Peeling and cleaning machine apparatus for cleaning wafers and cleaning machine including same

Abstract

The utility model provides stripping and cleaning machine equipment for cleaning wafers and a cleaning machine comprising the stripping and cleaning machine equipment. The stripping and cleaning machine equipment is placed in a cleaning cavity of the stripping and cleaning machine, and is characterized by comprising a cleaning spray head used for spraying cleaning liquid to a wafer in the cleaning cavity; the CCD camera is installed on the cleaning nozzle and used for identifying cross marks used for alignment on the two sides of the wafer; one end of the swing arm is connected to the cleaning nozzle and used for supporting and swinging the cleaning nozzle; the driving motor is connected to the swing arm and used for driving the swing arm to adjust the positions of the cleaning nozzle and the CCD camera; the stripping and cleaning machine equipment is operated in the following mode that a swing arm starts to swing, under the condition that a CCD camera recognizes that a cross mark on one side of a wafer is not located in the center of the CCD camera, a driving motor is controlled to drive the swing arm to adjust the positions of a cleaning spray head and the CCD camera, so that the cross mark on one side of the wafer is located in the center of the CCD camera, and the wafer is cleaned. And then the cleaning nozzle is controlled to spray liquid.

Description

Technical Field

[0001] The utility model patent application relates to a stripping cleaning machine for cleaning wafers, and in particular, to a stripping cleaning machine device capable of automatically adjusting a nozzle and a stripping cleaning machine comprising the device. Background Art

[0002] The cleaning chamber nozzle of the existing stripping cleaning machine is fixed on the swing arm by fixing. When the swing arm swings, the cleaning chamber nozzle passes through the center of the wafer from one side of the wafer to the other side.

[0003] Before cleaning, the position of the cleaning nozzle on the swing arm needs to be adjusted to ensure that the cleaning nozzle can pass through the center of the wafer when the arm is swung. Therefore, the cleaning range is determined by the swing arm amplitude.

[0004] However, the cleaning nozzle may sometimes be positionally offset, causing the cleaning nozzle to be unable to pass through the center of the wafer during the cleaning process, thereby resulting in poor cleaning effect at the center of the wafer and reduced yield.

[0005] In addition, if the swing arm has a position failure, it will cause insufficient cleaning of some parts of the wafer, affecting the cleaning effect and reducing the yield.

[0006] Furthermore, in order to ensure that the entire wafer is cleaned, the cleaning nozzle needs to spray liquid in advance.

[0007] Therefore, in order to improve the yield and convenience, a stripping cleaning machine device capable of automatically adjusting the nozzle and a stripping cleaning machine including the device are needed. Utility Model Content

[0008] The present application is made to solve the various problems of the above-mentioned existing stripping cleaning machines.

[0009] According to the present application, in order to prevent the risk of the cleaning nozzle being displaced, fixed cross marks for alignment are made on both sides of the wafer in the cleaning chamber. A CCD camera is installed on the cleaning nozzle. Each time cleaning starts, the CCD camera is aligned with the cross mark to ensure that the movement trajectory of the nozzle passes through the center of the wafer.

[0010] According to the present application, in order to deal with the problem of position failure of the swing arm, when the swing arm drives the CCD camera to recognize the cross mark, the cleaning nozzle starts to spray liquid without spraying liquid in advance, and when the swing arm is recognized to reach the cross mark on the other side of the wafer, the swing arm is controlled to move back. During one reciprocating process of the swing arm, two cross marks must be recognized, otherwise an alarm will be issued. If an alarm occurs, check whether the movement position of the swing arm is faulty, causing the cleaning nozzle to not pass through the entire wafer.

[0011] According to one aspect of the present application, a stripping cleaning machine device for cleaning wafers is proposed, which is placed in a cleaning chamber of the stripping cleaning machine and is characterized in that: the stripping cleaning machine device comprises: a cleaning nozzle for spraying cleaning liquid onto the wafers in the cleaning chamber; a CCD camera, which is mounted on the cleaning nozzle and is used to identify the cross marks for alignment on both sides of the wafer; a swing arm, one end of which is connected to the cleaning nozzle and is used to support and swing the cleaning nozzle; and a drive motor, which is connected to the swing arm and is used to drive the swing arm to adjust the position of the cleaning nozzle and the CCD camera; the stripping cleaning machine device is operated as follows: the swing arm starts to swing, and when the CCD camera identifies the cross mark position on one side of the wafer When the CCD camera recognizes that the cross mark on one side of the wafer is not located at the center of the CCD camera, the cleaning nozzle is controlled to start spraying liquid, and when the CCD camera recognizes that the cross mark on one side of the wafer is not located at the center of the CCD camera, the drive motor is controlled to drive the swing arm to adjust the positions of the cleaning nozzle and the CCD camera, so that the cross mark on one side of the wafer is located at the center of the CCD camera, and then the cleaning nozzle is controlled to start spraying liquid; and after the cleaning nozzle starts spraying liquid, the swing arm continues to swing to move the cleaning nozzle above the wafer, and when the CCD camera recognizes the cross mark on the other side of the wafer, the cleaning nozzle is controlled to stop spraying liquid, and when the CCD camera does not recognize the cross mark on the other side of the wafer, an alarm message is generated.

