Ultrathin copper foil and manufacturing device thereof

Abstract

The utility model discloses an ultra-thin copper foil and a manufacturing device thereof, the thickness of the ultra-thin copper foil is greater than 0 mu m and less than 5 mu m, the ultra-thin copper foil at least comprises a metal carrier, a copper plating layer and a dielectric layer, the copper plating layer and the dielectric layer are sequentially arranged on the first surface of the metal carrier, the dielectric layer is utilized to facilitate the subsequent pressing process, and the thickness of the ultra-thin copper foil is less than 0 mu m and less than 5 mu m. And the ultrathin copper foil provided by the utility model is transferred and pasted on other support plates.

Description

Technical Field

[0001] The utility model relates to a copper foil, in particular to an ultra-thin copper foil and a manufacturing device for the ultra-thin copper foil. Background Art

[0002] Copper foil has good electrical conductivity and is cheaper than precious metals such as silver. Therefore, it is not only widely used in basic industries, but also an important raw material for advanced technology industries. With the trend of high-speed, lightweight and miniaturized computer communication equipment in recent years, its internal circuit board must also be designed with miniaturized circuits and thin copper foil. The conventional copper foil manufacturing device for printed circuit boards has a SUS316 stainless steel drum-type rotating cathode and a plurality of fixed electrolytic anodes arranged in an electrolytic tank containing copper electrolyte, and electricity is passed between the rotating cathode and the electrolytic anode to deposit copper on the surface of the rotating cathode to form a layer of electrolytic copper foil.

[0003] Although the thickness of the copper foil produced by the above-mentioned conventional device can be changed by adjusting the current size and the rotation speed of the drum-type rotating cathode, in actual operation, the copper foil must have a certain thickness so that the tensile strength of the copper foil is greater than the adhesion of the copper foil to the drum-type rotating cathode, so that it can be separated and taken out from the surface of the drum-type rotating cathode. Therefore, it is actually impossible to supply ultra-thin copper foil such as below 6μm (micrometer).

[0004] The primary disadvantage of thicker steel foil is that after it is pressed together with the substrate to form a copper foil substrate, in the subsequent etching process, due to the thickness of the steel foil, it is easy to cause the copper foils that were originally isolated from each other to bend further than the upper layer, resulting in side etching of improper short circuits. Therefore, it is not easy to form fine lines (such as 3 mil line width and line spacing), and it cannot meet the trend of miniaturization of circuit boards inside electronic communication equipment today. In recent years, due to the rise of electric vehicles and smart phones, the demand for high-energy-density lithium batteries has increased significantly. In order to increase the energy density of lithium batteries, the thickness of the copper foil used as the negative electrode collector is also required to be thinner and thinner. As the thickness of the copper foil drops to 5μm, the cost of rolled copper foil will be much higher than the cost of electroplated copper foil, which is not conducive to commercial applications. Utility Model Content

[0005] In order to solve the technical problems existing in the prior art, the utility model provides a copper foil, in particular an ultra-thin copper foil and a manufacturing device for the ultra-thin copper foil.

[0006] The technical solution of the utility model is that the thickness of the ultra-thin copper foil in the utility model is greater than 0μm and is less than 5μm, and the ultra-thin copper foil at least comprises: a metal carrier having a first and a second surface relative to each other; a copper-plated layer disposed on the first surface; and a dielectric layer disposed on the surface of the copper-plated layer.

[0007] According to the above technical features, a reel is further included, and the ultra-thin copper foil is rolled up on the reel.

[0008] According to the above technical features, the ultra-thin copper foil can be cut into a sheet structure.

[0009] According to the above technical features, the material of the dielectric layer is ABF, PI, green paint or epoxy resin.

[0010] According to another aspect of the technical solution of the utility model, the utility model further provides a manufacturing device for manufacturing ultra-thin copper foil with a thickness greater than 0 μm and less than 5 μm, and the manufacturing device at least includes: a feeding area, which provides a metal carrier; a plating unit, which is arranged after the feeding area to receive the metal carrier and perform an electroplating operation on the surface of the metal carrier to form a copper-plated layer on the first surface of the metal carrier; a coating unit, which is arranged after the electroplating unit to coat a dielectric layer on the surface of the copper-plated layer to complete the ultra-thin copper foil.

[0011] According to the above technical features, a winding unit is further provided after the coating unit, and the winding unit has a winding shaft to wind the ultra-thin copper foil on the winding shaft.

[0012] According to the above technical features, a cutting unit is further provided after the coating unit to cut the ultra-thin copper foil into a sheet structure.

[0013] According to the above technical features, a stripping unit is further provided after the electroplating unit.

