Laser light source device of VCSEL chip

Abstract

The utility model provides a laser light source device of a VCSEL chip. The laser light source device comprises a light source chip, a packaging support, a structural support and an optical lens. The structural support is an integrally-formed non-metal support and is provided with a hollow channel extending in the axial direction, a first port and a second port, and the first port and the second port are oppositely arranged. The light source chip is a VCSEL chip, the packaging support packages the light source chip and then is fixedly arranged at the first port of the structural support, the optical lens is fixedly arranged at the second port of the structural support, and light emitted by the light source chip passes through the hollow channel and penetrates through the optical lens to be emitted out, so that the manufacturing cost can be remarkably saved, and the manufacturing difficulty can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of light source technology, and specifically relates to a laser light source device of a VCSEL chip. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the application that are recited in the claims. No description herein is admitted to be prior art by inclusion in this section.

[0003] LiDAR is widely used in machine vision, industrial inspection, autonomous driving and other fields. As the application scenarios become more and more extensive, the demand for LiDAR has increased significantly, and the demand for performance improvement and cost reduction of lasers, the key components of LiDAR, has also increased.

[0004] Generally speaking, the lasers in consumer-grade LiDAR modules are mainly divided into two categories: point lasers and line lasers. Currently, both types of lasers on the market use the same chip packaging and structural assembly solutions, which are expensive in terms of both material cost and production efficiency, and are difficult to meet the growing application needs.

[0005] Application Contents

[0006] In view of the problems of complex packaging structure and high cost of the laser light source device in the above-mentioned prior art, a laser light source device of a VCSEL chip is proposed. The laser light source device of the VCSEL chip can solve the above-mentioned problems.

[0007] This application provides the following solution.

[0008] In a first aspect, a laser light source device is provided, comprising: a light source chip, a packaging bracket, a structural bracket and an optical lens; wherein the structural bracket is formed as an integrally formed non-metallic bracket, having a hollow channel extending along the axial direction and a first port and a second port arranged oppositely; the light source chip is a VCSEL chip, the packaging bracket packages the light source chip and then fixes it on the first port of the structural bracket, the optical lens is fixedly arranged on the second port of the structural bracket, and the light emitted by the light source chip passes through the hollow channel and through the optical lens to be emitted.

[0009] Preferably, the optical lens is formed as one piece with the structural support by secondary injection molding and / or in-mold injection molding process.

[0010] Preferably, the optical lens is formed as an independent optical lens, the second port of the structural support is provided with a fitting portion for accommodating the optical lens, the fitting portion is provided with a groove at a mounting position for matching with the optical lens, and the groove is filled with glue.

[0011] Preferably, the optical lens and the structural support are provided with corresponding buckle structures at the mounting matching positions and are fixed by the buckle structures.

[0012] Preferably, a mounting mechanism is integrally injection-molded on the outer wall of the structural support, and the laser light source device is mounted to an external device via the mounting mechanism.

[0013] Preferably, the mounting mechanism is formed as a threaded mounting mechanism, and the laser light source device is axially mounted to the external device through the threaded mounting structure.

[0014] Preferably, the mounting mechanism is formed as a wing-shaped mounting mechanism, so that the laser light source device can be mounted on a concave mounting seat of the external device through the wing-shaped mounting mechanism.

[0015] Preferably, the packaging bracket is formed as any one of a TO (Transmitter Outline) bracket, an injection molding bracket, a rigid substrate bracket or a rigid-flex board bracket.

[0016] Preferably, the package bracket is provided with electrical connection wires and / or pins and / or electrical connection sheets outwardly for external electrical connection.

[0017] Preferably, the packaging support and the structural support are movably coupled in the axial direction of the hollow channel and are tightly matched in the non-axial direction.

[0018] Preferably, the optical axis of the light source chip and the optical axis of the optical lens are offset at the position of the light source chip, and the optical axis of the light source chip and the optical axis of the optical lens are set at an eccentric angle.

[0019] Preferably, the preset offset range of the above offset setting is 0um to 300um, and the offset accuracy is ±30um.

