Glue uniformizing, drying and developing integrated device for laboratory

Through the design of a compact laboratory, the integrated device of uniform glue, drying, and development is solved to solve the problem of efficient and low -cost technologies in scientific research experiments, and realize the low -cost, low maintenance and efficient operation of the equipment, which is suitable for laboratory use.

CN222420803UActive Publication Date: 2025-01-28MINSEOA (BEIJING) ADVANCED MATERIALS DEV CO LTD
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Patent Information

Application Number
CN202323456161.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-18
Publication Date
2025-01-28
Estimated Expiration
2033-12-18

AI Technical Summary

Technical Problem

The prior art is difficult to achieve efficient and low-cost uniformity, drying and developing processes in scientific research and experiments, and the equipment takes up a large space and has high maintenance costs, making it difficult to adapt to laboratory use.

Method used

A laboratory is designed with all -in -one device with uniform glue, drying, and sharing, including uniform glue machines, appearance systems, rinsing systems, and heating boxes. Low cost and low maintenance costs.

Benefits of technology

The efficient and low cost of the laboratory completes uniform glue, drying, and development technology. The equipment is compact and convenient to operate. It is suitable for laboratory use, reducing production costs.

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Abstract

The utility model relates to a laboratory glue uniformizing, drying and developing integrated device which comprises a glue uniformizing machine, a developing system, a rinsing system and a heating box, the glue uniformizing machine is provided with a glue uniformizing and developing cavity, the glue uniformizing and developing cavity is provided with a support, and the support is used for supporting and fixing a silicon wafer; the developing system is provided with a developing nozzle; the developing nozzle is positioned above the bracket; the rinsing system is provided with a rinsing spray head, and the rinsing spray head is located above the support; the heating box is adjacently arranged on one side of the spin coater, a heating plate for heating a silicon wafer is arranged in the heating box, and a heat insulation plate is arranged between the heating box and the spin coater; the device is compact in structure, small in occupied space, low in cost, low in maintenance cost, convenient to operate and suitable for being used in laboratories.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a laboratory-used device for glue spreading, drying and developing. Background Art

[0002] At present, industrial-grade glue leveling, drying and developing machines are all integrated cabinet equipment, which are bulky and require a specific independent space for placement. They are also expensive to build and have high maintenance costs, making them unsuitable for industrial production.

[0003] In scientific research experiments, existing technologies usually require manual development to complete the photolithography process, which has poor process repeatability and low efficiency.

[0004] Therefore, a laboratory-use device for coating, drying and developing is needed, which occupies a small space, has low cost, is easy to operate and is suitable for laboratory use. Summary of the invention

[0005] In view of at least one of the problems in the above-mentioned prior art, the purpose of the present utility model is to provide a laboratory-use integrated device for glue spreading, drying and developing, which has a compact structure, occupies a small space, has low cost, low maintenance cost, and is easy to operate, and is suitable for laboratory use.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A laboratory-use device for coating, drying and developing, characterized by comprising:

[0008] A coating machine is provided with a coating developing chamber, wherein a support is provided in the coating developing chamber, and the support is used to support and fix the silicon wafer;

[0009] A developing system, provided with a developing nozzle, wherein the developing nozzle is located above the bracket;

[0010] A rinsing system, provided with a rinsing nozzle, wherein the rinsing nozzle is located above the bracket;

[0011] A heating box is arranged adjacent to one side of the glue spreader. A heating plate for heating the silicon wafer is arranged inside the heating box. A heat insulation plate is arranged between the heating box and the glue spreader.

[0012] Preferably, the developing nozzle is connected to a developing solution storage tank arranged in the coating machine.

[0013] Preferably, a first peristaltic pump and a first regulating valve are provided between the developing nozzle and the developing solution storage tank.

[0014] Preferably, the rinsing nozzle is connected to a rinsing liquid storage tank arranged in the glue leveling machine.

[0015] Preferably, a second peristaltic pump and a second regulating valve are provided between the rinsing nozzle and the rinsing liquid storage tank.

[0016] Preferably, it further comprises a drainage system, and the drainage system comprises a waste liquid storage tank; a drainage hole is provided at the bottom of the coating and developing chamber, and the drainage hole is connected to the waste liquid storage tank through a pipeline.

[0017] Preferably, the bracket is configured as a vacuum suction bracket, which is connected to a vacuum pump, and a vacuum suction cup is installed on the top of the bracket; and a splash shield is provided on the edge of the coating and developing chamber.

