Installation structure for software integrated chip

Abstract

The utility model discloses a mounting structure for a software integrated chip, which relates to the technical field of mounting structures for integrated chips and comprises a mounting plate, and a plurality of miniature mounting rods are fixedly connected to the top of the mounting plate. When a device needs to be installed, the installation plate is integrally placed on the device, then the miniature installation rods are rotated to fix the device on other devices, circuit pins on an integrated chip are aligned with pin grooves in a chip plate and placed in chip grooves, then the heat guiding plate and the supporting foot pads are integrally fixed on the integrated chip, and the integrated chip is fixed on the chip plate. When the protective top cover is used, the whole protective top cover is placed on the sliding rods, then the connecting rods are rotated to fix the protective top cover in the fixing grooves in the fixing columns, when the protective top cover begins to be combined, the sliding rods are pressed downwards, the extrusion springs begin to be extruded, the internal stability and stability are enhanced when the protective top cover is fixed, and meanwhile the protective top cover is combined integrally.

Description

Technical Field

[0001] The utility model belongs to the technical field of mounting structures for integrated chips, in particular to a mounting structure for software integrated chips. Background Art

[0002] According to the patent number CN214704538U, a motherboard mounting structure for software engineering includes: a mounting base plate, a support plate is mounted at the middle of the top of the mounting base plate, and a wind guide plate located outside the support plate is mounted on the top surface of the mounting base plate, and a bottom sleeve is fixed to the side of the mounting base plate; a support column, the support column is fixedly mounted in the middle of the wind guide plate, and the corresponding covering between the pressure plate and the guard plate facilitates the motherboard to be pressed and fixed, thereby ensuring the limit of the motherboard, but there are still the following deficiencies such as:

[0003] After completion, the above-mentioned device simply reaches its limit, but it cannot make its internal installation more stable and firm when limiting. Long-term use will cause internal loosening. In addition, the integrated chip will be in long-term use. If the heat is not dissipated in time, it will cause equipment damage. Therefore, we propose an installation structure for software integrated chips. Utility Model Content

[0004] The utility model aims to provide a mounting structure for a software integrated chip, which solves the problem that the internal structure of the existing equipment is not stable enough after installation through a micro-mounting rod.

[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] The utility model is a mounting structure for a software integrated chip, comprising a mounting plate, a plurality of micro-mounting rods being fixedly connected to the top of the mounting plate, a plurality of micro-chips being fixedly connected to the outer wall of one side of the mounting plate close to the micro-mounting rods, a ceramic core board being fixedly connected to the outer wall of one side of the mounting plate close to the micro-chips, a plug interface being fixedly connected to the outer wall of one end of the mounting plate away from the ceramic core board, a chip board being fixedly connected to the central axis at the top of the mounting plate, and a chip groove being provided on the inner wall of the chip board.

[0007] Furthermore, an inserting groove is formed on the inner wall of the inserting port, and a transmission plate is fixedly connected to the inner wall of the inserting groove on one side close to the ceramic core plate.

[0008] Furthermore, a plurality of fixing blocks are fixedly connected to the top of the mounting plate, the fixing blocks are fitted to the outer wall of the chip board, and a plurality of fixing columns are fixedly connected to the top center axis of the fixing blocks.

[0009] Furthermore, a fixing groove is formed on the inner wall of the fixing column, a connecting rod is fixedly connected to the inner wall of the fixing groove, a plurality of pin grooves are formed on the outer wall of the chip board, and an integrated chip is fixedly connected to the inner wall of the chip groove.

[0010] Furthermore, a plurality of circuit pins are fixedly connected to the outer wall of the integrated chip, the circuit pins fit into the pin slots and are fixedly connected to the mounting plate, and a plurality of heat conducting plates are fixedly connected to the top of the integrated chip.

[0011] Furthermore, a plurality of supporting pads are fixedly connected to the top of the heat transfer plate, a damper is fixedly connected to the top of the supporting pad, a sliding rod is slidably connected to the central axis of the inner wall of the damper, and a compression spring is fixedly connected to the outer wall of the sliding rod.

[0012] Furthermore, the top of the sliding rod is fixedly connected to a heat sink, the top of the heat sink is fixedly connected to a protective top cover, the connecting rod passes through the inner wall of the protective top cover and extends to the outside, and the inner wall of the protective top cover is fixedly connected to a plurality of heat sink blocks.

[0013] The utility model has the following beneficial effects:

[0014] 1. The utility model is provided with a micro-mounting rod on the mounting plate. When the device needs to be installed, the mounting plate is first placed on the device as a whole, and then a plurality of micro-mounting rods are rotated to fix the device on other devices. Then, the circuit pins on the integrated chip are aligned with the pin grooves on the chip board and placed in the chip grooves. Then, the heat-guiding plate and the supporting foot pads are fixed on the integrated chip as a whole. Then, the protective top cover is placed on the sliding rod as a whole, and then a plurality of connecting rods are rotated to fix it in the fixing grooves on the fixing columns. When they begin to merge, a plurality of sliding rods are pressed down, and then the extrusion springs begin to be squeezed, so as to enhance the internal stability and firmness when it is fixed, and at the same time, the whole is merged.