[0020] Preferably, the light source chip is electrically connected to the die bonding platform of the packaging bracket by a planar die bonding method, and the optical axis of the light source chip and the optical axis of the optical lens are offset within a preset offset range by adjusting the die bonding position of the light source chip on the die bonding platform.

[0021] Preferably, the non-metal material of the structural support is one or more of the following: polyphenylene sulfide PPS, polycarbonate PC.

[0022] Preferably, glass fiber material is mixed into the non-metal material of the structural support.

[0023] One of the advantages of the above embodiment is that it provides a laser light source with a simple structure, in which an integrally formed non-metallic bracket is used as a structural bracket, and the packaging bracket encapsulating the light source chip and the optical lens are respectively installed on the two side ports of the hollow channel of the structural bracket, which can significantly save manufacturing costs and reduce manufacturing difficulty.

[0024] Other advantages of the present application will be explained in more detail with reference to the following description and drawings.

[0025] It should be understood that the above description is only an overview of the technical solution of the present application, so that the technical means of the present application can be more clearly understood and implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are specifically described below by way of example. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The advantages and benefits of the present invention and other advantages and benefits will be apparent to those skilled in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only used for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0027] Figure 1 An exploded schematic diagram of a laser light source device provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram of a partial structure of a laser light source device provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of the structure of a laser light source device provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of the structure of a laser light source device provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of the structure of a laser light source device provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the structure of a laser light source device provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of the installation structure of a laser light source device provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of the installation structure of a laser light source device provided in an embodiment of the present application;

[0035] Fig. 9 A schematic diagram of the installation structure of a laser light source device provided in an embodiment of the present application;

[0036] Fig.10 A schematic diagram of the operation of a laser light source device provided in an embodiment of the present application;

[0037] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0038] Figure markings: laser light source device 10, light source chip 11, packaging bracket 12, pin 121, structural bracket 13, hollow channel 131, first port 132, second port 133, fitting part 134, groove 135, threaded mounting structure 136, wing-shaped mounting mechanism 137, optical lens 14, external device 20, mounting seat 21. DETAILED DESCRIPTION

[0039] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0040] In the description of the embodiments of the present application, it should be understood that terms such as "including" or "having" are intended to indicate the presence of disclosed features, numbers, steps, behaviors, components, parts, or a combination thereof in the present specification, and do not exclude the possibility of the presence of one or more other features, numbers, steps, behaviors, components, parts, or a combination thereof.

[0041] Unless otherwise specified, “ / ” means or. For example, A / B can mean A or B. The “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0042] The terms "first", "second", etc. are used only to distinguish the same or similar technical features for the convenience of description, and should not be understood as indicating or implying the relative importance or quantity of these technical features. Thus, the features defined by "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the term "plurality" means two or more than two.

[0043] It should also be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] refer to Figure 1The present application provides a VCSEL chip laser light source device 10, comprising: a light source chip 11, a packaging bracket 12, a structural bracket 13 and an optical lens 14; wherein the structural bracket 13 is formed as an integrally formed non-metallic bracket, which has an axially extending hollow channel 131, and the structural bracket 13 is provided with a first port 132 and a second port 133 opposite to each other on both sides of the hollow channel 131.

[0045] The light source chip 11 is a VCSEL chip, and the packaging bracket 12 packages the light source chip 11 and is fixedly arranged at the first port 132 of the structural bracket 13. The optical lens 14 is fixedly arranged at the second port 133 of the structural bracket 13, so that the light emitted by the light source chip 11 can pass through the axial hollow channel 131 and then pass through the optical lens 11 to emit the laser light source device 10.

[0046] Compared with the prior art, the laser light source device provided in the embodiment of the present application adopts an integrally formed non-metallic bracket as the structural bracket 13 that mainly supports the laser light source device, and the packaging bracket 12 encapsulating the light source chip 11 and the optical lens 14 are respectively installed on the two side ports of the structural bracket 13, which significantly saves costs and reduces manufacturing difficulty.

[0047] In one embodiment, the non-metal material of the structural support 13 may be polyphenylene sulfide PPS, polycarbonate PC, etc. That is, the structural support 13 is formed as a plastic structural support, so that it can be obtained through an integral injection molding process.

