Degumming, inserting and cleaning all-in-one machine tool

Abstract

The utility model provides a degumming, wafer inserting and cleaning all-in-one machine tool which is used in the technical field of silicon wafer production. Comprising a main plate, a conveying device, a pressing device, an angle adjusting assembly and a side spraying assembly. The transmission device comprises a driving wheel, a driven wheel and an auxiliary wheel and is rotationally connected with the main plate; the angle adjusting assembly comprises a wedge block and an inclined block; the side spraying assembly comprises a mounting base and a spraying head, and the nozzle section of the spraying head is gradually reduced in the liquid spraying direction. According to the utility model, the wedge block and the inclined block are added, so that the main plate has an inclined installation angle, and damage caused by scratching during steering of a silicon wafer is avoided; the wedge block and the inclined block are simple in structure, easy to process and manufacture and convenient to mount; and the structure of the nozzle is finely designed, so that the silicon wafer can be more effectively separated.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer production, and in particular relates to a tooling for a debonding wafer cleaning integrated machine. Background Art

[0002] Photovoltaic power generation, as a green energy and a major energy source for sustainable development of mankind, is increasingly valued and developed by countries around the world. With the development of silicon rod cutting technology, the price of raw materials has risen, and the requirements for silicon wafer quality have become higher and higher.

[0003] In silicon wafer production, a degumming wafer cleaning machine is usually used to degumming and clean silicon wafers. The existing degumming wafer cleaning machine adopts a vertical wafer, which can reduce labor costs and realize automated production. After the silicon wafer is separated in the water tank of the wafer inserter, it is transmitted upward by a silicon wafer transmission device and then enters a sponge wheel. Because the sponge wheel and the silicon wafer transmission device are located in different vertical planes, the silicon wafer is rapidly converted from a vertical state to an inner tilted state close to the sponge wheel during transmission, and the tail of the silicon wafer is tilted outward. When the silicon wafer specification is small, it is very easy to scratch the head of the next silicon wafer, resulting in the collapse of the adhesive surface angle or surface of the next silicon wafer, affecting the wafer yield and causing losses to the production enterprise. In addition, in order to ensure the stable transmission of the silicon wafer, the silicon wafer transmission device and the clamping device need to work together. In the existing degumming wafer cleaning machine, the silicon wafer transmission device and the clamping device are respectively controlled by two motors, which makes it difficult to keep the running speeds of the two consistent, and eventually inevitably leads to the collapse of the silicon wafer edge. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a debonding wafer cleaning all-in-one machine tool, which changes the transmission angle of the silicon wafer, avoids the silicon wafer from being scratched and damaged when it turns, and improves the wafer formation rate.

[0005] The technical solution adopted by the utility model is: a degumming insert cleaning all-in-one machine tool, including a main board, a transmission device and an angle adjustment component;

[0006] The transmission device is rotatably connected to the mainboard and is used for transmitting silicon wafers;

[0007] The angle adjustment assembly includes a wedge block, which is used to fix the mainboard to the main body of the degumming insert cleaning machine so that the mainboard has an inclined installation angle relative to the degumming insert cleaning machine to change the transmission angle of the silicon wafer.

[0008] Furthermore, the wedge block has a first surface and a second surface that are opposite and non-parallel; the angle between the first surface and the second surface is 3°-6°.

[0009] Furthermore, it also includes a pressing device, which is connected to the mainboard and is used to press the silicon wafer.

[0010] Furthermore, the transmission device comprises a driving wheel, a driven wheel and an auxiliary wheel, and the driving wheel is connected to the driven wheel through a transmission belt.

[0011] Furthermore, the wheel axle of the clamping device, the wheel axle of the driving wheel and the wheel axle of the driven wheel all pass through two opposite side end surfaces of the main board.

[0012] Furthermore, a through hole is provided between the first surface and the second surface, and a connecting piece is provided in the hole.

[0013] Furthermore, it also includes a side spray assembly; the side spray assembly includes a mounting seat and a spray head;

[0014] The mounting seat is connected to the main board via an inclined block, and includes a water absorber for sucking liquid in the insert slot;

[0015] The inclined block has mounting surfaces parallel to the first surface and the second surface respectively.