[0018] Preferably, the glue spreading machine is provided with a control box, and the glue spreading and developing chamber is arranged at the upper central position of the control box; a controller is installed in the control box, and a touch screen, a glue spreading switch and a timer connected to the controller are arranged on the side wall of the control box.

[0019] Preferably, the top of the heating box is open, and an upper cover is provided at the opening.

[0020] Preferably, the heating box is provided with a temperature setting system, a heating switch is provided on the side wall of the heating box, the temperature setting system and the heating switch are connected to the controller; the heating plate is respectively connected to the temperature setting system and the heating switch.

[0021] The utility model adopts the above technical solution, which has the following advantages:

[0022] The utility model provides a laboratory-use glue leveling, drying and developing integrated device. By arranging a developing system and a rinsing system on a glue leveling machine, it can simulate an industrial-grade glue leveling, drying and developing integrated machine, and provide a research equipment basis for scientific research experimenters; it separates a heating box from the glue leveling machine by a heat insulation board, and reduces the influence of heat released when the heating box is heated on the glue leveling machine, the developing system and the rinsing system; it has a compact structure and occupies a small space, and is convenient for placement on a shockproof table; it has a low cost and low maintenance cost, and effectively reduces production costs; it is easy to operate, has high efficiency and good stability, and is suitable for laboratory use and for simulating industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The utility model is a schematic diagram of the structure of a laboratory-use device for glue spreading, drying and developing provided by one embodiment of the utility model.

[0024] Figure 2 It is a structural schematic diagram of a developing system of a laboratory-use glue-splitting, drying and developing integrated device provided by an embodiment of the utility model.

[0025] Figure 3 It is a structural schematic diagram of a rinsing system of a laboratory-use glue-splitting, drying and developing integrated device provided by one embodiment of the utility model.

[0026] Figure 4 It is a structural schematic diagram of a liquid discharge system of a laboratory glue spreading, drying and developing integrated device provided by an embodiment of the utility model.

[0027] Reference numerals in the figures:

[0028] 1 is a glue spreading machine, 110 is a glue spreading developing chamber, 111 is a bracket, 112 is a vacuum suction cup, 120 is a touch screen, 130 is a glue spreading switch, 140 is a timer, 2 is a developing system, 210 is a developing liquid storage tank, 220 is a first peristaltic pump, 230 is a first regulating valve, 3 is a rinsing system, 310 is a rinsing liquid storage tank, 320 is a second peristaltic pump, 330 is a third regulating valve, 4 is a heating box, 410 is a heating plate, 420 is a heat insulation plate, 430 is an upper cover, 440 is a temperature setting system, 450 is a heating switch, 5 is a drainage system, and 510 is a waste liquid storage tank. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the system or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "assembly", "setting", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The utility model provides a laboratory-use glue leveling, drying and developing integrated device, which can simulate an industrial-grade glue leveling, drying and developing integrated machine by arranging a developing system and a rinsing system on a glue leveling machine, thereby providing a research equipment basis for scientific research experimenters; a heating box is separated from the glue leveling machine by a heat insulation board, thereby reducing the influence of heat released when the heating box is heated on the glue leveling machine, the developing system and the rinsing system.

[0033] Below, the embodiments of the utility model are described in detail with reference to the accompanying drawings.

[0034] Example

[0035] Please refer to Figures 1 to 3 The present embodiment provides a laboratory-use glue-spinning, drying and developing integrated device, comprising a glue-spinning machine 1, a developing system 2, a rinsing system 3 and a heating box 4. The glue-spinning machine 1 is provided with a glue-spinning and developing chamber 110, and the glue-spinning and developing chamber 110 is provided with a bracket 111, and the bracket 111 is used to support and fix the silicon wafer; the developing system 2 is provided with a developing nozzle, and the developing nozzle is located above the bracket 111; the rinsing system 3 is provided with a rinsing nozzle, and the rinsing nozzle is located above the bracket 111; the heating box 4 is adjacent to one side of the glue-spinning machine 1, and a heating plate 410 for heating the silicon wafer is provided inside the heating box 4, and a heat insulation board 420 is provided between the heating box 2 and the glue-spinning machine 1.

