is in contact with the second compression spring, and the positioning rod is movably clamped in the second mounting hole.

[0010] Preferably, the driving assembly includes a driving motor arranged on one of the positioning mounting blocks, the output end of the driving motor passes through the positioning mounting block and is connected to a transmission shaft, a plurality of driving spur gears and guide blocks are fixedly provided on the transmission shaft, a rack meshing with the driving spur gears is provided on one side of the slider, a plurality of ball bearings are rotatably connected on both sides of the plurality of guide blocks, and a guide limit groove matching the guide block and the ball bearings is provided on the slider.

[0011] Preferably, the snap-on assembly includes guide rails fixedly mounted on both sides of the main shell body, guide strips matching the guide rails are provided on both sides of the solder paste collection box, a snap-on piece is rotatably connected to the outer side of the guide rail, a U-shaped snap plate matching the snap-on piece is fixed on the guide bar, a magnetic block for adsorbing the snap-on piece is provided on the side of the guide rail away from the guide bar, and a groove is provided on the magnetic block for facilitating the rotation of the snap-on piece.

[0012] Preferably, two mesh cleaning rods are provided and are sequentially arranged on the positioning mounting block and abut against the surface of the steel mesh, wherein the mesh cleaning rod located relatively outerward is located on one side of the steel mesh mesh and does not contact the steel mesh mesh when not in operation, and the outer side of the solder paste scraping rod located at the bottom of the steel mesh is in the same vertical plane as the inner side of the other mesh cleaning rod.

[0013] It can be seen without a doubt that the above-mentioned technical solution of the present application can definitely solve the technical problem to be solved by the present application.

[0014] At the same time, through the above technical solutions, the utility model has at least the following beneficial effects:

[0015] 1. The utility model provides a cleaning structure for an SMT solder paste printer. Through the design of a steel mesh cleaning mechanism, the solder paste blocked inside the mesh holes of the steel mesh is cleaned, thereby avoiding the phenomenon that the solder paste solidifies inside the mesh holes of the steel mesh and blocks the mesh holes, effectively ensuring the normal operation of the SMT solder paste printer and improving the practical performance of the device.

[0016] 2. The cleaning structure for an SMT solder paste printer provided by the utility model, through the design of fixed components, enables the staff to conveniently disassemble and assemble the mesh cleaning rod and the solder paste scraping rod only by pushing the positioning rods to both sides, thereby improving the convenience of using the device.

[0017] 3. The utility model provides a cleaning structure for an SMT solder paste printer. Through the design of the driving component, the staff only needs to control one driving motor to realize the synchronous movement of the mesh cleaning rod and the solder paste scraping rod. This ensures the normal cleaning of the solder paste inside the steel mesh, while reducing the production cost of the cleaning structure for the SMT solder paste printer, which is conducive to improving the market competitiveness of the device.

[0018] 4. The cleaning structure for an SMT solder paste printer provided by the utility model, through the design of the clamping assembly, enables the staff to conveniently disassemble and assemble the solder paste collection box on the guide rail only by rotating the clamping piece, thereby further improving the convenience of using the device.

[0019] 5. The utility model provides a cleaning structure for an SMT solder paste printer. Through the cooperation of two parallel mesh cleaning rods and a solder paste scraping rod at the bottom of the steel mesh, the mesh holes of the steel mesh are effectively sealed while ensuring normal cleaning of the mesh holes of the steel mesh. This prevents the solder paste at the bottom of the steel mesh from flowing into the cleaned mesh holes for a second time under the push of the solder paste scraping rod, thereby affecting the cleaning effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the axial structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the main housing of the utility model;

[0023] Figure 3 It is a structural schematic diagram of the steel mesh cleaning mechanism of the utility model;

[0024] Figure 4 It is a cross-sectional structural schematic diagram of the steel mesh cleaning mechanism of the utility model;

[0025] Figure 5 It is a half-section structural schematic diagram of the mesh cleaning rod of the utility model;

[0026] Figure 6 For the utility model Figure 4 Schematic diagram of the structure;

[0027] Figure 7 It is a structural schematic diagram of the drive assembly of the utility model;

[0028] Figure 8 It is a structural schematic diagram of the clamping assembly of the utility model;

[0029] Fig. 9 It is a structural schematic diagram of the steel mesh cleaning mechanism of the utility model;

[0030] Fig.10 It is a schematic diagram of the matching structure of the mesh cleaning rod and the solder paste scraping rod of the utility model.