[0016] The nozzle cross section of the nozzle gradually decreases along the liquid spraying direction; the nozzle is densely and evenly provided with a plurality of spray holes;

[0017] The nozzle comprises a lower nozzle and an upper nozzle arranged along the transmission direction of the silicon wafer; the upper nozzle and the lower nozzle are respectively arranged at two ends of the mounting seat facing each other and are connected to the water absorber of the mounting seat;

[0018] The hole length of the nozzle hole for the lower spray is smaller than the hole length of the nozzle hole for the upper spray.

[0019] Further, the length of the channel of the upper side spray is 25mm-40mm, and the length of the channel of the lower side spray is 20mm-25mm;

[0020] The number of the nozzle holes for spraying on the upper side is greater than that of the nozzle holes for spraying on the lower side;

[0021] The nozzle holes for spraying on the upper side are closer to the main board than the nozzle holes for spraying on the lower side;

[0022] The diameter of the nozzle hole of the lower nozzle close to the main board is larger than the diameter of the nozzle hole of the lower nozzle far from the main board.

[0023] Furthermore, the inclined block is arranged on a side of the main board close to an entrance end of the transmission device.

[0024] Furthermore, the nozzle is provided with a cleaning hole and a cavity connected to the channel for containing the liquid; the cleaning hole is communicated with the cavity for cleaning the cavity; a detachable sealing body is provided in the cleaning hole.

[0025] The advantages and positive effects of the utility model are:

[0026] 1. On the basis of the original equipment, wedges and inclined blocks are added to make the mainboard tilt to one side on the original basis, changing the transmission angle of the silicon wafer, avoiding the scratches and damages of the silicon wafer when it enters the next process, and improving the wafer yield;

[0027] 2. The wedge block and the fixed block have simple structures, are easy to process and manufacture, and are easy to install;

[0028] 3. Through fine design of the nozzle structure and improvement of the upper and lower side sprays, the nozzle has a smaller volume and a greater spray pressure, which can more effectively separate the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a specific implementation of the utility model;

[0030] Figure 2 It is a side view of a wedge block of a specific implementation of the utility model;

[0031] Figure 3 This is a front view of a wedge block of a specific implementation of the utility model.

[0032] Figure 4 It is a side view of an inclined block of a specific implementation of the utility model;

[0033] Figure 5 It is a front view of an inclined block of a specific implementation of the utility model;

[0034] Figure 6 It is a schematic diagram of a nozzle structure of a specific implementation of the utility model;

[0035] Figure 7 It is a front view of a lower side spray structure of a specific implementation of the utility model;

[0036] Figure 8 It is a top view of a nozzle structure of a specific implementation of the utility model.

[0037] In the figure:

[0038] 10. Main board 20. Transmission device 21. Driving wheel

[0039] 22, driven wheel 23, auxiliary wheel 30, angle adjustment assembly

[0040] 31, wedge block 32, inclined block 40, clamping device

[0041] 50. Degumming insert cleaning machine body 60. Conveyor belt 70. Side spray assembly

[0042] 71. Mounting seat 72. Sprinkler head 721. Nozzle

[0043] 722, spray hole 723, cavity 724, cleaning hole

[0044] 73, upper side spray 74, lower side spray 80, silicon wafer DETAILED DESCRIPTION

[0045] The embodiments of the present utility model are described below in conjunction with the accompanying drawings.

[0046] First of all, it should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0047] The drawings of this specification are schematic diagrams, which assist in explaining the concept of this application and schematically show the shapes of various parts and their mutual relationships. Please note that in order to clearly show the structures of various components of the embodiments of this application, the drawings are not drawn according to the same scale. The same reference numerals are used to represent the same parts.

[0048] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6As shown, the utility model proposes a degumming insert cleaning all-in-one machine tool, including a main board 10, a transmission device 20 and an angle adjustment component 30; wherein the main board 10 has an adsorption hole to adsorb the silicon wafer 80; the transmission device 20 is rotatably connected to the main board 10, and is used to transmit the silicon wafer 80; the angle adjustment component 30 includes a wedge block 31, and the wedge block 31 is used to fix the main board 10 to the degumming insert cleaning all-in-one machine body 50, so that the main board 10 has an inclined installation angle relative to the degumming insert cleaning all-in-one machine body 50, so as to change the transmission angle of the silicon wafer 80.

