Heat dissipation circuit board

Abstract

The utility model discloses a heat dissipation circuit board which comprises a circuit board, a heat dissipation plate is installed on the inner wall of the circuit board in an inserted mode, the bottom of the heat dissipation plate is fixedly connected with a first heat dissipation pipe, the first heat dissipation pipe is of a hollow structure, air holes are evenly formed in the inner wall of the bottom of the first heat dissipation pipe, and the bottom of the first heat dissipation pipe is fixedly connected with a second heat dissipation pipe. An end cover plate is welded to the bottom of the second heat dissipation pipe, the bottom of the circuit board is connected with an aluminum plate, the outer wall of the bottom of the aluminum plate is fixedly connected with a heat dissipation water tank, and the second heat dissipation pipe extends into the heat dissipation water tank. The bottom of the circuit board has two heat dissipation modes of air cooling and water cooling at the same time, the heat dissipation efficiency is improved, the working time of the heat dissipation fan is shortened, the heat dissipation efficiency is conveniently and effectively improved, noise generated by working is reduced, and the heat dissipation effect and the mute effect of equipment are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a heat dissipation circuit board. Background Art

[0002] The circuit board is called a printed circuit board or a printed circuit board. It is an indispensable component in electronic equipment in today's technological era. It makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. When the electronic components are installed on the circuit board, a large amount of heat will be generated when the electronic components are powered on. The circuit board needs to be cooled in time to maintain the normal operation of each electronic component. The existing circuit board heat dissipation is generally achieved by installing a heat sink on the surface of the circuit board and cooling the circuit board through air cooling. Due to the simple heat dissipation structure, only a heat dissipation fan is used for air cooling. At higher temperatures, the heat dissipation efficiency is effective. At the same time, the heat dissipation fan will also generate a lot of noise when working, which is inconvenient to use. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation circuit board to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A heat dissipation circuit board comprises a circuit board, a heat dissipation plate is plugged and installed on the inner wall of the circuit board, a first heat dissipation tube is fixedly connected to the bottom of the heat dissipation plate, the first heat dissipation tube is a hollow structure, air holes are evenly opened on the inner wall of the bottom of the first heat dissipation tube, a second heat dissipation tube is fixedly connected to the bottom of the first heat dissipation tube, an end cover plate is welded to the bottom of the second heat dissipation tube, the bottom of the circuit board is connected to an aluminum plate, the outer wall of the bottom of the aluminum plate is fixedly connected to a heat dissipation water tank, the second heat dissipation tube extends to the inside of the heat dissipation water tank, and a self-priming pump for circulating coolant in the heat dissipation water tank is fixedly installed on the outer wall of the heat dissipation water tank.

[0006] In a preferred embodiment of the utility model, a countersunk hole is formed on the inner wall of the top of the circuit board, through holes are evenly formed on the inner wall of the countersunk hole, the heat sink is fixedly installed inside the countersunk hole, and the outer wall of the top of the circuit board is electrically connected to the electronic components.

[0007] In a preferred embodiment of the utility model, the heating part at the bottom of the electronic component contacts the surface of the heat sink, the first heat dissipation tube passes through the through hole, the bottom outer wall of the circuit board and the aluminum plate are fixedly connected by a bracket, and a suspended structure is formed between the bottom of the circuit board and the aluminum plate.

[0008] In a preferred embodiment of the utility model, the air vent is located between the circuit board and the aluminum plate, a cooling fan is fixedly installed on the top of the aluminum plate, and the second heat dissipation pipe is connected to the aluminum plate by welding.

[0009] In a preferred embodiment of the present utility model, the input end of the self-priming pump is fixedly connected to the first conduit, and the output end of the self-priming pump is fixedly connected to the second conduit, and the second conduit is arranged in an S shape.

[0010] In a preferred embodiment of the utility model, the second conduit extends to the inside of the heat dissipation water tank, the outer wall of the second conduit is fixedly connected to the aluminum plate by means of legs, an air hole is opened on the inner wall of the top of the heat dissipation water tank, and a waterproof breathable membrane is fixedly installed on the inner wall of the air hole.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

[0012] 1. By integrating the two cooling modes of air cooling and water cooling, the bottom of the circuit board has both air cooling and water cooling modes, which improves the heat dissipation efficiency and reduces the working time of the cooling fan, which is convenient and effective to improve the heat dissipation efficiency, reduce the noise generated during operation, and improve the heat dissipation effect and quietness effect of the equipment;

[0013] 2. By installing the heat sink in a hidden manner inside the circuit board, the bottom heating part of the electronic component is heat-dissipated by contact, and a plurality of first heat dissipation tubes and second heat dissipation tubes are arranged for use together, so as to increase the heat dissipation speed and improve the working stability of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1 It is a schematic diagram of the main structure of a heat dissipation circuit board;

[0016] Figure 2 It is a schematic diagram of the structure of a heat dissipation circuit board when viewed from above;

[0017] Figure 3 It is a schematic diagram of the structure of a heat dissipation fan in a heat dissipation circuit board;

[0018] Figure 4 It is a schematic diagram of the exploded structure of a heat dissipation circuit board;

[0019] Figure 5 A schematic diagram of a top view structure of a circuit board in a heat dissipation circuit board;

[0020] Figure 6 It is a schematic diagram of the structure of a heat sink in a heat dissipation circuit board;

[0021] Figure 7 This is a schematic diagram of the working structure of a circulation pump in a heat dissipation circuit board.