[0012] According to one aspect of the present application, the cleaning nozzle and the CCD camera may be formed as one module.

[0013] According to one aspect of the present application, a drive motor may be installed in the swing arm to control the movement of the swing arm, the cleaning nozzle, and the CCD camera.

[0014] According to one aspect of the present application, cross marks can be fixed on wafer stages on both sides of the wafer in the cleaning chamber.

[0015] According to one aspect of the present application, a stripping cleaning machine for cleaning wafers is provided, wherein a stripping cleaning machine device provided according to any aspect of the present application is installed in a cleaning chamber.

[0016] By using the stripping cleaning device and stripping cleaning machine provided according to any aspect of the present application, during each cleaning process, the cleaning nozzle will pass through the center point of the wafer, and the movement path of the swing arm can also pass through the entire wafer, thereby preventing insufficient wafer cleaning due to cleaning nozzle position offset and swing arm position failure, thereby affecting the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A side view of a cleaning machine apparatus for cleaning wafers is shown;

[0018] Figure 2 A top view showing a cleaning machine apparatus for cleaning wafers; and

[0019] Figure 3 A diagram showing the effect of the CCD camera alignment cross mark. DETAILED DESCRIPTION

[0020] Before proceeding to the following detailed description, it may be advantageous to set forth the definitions of certain words and phrases used throughout this patent document. The terms "coupling", "connection" and their derivatives refer to any direct or indirect communication or connection between two or more elements, regardless of whether those elements are in physical contact with each other. The terms "transmission", "reception" and "communication" and their derivatives cover direct and indirect communication. The terms "include" and "comprising" and their derivatives refer to including but not limited to. The term "or" is inclusive, meaning and / or. The phrase "associated with..." and its derivatives refer to including, including within, interconnecting, containing, contained within, connecting or connecting with, coupling or coupling with, communicating with, cooperating, interweaving, parallel, close to, binding or binding with, having, having attributes, having a relationship or having a relationship with, etc. The term "controller" refers to any device, system or part thereof that controls at least one operation. Such a controller can be implemented with hardware, or a combination of hardware and software and / or firmware. The functions associated with any particular controller can be centralized or distributed, whether local or remote. The phrase "at least one of", when used with a list of items, means that different combinations of one or more of the listed items may be used, and only one of the items in the list may be required. For example, "at least one of A, B, C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, A and B and C.

[0021] Definitions for other specific words and phrases are provided throughout this patent document. Those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior and future uses of such defined words and phrases.

[0022] In this patent document, the application combination of modules and the division level of sub-modules are only used for illustration, and the application combination of modules and the division level of sub-modules may have different forms without departing from the scope of the present disclosure.

[0023] In this patent document, nozzle and cleaning nozzle can be used interchangeably.

[0024] Figure 1 A side view of a cleaning machine apparatus for cleaning wafers is shown.

[0025] The cleaning machine equipment is specially used for cleaning wafers and is placed in the cleaning chamber of the stripping cleaning machine. Figure 1As shown, the cleaning machine equipment includes: a cleaning nozzle, used to spray cleaning liquid onto the wafer in the cleaning chamber; a CCD camera, which is installed on the cleaning nozzle and is used to identify the cross marks used for alignment on both sides of the wafer; a swing arm, one end of which is connected to the cleaning nozzle, used to support and swing the cleaning nozzle; a drive motor, connected to the swing arm, used to drive the swing arm to adjust the position of the cleaning nozzle and the CCD camera.

[0026] Figure 2 A top view of a cleaning machine apparatus for cleaning wafers is shown.

[0027] like Figure 2 As shown, during the cleaning process, after the wafer reaches the cleaning chamber, the swing arm starts to swing. If the CCD camera recognizes that the cross mark is not in the center, the control system controls the drive motor to adjust the nozzle and CCD camera so that the cross mark is in the center. After the recognition is completed, the nozzle starts to spray liquid until the cross mark on the other side is recognized, and then stops spraying liquid. If the cross mark on the other side cannot be recognized, an alarm is issued. When the swing arm returns to its position, the above-mentioned operations are repeated, that is, the cross mark is recognized, the cross mark is controlled to be located in the center of the CCD camera, and the liquid is sprayed.

[0028] Figure 3 A diagram showing the effect of the CCD camera alignment cross mark.