[0050] In the prior art, the mainboard 10 of the degumming insert cleaning machine is usually fixed to the degumming insert cleaning machine body 50 in the vertical direction; during use, the mainboard 10 and the transmission device 20 are in a liquid environment, and the negative pressure of the liquid flow is used to adsorb the silicon wafer 80, so that the silicon wafer 80 is transmitted from bottom to top along the transmission device 20. The inventors of the present application discovered that, in the process of upward transmission of the silicon wafer 80 to the sponge wheel of the next process, because the transmission plane of the sponge wheel and the transmission plane of the silicon wafer 80 on the transmission device 20 are not on the same plane, the transmission direction of the silicon wafer 80 changes, and the silicon wafer 80 tilts to the side close to the sponge wheel. At this time, the silicon wafer 80 rotates, and its tail is tilted to the other side, which is easy to collide or scratch with the next silicon wafer 80, thereby causing damage to the silicon wafer 80; in this embodiment, by providing a wedge block 31, the main board 10 has an inclined installation angle, without changing the original structure of the degumming insert cleaning all-in-one machine body 50, the main board 10 is transformed from a vertical state to an inclined state along a fixed angle, thereby changing the transmission angle of the silicon wafer 80, achieving a reduction in the rotation angle of the silicon wafer 80 in the process of entering the sponge wheel, thereby avoiding the phenomenon of scratching with the next silicon wafer 80 and causing damage.

[0051] In this embodiment, if Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the wedge block 31 has a first surface and a second surface that are relative and non-parallel; the angle between the first surface and the second surface is 3°-6°. Specifically, the first surface of the wedge block 31 is attached to the main board 10, and the second surface is attached to the main body 50 of the debonding insert cleaning machine, so that the installation angle of the main board 10 is changed. The inventor of the present application found that when the installation angle of the main board 10 is inclined 3°-6° toward the side close to the sponge wheel, it can effectively prevent the silicon wafer 80 from scratching the next silicon wafer 80 when entering the sponge wheel. When the installation angle is less than this range, the effect of preventing the silicon wafer 80 from scratching is not obvious, and when the installation angle is greater than this range, it will affect the stable transmission of the silicon wafer 80.

[0052] In a preferred embodiment, the angle between the first surface and the second surface of the wedge block 31 is 5°, that is, when the main board 1 and the transmission device 2 are installed at an angle of 5° to the vertical direction, while preventing the silicon wafer 80 from being scratched, it can have good transmission and compression effects and has little impact on other functional structures.

[0053] In a specific embodiment, the wedge block 31 includes relative vertical surfaces and inclined surfaces, the inclined surface is the first surface, and the vertical surface is the second surface. The cross-sectional shape of the wedge block 31 along its thickness direction is a trapezoid, and also includes an upper end surface and a lower end surface that are parallel to each other, so that the wedge block 31 is easier to process and manufacture.

[0054] like Figure 1 As shown, in a preferred embodiment, the debonding insert cleaning integrated machine tool proposed by the utility model also includes a clamping device 40, which is connected to the main board 10 and is used to clamp the silicon wafer 80, and its position is set above the transmission device 20.

[0055] Furthermore, the transmission device 20 includes a driving wheel 21, a driven wheel 22 and an auxiliary wheel 23. The driving wheel 21 is connected to the driven wheel 22 through a transmission belt to drive the silicon wafer 80 to move upward. At the same time, the auxiliary wheel 23 rotates under the drive of the silicon wafer 80 to assist the silicon wafer 80 to move upward.

[0056] The pressing device 40 in this embodiment enables the silicon wafer 80 to be closely attached to the conveying belt 60 during the upward conveying process, thereby preventing the silicon wafer 80 from moving and falling off.

