Refrigeration and heat dissipation structure and cold and hot water dispenser

Abstract

The utility model relates to the technical field of water dispensers, and discloses a refrigeration and heat dissipation structure. An air inlet and an air outlet are formed in the side wall of the accommodating cavity; the semiconductor chilling plate is positioned in the containing cavity, the cold end of the semiconductor chilling plate is connected with a cold water container, and the hot end of the semiconductor chilling plate is aligned to the air outlet and connected with a heat dissipation plate; the fan is positioned between the heat dissipation plate and the air outlet and is used for blowing air to the air outlet; an air guide channel is arranged in the containing cavity, one end of the air guide channel is connected with the air outlet end of the fan in a sealed mode, and the other end of the air guide channel is connected with the air outlet in a sealed mode. According to the utility model, airflow blown out by the fan can be directly and efficiently discharged out of the accommodating cavity through the air outlet, so that the stability and continuity of the airflow are improved, the loss and disorder of the airflow are slowed down, the amount of retained air is reduced, the heat remaining in the accommodating cavity is reduced, the heat dissipation efficiency is improved, and the direct cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of water dispensers, in particular to a refrigeration and heat dissipation structure and a cold and hot water dispenser. Background Art

[0002] Hot and cold water dispensers are devices that can provide both hot and cold water, and are very suitable for use in offices, homes or public places. Existing hot and cold water dispensers are gradually using semiconductor technology to replace compressors for refrigeration. The semiconductor refrigeration chip contacts the water tank, and the semiconductor refrigeration chip is powered on to work, absorbing the heat in the water tank and transferring it to the external environment, thereby reducing the water temperature in the water tank and achieving refrigeration. Compared with traditional compressor refrigeration technology, it has the advantages of high efficiency, energy saving, environmental protection, compact size, no vibration, and no noise.

[0003] In order to enable the semiconductor refrigeration chip to maintain high cooling efficiency, the heat dissipation structure of the hot and cold water dispenser is particularly important. The current heat dissipation structure of the hot and cold water dispenser usually takes the form of heat sink + fan. By setting air inlets and air outlets at both ends of the water dispenser, the heat sink absorbs the heat from the hot end of the semiconductor refrigeration chip, and the negative pressure is generated by the rotation of the fan to form a circulating airflow. The circulating airflow enters the water dispenser from the air inlet to exchange heat with the heat sink, and then carries the heat out of the water dispenser through the air outlet to achieve heat dissipation.

[0004] However, the above-mentioned heat dissipation structure of the current hot and cold water dispensers has the following defects: for dust prevention considerations, the air inlet and outlet of the existing hot and cold water dispensers are composed of a number of heat dissipation holes, and the heat dissipation hole structure is a planar design, so that the heat dissipation and ventilation area of ​​the air outlet is often smaller than the blowing area of ​​the fan, resulting in that when the airflow blown by the fan is discharged to the outside through the air outlet, part of the airflow diverges with the air outlet as the center and remains in the water dispenser, thereby reducing the heat dissipation efficiency and affecting the direct cooling effect of the water dispenser. Utility Model Content

[0005] The utility model aims to provide a refrigeration and heat dissipation structure to solve the above technical problems.

[0006] In order to achieve the above objectives, the following technical solutions are provided:

[0007] In the first aspect, the utility model provides a refrigeration and heat dissipation structure, including: a accommodating cavity, whose side wall is provided with an air inlet and an air outlet; a semiconductor refrigeration plate, positioned in the accommodating cavity, whose cold end is connected to a cold water tank, and whose hot end is aligned with the air outlet and connected to a heat sink; a fan, positioned between the heat sink and the air outlet, and used for blowing air toward the air outlet; an air guide channel is provided in the accommodating cavity, one end of the air guide channel is sealedly connected to the air outlet end of the fan, and the other end thereof is sealedly connected to the air outlet.

[0008] As an optional solution for the refrigeration and heat dissipation structure provided by the utility model, a flange is formed on the fan, and a wind shield is clamped on the outer wall of the flange. One end of the wind shield is closed-loop around the air outlet end of the fan, and the other end abuts against the inner wall of the accommodating cavity and closed-loop around the air outlet, and the air guide channel is formed on the inner wall of the wind shield.

[0009] As an optional solution of the refrigeration and heat dissipation structure provided by the utility model, the inner wall of the accommodating cavity is provided with a raised rib, and the wind shield is provided with a limiting groove adapted to be clamped with the raised rib.

[0010] As an optional solution of the refrigeration and heat dissipation structure provided by the utility model, an elastic gasket for elastically abutting against the inner wall of the accommodating cavity is provided at one end of the wind shield tube close to the air outlet.