[0036] In the laboratory-use glue-splitting, drying and developing integrated device of this embodiment, the bracket 111 of the glue-splitting machine 1 is used to carry silicon wafers, and the glue-splitting machine 1 is used to apply glue and glue-splitting to silicon wafers, and to develop and rinse the glue surface through the developing system 2 and the rinsing system 3 respectively. The heating box 4 is used for pre-baking pretreatment of heating the silicon wafer and the glue surface through the heating plate 410. The heating box 4 is separated from the glue-splitting machine 1 by the heat insulation board 420 to reduce the influence of the heat released by the heating box 4 when heating on the glue-splitting machine 1, the developing system 2 and the rinsing system 3. The glue-splitting machine 1 and the heating box 4 can respectively adopt existing technology products.

[0037] The laboratory-use device for coating, drying and developing in one device of this embodiment can be used in the following steps:

[0038] Step S11, placing the silicon wafer: placing the silicon wafer on the support 111 of the coating developing chamber 110;

[0039] Step S12, placing glue: manually pouring the glue on the silicon wafer;

[0040] Step S13, silicon wafer coating: start the coating machine 1 to complete the coating and coating of the silicon wafer;

[0041] Step S14, heating the silicon wafer: transferring the silicon wafer to the heating plate 410 of the heating box 4 and starting heating;

[0042] Step S15: exposing the silicon wafer: transferring the silicon wafer to an exposure machine for exposure;

[0043] Step S16, developing and rinsing: transferring the silicon wafer to the support 111 of the coating developing chamber 110, and simultaneously starting the developing system 2 and the rinsing system 3 for developing and rinsing, so that the developing solution and the rinsing solution respectively sprayed from the developing nozzle and the rinsing nozzle are sprayed onto the silicon wafer;

[0044] Step S17, removing the silicon wafer: removing the silicon wafer from the bracket 111;

[0045] Step S18, cleaning equipment: clean the laboratory with a device for coating, drying and developing.

[0046] like Figure 1 As shown, the heating box 4 and the glue-spinning machine 1 are arranged horizontally side by side. The heat insulation board 420 is set as a vertical rectangular board.

[0047] The developing nozzle and the rinsing nozzle adopt the shower-type nozzle of the prior art, which is conducive to the developer and the rinsing liquid being evenly sprayed on the exposed rubber surface. The developing nozzle and the rinsing nozzle are respectively installed at the end of the developing system 2 and the rinsing system 3. The rinsing liquid adopts clean water.

[0048] A vacuum suction cup is fixed on the bracket 111. A channel is provided in the bracket 111. One end of the channel is connected to the vacuum suction cup, and the other end of the channel is connected to the vacuum pump through a pipeline. By turning on the vacuum pump, the vacuum suction cup can fix the silicon wafer on the vacuum suction cup.

[0049] like Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the developing nozzle is connected to a developing liquid storage tank 210. The developing liquid storage tank 210 is used to store the developing liquid. The developing liquid storage tank 210 is arranged in the coating machine 1.

[0050] A first peristaltic pump 220 and a first regulating valve 230 are disposed between the developing nozzle and the developing solution storage tank 210 .

[0051] Specifically, the developing nozzle is connected to the developing solution storage tank 210 through a pipeline, and the first peristaltic pump 220 and the first regulating valve 230 are installed on the pipeline.

[0052] The developing system 2 includes a developing nozzle, a liquid image storage tank 210 , a first peristaltic pump 220 and a first regulating valve 230 . The liquid image storage tank 210 , the first peristaltic pump 220 and the first regulating valve 230 can be installed in a control box of the coating machine 1 .

[0053] The rinsing nozzle is connected to a rinsing liquid storage tank 310. The rinsing liquid storage tank 310 is used to store rinsing liquid. The rinsing liquid storage tank 310 is arranged in the glue-spinning machine 1. A second peristaltic pump 320 and a second regulating valve 330 are arranged between the rinsing nozzle and the rinsing liquid storage tank 310.

[0054] Specifically, the rinsing nozzle is connected to the rinsing liquid storage tank 310 through a pipeline, and the second peristaltic pump 320 and the second regulating valve 330 are installed on the pipeline.

[0055] The rinsing system 3 includes a rinsing nozzle, a rinsing liquid storage tank 310, a second peristaltic pump 320 and a second regulating valve 330. The rinsing liquid storage tank 310, the second peristaltic pump 320 and the second regulating valve 330 can be installed in the control box of the glue-spinning machine 1.

[0056] The first peristaltic pump 220 and the second peristaltic pump 320 can be powered by nitrogen to spray the developer and the rinse solution on the exposed adhesive surface of the silicon wafer. The first peristaltic pump 220 and the second peristaltic pump 320 are respectively connected to an external nitrogen supply device.

