Surface-mounted infrared receiving head with high shielding performance

Abstract

A patch type infrared receiving head with high shielding performance comprises a support (1) with pins, the support (1) is provided with an IC chip and is connected with the pins of the support (1) through leads, the support (1) and a packaging colloid (2) are integrally formed through injection molding, the support (1) extends upwards to form a bent shielding cover (11), the two sides of the shielding cover (11) are provided with bent sections (12), and the bent sections (12) are connected with the IC chip. The packaging colloid (2) is externally provided with at least one light condensation structure (3) which is connected and molded with the packaging colloid (2). The utility model has the advantages that: 1, the integrated molding design is adopted, so that the product size and the support cost can be optimized, the air tightness of the product is better, and the performance is more stable;

Description

Technical Field

[0001] The utility model relates to the field of infrared receivers, in particular to a patch type infrared receiver head with high shielding performance. Background Art

[0002] At present, infrared receivers are products that are packaged with photosensitive chips and ICs. They are used to receive infrared signals and are widely used in remote control devices for home audio and video, home appliances and other electronic devices. With the advent of the intelligent era, product requirements are becoming more and more intelligent, product size requirements are becoming smaller and smaller, performance requirements are becoming higher and higher, and production operations are becoming more and more automated. How to adapt to market demand and develop new products is a problem currently faced by infrared receiver manufacturers. Utility Model Content

[0003] The purpose of the utility model is to provide a patch type infrared receiving head with high shielding performance to solve the above-mentioned shortcomings.

[0004] The utility model comprises a bracket with pins, an IC chip is arranged on the bracket and connected with the pins of the bracket through leads, the bracket and the packaging colloid are integrally formed by injection molding, and the characteristics are as follows:

[0005] The bracket extends upward to form a bent shielding cover, and the shielding cover has bent sections on both sides.

[0006] At least one light-gathering structure connected with the encapsulating colloid is arranged outside the encapsulating colloid.

[0007] The shielding cover and the bent sections on both sides of the shielding cover cover three sides of the IC chip.

[0008] The light-focusing structure is a semicircular or semi-elliptical structure.

[0009] The light focusing structure and the packaging colloid are integrally formed.

[0010] The light-concentrating structure is one and is located on the top of the encapsulation colloid, or the light-concentrating structure is two and is located on the top and one side.

[0011] The utility model has the following advantages:

[0012] 1. The one-piece molding design can optimize the product size and bracket cost, and the product has better air tightness and more stable performance.

[0013] 2. The shielding cover of the bracket and the bent sections on both sides of the shielding cover can shield the IC surface over a large area, effectively shield external visible light, and reduce the interference of light on the IC itself.

[0014] 3. The focusing structure is encapsulated with epoxy resin into a semicircular or semi-elliptical structure, which has a good focusing effect and can increase the receiving sensitivity and receiving distance; and the epoxy resin is added with a visible light shielding infrared colorant, which can effectively improve the product's anti-interference ability and the product's sensitivity and receiving ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model.

[0016] Figure 2 It is a schematic diagram of the bracket structure.

[0017] Figure 3 It is a schematic diagram of the focusing structure. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0021] In the description of the embodiments of the present invention, it should be noted that if the terms "upper", "lower", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of the invention is usually placed when in use. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, if the terms "first", "second", etc. appear in the description of the present invention, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0022] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] like Figure 1-2 As shown, a patch-type infrared receiving head with high shielding performance includes a bracket 1 with pins, an IC chip is arranged on the bracket 1 and connected to the pins of the bracket 1 through leads, and the bracket 1 and the packaging colloid 2 are integrally formed by injection molding.

[0024] The bracket 1 extends upward with a bent shielding cover 11, and the shielding cover 11 has bent sections 12 on both sides. The shielding cover 11 with the bracket 1 and the bent sections 12 on both sides of the shielding cover 11 can shield the IC surface over a large area, effectively shield external visible light, and reduce the interference of light on the IC itself.

[0025] At least one light-gathering structure 3 connected to the encapsulating colloid 2 is disposed outside the encapsulating colloid 2 .

[0026] Furthermore, the shielding cover 11 and the bent sections 12 on both sides of the shielding cover 11 cover three sides of the IC chip. The focusing structure 3 is encapsulated by epoxy resin into a semicircular or semi-elliptical structure, which has a good focusing effect and can increase the receiving sensitivity and receiving distance.

[0027] Furthermore, the light-focusing structure 3 is a semicircular or semi-elliptical structure.

[0028] Furthermore, the light focusing structure 3 and the packaging colloid 2 are integrally formed.

[0029] like Figure 3 As shown, further, the light-concentrating structure 3 is one and is located on the top of the encapsulation colloid 2, or the light-concentrating structure 3 is two and is located on the top and one of the sides.

[0030] When the focusing structure 3 is increased, the focusing range can be increased, the focusing effect can be improved, and the receiving sensitivity and receiving distance can be increased.

Claims

1. A patch-type infrared receiving head with high shielding performance, comprising a bracket (1) with pins, an IC chip is arranged on the bracket (1) and connected to the pins of the bracket (1) through leads, the bracket (1) and the packaging colloid (2) are integrally formed by injection molding, characterized in that The bracket (1) is provided with a bent shielding cover (11) extending upwards, and the shielding cover (11) has bent sections (12) on both sides. At least one light-gathering structure (3) connected and formed with the encapsulating colloid (2) is arranged outside the encapsulating colloid (2).

2. A patch-type infrared receiving head with high shielding performance according to claim 1, characterized in that: The shielding cover (11) and the bent sections (12) on both sides of the shielding cover (11) cover three sides of the IC chip.

3. A patch-type infrared receiving head with high shielding performance according to claim 1, characterized in that: The light-focusing structure (3) is a semicircular or semi-elliptical structure.

4. A patch-type infrared receiving head with high shielding performance according to claim 1, characterized in that: The light-focusing structure (3) and the packaging colloid (2) are integrally formed.

5. The high-shielding performance patch-type infrared receiving head according to claim 1, characterized in that: The light-concentrating structure (3) is one and is located on the top of the encapsulating colloid (2), or the light-concentrating structure (3) is two and is located on the top and one of the sides.

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