[0011] As an optional solution for the refrigeration and heat dissipation structure provided by the utility model, a support frame for installing water dispenser components is provided in the accommodating cavity, and the support frame cooperates with the outer wall of the cold water tank to form a flow converging channel, and the flow converging channel extends from the air inlet to the heat dissipation plate.

[0012] As an optional solution of the refrigeration and heat dissipation structure provided by the utility model, the outer wall of the cold water tank is provided with a drainage arc surface, the drainage arc surface extends from the air inlet to the heat dissipation plate, and the drainage arc surface participates in forming the flow converging channel.

[0013] As an optional solution for the refrigeration and heat dissipation structure provided by the utility model, the fan includes a fan frame and an impeller, the fan frame forms a wind tunnel for air flow to pass through, the impeller can be rotatably positioned in the wind tunnel, the heat sink includes a substrate connected to the semiconductor refrigeration plate, the substrate extends toward the air outlet to form a plurality of fins arranged side by side, and the air inlet end of the wind tunnel is connected to the top of the fin.

[0014] As an optional solution of the refrigeration and heat dissipation structure provided by the utility model, the air inlet and the air outlet are arranged opposite to each other.

[0015] As an optional solution of the refrigeration and heat dissipation structure provided by the utility model, the air outlet includes a curved plate, the curved plate is formed on the side wall of the accommodating cavity and arches outward, and the curved plate is dispersedly arranged with a plurality of ventilation micropores.

[0016] In a second aspect, the utility model provides a hot and cold water dispenser, which includes the refrigeration and heat dissipation structure as described above.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] An air guide channel is provided to limit the flow range of the heat dissipation airflow blown by the fan, ensuring that the airflow blown by the fan can be directly and efficiently discharged from the accommodating cavity through the air outlet, thereby improving the stability and continuity of the airflow, slowing down the loss and turbulence of the airflow, reducing the amount of retained air, reducing the heat remaining in the accommodating cavity, improving the heat dissipation efficiency, and improving the direct cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the cooling and heat dissipation structure provided in this specific embodiment. Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the cooling and heat dissipation structure provided in this specific embodiment. Figure 2 ;

[0022] In the figure:

[0023] 1. Accommodation cavity; 11. Air inlet; 12. Air outlet; 121. Curved panel; 122. Ventilation micropores; 2. Semiconductor refrigeration plate; 3. Cold water tank; 31. Flow guide arc surface; 4. Heat sink; 41. Base plate; 42. Fins; 5. Fan; 51. Fan frame; 52. Impeller; 53. Wind tunnel; 54. Flanging; 6. Air guide channel; 7. Wind shield; 71. Groove; 8. Support frame; 9. Flow focusing channel. DETAILED DESCRIPTION

[0024] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The first specific implementation of the utility model is:

[0028] refer to Figure 1 , Figure 2 A refrigeration and heat dissipation structure can be applied to drinking water equipment such as water dispensers, which includes a accommodating chamber 1 for accommodating objects. The accommodating chamber 1 can be formed by being enclosed by a shell of the drinking water equipment. An air inlet 11 and an air outlet 12 are provided on the side wall of the accommodating chamber 1. A semiconductor refrigeration sheet 2 is positioned inside the accommodating chamber 1. The cold end of the semiconductor refrigeration sheet 2 is connected to a cold water tank 3. The cold water tank 3 is made of materials such as stainless steel, glass, polyethylene PP plastic or PE plastic. It is hollow inside and is used to store cold water. The hot end of the semiconductor refrigeration sheet 2 is arranged in alignment with the air outlet 12 and is connected to a heat dissipation plate 4 for accelerating heat dissipation. A fan 5 is positioned between the heat dissipation plate 4 and the air outlet 12. The fan 5 is used to blow air to the air outlet 12.

[0029] When in use, drinking water is stored in the cold water tank 3, direct current is passed into the semiconductor refrigeration sheet 2 and the Peltier effect occurs under the action of direct current, the cold end of the semiconductor refrigeration sheet 2 absorbs the heat of the water in the cold water tank 3, and transfers the heat to the hot end of the semiconductor refrigeration sheet 2, and dissipates the heat through the heat sink 4, thereby realizing a continuous cooling function. At the same time, the fan 5 is powered on and rotated to generate negative pressure and form an airflow, and the airflow enters the accommodating chamber 1 through the air inlet 11, is accelerated by the fan 5 to blow toward the air outlet 12, and is discharged from the accommodating chamber 1 through the air outlet 12. During this period, the airflow enters the water dispenser from the air inlet 11 to exchange heat with the heat sink, and then carries the heat to leave the water dispenser through the air outlet 12 to realize heat dissipation.