[0048] Preferably, in order to increase the overall structural strength of the device, glass fiber material may be mixed into the non-metal material (such as polyphenylene sulfide PPS, polycarbonate PC) of the structural support 13 .

[0049] refer to Figure 2 , the optical lens 14 can be formed as an independent optical lens and tightly mounted to the second port 132 of the structural support 13. Specifically, in order to improve the tightness of the installation, the second port 132 of the structural support 13 can be provided with a fitting portion 134 for accommodating the optical lens 14. The inner contour of the fitting portion 134 and the outer contour of the optical lens 14 are in a mounting matching relationship, so that the optical lens 14 can be more tightly embedded in the structural support 13. Further, in order to improve the sealing, the fitting portion 134 is provided with a groove 135 at the mounting matching position with the optical lens, in which an adhesive is filled. It can be understood that simply filling the colloid in the installation gap between the fitting portion 134 and the optical lens 14, if less filling, it is easy to cause the colloid filling in the gap to be missing, and if too much filling is filled, it is easy to overflow. By setting the groove 135, the colloid filling can be achieved more evenly and fully. As a result, the sealing can be improved, the intrusion of water vapor can be effectively isolated, and the overflow of too much colloid can be avoided.

[0050] refer to Figure 2 The fitting portion 134 may be formed as a step structure that matches the outer edge of the optical lens 14, so that the optical lens 14 can be fixedly mounted on the step structure. Preferably, a circle of grooves 135 may be provided on the step of the step structure at a position away from the hollow channel for filling the colloid, so that the colloid can be further prevented from overflowing into the hollow channel 131.

[0051] Optionally, the fitting portion 134 may also be formed as an internal thread structure that matches the outer thread of the optical lens 14. Optionally, the fitting portion 134 may also be formed as a buckle structure, wherein the optical lens 14 and the structural support are correspondingly provided with the buckle structure at the installation matching position and fixed by the buckle structure.

[0052] It can be understood that any structure of the engaging portion 134 that can be installed and matched with the outer contour of the optical lens 14 can be used in the present application, and the present application will not describe them one by one.

[0053] In another embodiment, in order to further improve the sealing effect between the optical lens 14 and the structural support 13, it is not necessary to additionally install and embed the optical lens into the structural support, but the optical lens 14 can be directly formed integrally with the structural support 13. Specifically, the optical lens 14 and the structural support 13 can be formed into one piece through secondary injection molding or in-film injection molding. The optical lens 14 can be made of transparent plastic material, such as polycarbonate PC, polymethyl methacrylate PMMA, etc., so that the optical lens 14 can be directly formed at the second port 132 of the structural support 13 through an injection molding process. In this way, the assembly process can be further reduced, and better sealing effect and installation and matching accuracy can be achieved.

[0054] refer to Figure 3 and Figure 4 The packaging bracket 12 fixes the packaged light source chip 11 on the side facing the optical lens 14, and the side of the packaging bracket away from the optical lens is provided with an electrical pin 121 for external electrical connection.

[0055] Optionally, the electrical pin 121 may be formed as a needle-shaped metal pin, such as Figure 3 The electrical pin 121 may also be formed as a sheet metal pin, such as Figure 4 The electrical pins 121 may also be formed as metal flexible wires, etc., and this application does not impose any specific limitation on this.

[0056] In one embodiment, the packaging bracket 12 and the structural bracket 13 are movably coupled in the axial direction of the hollow channel 131 and are tightly matched in the non-axial direction. This reduces the installation error of the packaging bracket 12 and the structural bracket 13 in the non-axial direction, thereby reducing the offset error of the optical axis of the light source chip 11 in the non-axial direction.

[0057] For example, refer to Figure 3 The packaging bracket 12 is a circular bracket of TO package, and the matching size of the second port 133 of the structural bracket 13 is a tightly fitting circular hole shape to ensure the stable offset of the light source chip in the X / Y axis direction. It only needs to move in a single direction in the Z axis (that is, the axial direction of the hollow channel) until the packaging bracket 12 is coupled to the structural bracket 13, which can greatly speed up the coupling efficiency and avoid the optical axis offset error of the light source chip 11 caused by installation errors.