[0029] like Figure 3 As shown, the CCD camera recognizes the cross mark on one side of the wafer. If the cross mark is in the center position, the recognition is completed. If it is not in the center position, the drive motor drives the module to make the cross mark in the center position.

[0030] The following combination Figures 1 to 3 Describe the cleaning process and working principle of the cleaning machine equipment.

[0031] 1. The arm swings, and the CCD camera identifies the cross mark on one side of the wafer. If the cross mark is in the center, the identification is complete. If the cross mark is not in the center, the drive motor drives the module to make the cross mark in the center.

[0032] 2. After the recognition is completed, the cleaning nozzle sprays liquid and the swing arm continues to swing until the cross mark on the other side of the wafer is recognized, and then the spraying stops. If the cross mark on the other side cannot be recognized, it means that the swing arm is not enough to make the cleaning nozzle pass through the wafer or the nozzle position is greatly offset, and the information needs to be fed back to the machine's alarm system to generate an alarm message.

[0033] According to an embodiment of the present utility model, preferably:

[0034] 1. The CCD camera and the cleaning nozzle can be formed into one module;

[0035] 2. The material and style of the cleaning nozzle and the swing arm can remain unchanged, the CCD camera and the nozzle can be formed into one module, and a drive motor can be added to the swing arm;

[0036] 3. Make fixed cross marks for alignment on the wafer platforms on both sides of the wafer in the cleaning chamber.

[0037] According to the present application, during each cleaning process, the cleaning nozzle will pass through the center point of the wafer, and the movement path of the swing arm can also pass through the entire wafer, thereby preventing insufficient wafer cleaning and reduced yield due to cleaning nozzle position offset and swing arm position failure.

[0038] Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. The present disclosure is intended to encompass such changes and modifications as fall within the scope of the appended claims.

[0039] Any description in this application should not be construed as implying that any particular element, step, or function is an essential element that must be included in the claims scope. The scope of the patented subject matter is limited solely by the claims.

Claims

1. A stripping cleaning machine device for cleaning wafers, placed in a cleaning chamber of the stripping cleaning machine, characterized in that: The stripping and cleaning machine equipment comprises: A cleaning nozzle is used to spray cleaning liquid onto the wafer in the cleaning chamber; A CCD camera mounted on the cleaning nozzle to identify the cross marks on both sides of the wafer for alignment; A swing arm, one end of which is connected to the cleaning nozzle and is used to support and swing the cleaning nozzle; and A driving motor connected to the swing arm, used for driving the swing arm to adjust the position of the cleaning nozzle and the CCD camera; The stripping cleaning machine operates as follows: The swing arm starts to swing, and when the CCD camera recognizes that the cross mark on one side of the wafer is located at the center of the CCD camera, the cleaning nozzle is controlled to start spraying liquid, and when the CCD camera recognizes that the cross mark on one side of the wafer is not located at the center of the CCD camera, the drive motor is controlled to drive the swing arm to adjust the positions of the cleaning nozzle and the CCD camera so that the cross mark on one side of the wafer is located at the center of the CCD camera, and then the cleaning nozzle is controlled to start spraying liquid; and After the cleaning nozzle starts spraying liquid, the swing arm continues to swing to move the cleaning nozzle above the wafer. When the CCD camera recognizes the cross mark on the other side of the wafer, the cleaning nozzle is controlled to stop spraying liquid. When the CCD camera does not recognize the cross mark on the other side of the wafer, an alarm message is generated.

2. The stripping and cleaning machine according to claim 1, characterized in that: The cleaning nozzle and the CCD camera are formed into one module.

3. The stripping and cleaning machine according to claim 1, characterized in that: The driving motor is installed in the swing arm and is used to control the movement of the swing arm, the cleaning nozzle and the CCD camera.

4. The stripping cleaning machine according to any one of claims 1 to 3, characterized in that: Cross marks are fixed on wafer stages at both sides of the wafer in the cleaning chamber.

5. The stripping and cleaning machine according to claim 2, characterized in that: The driving motor is installed in the swing arm and is used to control the movement of the swing arm, the cleaning nozzle and the CCD camera.

6. The stripping and cleaning machine according to claim 2, characterized in that: Cross marks are fixed on wafer stages at both sides of the wafer in the cleaning chamber.

7. The stripping and cleaning machine according to claim 3, characterized in that: Cross marks are fixed on wafer stages at both sides of the wafer in the cleaning chamber.

8. The stripping and cleaning machine according to claim 5, characterized in that: Cross marks are fixed on wafer stages at both sides of the wafer in the cleaning chamber.

9. A stripping cleaning machine for cleaning wafers, characterized in that: The stripping cleaning machine according to any one of claims 1 to 8 is installed in the cleaning chamber.

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