[0057] In a specific implementation, the main board 10 of the utility model has a certain length along the transmission direction of the silicon wafer 80, and the axle of the driving wheel 21 and the axle of the driven wheel 22 pass through the two side end surfaces of the main board 10 respectively. It can be understood that the axles of the two are arranged in parallel. In other words, the motor drives the driving wheel 21 to rotate, and the driving wheel 21 drives the driven wheel 22 to rotate. The silicon wafer 80 is adsorbed on the transmission belt 60 and moves upward with the assistance of the auxiliary wheel 23, and remains stable during the transmission process. The specific structure of the transmission belt 60 is a common setting in the technical field, and will not be repeated here.

[0058] In this embodiment, the first surface and the second surface of the wedge block 31 are provided with through holes, and the main board 10 is provided with corresponding holes. The main board 10 is fixed to the debonding insert cleaning machine body 50 by arranging a connecting piece passing through the hole; preferably, the connecting piece is a bolt, so that the wedge block 31 can be detachably connected.

[0059] like Figure 1As shown, in a preferred embodiment, a debonding insert cleaning integrated machine tool proposed by the utility model also includes a side spray assembly 70, and the side spray assembly 70 is installed on the main board 10 through the inclined block 32 of the angle adjustment assembly 30; because the wedge block 31 changes the installation angle of the main board 10, if the side spray assembly 70 is directly installed on the main board 10, the spraying angle of the side spray assembly 70 will also change, thereby affecting the spraying effect of the side spray assembly 70. Therefore, by setting the inclined block 32, the spraying angle of the side spray assembly 70 does not change, thereby ensuring that the side spray assembly 70 has a good effect of separating silicon wafers.

[0060] Specifically, the inclined block 32 has mounting surfaces parallel to the first surface and the second surface of the wedge block 31, respectively, and the mounting surface parallel to the first surface of the wedge block 31 is attached to the main board 10, and the mounting surface parallel to the second surface of the wedge block 31 is attached to the side spray assembly 70, so that the side spray assembly 70 can maintain its original mounting angle; when in use, the silicon wafer 80 still enters the transmission device 20 along its original direction, because the transmission device 20 and the main board 10 both have an inclined mounting angle, and the direction in which the silicon wafer 80 enters is also formed between the transmission device 20 The angle is formed, one of the silicon wafers 80 is attached to the main board 10 under the adsorption effect of the main board 10, and is transmitted upward under the drive of the transmission device 20; but the other silicon wafers 80 arranged behind it still maintain their original posture when entering, and the side spray assembly 70 is required to separate them from the previous silicon wafer 80; at this time, by setting the inclined block 32, the spraying direction of the side spray assembly 70 will not change, and the nozzle 72 of the side spray assembly 70 can still spray perpendicular to the silicon wafer 80, thereby effectively separating the silicon wafers 80 entering later one by one.

[0061] It is understandable that the mounting surface of the inclined block 32 also has a through hole, and is detachably connected to the main board 10 and the side spray assembly 70 via a connecting piece.

[0062] Furthermore, the side spray assembly 70 is used to separate the silicon wafer 80, such as Figure 6 , Figure 7 , Figure 8 As shown, the side spray assembly 70 includes a mounting seat 71 and a spray head 72; the mounting seat 71 is detachably connected to the inclined block 32, and the spray head 72 is disposed at two ends of the mounting seat 71 facing each other, and is used to separate the silicon wafer 80 transmitted by the belt, while ensuring that the silicon wafer 80 does not deviate to one side; the cross section of the nozzle 721 of the spray head 72 gradually decreases along the liquid spraying direction.

[0063] In the present application, the cross-section of the nozzle 721 of the nozzle 72 is designed to be a gradually decreasing shape along the liquid spraying direction, so that the water pressure in the nozzle 72 is increased without changing the original water pump pressure, so that the liquid has a greater impact force and can separate the silicon wafer 80 more effectively; at the same time, this shape makes the nozzle 72 have a smaller volume, which is easier to install and cooperates well with other components of the degumming insert cleaning machine.

[0064] In this embodiment, in addition to being used to install the side spray assembly 70, the mounting seat 71 also has the functions of absorbing and spraying water. The mounting seat 71 is provided with a water absorber, which is connected to the nozzle 72. The liquid in the insert slot is sucked into the nozzle 72 and sprayed out through the nozzle 721. The nozzles 72 arranged opposite to each other keep the silicon wafer 80 located on the transmission device 20 in the middle position and will not deviate to one side.