[0058] For example, refer to Figure 4 When the packaging bracket 12 is a square or a rectangle, the matching size of the second port 133 of the structural bracket 13 can be designed to be a tightly fitting square or rectangular size, which also ensures the stable offset of the light source chip in the X / Y direction. Only a single-direction movement coupling in the Z axis (that is, the axial direction of the hollow channel) is required, which can greatly speed up the coupling efficiency and avoid the offset error of the optical axis of the light source chip 11 caused by installation errors.

[0059] In one embodiment, the package bracket is formed as any one of a TO (Transmitter Outline) bracket, an injection molding bracket, a rigid substrate bracket, or a rigid-flexible board bracket.

[0060] refer to Figure 5 and Figure 6 In order to reduce the installation complexity of the client, a mounting mechanism can also be designed on the outer wall of the structural support 13 so that the laser light source device can be installed to the external device through the mounting mechanism. Preferably, the mounting mechanism is directly formed by the structural support through an integrated molding process.

[0061] refer to Figure 5 In one embodiment, the mounting mechanism may be formed as a threaded mounting mechanism 136, and the laser light source device may be axially mounted to an external device through the threaded mounting structure 136. For example, an axial hole may be provided on the external device, and an internal thread structure matching the threaded mounting structure may be provided in the axial hole, so that the laser light source device 10 may be axially mounted in the axial hole of the external device through the threaded mounting structure 136.

[0062] refer to Figure 6The above-mentioned mounting mechanism can also be formed as a wing-shaped mounting mechanism 137, so that the laser light source device 10 is mounted on the concave mounting seat 21 of the external device 20 through the wing-shaped mounting mechanism 137. For example, in combination with reference Figure 6 , Figure 7 and Figure 8 A horizontal wing-shaped mounting mechanism 137 can be set on the outer wall of the structural support 13, and a mounting half hole can be opened on the wing. A concave mounting seat 21 can be set on the external device 20. The concave mounting seat 21 cooperates with the wing-shaped mounting mechanism 137 and the outer wall of the structural support 13, and then the wing-shaped mounting mechanism 137 can be installed and locked on the concave mounting seat 21 by screws.

[0063] It should be understood that compared with the structural brackets made of metal materials commonly used in the prior art, the structural brackets made of non-metallic materials used in the present application can realize the structural brackets of the aforementioned various complex structures with lower manufacturing cost and lower manufacturing difficulty.

[0064] It is understandable that the present application embodiment may also adopt other types of mounting mechanisms as long as they can be fixedly connected to the external device. By setting the aforementioned mounting mechanism, the installation accessories of the client can be reduced, which is convenient for reducing the installation complexity of the client and also can increase the stability after installation.

[0065] See also Fig. 9 Under normal use, when the laser light source device 10 is assembled with the external device 20 of the client, it is usually required that there is a horizontal elevation angle of about 0 to +1.5° between the light source optical axis of the laser light source device 10 and the horizontal plane. However, the eccentric direction of the light source optical axis of the laser light source device in the prior art is uncertain, and it is usually necessary to rotate and adjust during the assembly process of the client to achieve the desired elevation angle.

[0066] refer to Fig.10 In order to reduce the debugging complexity of the client during the assembly process, an embodiment of the present application further sets the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 to be offset within a preset offset range at the position of the light source chip 11, and the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are set at an eccentric angle. It can be understood that by controlling the offset between the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14, the eccentric angle between the optical axis a of the light source chip and the Y axis (that is, the optical axis b) can be controlled. When the laser light source device 10 is fixedly installed to an external device at a set installation angle, the Y axis can be flush with the horizontal plane, and the eccentric angle can be used as the horizontal elevation angle. At this time, the customer does not need to adjust the pitch angle during the assembly process.

[0067] Furthermore, the light source chip 11 is electrically connected to the packaging bracket 12 by a planar die-bonding method. By directly adjusting the die-bonding position of the light source chip 11 on the packaging bracket 12, the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 are offset within a preset offset range, thereby making the optical axis a of the light source chip 11 and the optical axis b of the optical lens 14 eccentric.