[0031] In the figure: 1. main housing; 2. CNC screen; 3. steel mesh; 4. solder paste collecting box; 5. mesh cleaning rod; 6. solder paste scraping rod; 7. anti-blocking; 8. mounting hole one; 9. compression spring one; 10. limiting ring; 11. positioning rod; 12. positioning hole; 13. slide rail; 14. slide block; 15. positioning mounting block; 16. mounting hole two; 17. compression spring two; 18. driving motor; 19. transmission shaft; 20. driving spur gear; 21. guide block; 22. rack; 23. ball; 24. guide limiting groove; 25. guide rail; 26. guide strip; 27. card plate; 28. U-shaped card plate; 29. ​​magnetic block. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0033] Embodiment 1

[0034] Reference Figure 1-8A cleaning structure for an SMT solder paste printer comprises a main shell 1 and a numerical control screen 2, wherein the numerical control screen 2 is fixedly mounted on the outside of the main shell 1, a steel mesh 3 is fixedly mounted inside the main shell 1, and a steel mesh 3 cleaning mechanism for cleaning residual solder paste in the mesh of the steel mesh 3 is disposed on the upper and lower sides of the steel mesh 3, a solder paste collecting box 4 for collecting residual solder paste on the steel mesh 3 is also disposed inside the main shell 1, and the solder paste collecting box 4 is disposed at the bottom of the steel mesh 3, and a clamping component for limiting the position of the solder paste collecting box 4 is disposed inside the main shell 1.

[0035] Through the design of the steel mesh 3 cleaning mechanism, the solder paste blocked inside the mesh holes of the steel mesh 3 is cleaned, thereby avoiding the phenomenon that the solder paste solidifies inside the mesh holes of the steel mesh 3 and blocks the mesh holes, effectively ensuring the normal operation of the SMT solder paste printer and improving the practical performance of the device.

[0036] Reference Figure 3-7 The cleaning mechanism of the steel mesh 3 includes a steel mesh 3 cleaning component, a fixing component and a driving component. The steel mesh 3 cleaning component includes a mesh cleaning rod 5 and a solder paste scraping rod 6. The mesh cleaning rod 5 and the solder paste scraping rod 6 are respectively arranged on the upper and lower sides of the steel mesh 3 and are in conflict with the surface of the steel mesh 3. The mesh cleaning rod 5 is provided with a plurality of anti-blocking 7 matching the mesh of the steel mesh 3. The mesh cleaning rod 5 is provided with a plurality of mounting holes 8 matching the anti-blocking 7. The outer sleeve of the anti-blocking 7 is provided with a compression spring 9. A limiting ring 10 abutting against one end of the compression spring 9 is fixed on the anti-blocking 7. The other end of the compression spring 9 is fixedly connected to the inner wall of the mounting hole 8. Specifically, in the utility model, through the design of the mesh cleaning rod 5 and the solder paste scraping rod 6, the solder paste remaining on the surface of the steel mesh 3 and the inside of the mesh is cleaned, and the scraped solder paste is recovered through the solder paste collecting box 4, which is convenient for workers to The second use of solidified solder paste by staff can effectively improve the utilization rate of solder paste and reduce the production cost of solder paste printing; on the other hand, through the design of anti-blocking 7, compression spring 9 and limit ring 10, the solder paste blocked in the mesh of steel mesh 3 is cleaned, when the mesh cleaning rod 5 is at the edge of steel mesh 3 and does not contact the mesh of steel mesh 3, the anti-blocking 7 abuts against the surface of steel mesh 3 and curls up inside the mesh cleaning rod 5, when the mesh cleaning rod 5 moves forward and contacts the mesh of steel mesh 3, the anti-blocking 7 extends into the mesh under the action of compression spring 9, thereby squeezing the solder paste blocked in the mesh out of the mesh, avoiding the solidification and blockage of solder paste in the mesh, effectively ensuring the normal operation of SMT solder paste printer, and improving the practical performance of the device; through the design of limit ring 10, the extreme position of anti-blocking 7 popping out is controlled to avoid its separation from mesh cleaning rod 5 in the process of popping out to the mesh, effectively ensuring the continuous use of the mechanism;