[0015] 2. The utility model is provided with a plug interface on the installation board. When the device is started, the external device is connected to the transmission board through the plug slot provided in the plug interface to start it. The heat generated by the random integrated chip during use will be led out through multiple heat-leading plates, and then discharged to the outside through the heat sink and multiple heat sinks, so that the internal heat can be led out in time to reduce the damage to the integrated chip.

[0016] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of an installation structure for a software integrated chip of the utility model;

[0019] Figure 2 This is a front sectional view of the overall device of a software integrated chip installation structure of the utility model;

[0020] Figure 3 The utility model is a software integrated chip installation structure Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 This is a cross-sectional view of the overall structure of a mounting structure for a software integrated chip of the utility model;

[0022] Figure 5 The utility model is an exploded diagram of the chip board structure of the mounting structure for the software integrated chip.

[0023] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0024] 1. Mounting plate, 101. Micro mounting rod, 102. Micro chip, 103. Ceramic core board, 104. Plug interface, 105. Plug slot, 106. Transmission board, 108. Fixed block, 109. Fixed column, 110. Fixed slot, 111. Connecting rod, 2. Chip board, 201. Chip slot, 202. Pin slot, 203. Integrated chip, 204. Circuit pin, 205. Heat sink, 206. Support foot pad, 207. Damper, 208. Sliding rod, 209. Extrusion spring, 210. Heat sink, 211. Protective top cover, 212. Heat sink. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-5As shown, the utility model is a mounting structure for a software integrated chip, including a mounting plate 1, which is provided to facilitate the installation of the overall equipment. A plurality of micro-mounting rods 101 are fixedly connected to the top of the mounting plate 1, and the micro-mounting rods 101 are provided to enable the installation of the equipment. A plurality of micro-chips 102 are fixedly connected to the outer wall of the mounting plate 1 on one side close to the micro-mounting rods 101, and the micro-chips 102 are provided to facilitate multi-line connection. A ceramic core board 103 is fixedly connected to the outer wall of the mounting plate 1 on one side close to the micro-chip 102, and the ceramic core board 103 is provided to facilitate the connection of other equipment. A plug interface 104 is fixedly connected to the outer wall of one end of the mounting plate 1 away from the ceramic core board 103, and the plug interface 104 is provided to facilitate the connection of equipment. A chip board 2 is fixedly connected to the central axis of the top of the mounting plate 1, and the chip board 2 is provided to install an integrated chip 203. A chip groove 201 is provided on the inner wall of the chip board 2, and the chip groove 201 is provided to fix the integrated chip 203.

[0027] Among them Figure 2 As shown, the inner wall of the plug port 104 is provided with a plug slot 105, and a transmission plate 106 is fixedly connected to the inner wall of the plug slot 105 close to the ceramic core board 103;

[0028] By providing the plug-in slot 105 on the plug-in interface 104 , an external device can be inserted into the inside through the plug-in slot 105 to start the transmission board 106 .

[0029] Among them Figure 4 As shown, a plurality of fixing blocks 108 are fixedly connected to the top of the mounting plate 1, the fixing blocks 108 are attached to the outer wall of the chip board 2, and a plurality of fixing columns 109 are fixedly connected to the top center axis of the fixing blocks 108;

[0030] By providing the fixing block 108 on the mounting plate 1 , the protective top cover 211 can be fixed as a whole by fixing a plurality of fixing columns 109 .

[0031] Among them Figure 4-Figure 5 As shown, the inner wall of the fixing column 109 is provided with a fixing groove 110, the inner wall of the fixing groove 110 is fixedly connected with a connecting rod 111, the outer wall of the chip board 2 is provided with a plurality of pin grooves 202, and the inner wall of the chip groove 201 is fixedly connected with an integrated chip 203;

[0032] By providing the fixing groove 110 on the fixing column 109 , the fixing column 109 can be fixed in the fixing groove 110 .

[0033] Among them Figure 3-Figure 5 As shown, the outer wall of the integrated chip 203 is fixedly connected with a plurality of circuit pins 204, the circuit pins 204 fit into the pin slots 202 and are fixedly connected to the mounting plate 1, and the top of the integrated chip 203 is fixedly connected with a plurality of heat transfer plates 205;

[0034] By setting the circuit pin 204 on the integrated chip 203, the overall device can be connected and enabled.