[0065] In a specific embodiment, the inclined block 32 is arranged on one side of the main board 10 close to the entrance end of the transmission device 20, and then the mounting seat 71 is fixed at a position close to the entrance end of the transmission device 20, so as to better realize the separation of the silicon wafer 80 by the side spray assembly 70; the side spray assembly 70 includes a plurality of nozzles 72, and the nozzles 72 include an upper side spray 73 and a lower side spray 74. The upper side spray 73 and the lower side spray 74 are both arranged at both ends of the mounting seat 71 opposite to each other, and liquid is sprayed toward the silicon wafer 80 located on the transmission device 20 to separate the silicon wafer 80; specifically, the liquid pressure sprayed by the relative upper side spray 73 is the same to prevent the silicon wafer 80 from tilting to one side, and the liquid pressure of the relative lower side spray 74 is also the same.

[0066] In this embodiment, the lower side spray 74 and the upper side spray 73 are arranged along the transmission direction of the silicon wafer 80, that is, the silicon wafer 80 passes through the lower side spray 74 first and then the upper side spray 73 during the transmission process; the upper side spray 73 and the lower side spray 74 are densely provided with a plurality of spray holes 722, so that the liquid can be sprayed more evenly; wherein the lower side spray 74 is used to pre-separate the silicon wafer 80 and maintain the angle of the silicon wafer 80, and the main board 10 at its installation position cannot be provided with a water absorption hole, so the channel length of the spray hole 722 of the lower side spray 74 is smaller than the hole length of the spray hole 722 of the upper side spray 73 The nozzle 721 is further away from the silicon wafer 80, and the distance between the nozzle hole 722 of the lower nozzle 74 and the mainboard 10 is smaller than that of the upper nozzle 73, so as to avoid blowing the silicon wafer 80 away from the transmission device 20 due to its too close distance to the mainboard 10 and the silicon wafer 80; at the same time, the number of the nozzle holes 722 of the upper nozzle 73 is greater than the nozzle holes 722 of the lower nozzle 74, and it is closer to the mainboard 10 than the nozzle holes 722 of the lower nozzle 74. When the first silicon wafer 80 is adsorbed on the mainboard 10, the subsequent silicon wafers 80 can be separated more effectively, so as to realize the transmission of the silicon wafers 80 one by one.

[0067] In a preferred embodiment, the channel length of the spray hole 722 of the upper spray 73 is 25mm-40mm, and the channel length of the spray hole 722 of the lower spray 74 is 20mm-25mm. At the same time, the channel length of the spray hole 722 of the lower spray 74 is smaller than the channel length of the spray hole 722 of the upper spray 73.

[0068] In a preferred embodiment, Figure 7 As shown, the aperture of the spray hole 722 of the lower side spray 74 close to the main board 10 is larger than the spray hole 722 far away from the main board 10, so that the pressure of the liquid sprayed by the lower side spray 74 becomes smaller as it gets closer to the main board 10, so as to avoid affecting the silicon wafer 80 entering the transmission device 20 and being adsorbed by the main board 10, while having a good separation effect on the silicon wafer 80 entering later.

[0069] In a specific embodiment, the number of nozzle holes 722 of the upper nozzle 73 is greater than the number of nozzle holes 722 of the lower nozzle 74, ensuring that the upper nozzle 73 can effectively separate the silicon wafer 80 and transfer the silicon wafer 80 adsorbed on the mainboard 1 upward to avoid stacking.

[0070] Furthermore, if Figure 6 , Figure 7 , Figure 8 As shown, the nozzle 72 is provided with a cleaning hole 724 and a cavity 723 connected to the hole, the cavity 723 is used to contain liquid; the cleaning hole 724 is connected to the cavity 723 and is used to clean the cavity 723; a removable sealing body is provided in the cleaning hole 724; in this embodiment, the bottom end of the nozzle 72 is the entrance end of the liquid, the cleaning hole 724 is arranged at the upper part of the nozzle 72, and is connected to the cavity 723, and the cleaning tool can enter the cavity 723 through the cleaning hole 724 more conveniently to clean the inside of the cavity 723.