[0037] It should be noted that, in the present invention, the end of the anti-clogging 7 abutting against the steel mesh 3 is spherical in design and made of aluminum oxide material. Through this design, the anti-clogging 7 can be abutted and retracted during the continuous forward movement of the cleaning rod of the steel mesh 3, and the aluminum oxide material can effectively prevent the adhesion of solder paste on the surface of the anti-clogging 7, thereby improving the use effect of the device; on the other hand, the mesh cleaning rod 5 and the solder paste scraping rod 6 are staggered in design, and the outer side of the solder paste scraping rod 6 and the inner side of the mesh cleaning rod 5 are in the same vertical plane. Through this design, the motion interference generated by the mesh cleaning rod 5 and the solder paste scraping rod 6 when cleaning the steel mesh 3 is avoided, thereby effectively ensuring the normal operation of the device.

[0038] Reference Figure 4-6 The fixing assembly includes a positioning rod 11 movably inserted on both sides of the mesh cleaning rod 5 and the solder paste scraping rod 6, and the mesh cleaning rod 5 and the solder paste scraping rod 6 are provided with a positioning hole 12 matching the positioning rod 11. The interior of the main housing 1 is symmetrically provided with a plurality of slide rails 13, and a plurality of sliders 14 are movably connected to the slide rails 13. The tops of the plurality of sliders 14 are fixedly provided with a positioning mounting block 15 matching the positioning rod 11, and the interior of the positioning mounting block 15 is provided with a mounting hole 2 16 matching the positioning rod 11, and the interior of the mounting hole 2 16 is fixedly provided with a compression spring 2 17, and the positioning rod 11 is away from the mesh cleaning rod 5. One end of the sorting rod 5 and the solder paste scraping rod 6 is in contact with the second compression spring 17, and the positioning rod 11 is movably arranged in the second mounting hole 16. Specifically, in the present invention, the mesh cleaning rod 5 and the solder paste scraping rod 6 are conveniently fixed on the positioning mounting block 15 through the design of the positioning rod 11, the positioning hole 12, the second mounting hole 16, and the second compression spring 17. When the staff needs to disassemble the mesh cleaning rod 5 and the solder paste scraping rod 6, they only need to push the positioning rod 11 corresponding to the mesh cleaning rod 5 or the solder paste scraping rod 6 to both sides, so as to realize the convenient disassembly and assembly of the mesh cleaning rod 5 and the solder paste scraping rod 6, thereby effectively improving the convenience of using the device.

[0039] It should be noted that, in the present invention, the end of the positioning rod 11 that matches the positioning hole 12 is a wedge-shaped design that is narrow in front and wide in the back. This design avoids the positioning rod 11 from getting stuck during the insertion process of the positioning hole 12, and effectively improves the stability of the positioning rod 11 when it is inserted into the positioning hole 12.