[0035] Among them Figure 3 As shown, a plurality of support pads 206 are fixedly connected to the top of the heat conducting plate 205, a damper 207 is fixedly connected to the top of the support pad 206, a slide bar 208 is slidably connected to the central axis of the inner wall of the damper 207, and an extrusion spring 209 is fixedly connected to the outer wall of the slide bar 208;

[0036] By providing the support pads 206 on the heat conducting plate 205 , the heat generated by the integrated chip 203 can be conducted away.

[0037] Among them Figure 3 As shown, the top of the slide bar 208 is fixedly connected with a heat sink 210, the top of the heat sink 210 is fixedly connected with a protective top cover 211, the connecting rod 111 passes through the inner wall of the protective top cover 211 and extends to the outside, and the inner wall of the protective top cover 211 is fixedly connected with a plurality of heat sink blocks 212;

[0038] By providing the heat sink 210 on the slide bar 208 , the internal heat can be discharged through the heat sink 210 along with the heat sink block 212 .

[0039] A specific application of this embodiment is:

[0040] When the staff needs to use the device, they need to first place the mounting plate 1 as a whole on the device, then rotate multiple micro-mounting rods 101 to fix the device on other devices, then align the circuit pins 204 on the integrated chip 203 with the pin grooves 202 on the chip board 2 and place it in the chip groove 201, then fix the heat guide plate 205 and the supporting foot pad 206 as a whole on the integrated chip 203, then place the protective top cover 211 as a whole on the slide bar 208, and then rotate multiple connecting rods 111 to fix it on the fixing column 1. 09, when it begins to merge, multiple slide bars 208 will be pressed down, and then the extrusion spring 209 will begin to be squeezed, so that the internal stability and firmness are enhanced when it is fixed, and the whole is merged at the same time. Then, when the device is used, the external device is connected to the transmission board 106 through the plug slot 105 opened in the plug interface 104 to start it. The heat generated by the random integrated chip 203 during use will be drawn out through the multiple heat-conducting plates 205, and then discharged to the outside through the heat sink 210 and the multiple heat sink blocks 212.

[0041] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0042] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A mounting structure for a software integrated chip, comprising a mounting plate (1), characterized in that: The top of the mounting plate (1) is fixedly connected to a plurality of micro-mounting rods (101); the outer wall of the mounting plate (1) close to the micro-mounting rods (101) is fixedly connected to a plurality of micro-chips (102); the outer wall of the mounting plate (1) close to the micro-chips (102) is fixedly connected to a ceramic core board (103); the outer wall of the mounting plate (1) away from the ceramic core board (103) is fixedly connected to a plug interface (104); the top center axis of the mounting plate (1) is fixedly connected to a chip board (2); and the inner wall of the chip board (2) is provided with a chip slot (201).

2. The software integrated chip installation structure according to claim 1, characterized in that: The inner wall of the plug port (104) is provided with a plug-in slot (105), and a transmission plate (106) is fixedly connected to the inner wall of the plug-in slot (105) on one side close to the ceramic core plate (103).

3. The software integrated chip installation structure according to claim 2, characterized in that: A plurality of fixing blocks (108) are fixedly connected to the top of the mounting plate (1), the fixing blocks (108) are fitted to the outer wall of the chip board (2), and a plurality of fixing columns (109) are fixedly connected to the top center axis of the fixing blocks (108).

4. The software integrated chip installation structure according to claim 3, characterized in that: The inner wall of the fixing column (109) is provided with a fixing groove (110), the inner wall of the fixing groove (110) is fixedly connected with a connecting rod (111), the outer wall of the chip board (2) is provided with a plurality of pin grooves (202), and the inner wall of the chip groove (201) is fixedly connected with an integrated chip (203).

5. The software integrated chip installation structure according to claim 4, characterized in that: The outer wall of the integrated chip (203) is fixedly connected with a plurality of circuit pins (204), the circuit pins (204) fit into the pin slots (202) and are fixedly connected to the mounting plate (1), and the top of the integrated chip (203) is fixedly connected with a plurality of heat transfer plates (205).

6. The software integrated chip installation structure according to claim 5, characterized in that: A plurality of supporting pads (206) are fixedly connected to the top of the heat transfer plate (205), a damper (207) is fixedly connected to the top of the supporting pad (206), a sliding rod (208) is slidably connected to the center axis of the inner wall of the damper (207), and an extrusion spring (209) is fixedly connected to the outer wall of the sliding rod (208).

7. The software integrated chip installation structure according to claim 6, characterized in that: The top of the sliding rod (208) is fixedly connected to a heat sink (210), the top of the heat sink (210) is fixedly connected to a protective top cover (211), the connecting rod (111) passes through the inner wall of the protective top cover (211) and extends to the outside, and the inner wall of the protective top cover (211) is fixedly connected to a plurality of heat sink blocks (212).

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