Light and thin heat dissipation device for equipment chip

Abstract

The utility model relates to a light and thin heat dissipation device for an equipment chip, which comprises a main board, a heat dissipation module and a heat dissipation module, the heat dissipation assembly comprises a fixing frame and a heat conduction plate, tooth grooves are formed in the edge of the fixing frame, tooth plates are arranged on the side face of the heat conduction plate and pasted in the tooth grooves, and the fixing frame is pasted on the surface of the chip; the light and thin heat dissipation device for the equipment chip is small in occupied space, reduces the gluing area, and reduces the influence of gluing on heat conduction.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip heat dissipation, in particular to a light and thin heat dissipation device for equipment chips. Background Art

[0002] In order to improve the working efficiency of electrical devices used in today's social life, such as solid-state drives, optical modules, laser TVs, communication base stations, TVs, electric vehicles, etc., one or more chips are built in to play the role of control and caching. A large amount of heat will be generated during the operation of the electrical equipment. This heat needs to be dissipated in time, otherwise it will cause the temperature of the electrical equipment to be too high, thereby affecting the performance of the electrical equipment.

[0003] The heat dissipation structure in existing electrical equipment is mostly an aluminum extrusion structure. The traditional aluminum extrusion heat dissipation structure has low heat dissipation efficiency, slow heat transfer, large thermal resistance, and uneven heat transfer. When the hard disk reads and writes data for a long time, the heat of the chip cannot be dissipated in time. Therefore, the temperature of the electrical equipment will be extremely high, affecting the normal operation of the electrical equipment and even burning the electrical equipment. In addition, the traditional aluminum extrusion heat dissipation structure is large in size and thick in thickness, and cannot be installed in thinner products, so the scope of application is limited. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and utility model name of this application to avoid blurring the purpose of this section, specification abstract and utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the following technical problems in the prior art: the existing heat dissipation mechanism occupies a large space.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a light and thin heat dissipation device for device chips, comprising:

[0007] A mainboard, on which a chip is arranged;

[0008] The heat dissipation component includes a fixed frame and a heat conducting plate, a tooth groove is arranged at the edge of the fixed frame, a tooth plate is arranged on the side of the heat conducting plate, the tooth plate is pasted in the tooth groove, and the fixed frame is pasted on the surface of the chip.

[0009] As an optimal technical solution for a light and thin heat dissipation device for device chips, a placement groove is provided on one side of the heat conducting plate.

[0010] As an optimal technical solution for a light and thin heat dissipation device for device chips, an empty groove is provided in the middle of the fixed frame, and the heat conducting plate is placed in the empty groove.

[0011] As a preferred technical solution for a thin and light heat dissipation device for device chips, the thickness of the tooth plate is less than the depth of the tooth socket.

[0012] As an optimal technical solution for a light and thin heat dissipation device for device chips, it also includes a heat dissipation plate, which is embedded in the placement groove.

[0013] As an optimal technical solution for a light and thin heat dissipation device for device chips, the heat dissipation plate is also provided with heat dissipation grooves.

[0014] Beneficial effects of the utility model: the light and thin heat dissipation device for device chips of the utility model occupies a small space, reduces the adhesive area, and reduces the influence of the adhesive on heat conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0016] Figure 1 It is a schematic diagram of the overall combined structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the overall explosion structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the heat dissipation plate of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the fixed frame and the heat conducting plate in the utility model.

[0020] Figure numerals: main board 100, chip 101, heat dissipation assembly 200, fixing frame 201, heat conducting plate 202, tooth socket 201a, tooth plate 202a, placement groove 202b, empty groove 201b, heat dissipation plate 203, heat dissipation groove 203a. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0024] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0025] Example 1

[0026] Reference Figure 1 to Figure 4 , This embodiment provides a light and thin heat dissipation device for a device chip, including a mainboard 100, on which a chip 101 is arranged;

[0027] The heat dissipation component 200 includes a fixed frame 201 and a heat conducting plate 202. A tooth groove 201a is arranged at the edge of the fixed frame 201, a tooth plate 202a is arranged on the side of the heat conducting plate 202, the tooth plate 202a is pasted in the tooth groove 201a, and the fixed frame 201 is pasted on the surface of the chip 101; an empty groove 201b is arranged in the middle of the fixed frame 201, and the heat conducting plate 202 is placed in the empty groove 201b.

[0028] Specifically, the fixed frame 201 is fixed to the surface of the chip 101 by gluing, and the heat conducting plate 202 is arranged close to the surface of the chip 101; the fixed frame 201 is a frame structure, and the bottom surface of the fixed frame 201 is glued to the edge of the surface of the chip 101, and a groove 201a is arranged at the bottom of the fixed frame 201, which reduces the gluing area, avoids affecting the heat dissipation due to the large gluing part, and ensures that the frame structure will not completely seal the top of the chip.

[0029] The thickness of the tooth plate 202a is less than the depth of the tooth groove 201a, so that the edge of the chip 101 is not sealed, leaving space for natural heat dissipation.

[0030] Furthermore, a placement groove 202 b is provided on one side of the heat conducting plate 202 ; a heat dissipation plate 203 is also included, and the heat dissipation plate 203 is embedded in the placement groove 202 b ; and a heat dissipation groove 203 a is also provided on the heat dissipation plate 203 .

[0031] Specifically, the heat conducting plate 202 can be heat conducting silicone. The heat conducting plate 202 is arranged close to the chip surface 101 to conduct the heat of the chip 101 to the heat dissipation plate 203. The heat dissipation plate 203 has a heat conducting medium inside. A cooling plate is arranged in the heat dissipation groove 203a. Specifically, the working medium absorbs heat and vaporizes, and condenses and exchanges heat when it contacts the cooling plate in the heat dissipation groove 203a.

[0032] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0033] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A light and thin heat dissipation device for a device chip, characterized in that: include, A main board (100), wherein a chip (101) is arranged on the main board (100); A heat dissipation component (200), the heat dissipation component (200) comprising a fixed frame (201) and a heat conducting plate (202), a tooth groove (201a) being provided at the edge of the fixed frame (201), a tooth plate (202a) being provided on the side of the heat conducting plate (202), the tooth plate (202a) being adhered to the tooth groove (201a), and the fixed frame (201) being adhered to the surface of the chip (101).

2. The light and thin heat dissipation device for device chips according to claim 1, characterized in that: A placement groove (202b) is provided on one side of the heat conduction plate (202).

3. The light and thin heat dissipation device for device chips according to claim 2, characterized in that: An empty slot (201b) is provided in the middle of the fixed frame (201), and the heat conducting plate (202) is placed in the empty slot (201b).

4. The light and thin heat dissipation device for device chips according to claim 3, characterized in that: The thickness of the tooth plate (202a) is less than the depth of the tooth socket (201a).

5. The light and thin heat dissipation device for device chips according to claim 4, characterized in that: It also includes a heat dissipation plate (203), wherein the heat dissipation plate (203) is embedded in the placement groove (202b).

6. The light and thin heat dissipation device for device chips according to claim 5, characterized in that: The heat dissipation plate (203) is also provided with a heat dissipation groove (203a).

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