[0040] Reference Figure 7The driving assembly includes a driving motor 18 arranged on one of the positioning mounting blocks 15, the output end of the driving motor 18 passes through the positioning mounting block 15 and is connected to a transmission shaft 19, a plurality of driving spur gears 20 and a guide block 21 are fixedly arranged on the transmission shaft 19, a rack 22 meshing with the driving spur gear 20 is arranged on one side of the slider 14, a plurality of balls 23 are rotatably connected on both sides of the plurality of guide blocks 21, and a guide limiting groove 24 matching the guide block 21 and the ball 23 is arranged on the slider 14. Specifically, in the utility model, through the design of the driving motor 18, the transmission shaft 19, the driving spur gear 20 and the rack 22, the staff can Only one driving motor 18 needs to be controlled to realize the synchronous movement of the mesh cleaning rod 5 and the solder paste scraping rod 6, thereby ensuring the normal cleaning of the solder paste inside the mesh of the steel mesh 3 while reducing the production cost of the cleaning structure for the SMT solder paste printer, which is beneficial to improving the market competitiveness of the device; on the other hand, through the design of the guide block 21 and the ball 23, the moving position of the positioning mounting block 15 is further restricted, effectively ensuring the stability of the movement process of the steel mesh 3 cleaning rod and the solder paste scraping rod 6, and at the same time, through the design of the ball 23, the movement resistance of the guide block 21 in the limiting guide groove is effectively reduced, effectively avoiding the guide block 21 from getting stuck in the limiting guide groove, and improving the stability of the device.

[0041] Reference Figure 8 The clamping assembly includes guide rails 25 fixedly arranged on both sides of the interior of the main shell 1, guide bars 26 matching the guide rails 25 are arranged on both sides of the solder paste collection box 4, and a clamping piece 27 is rotatably connected to the outer side of the guide rail 25, and a U-shaped clamping plate 28 matching the clamping piece 27 is fixedly arranged on the guide bar 26, and a magnetic block 29 for adsorbing the clamping piece 27 is arranged on the side of the guide rail 25 away from the guide bar 26, and a groove is arranged on the magnetic block 29 for facilitating the rotation of the clamping piece 27. Specifically, the utility model In the embodiment, the guide bar 26 is designed to guide, receive and insert the solder paste collecting box 4 inside the guide rail 25, so as to facilitate the fixing of the solder paste collecting box 4 inside the main housing 1; on the other hand, the design of the clamping piece 27 and the U-shaped clamping plate 28 limits the axial position of the solder paste collecting box 4 inside the guide rail 25. When the solder paste collecting box 4 is completely placed in the guide rail 25, the staff rotates the clamping piece 27 clockwise to place it inside the U-shaped clamping plate 28, so as to prevent it from sliding out of the guide rail 25 during use, thereby improving the stability of the connection;

[0042] It should be noted that, in the present invention, the snap-on piece 27 is made of cast iron material. Through this design, it cooperates with the magnetic block 29 so that the snap-on piece 27 can be adsorbed on the magnetic block 29 after rotation, which is convenient for the staff to subsequently pull out the solder paste collection box 4 from the guide rail 25, thereby improving the actual use effect of the device. On the other hand, through the design of the groove, the rotation movement of the snap-on piece 27 is facilitated, and the motion interference during the rotation of the snap-on piece 27 is avoided, thereby ensuring the normal use of the device.

[0043] When it is necessary to clean the steel mesh 3, the staff controls the driving motor 18 to rotate forward through the operation control screen. At this time, the transmission shaft 19 at the output end of the driving motor 18 immediately drives the driving spur gear 20 to rotate, and through the engagement with the rack 22, the positioning mounting block 15 drives the slider 14 fixed at the bottom to move on the slide rail 13. At this time, the positioning rod 11 inserted on the positioning mounting block 15 drives the mesh cleaning rod 5 and the solder paste scraping rod 6 to move forward. When the anti-blocking 7 on the mesh cleaning rod 5 is aligned with the mesh, the anti-blocking 7 is placed in the mesh under the action of the compression spring 9, and the accumulated solder paste in the mesh is removed. The solder paste is squeezed out of the mesh, and at the same time, the solder paste discharged from the bottom of the steel mesh 3 and the mesh is scraped by the solder paste scraper rod 6. In this process, part of the solder paste falls into the collection box under the action of its own gravity, and at the same time, the mesh cleaning rod 5 and the solder paste scraper rod 6 continue to move forward to clean the mesh of the steel mesh 3 in turn, and when the solder paste scraper rod 6 moves to the front end of the steel mesh 3, the solder paste pushed by the solder paste scraper rod 6 is separated from the bottom of the steel mesh 3 and falls into the solder paste collection box 4 under the action of gravity. At this time, the drive motor 18 reverses, driving the mesh cleaning rod 5 and the solder paste scraper rod 6 to reset, and the cleaning of the steel mesh 3 can be completed.