[0071] In a preferred embodiment, the wedge block 31 is made of metal material and has good rigidity, so that the connection between the main board 10 and the degumming insert cleaning machine body 50 is more stable. At the same time, the inclined block 32 is made of polymer material and has a certain flexibility, so that the mounting seat 71 is fixed to the main board 10 without being easily worn.

[0072] The advantages and positive effects of the utility model are:

[0073] 1. On the basis of the original equipment, wedges and inclined blocks are added to make the mainboard tilt to one side on the original basis, changing the transmission angle of the silicon wafer, avoiding the scratches and damages of the silicon wafer when it enters the next process, and improving the wafer yield;

[0074] 2. The wedge block and the fixed block have simple structures, are easy to process and manufacture, and are easy to install;

[0075] 3. Through fine design of the nozzle structure and improvement of the upper and lower side sprays, the nozzle has a smaller volume and a greater spray pressure, which can more effectively separate the silicon wafers.

[0076] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A degumming insert cleaning machine tool, characterized by: It includes a main board, a transmission device and an angle adjustment component; The transmission device is rotatably connected to the main board and is used to transmit silicon wafers; The angle adjustment assembly includes a wedge block, which is used to fix the mainboard to the main body of the degumming insert cleaning machine so that the mainboard has an inclined installation angle relative to the degumming insert cleaning machine to change the transmission angle of the silicon wafer.

2. The degumming insert cleaning integrated machine tool according to claim 1, characterized in that: The wedge block has a first surface and a second surface that are opposite and non-parallel; the angle between the first surface and the second surface is 3°-6°.

3. The integrated degumming insert cleaning machine according to claim 1 or 2, characterized in that: It also includes a pressing device, which is connected to the mainboard and is used to press the silicon wafer.

4. The integrated degumming insert cleaning machine according to claim 3, characterized in that: The transmission device comprises a driving wheel, a driven wheel and an auxiliary wheel, and the driving wheel is connected with the driven wheel through a transmission belt.

5. The degumming insert cleaning integrated machine tool according to claim 4, characterized in that: The wheel axle of the clamping device, the wheel axle of the driving wheel and the wheel axle of the driven wheel all pass through two opposite side end surfaces of the main board.

6. The integrated degumming insert cleaning machine according to claim 2, characterized in that: A through hole is provided between the first surface and the second surface, and a connecting piece is provided in the hole.

7. The integrated degumming insert cleaning machine according to claim 2, characterized in that: Also included is a side spray assembly; the side spray assembly includes a mounting seat and a spray head; The mounting seat is connected to the main board via an inclined block, and includes a water absorber for sucking liquid in the insert slot; The inclined block has mounting surfaces respectively parallel to the first surface and the second surface; The nozzle cross section of the nozzle gradually decreases along the liquid spraying direction; the nozzle is densely and evenly provided with a plurality of spray holes; The nozzle comprises a lower nozzle and an upper nozzle arranged along the transmission direction of the silicon wafer; the upper nozzle and the lower nozzle are respectively arranged at two ends of the mounting seat facing each other and are connected to the water absorber of the mounting seat; The hole length of the nozzle hole for the lower spray is smaller than the hole length of the nozzle hole for the upper spray.

8. The integrated degumming insert cleaning machine according to claim 7, characterized in that: The length of the hole of the upper spray is 25mm-40mm, and the length of the hole of the lower spray is 20mm-25mm; The number of the nozzle holes for spraying on the upper side is greater than that of the nozzle holes for spraying on the lower side; The nozzle holes for spraying on the upper side are closer to the main board than the nozzle holes for spraying on the lower side; The diameter of the nozzle hole of the lower nozzle close to the main board is larger than the diameter of the nozzle hole of the lower nozzle far from the main board.

9. The integrated degumming insert cleaning machine according to claim 7, characterized in that: The inclined block is arranged on one side of the main board close to the entrance end of the transmission device.

10. The integrated degumming insert cleaning machine according to claim 7, characterized in that: The nozzle is provided with a cleaning hole and a cavity connected to the channel for containing the liquid; the cleaning hole is communicated with the cavity for cleaning the cavity; a detachable sealing body is provided in the cleaning hole.

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