[0022] In the figure: circuit board 100, countersunk hole 110, through hole 111, electronic component 120, heat sink 200, first heat dissipation pipe 210, air inlet 220, second heat dissipation pipe 230, cover plate 231, aluminum plate 240, heat dissipation water tank 250, self-priming pump 260, first conduit 261, second conduit 262, heat dissipation fan 270, bracket 300. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] Example 1: Figure 1-4 and 6, comprising a circuit board 100, a heat sink 200 is plugged and installed on the inner wall of the circuit board 100, a first heat sink 210 is fixedly connected to the bottom of the heat sink 200, the first heat sink 210 is a hollow structure, an air inlet hole 220 is evenly opened on the inner wall at the bottom of the first heat sink 210, a second heat sink 230 is fixedly connected to the bottom of the first heat sink 210, an end cover plate 231 is welded to the bottom of the second heat sink 230, an aluminum plate 240 is connected to the bottom of the circuit board 100, an outer wall of the bottom of the aluminum plate 240 is fixedly connected to a heat sink 250, the second heat sink 230 extends to the interior of the heat sink 250, and a self-priming pump 260 for circulating the coolant in the heat sink 250 is fixedly installed on the outer wall of the heat sink 250.

[0025] The specific usage scenario of this embodiment is: the self-priming pump 260 is turned on, and the water in the heat dissipation water tank 250 is pumped into the second conduit 262 by the self-priming pump 260. The second conduit 262 is set to an S-shaped structure, thereby extending the length of the second conduit 262. When the coolant flows through the second conduit 262, the surface area in contact with the inner wall of the second conduit 262 is increased, so that in the process of circulating the coolant, the coolant is cooled, thereby maintaining the coolant with a continuous heat dissipation effect.

[0026] Example 2: Figure 4-5A countersunk hole 110 is provided on the inner wall of the top of the circuit board 100, and through holes 111 are evenly provided on the inner wall of the countersunk hole 110. The heat sink 200 is fixedly installed inside the countersunk hole 110. The outer wall of the top of the circuit board 100 is electrically connected to the electronic component 120. The heating part at the bottom of the electronic component 120 contacts the surface of the heat sink 200. The first heat dissipation pipe 210 passes through the through hole 111. The outer wall of the bottom of the circuit board 100 is fixedly connected to the aluminum plate 240 through a bracket 300. The bottom of the circuit board 100 and the aluminum plate 240 are in a suspended structure. The air inlet 220 is located between the circuit board 100 and the aluminum plate 240. A heat dissipation fan 270 is fixedly installed on the top of the aluminum plate 240. The second heat dissipation pipe 230 is connected to the aluminum plate 240 by welding.

[0027] The specific usage scenario of this embodiment is: by setting the countersunk hole 110 and the through hole 111 for installing the heat sink 200, by setting the air inlet hole 220 for air flow to enter the first heat sink 210, it is convenient to dissipate heat to the bottom of the electronic component 120 and the heat sink 200 through air cooling.

[0028] Example 3: Figure 7 The input end of the self-priming pump 260 is fixedly connected to the first conduit 261, and the output end of the self-priming pump 260 is fixedly connected to the second conduit 262. The second conduit 262 is set in an S shape. The second conduit 262 extends to the inside of the heat dissipation water tank 250. The outer wall of the second conduit 262 is fixedly connected to the aluminum plate 240 through a support leg. An air hole is opened on the inner wall of the top of the heat dissipation water tank 250, and a waterproof breathable membrane (not marked in the figure) is fixedly installed on the inner wall of the air hole.

[0029] The specific usage scenario of this embodiment is: by setting a self-priming pump 260 to extract the coolant in the heat dissipation water tank 250, the heat is dissipated through the second conduit 262 to maintain the effect of continuous heat dissipation of the coolant, and by setting a waterproof and breathable membrane to facilitate water circulation in the heat dissipation water tank 250, the inside of the heat dissipation water tank 250 can be kept at a normal pressure state, thereby facilitating the self-priming pump 260 to extract the coolant, and a filter element is installed above the waterproof and breathable membrane (not marked in the figure). The filter element is set to filter the air entering the heat dissipation water tank 250 from the environment, thereby preventing impurities from entering the heat dissipation water tank 250.