[0044] Embodiment 2

[0045] It should be noted that this embodiment is further optimized on the basis of the first embodiment. During the use of the cleaning structure for the SMT solder paste printer, we found that although this cleaning structure can clean the surface and mesh of the steel mesh 3, during the cleaning process, due to the staggered design of the mesh cleaning rod 5 and the solder paste scraping rod 6, a small amount of solder paste will still be scraped by the solder paste scraping rod 6 and flow into the mesh of the steel mesh 3 for a second time, thereby affecting the printing effect of the SMT solder paste printer. The actual use effect of the device is poor.

[0046] Reference Figure 9-10, the mesh cleaning rods 5 are provided with two and are arranged on the positioning and mounting blocks 15 in sequence and abut against the surface of the steel mesh 3, wherein the mesh cleaning rod 5 located relatively outside is on one side of the mesh of the steel mesh 3 when not working and does not contact the mesh of the steel mesh 3, and the outer side of the solder paste scraping rod 6 arranged at the bottom of the steel mesh 3 and the inner side of the other mesh cleaning rod 5 are in the same vertical plane. Specifically, in the utility model, through the cooperation of the two mesh cleaning rods 5 arranged in parallel and the solder paste scraping rod 6 at the bottom of the steel mesh 3, the mesh of the cleaned steel mesh 3 is effectively blocked while ensuring the normal cleaning of the mesh of the steel mesh 3, thereby preventing the solder paste at the bottom of the steel mesh 3 from flowing into the cleaned mesh for a second time under the push of the solder paste scraping rod 6, affecting the cleaning effect of the device.

[0047] The use process of a cleaning structure for an SMT solder paste printer provided by the utility model is as follows:

[0048] When it is necessary to clean the steel mesh 3, the staff controls the driving motor 18 to rotate forward through the operation control screen. At this time, the transmission shaft 19 at the output end of the driving motor 18 immediately drives the driving spur gear 20 to rotate, and through the engagement with the rack 22, the positioning mounting block 15 drives the slider 14 fixedly connected at the bottom to move on the slide rail 13. At this time, the positioning plug 11 plugged into the positioning mounting block 15 drives the mesh cleaning rod 5 and the solder paste scraping rod 6 to move forward. When the anti-blocking 7 on the mesh cleaning rod 5 is aligned with the mesh, the anti-blocking 7 is placed in the mesh under the action of the compression spring 19, and the solder paste accumulated in the mesh is squeezed out of the mesh. At this time, the mesh cleaning rod 5 and the solder paste scraping rod 6 continue to move forward, so that the mesh cleaning rod 5 in the front position is pulled out from the anti-blocking 7 on the mesh after cleaning, and gradually falls into the mesh to be cleaned in front. When the anti-blocking 7 on the mesh cleaning rod 5 at the front end is completely placed in the mesh to be cleaned, the mesh cleaning rod 5 at the back position After cleaning, the cleaning rod 5 is in the state of being crushed, and the cleaning rod 6 is in the state of being crushed.

[0049] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A cleaning structure for an SMT solder paste printer, comprising a main housing (1) and a numerical control screen (2), characterized in that: The numerical control screen (2) is fixedly arranged on the outside of the main shell (1), and a steel mesh (3) is fixedly arranged inside the main shell (1). A steel mesh (3) cleaning mechanism for cleaning residual solder paste in the mesh of the steel mesh (3) is arranged on the upper and lower sides of the steel mesh (3). A solder paste collection box (4) for collecting residual solder paste on the steel mesh (3) is also arranged inside the main shell (1). The solder paste collection box (4) is arranged at the bottom of the steel mesh (3), and a clamping component for limiting the position of the solder paste collection box (4) is arranged inside the main shell (1).