[0014] According to the above technical features, the electroplating unit has an electroplating tank, which has two electrode parts and two diaphragms. The metal carrier is located between the two electrode parts, and the two diaphragms are respectively located between the metal carrier and the electrode parts, and the diaphragm located below the metal carrier is inclined in the electroplating tank.

[0015] According to the above technical features, the area of ​​the diaphragm is larger than the area of ​​the metal carrier.

[0016] According to the above technical features, a degreasing unit is further provided between the feed area and the electroplating unit to perform degreasing treatment on the metal carrier.

[0017] According to the above technical features, an anti-oxidation unit is further provided between the electroplating unit and the coating unit to perform anti-oxidation treatment on the copper-plated layer.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The thickness of the overall ultra-thin copper foil 1 is greater than 0 μm and less than 5 μm, and is more suitable for thin and small electronic products. The dielectric layer can facilitate the subsequent lamination process and transfer the ultra-thin copper foil to other carriers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a schematic structural diagram of the ultra-thin copper foil in the utility model.

[0021] Figure 2A , Figure 2B Shown is another structural schematic diagram of the ultra-thin copper foil in the utility model.

[0022] Figure 3 Shown is a schematic structural diagram of the manufacturing device in the utility model.

[0023] Figure 4 Shown is a schematic structural diagram of the electroplating unit in the utility model.

[0024] Figure 5 Shown is another structural schematic diagram of the manufacturing device in the utility model.

[0025] Description of the figure number:

[0026] Ultra-thin copper foil 1

[0027] Metal carrier 11

[0028] First surface 111

[0029] Second surface 112

[0030] Copper plating layer 12, 12'

[0031] Dielectric layer 13

[0032] Reel 21, 21'

[0033] Sheet structure 22

[0034] Feeding area 31

[0035] Electroplating unit 32

[0036] Plating tank 321

[0037] Electrode 322

[0038] Diaphragm 323

[0039] Bubble 324

[0040] Coating unit 33

[0041] Rewinding unit 34

[0042] The peeling unit 35 . DETAILED DESCRIPTION

[0043] See also Figure 1 The structure diagram of the ultra-thin copper foil in the utility model is shown. First, the ultra-thin copper foil 1 in the utility model at least comprises: a metal carrier 11, a copper-plated layer 12 and a dielectric layer 13. The metal carrier 11 has a first and a second surface 111 and 112 extending in a plane direction and opposite to each other, and a side surface 113 connecting the first and the second surfaces 111 and 112. The copper-plated layer 12 is arranged on the first surface 111, and the dielectric layer 13 is arranged on the surface of the copper-plated layer 12. The material of the dielectric layer 13 can be Ajinomoto Build-up Film (ABF), polyimide (PI), green paint or epoxy resin; the thickness of the overall ultra-thin copper foil 1 is greater than 0μm and less than 5μm, and it is more suitable for thin and short electronic products.

[0044] like Figure 2A As shown, the ultra-thin copper foil 1 can be rolled up on a roll 21. Figure 2B As shown, the sheet structure 22 may be formed after cutting. The utility model utilizes the dielectric layer to facilitate the subsequent lamination process and transfer the ultra-thin copper foil to other carriers.

[0045] like Figure 3 The structure schematic diagram of the manufacturing device in the utility model is shown, and the manufacturing device includes the following structures in sequence: a feeding area 31 provides a metal carrier 11. A plating unit 32 is arranged after the feeding area 31 to receive the metal carrier 11 and perform electroplating operation on the surface of the metal carrier 11 to form a copper-plated layer 12 on the first surface 111 of the metal carrier 11. A coating unit 33 is arranged after the plating unit 32 to coat a dielectric layer 13 on the surface of the copper-plated layer 12 to complete the ultra-thin copper foil. Each structure in the above manufacturing device can directly produce ultra-thin copper foil in a horizontal or vertical manner.

[0046] A winding unit 34 may be further provided after the coating unit 33, and the winding unit 34 has a winding shaft 21 to wind the ultra-thin copper foil 1 on the winding shaft 21; or, a cutting unit (not shown) may be further provided after the coating unit to cut the ultra-thin copper foil into a sheet structure.