[0030] The working principle of the utility model is as follows: when in use, a person skilled in the art installs the heat sink 200 by inserting the heat sink 200, the first heat sink 210, and the second heat sink 230 into the countersunk hole 110 and the through hole 111, then inserts the second heat sink 230 into the inner wall of the aluminum plate 240, welds the aluminum plate 240 and the second heat sink 230 together by welding, then installs the bracket 300 between the circuit board 100 and the aluminum plate 240, then fixes the heat sink 250 on the bottom of the aluminum plate 240, so that The second heat dissipation pipe 230 is inserted into the heat dissipation water tank 250, and the connection between the second heat dissipation pipe 230 and the heat dissipation water tank 250 is fixedly connected by welding. An air hole is opened on the inner wall of the heat dissipation water tank 250, and a waterproof and breathable membrane is installed in the air hole to ventilate the heat dissipation water tank 250. Then, a proper amount of coolant is added to the heat dissipation water tank 250, and then a self-priming pump 260 is fixedly installed on the outer wall of the heat dissipation water tank 250. When the electronic component 120 on the top of the circuit board 100 generates high temperature during operation, the heating part at the bottom of the electronic component 120 contacts the heat dissipation plate 260. The heat exchange is performed on the surface of the first heat dissipation tube 200 to dissipate heat, and then the heat is dissipated through the first heat dissipation tube 210 and the second heat dissipation tube 230, so that the heat is transported to the heat dissipation water tank 250 through the second heat dissipation tube 230, and the heat is dissipated through the coolant in the heat dissipation water tank 250. By turning on the heat dissipation fan 270, the heat dissipation fan 270 performs air cooling and heat dissipation on the outer wall of the first heat dissipation tube 210, and the air flow enters the first heat dissipation tube 210 through the air inlet 220 on the surface of the first heat dissipation tube 210, thereby directly cooling the bottom of the heat dissipation plate 200 through air cooling. Heat dissipation enables the heat dissipation plate 200 to accelerate the heat dissipation of the bottom of the electronic component 120. By turning on the self-priming pump 260, the water in the heat dissipation water tank 250 is pumped into the second conduit 262 by the self-priming pump 260. By setting the second conduit 262 into an S-shaped structure, the length of the second conduit 262 is extended. When the coolant flows through the second conduit 262, the surface area in contact with the inner wall of the second conduit 262 is increased, so that in the process of circulating the coolant, the coolant is cooled, thereby maintaining the coolant with a continuous heat dissipation effect.

[0031] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation circuit board, comprising a circuit board (100), wherein a heat dissipation plate (200) is plugged and installed on the inner wall of the circuit board (100), characterized in that: The bottom of the heat dissipation plate (200) is fixedly connected to a first heat dissipation tube (210); the first heat dissipation tube (210) is a hollow structure; the inner wall of the bottom of the first heat dissipation tube (210) is evenly provided with air inlet holes (220); the bottom of the first heat dissipation tube (210) is fixedly connected to a second heat dissipation tube (230); the bottom of the second heat dissipation tube (230) is welded with an end cover plate (231); the bottom of the circuit board (100) is connected to an aluminum plate (240); the outer wall of the bottom of the aluminum plate (240) is fixedly connected to a heat dissipation water tank (250); the second heat dissipation tube (230) extends to the interior of the heat dissipation water tank (250); and the outer wall of the heat dissipation water tank (250) is fixedly installed with a self-priming pump (260) for circulating coolant in the heat dissipation water tank (250).

2. A heat dissipation circuit board according to claim 1, characterized in that: The top inner wall of the circuit board (100) is provided with a countersunk hole (110), the inner wall of the countersunk hole (110) is evenly provided with through holes (111), the heat sink (200) is fixedly installed inside the countersunk hole (110), and the top outer wall of the circuit board (100) is electrically connected to the electronic component (120).

3. A heat dissipation circuit board according to claim 2, characterized in that: The bottom heating portion of the electronic component (120) contacts the surface of the heat dissipation plate (200); the first heat dissipation tube (210) passes through the through hole (111); the bottom outer wall of the circuit board (100) and the aluminum plate (240) are fixedly connected via a bracket (300); and a suspended structure is formed between the bottom of the circuit board (100) and the aluminum plate (240).

4. A heat dissipation circuit board according to claim 3, characterized in that: The air inlet (220) is located between the circuit board (100) and the aluminum plate (240), a heat dissipation fan (270) is fixedly installed on the top of the aluminum plate (240), and the second heat dissipation pipe (230) is connected to the aluminum plate (240) by welding.

5. The heat dissipation circuit board according to claim 1, characterized in that: The input end of the self-priming pump (260) is fixedly connected to the first conduit (261), and the output end of the self-priming pump (260) is fixedly connected to the second conduit (262), and the second conduit (262) is configured to be S-shaped.

6. The heat dissipation circuit board according to claim 5, characterized in that: The second conduit (262) extends into the interior of the heat dissipation water tank (250); the outer wall of the second conduit (262) is fixedly connected to the aluminum plate (240) via legs; an air hole is provided on the inner wall of the top of the heat dissipation water tank (250); a waterproof and breathable membrane is fixedly installed on the inner wall of the air hole.

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