2. The cleaning structure for an SMT solder paste printer according to claim 1, characterized in that: The steel mesh (3) cleaning mechanism comprises a steel mesh (3) cleaning component, a fixing component and a driving component. The steel mesh (3) cleaning component comprises a mesh cleaning rod (5) and a solder paste scraping rod (6). The mesh cleaning rod (5) and the solder paste scraping rod (6) are respectively arranged on the upper and lower sides of the steel mesh (3) and are in contact with the surface of the steel mesh (3). The mesh cleaning rod (5) is provided with a plurality of anti-blocking (7) matching the mesh of the steel mesh (3). The mesh cleaning rod (5) is provided with a plurality of mounting holes (8) matching the anti-blocking (7). The anti-blocking (7) is sleeved with a compression spring (9). The anti-blocking (7) is fixedly provided with a limiting ring (10) abutting against one end of the compression spring (9). The other end of the compression spring (9) is fixedly connected to the inner wall of the mounting hole (8).

3. The cleaning structure for an SMT solder paste printer according to claim 2, characterized in that: The fixing assembly comprises a positioning rod (11) movably inserted on both sides of the mesh cleaning rod (5) and the solder paste scraping rod (6); the mesh cleaning rod (5) and the solder paste scraping rod (6) are provided with positioning holes (12) matching the positioning rod (11); a plurality of slide rails (13) are symmetrically arranged inside the main shell (1); a plurality of sliders (14) are movably connected to the slide rails (13); a positioning mounting block (15) matching the positioning rod (11) is fixed at the top of the plurality of sliders (14); a second mounting hole (16) matching the positioning rod (11) is provided inside the positioning mounting block (15); a second compression spring (17) is fixed inside the second mounting hole (16); one end of the positioning rod (11) away from the mesh cleaning rod (5) and the solder paste scraping rod (6) abuts against the second compression spring (17); the positioning rod (11) is movably clamped in the second mounting hole (16).

4. The cleaning structure for an SMT solder paste printer according to claim 3, characterized in that: The driving assembly comprises a driving motor (18) arranged on one of the positioning mounting blocks (15); the output end of the driving motor (18) passes through the positioning mounting block (15) and is connected to a transmission shaft (19); a plurality of driving spur gears (20) and a guide block (21) are fixedly arranged on the transmission shaft (19); a rack (22) meshing with the driving spur gears (20) is arranged on one side of the slider (14); a plurality of balls (23) are rotatably connected to both sides of the plurality of guide blocks (21); and a guide limiting groove (24) matching the guide block (21) and the ball (23) is arranged on the slider (14).

5. The cleaning structure for an SMT solder paste printer according to claim 1, characterized in that: The snap-on assembly comprises guide rails (25) fixedly arranged on both sides of the interior of the main shell (1); guide bars (26) matching the guide rails (25) are arranged on both sides of the solder paste collection box (4); a snap-on piece (27) is rotatably connected to the outer side of the guide rail (25); a U-shaped clamping plate (28) matching the snap-on piece (27) is fixedly arranged on the guide bar (26); a magnetic block (29) for adsorbing the snap-on piece (27) is arranged on the side of the guide rail (25) away from the guide bar (26); and a groove is arranged on the magnetic block (29) for facilitating the rotation of the snap-on piece (27).

6. The cleaning structure for an SMT solder paste printer according to claim 2, characterized in that: Two mesh cleaning rods (5) are provided and are arranged in sequence on the positioning and mounting blocks (15) and abut against the surface of the steel mesh (3), wherein the mesh cleaning rod (5) located relatively on the outside is located on one side of the mesh of the steel mesh (3) when not in operation and does not contact the mesh of the steel mesh (3), and the outer side of the solder paste scraping rod (6) arranged at the bottom of the steel mesh (3) and the inner side of the other mesh cleaning rod (5) are located in the same vertical plane.

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