[0030] Before specifically introducing the specific improvements of the present invention, it should be noted that: when the air flow is blown toward the air outlet through the fan 5, there are two values, one of which is the complete circulation air volume, and the other is the retained air volume, wherein the complete circulation air volume refers to the amount of gas that is completely discharged from the accommodating chamber 1 through the air outlet when the unit volume of air flow is blown toward the air outlet; when the unit volume of air flow is blown toward the air outlet, due to air flow collision, dispersed turbulence and other reasons, part of the air flow may fail to pass through the air outlet 12 smoothly and be retained in the accommodating chamber 1, and the retained air volume refers to the amount of gas that remains in the accommodating chamber 1 per unit volume of air flow.

[0031] Based on the above two values, the main improvements of the utility model are: the accommodating chamber 1 also has an air guide channel 6, one end of the air guide channel 6 is sealed and connected to the air outlet end of the fan 5, and the other end of the air guide channel 6 is sealed and connected to the air outlet 12. By setting the air guide channel 6, the air guide channel 6 limits the flow range of the heat dissipation airflow blown by the fan 5, ensuring that the airflow blown by the fan 5 can be directly and efficiently discharged from the accommodating chamber 1 through the air outlet 12, thereby improving the stability and continuity of the airflow, slowing down the loss and turbulence of the airflow, reducing the amount of retained air, reducing the heat remaining in the accommodating chamber 1, improving the heat dissipation efficiency, and improving the direct cooling effect.

[0032] Specifically, the fan 5 is the same as the common existing heat dissipation fan, and includes a fan frame 51 and an impeller 52. The fan frame 51 is formed with a wind tunnel 53 for airflow to pass through, and the impeller 52 is rotatably positioned in the wind tunnel 53. In this example, a flange 54 is formed at one end of the fan frame 51 close to the air inlet 11, and a windshield 7 is clamped on the outer wall of the flange 54. One end of the windshield 7 is clamped with the flange 54 and surrounds the air outlet end of the wind tunnel 53 in a closed loop. The other end of the windshield 7 is sealed against the inner wall of the accommodating cavity 1 and surrounds the air outlet 12 in a closed loop. The air guide channel 6 mentioned above is formed on the inner wall of the windshield 7. Through the above technical solution, the air guide channel 6 can be independently detachably connected between the fan 5 and the air outlet 12, which is convenient for actual assembly and disassembly, and is conducive to reducing production costs.

[0033] Taking into account that a certain vibration will be generated during the operation of the fan 5, the wind shield 7 will be prevented from rotating due to the vibration, resulting in a gap for air leakage between the wind shield 7 and the inner wall of the accommodating chamber 1. In this embodiment, the inner wall of the accommodating chamber 1 is provided with a raised rib, and the wind shield 7 is provided with a limiting groove 71 adapted to engage with the raised rib. The limiting groove 71 engages with the raised rib to limit the wind shield 7 circumferentially, thereby effectively preventing the wind shield 7 from rotational deviation.

[0034] Furthermore, an elastic gasket is provided at one end of the windshield 7 close to the air outlet 12 . When in use, the elastic gasket elastically abuts against the inner wall of the accommodating cavity 1 , so that the windshield 7 can be tightly connected to the accommodating cavity 1 , thereby enhancing the sealing of the air guide channel 6 .

[0035] In order to enhance the gas flowability in the accommodating chamber 1 , in this embodiment, the gas inlet 11 and the gas outlet 12 are arranged opposite to each other.

[0036] In order to further enhance the heat dissipation efficiency, in this embodiment, the air outlet 12 is improved on the basis of the existing planar design heat dissipation structure. The air outlet 12 includes a curved panel 121. The curved panel 121 is formed on the side wall of the accommodating cavity 1 and arches outward. The cross section of the curved panel 121 is arc-shaped. The curved panel 121 is dispersedly arranged with a plurality of ventilation micropores 122. By adopting the above-mentioned arc-shaped curved surface design, the overall heat dissipation area of ​​the air outlet 12 can be increased. Moreover, due to the increase in the overall heat dissipation area, when the fan 5 blows out the airflow through the air outlet 12, the wind pressure generated by the airflow acting on the surface of the air outlet 12 is reduced, making the air outlet smoother and reducing wind noise. In this embodiment, in order to maximize the heat dissipation efficiency, the air inlet 11 is also set to the same arc-shaped curved surface + multiple ventilation micropores 122 design as the air outlet 12, that is, it also includes a curved panel 121, and a plurality of ventilation micropores 122 are provided on the curved panel 121.

