Testing device for TO packaging optical device

Abstract

The utility model relates to the technical field of gas analysis based on TDLAS (tunable diode laser absorption spectroscopy) tunable semiconductor laser absorption spectra, in particular to a testing device for TO (transistor-transistor) packaging optical devices, which comprises a signal analysis component, a device plugging heat dissipation component and a signal receiving component. The signal analysis component comprises a display screen, a first mainboard PCB (Printed Circuit Board), a keyboard and a pre-processing circuit PCB; the device plugging heat dissipation assembly comprises a second mainboard PCB, a device plugging installation seat, a supporting column, a first support, a copper-based fiber composite heat dissipation plate, an optical device and a device fixing auxiliary heat dissipation block. The signal receiving assembly comprises a signal receiver, a signal receiver PCB and a second support. According to the scheme, the optical device is tightly pressed on the copper-based fiber composite heat dissipation plate through the device fixing auxiliary heat dissipation block, heat generated when the optical device works can be effectively dissipated to the environment, and the optical device works stably; a signal curve of the optical device is recorded in real time through the signal analysis assembly, and a basis is provided for performance judgment of the optical device.

Description

Technical Field

[0001] The utility model relates to the technical field of gas analysis based on TDLAS tunable semiconductor laser absorption spectroscopy, in particular to a testing device for TO packaged optical devices. Background Art

[0002] The non-radiative recombination loss and free-carrier absorption loss mechanism of semiconductor lasers make their light extraction efficiency between 20% and 50%, which means that a considerable part of the injected electrical power will be converted into heat. As the temperature rises, the threshold current of the laser increases, the output power decreases, and the emission wavelength drifts, which will eventually cause mode instability and increase internal defects, which will seriously affect the life of the device and the measurement accuracy of instruments using such lasers, bringing great difficulties to their application.

[0003] Therefore, there is an urgent need to design a test device for TO-packaged optical devices to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of the utility model is to provide a testing device for TO packaged optical devices to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A test device for TO packaged optical devices, which is based on TDLAS tunable semiconductor laser absorption spectroscopy gas analysis technology, including a signal analysis component, a device plug-in heat dissipation component, and a signal receiving component;

[0007] The signal analysis component includes a display screen, a first mainboard PCB, a keyboard, and a pre-processing circuit PCB;

[0008] The device plug-in heat dissipation assembly comprises a second mainboard PCB, a device plug-in mounting seat, a support column, a first bracket, a copper-based fiber composite heat dissipation plate, an optical device, and a device fixing auxiliary heat dissipation block;

[0009] The signal receiving component includes a signal receiver, a signal receiver PCB, and a second bracket.

[0010] As a preferred solution of the utility model, the display screen and the keyboard are fixed on a sheet metal bending part, and the sheet metal bending part, the first main board PCB and the pre-processing circuit PCB are fixed on a mounting plate in a test site.

[0011] As a preferred solution of the utility model, the device plug-in mounting seat is installed on the second main board PCB by welding, and the second main board PCB is fixedly installed on the first bracket by using screws through support columns.

[0012] As a preferred solution of the utility model, the optical device is inserted into the device plug-in mounting seat through the copper-based fiber composite heat sink plate, the copper-based fiber composite heat sink plate and the device fixing auxiliary heat sink block are installed on the first bracket by screws, and the first bracket is fixed to the mounting plate at the test site by screws.

[0013] As a preferred solution of the utility model, the signal receiver is welded on the signal receiver PCB, and the signal receiver PCB is fixed to the second bracket by screws.

[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0015] 1. TO-packaged optical devices can be installed non-destructively and quickly during testing.

[0016] 2. When testing TO-packaged optical devices, the optical devices are pressed against the copper-based fiber composite heat sink through the device fixing auxiliary heat sink block, which can effectively dissipate the heat generated by the optical device during operation into the environment, allowing the optical device to work stably.

[0017] 3. When testing TO-packaged optical devices, the signal curve of the optical devices can be recorded in real time through the signal analysis component, providing a basis for the performance judgment of the optical devices.

[0018] 4. When testing TO-packaged optical devices, the distance and angle between the device plug-in heat dissipation component and the signal receiving component can be adjusted to accommodate different optical devices.

[0019] 5. When testing different types of TO packaged optical devices, you only need to replace the corresponding device plug-in mounting seat to perform measurements, which has a wide range of uses.

[0020] Compared with the prior art, the beneficial effects of the utility model are as follows: a testing device for TO-packaged optical devices is proposed, which has a simple structure, and the optical devices can be easily and non-destructively installed and disassembled. The copper-based fiber composite heat sink can effectively dissipate the heat generated by the optical device when it is working, and the device fixing auxiliary heat sink block further absorbs the heat generated by the optical device when it is working, so that the optical device can work stably and defective products can be found more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0022] In the figure: 1. signal analysis component; 11. display screen; 12. first mainboard PCB; 13. keyboard; 14. pre-processing circuit PCB; 2. device plug-in heat dissipation component; 21. second mainboard PCB; 22. device plug-in mounting seat; 23. support column; 24. first bracket; 25. copper-based fiber composite heat dissipation plate; 26. optical device; 27. device fixing auxiliary heat dissipation block; 3. signal receiving component; 31. signal receiver; 32. signal receiver PCB; 33. second bracket. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. Several embodiments of the utility model are given. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] For examples, see Figure 1 , the utility model provides a technical solution:

[0028] A testing device for TO-packaged optical devices, based on TDLAS tunable semiconductor laser absorption spectroscopy gas analysis technology, comprises a signal analysis component 1, a device plug-in heat dissipation component 2, and a signal receiving component 3.