[0047] Among them, Figure 4As shown, the electroplating unit 32 has an electroplating tank 321 for accommodating the electroplating solution. The electroplating tank 321 has two electrode members 322 and two diaphragms 323. The two diaphragms 323 are made of a polymer material that allows electric lines to pass through. The metal carrier 11 is located between the two electrode members 322. The two electrode members 322 can form an anode after being energized, and the metal carrier 11 is a cathode. The two diaphragms 323 are respectively located between the metal carrier 11 and the electrode members 322, and the diaphragm 323 located below the metal carrier 11 is tilted in the electroplating tank 321. The area of ​​the diaphragm 323 is larger than the area of ​​the metal carrier 11, so that the metal carrier 11 and the cathode are connected. The distance between the diaphragm 323 below it increases gradually from the center to at least one side. In the embodiment shown in the figure, the diaphragm 323 below the metal carrier 11 is tilted from the lower left to the upper right, so that the distance between the metal carrier 11 and the diaphragm 323 below it increases gradually from the center to the right. During electroplating, the two electrodes 322 and the metal carrier 11 can be separated by the diaphragm 323 to isolate the bubbles generated by the two electrodes 322. Because the bubbles 324 in the electroplating solution can be guided by the tilt of the diaphragm 323 through buoyancy, they can leave the outside of the metal carrier 11 to avoid interfering with the deposition of copper on the metal carrier 11 and reducing the sensitive and easily damaged components in the electroplating solution, so as to ensure the quality of electroplating. Of course, the diaphragm can also be tilted to the other side, so that the distance between the metal carrier and the diaphragm below it increases gradually from the center to the left; or, the diaphragm can also form a V-shaped structure, so that the distance between the metal carrier and the diaphragm below it increases gradually from the center to the left and right at the same time, so that the bubbles can leave to both sides.

[0048] Furthermore, a degreasing unit is further provided between the feed area and the electroplating unit to perform a degreasing treatment on the metal carrier, and an anti-oxidation unit is further provided between the electroplating unit and the coating unit to perform an anti-oxidation treatment on the copper-plated layer.

[0049] In addition, the electroplating unit can electroplate the first and second surfaces of the metal carrier simultaneously. Figure 5 As shown, a stripping unit 35 may be further provided after the coating unit 33, and the stripping unit 35 is used to separate the metal carrier 11 carrying the copper-plated layer 12 and the dielectric layer 13 from the copper-plated layer 12' on the second surface 112, and the metal carrier 11 carrying the copper-plated layer 12 and the dielectric layer 13 may be rolled up on a winding shaft 21, and the other copper-plated layer 12' may be rolled up on another winding shaft 21'.

Claims

1. An ultra-thin copper foil, characterized in that: The ultra-thin copper foil has a thickness greater than 0 μm and less than 5 μm, and the ultra-thin copper foil at least comprises: A metal carrier having first and second opposite surfaces; a copper-plated layer disposed on the first surface; and A dielectric layer is disposed on the surface of the copper plating layer.

2. The ultra-thin copper foil according to claim 1, characterized in that in, The invention further comprises a reel, on which the ultra-thin copper foil is reeled.

3. The ultra-thin copper foil according to claim 1, characterized in that in, The ultra-thin copper foil can be cut into a sheet structure.

4. A device for manufacturing ultra-thin copper foil, characterized in that: The manufacturing device can be used to manufacture ultra-thin copper foil with a thickness greater than 0 μm and less than 5 μm, and the manufacturing device at least comprises: a feeding area, providing a metal carrier; an electroplating unit, disposed behind the material supply area, to receive the metal carrier and perform an electroplating operation on the surface of the metal carrier to form a copper plating layer on the first surface of the metal carrier; A coating unit is arranged after the electroplating unit to coat a dielectric layer on the surface of the copper-plated layer to complete an ultra-thin copper foil.

5. The manufacturing device according to claim 4, characterized in that in, A reeling unit is further arranged behind the coating unit. The reeling unit has a reeling shaft to reel the ultra-thin copper foil onto the reeling shaft.

6. The manufacturing device according to claim 4, characterized in that in, A cutting unit is further arranged after the coating unit to cut the ultra-thin copper foil into a sheet structure.

7. The manufacturing device according to claim 4, characterized in that: in, The electroplating unit is further provided with a stripping unit.

8. The manufacturing device according to any one of claims 4 to 7, characterized in that: in, The electroplating unit has an electroplating tank, which has two electrode parts and two diaphragms. The metal carrier is located between the two electrode parts, and the two diaphragms are respectively located between the metal carrier and the electrode parts, and the diaphragm located below the metal carrier is tilted in the electroplating tank.

9. The manufacturing device according to claim 8, characterized in that in, The area of ​​the diaphragm is larger than the area of ​​the metal carrier.

10. The manufacturing device according to any one of claims 4 to 7, characterized in that: in, A degreasing unit is further provided between the feed area and the electroplating unit to degrease the metal carrier. Grease treatment; or, an anti-oxidation unit is further provided between the electroplating unit and the coating unit, The copper plating layer is subjected to an anti-oxidation treatment.

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