[0057] The first regulating valve 230 is used to adjust the speed at which the developing nozzle sprays the developing solution, and the second regulating valve 330 is used to adjust the speed at which the rinsing nozzle sprays the rinsing solution.

[0058] like Figure 1 and Figure 4 As shown, in some embodiments, the laboratory-use coating, drying, and developing integrated device further includes a drainage system 5, and the drainage system 5 includes a waste liquid storage tank 510; a drainage hole is provided at the bottom of the coating and developing chamber 110, and the drainage hole is connected to the waste liquid storage tank 510 through a pipeline. The waste liquid storage tank 510 can be installed in the control box of the coating machine 1.

[0059] The waste liquid storage tank 510 is used to collect waste glue liquid, waste developer liquid and waste rinse liquid.

[0060] The developing liquid storage tank 210 and the rinsing liquid storage tank 320 may be made of stainless steel, and the waste liquid storage tank 510 may be made of polytetrafluoroethylene plastic.

[0061] like Figure 1 As shown, in some embodiments, the bracket 111 can be connected to the rotary drive motor in the glue spreading machine 1, and the rotary drive motor can drive the bracket 111 to rotate; the bracket 111 is configured as a vacuum suction bracket, which is connected to a vacuum pump, and a vacuum suction cup 112 is installed on the top of the bracket 111; a splash guard is provided on the edge of the glue spreading and developing chamber 110.

[0062] The vacuum pump is used to provide vacuum suction power so that the support 111 can absorb the silicon wafer through the vacuum suction cup 112. The vacuum pump can be connected to the controller, and the controller can control the start and stop of the vacuum pump.

[0063] The splash shield is installed at the edge of the coating and developing chamber 110 to prevent the glue liquid and waste glue liquid, developer, rinse liquid and waste developer, waste rinse liquid from splashing onto the surface of the control box during the coating and coating, developing and rinsing processes.

[0064] In some embodiments, the glue spreading machine 1 is provided with a control box, and the glue spreading and developing chamber 110 is arranged at the upper central position of the control box; a controller is installed in the control box, and a touch screen 120, a glue spreading switch 130 and a timer 140 are arranged on the side walls of the control box, and the controller is respectively connected to the touch screen 120, the glue spreading switch 130 and the timer 140.

[0065] The controller may be installed with a program for setting the rotation speed, rotation time, development and rinsing time of the rotation drive motor. The touch screen 120 may be used to input the above rotation speed and time parameters. The timer 140 is used to record the development time and the rinsing time.

[0066] The glue-spinning switch 130 is used to start and stop the glue-spinning machine 1 .

[0067] Specifically, the touch screen 120 is installed on the front side wall of the control box.

[0068] The control box is set as a rectangular box. The control box is made of stainless steel, which is smooth, corrosion-resistant and easy to clean. The length of the control box can be 700mm, the width can be 400mm, and the height can be 450mm.

[0069] The maximum speed of the rotary drive motor is 5000rpm and the maximum acceleration is 10000rpm / s.

[0070] In some embodiments, the top of the heating box 4 is open, and an upper cover 430 is provided at the opening; when heating the silicon wafer and the adhesive surface, the upper cover 430 is placed on the heating box 4 to make the pre-baking temperature of the silicon wafer and the adhesive surface constant, reduce the influence of the external environment, and facilitate uniform heating of the silicon wafer and the adhesive surface.

[0071] In some embodiments, the heating box 4 is provided with a temperature setting system 440 , and a heating switch 450 is provided on the side wall of the heating box 4 ; the heating plate 410 is connected to the temperature setting system 440 and the heating switch 450 , respectively.

[0072] The heating switch 450 is used to start and stop the heating system 4. The temperature setting system 440 is used to install a temperature setting program.

[0073] The laboratory-use device for coating, drying and developing in one device in the above embodiment can also be used in the following steps when in use:

[0074] Step S21, start the glue spreader and the heating box: start the glue spreader switch 130 and the heating switch 450, input the rotation motor speed parameter and the rotation time parameter through the touch screen 120, and set the heating temperature value and heating time in the temperature setting system 440;

[0075] Step S22, coating the silicon wafer with glue: placing the silicon wafer on the vacuum suction cup 112 of the coating developing chamber 110, turning on the vacuum pump so that the support 111 fixes the silicon wafer, and manually pouring the glue on the silicon wafer;