[0068] Preferably, the preset offset range is between 0um and 300um, and the accuracy of the offset can reach ±30um, thereby controlling the deflection accuracy of the eccentric angle to reach, for example, 1°±0.3°.

[0069] Preferably, the light-emitting holes of the VCSEL chip can be arranged in a variety of combinations, and can project a variety of laser light types in conjunction with an optical lens. For example, the VCSEL chip can be a single light-emitting hole, which can generate a single-point laser, that is, it can be a point laser light source. For another example, the light-emitting holes of the VCSEL chip are arranged in a single row along the light diffusion direction, generating a single straight line of light, that is, it can be a line laser light source. This application does not impose specific restrictions on this.

[0070] In the description of this specification, the description with reference to the terms "some possible embodiments", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application, and the above terms do not necessarily represent the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0071] Although the spirit and principle of the present application have been described above with reference to several specific embodiments, it should be understood that the present application is not limited to the disclosed specific embodiments, and the division of various aspects does not mean that the features in these aspects cannot be combined. The present application is intended to cover various modifications and equivalent arrangements included in the spirit and scope of the attached claims.

Claims

1. A laser light source device of a VCSEL chip, characterized in that: include: Light source chip, packaging bracket, structural bracket and optical lens; wherein, The structural support is formed as an integrally formed non-metallic support having a hollow channel extending in the axial direction and a first port and a second port arranged opposite to each other; The light source chip is a VCSEL chip. The packaging bracket packages the light source chip and then fixes it on the first port of the structural bracket. The optical lens is fixed on the second port of the structural bracket. The light emitted by the light source chip passes through the hollow channel and through the optical lens.

2. The device according to claim 1, characterized in that The optical lens is formed into one piece with the structural support through secondary injection molding and / or in-mold injection molding process.

3. The device according to claim 1, characterized in that The second port of the structural support is provided with an engaging portion for accommodating the optical lens, and the engaging portion is provided with a groove at a mounting position for matching with the optical lens, and the groove is filled with glue.

4. The device according to claim 3, characterized in that The optical lens and the structural support are provided with corresponding buckle structures at the installation matching positions, and are fixed together by the buckle structures. 5 . The device according to claim 1 , wherein the packaging bracket fixes and packages the light source chip on a side facing the optical lens, and an electrical pin is provided on a side of the packaging bracket away from the optical lens for external electrical connection. 6 . The device according to claim 1 , wherein the packaging support and the structural support are movably coupled in the axial direction of the hollow channel and are tightly fitted and connected in a non-axial direction. 7 . The device according to claim 1 , wherein the package bracket is formed as any one of a TO bracket, an injection molding bracket, a rigid substrate bracket or a rigid-flexible board bracket.

8. The device according to claim 1, characterized in that A mounting mechanism is integrally formed by injection molding on the outer wall of the structural support, and the laser light source device is mounted to an external device via the mounting mechanism.

9. The device according to claim 8, characterized in that The mounting mechanism is formed as a threaded mounting mechanism, and the laser light source device is axially mounted to an external device through the threaded mounting structure.

10. The device according to claim 8, characterized in that The mounting mechanism is formed as a wing-shaped mounting mechanism, so that the laser light source device is mounted on a concave mounting seat of an external device through the wing-shaped mounting mechanism.

11. The device according to claim 1, characterized in that The optical axis of the light source chip and the optical axis of the optical lens are offset at the position of the light source chip, and the optical axis of the light source chip and the optical axis of the optical lens are set at an eccentric angle.

12. The device according to claim 11, characterized in that The preset offset range of the offset setting is 0um to 300um, and the offset accuracy is ±30um.

13. The device according to claim 11, characterized in that The light source chip is electrically connected to the packaging bracket by a planar die bonding method, and the optical axis of the light source chip and the optical axis of the optical lens are offset within a preset offset range by adjusting the die bonding position of the light source chip on the packaging bracket.

14. The device according to claim 1, characterized in that The non-metal material of the structural support is mixed with glass fiber material.

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