[0029] For details, please refer to Figure 1 The signal analysis component 1 includes a display screen 11, a first main board PCB 12, a keyboard 13, and a pre-processing circuit PCB 14; the display screen 11 and the keyboard 13 are fixed on a sheet metal bending part, and the sheet metal bending part, the first main board PCB 12 and the pre-processing circuit PCB 14 are fixed on a mounting plate at a test site.

[0030] For details, please refer to Figure 1 The device plug-in heat dissipation assembly 2 includes a second mainboard PCB21, a device plug-in mounting seat 22, a support column 23, a first bracket 24, a copper-based fiber composite heat dissipation plate 25, an optical device 26 and a device fixing auxiliary heat dissipation block 27; the device plug-in mounting seat 22 is installed on the second mainboard PCB21 by welding, the second mainboard PCB21 is fixedly installed on the first bracket 24 by screws through the support column 23, and the first bracket 24 is fixed to the mounting plate of the test site by screws.

[0031] Preferably, the optical device 26 is inserted into the device plug-in mounting seat 22 through the copper-based fiber composite heat sink 25; the optical device 26 can be easily and quickly plugged in and out of the device plug-in mounting seat 22, thereby achieving rapid replacement and improving test efficiency.

[0032] Preferably, the copper-based fiber composite heat sink 25 and the device fixing auxiliary heat sink block 27 are installed on the first bracket 24 by screws; the device fixing auxiliary heat sink block 27 presses the optical device on the copper-based fiber composite heat sink 25 by screws to improve the heat dissipation efficiency.

[0033] For details, please refer to Figure 1 The signal receiving component 3 includes a signal receiver 31, a signal receiver PCB 32, and a second bracket 33; the signal receiver 31 is welded on the signal receiver PCB 32, and the signal receiver PCB 32 is fixed on the second bracket 33 by screws.

[0034] Working process of the utility model: when using the test device for TO-packaged optical devices, the TO-packaged optical device 26 will start working under the drive of the pre-processing circuit PCB14, and the heat generated during the working process will be dissipated to the environment by the copper-based fiber composite heat sink 25 and the device fixing auxiliary heat sink block 27 to achieve the purpose of heat dissipation; then the signal receiver 31 receives the optical signal emitted by the optical device 26 when it is working, and converts the optical signal into an electrical signal and transmits it to the first main board PCB12 for processing, display, and recording; further, the distance and angle between the signal analysis component 1 and the signal receiving component 3 can be adjusted to obtain a suitable photoelectric signal.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A test device for TO packaged optical devices, based on TDLAS tunable semiconductor laser absorption spectroscopy gas analysis technology, characterized in that: It comprises a signal analysis component (1), a device plug-in and heat dissipation component (2), and a signal receiving component (3); The signal analysis component (1) comprises a display screen (11), a first main board PCB (12), a keyboard (13), and a pre-processing circuit PCB (14); The device plug-in heat dissipation assembly (2) comprises a second mainboard PCB (21), a device plug-in mounting seat (22), a support column (23), a first bracket (24), a copper-based fiber composite heat dissipation plate (25), an optical device (26), and a device fixing auxiliary heat dissipation block (27); The signal receiving component (3) comprises a signal receiver (31), a signal receiver PCB (32), and a second bracket (33).

2. A testing device for TO packaged optical devices according to claim 1, characterized in that: The display screen (11) and the keyboard (13) are fixed on a sheet metal bending part, and the sheet metal bending part, the first main board PCB (12) and the pre-processing circuit PCB (14) are fixed on a mounting plate in a test site.

3. A testing device for TO packaged optical devices according to claim 1, characterized in that: The device plug-in mounting seat (22) is mounted on the second main board PCB (21) by welding, and the second main board PCB (21) is fixedly mounted on the first bracket (24) by screws via a supporting column (23).

4. A testing device for TO packaged optical devices according to claim 1, characterized in that: The optical device (26) is inserted into the device plug-in mounting seat (22) through the copper-based fiber composite heat dissipation plate (25); the copper-based fiber composite heat dissipation plate (25) and the device fixing auxiliary heat dissipation block (27) are mounted on the first bracket (24) by screws; and the first bracket (24) is fixed to the mounting plate of the test site by screws.

5. A testing device for TO packaged optical devices according to claim 1, characterized in that: The signal receiver (31) is welded on a signal receiver PCB (32), and the signal receiver PCB (32) is fixed on a second bracket (33) by means of screws.

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