[0076] Step S23, glue spreading: inputting instructions to the controller through the touch screen 120, the controller starts the rotation drive motor to drive the support 111 and the silicon wafer to rotate for glue spreading; after the glue spreading is completed, inputting instructions to the controller through the touch screen 120, the controller turns off the vacuum pump;

[0077] Step S24, heating: the silicon wafer is transferred to the heating plate 410 in the heating box 4, the upper cover 430 is placed on the heating box 4, and the heating plate 410 is started to heat the silicon wafer and the adhesive surface through the temperature setting system 440;

[0078] Step S25, exposure: transferring the silicon wafer to an exposure machine for exposure;

[0079] Step S26, development and rinsing: transfer and fix the silicon wafer to the vacuum suction cup 112 of the coating developing chamber 110, start the vacuum pump, so that the bracket 111 fixes the silicon wafer; input instructions to the controller through the touch screen 120, and the controller starts the developing system 2 and the rinsing system 3, so that the developing nozzle and the rinsing nozzle spray the developing solution and the rinsing solution onto the silicon wafer and the adhesive surface respectively, and perform development and rinsing, and at the same time start the timer 140 to record the developing time and the rinsing time;

[0080] Step S27, removing the silicon wafer: inputting instructions to the controller via the touch screen 120, the controller turns off the vacuum pump and removes the silicon wafer.

[0081] Then step S18 can be performed to clean the device.

[0082] The controller is connected to the first peristaltic pump 220, the first regulating valve 230, the second peristaltic pump 320 and the second regulating valve 330. The temperature setting system 440 and the heating switch 450 are connected to the controller.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A laboratory-use device for coating, drying and developing, characterized in that: include: A coating machine (1) is provided with a coating developing chamber (110), wherein a support (111) is provided in the coating developing chamber (110), and the support (111) is used to support and fix a silicon wafer; A developing system (2) is provided with a developing nozzle, wherein the developing nozzle is located above the bracket (111); A rinsing system (3) is provided with a rinsing nozzle, wherein the rinsing nozzle is located above the bracket (111); A heating box (4) is arranged adjacent to one side of the glue spreader (1), a heating plate (410) for heating the silicon wafer is arranged inside the heating box (4), and a heat insulation plate (420) is arranged between the heating box (4) and the glue spreader (1).

2. The laboratory glue-spinning, drying and developing integrated device according to claim 1, characterized in that: The developing nozzle is connected to a developing liquid storage tank (210) arranged in the coating machine (1).

3. The laboratory glue-spinning, drying and developing integrated device according to claim 2, characterized in that: A first peristaltic pump (220) and a first regulating valve (230) are arranged between the developing nozzle and the developing liquid storage tank (210).

4. The laboratory-use device for coating, drying and developing according to claim 1, characterized in that: The rinsing nozzle is connected to a rinsing liquid storage tank (310) arranged in the glue leveling machine (1).

5. The laboratory-use device for coating, drying and developing according to claim 4, characterized in that: A second peristaltic pump (320) and a second regulating valve (330) are provided between the rinsing nozzle and the rinsing liquid storage tank (310).

6. The laboratory-use device for coating, drying and developing according to claim 1, characterized in that: It also comprises a drainage system (5), the drainage system (5) comprising a waste liquid storage tank (510); a drainage hole is provided at the bottom of the coating developing chamber (110), and the drainage hole is connected to the waste liquid storage tank (510) through a pipeline.

7. The laboratory-use device for coating, drying and developing according to any one of claims 1 to 6, characterized in that: The support (111) is configured as a vacuum suction support, which is connected to a vacuum pump, and a vacuum suction cup (112) is installed on the top of the support (111); and a splash shield is provided on the edge of the coating developing chamber (110).

8. The laboratory-use device for coating, drying and developing according to any one of claims 1 to 6, characterized in that: The coating machine (1) is provided with a control box, and the coating developing chamber (110) is arranged at the upper center position of the control box; a controller is installed in the control box, and a touch screen (120) connected to the controller, a coating switch (130) and a timer (140) are arranged on the side wall of the control box.

9. The laboratory-use device for coating, drying and developing according to any one of claims 1 to 6, characterized in that: The top of the heating box (4) is open, and an upper cover (430) is provided at the opening.

10. The laboratory-use device for coating, drying and developing according to claim 8, characterized in that: The heating box (4) is provided with a temperature setting system (440), and a heating switch (450) is provided on a side wall of the heating box (4); the temperature setting system (440) and the heating switch (450) are connected to the controller; and the heating plate (410) is connected to the temperature setting system (440) and the heating switch (450), respectively.