[0037] In addition, this implementation case also makes corresponding improvements to the airflow heat dissipation path, specifically:

[0038] A support frame 8 for installing the parts of the water dispenser is provided in the accommodating chamber 1, and the cold water tank 3, the heat sink 4, and the fan 5 are all positioned and connected to the support frame 8, wherein the support plate cooperates with the outer wall of the cold water tank 3 to form a focusing channel 9, and the focusing channel 9 extends from the air inlet 11 to the heat sink 4. Through the above technical solution, the focusing channel 9 with a specific extension trajectory is formed by the support plate and the cold water tank 3, and the flow trajectory of the gas entering the accommodating chamber 1 from the air inlet 11 is restricted, so that the airflow flows through the heat sink 4 to the greatest extent, the contact between the heat sink 4 and the airflow is enhanced, the heat exchange effect is improved, and the heat dissipation efficiency of the heat sink 4 is enhanced.

[0039] In order to increase the gas flow rate when the airflow contacts the heat sink 4 and further improve the heat exchange effect, in this embodiment, the outer wall of the cold water tank 3 is provided with a drainage arc surface, which extends from the air inlet 11 to the heat sink 4, and the drainage arc surface participates in forming a focusing channel 9.

[0040] Furthermore, the heat sink 4 includes a base plate 41 and fins 42 integrally connected to the base plate 41. The base plate 41 is used to connect the cold end of the semiconductor refrigeration plate 2. There are multiple fins 42 arranged side by side on the base plate 41. The top of the fin 42 away from the base plate 41 is connected to the air inlet end of the wind tunnel 53 of the fan 5. Through the above technical solution, the airflow path of the gas flowing into the fan 5 through the heat sink 4 is limited, that is, when the fan 5 rotates, the negative pressure generated by the fan 5 will act on the top of each fin 42 of the heat sink 4, so that the airflow flowing from the air inlet 11 to the fan 5 will enter the heat sink 4 along the gap formed by adjacent fins 42, and uniformly flow into the fan 5 through the top of the gap formed by adjacent fins 42, thereby greatly increasing the heat exchange area between the heat sink 4 and the airflow, making the heat sink 4 more evenly contacting the airflow, and improving the heat dissipation efficiency.

[0041] The second specific implementation of the utility model is:

[0042] A hot and cold water dispenser comprises a shell, on which is provided a refrigeration and heat dissipation structure as described in the first specific embodiment.

[0043] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A refrigeration and heat dissipation structure, characterized in that: include; An accommodating cavity (1) having a side wall provided with an air inlet (11) and an air outlet (12); A semiconductor refrigeration sheet (2) is positioned in the accommodating cavity (1), with its cold end connected to a cold water container (3), and its hot end aligned with the air outlet (12) and connected to a heat dissipation plate (4); A fan (5) is positioned between the heat dissipation plate (4) and the air outlet (12) and is used for blowing air toward the air outlet (12); an air guide channel (6) is provided in the accommodating cavity (1), one end of the air guide channel (6) is sealedly connected to the air outlet end of the fan (5), and the other end thereof is sealedly connected to the air outlet (12).

2. The refrigeration and heat dissipation structure according to claim 1, characterized in that: The fan (5) is formed with a flange (54), and a windshield (7) is clamped on the outer wall of the flange (54). One end of the windshield (7) surrounds the air outlet end of the fan (5) in a closed loop, and the other end abuts against the inner wall of the accommodating cavity (1) and surrounds the air outlet (12) in a closed loop. The air guide channel (6) is formed on the inner wall of the windshield (7).

3. The refrigeration and heat dissipation structure according to claim 2, characterized in that: The inner wall of the accommodating cavity (1) is provided with a raised rib, and the wind shield cylinder (7) is provided with a groove (71) adapted to engage with the raised rib.

4. The refrigeration and heat dissipation structure according to claim 2, characterized in that: An elastic gasket for elastically abutting against the inner wall of the accommodating cavity (1) is provided at one end of the wind shield cylinder (7) close to the air outlet (12).

5. The refrigeration and heat dissipation structure according to claim 2, characterized in that: A support frame (8) for mounting water dispenser components is provided in the accommodating cavity (1); the support frame (8) cooperates with the outer wall of the cold water tank (3) to form a flow converging channel (9); and the flow converging channel (9) extends from the air inlet (11) to the heat dissipation plate (4).

6. The refrigeration and heat dissipation structure according to claim 5, characterized in that: The outer wall of the cold water tank (3) is provided with a drainage arc surface, the drainage arc surface extends from the air inlet (11) to the heat dissipation plate (4), and the drainage arc surface participates in forming the flow-gathering channel (9).

7. The refrigeration and heat dissipation structure according to claim 2, characterized in that: The fan (5) comprises a fan frame (51) and an impeller (52), wherein the fan frame (51) forms a wind tunnel (53) for air flow to pass through, and the impeller (52) is rotatably positioned in the wind tunnel (53). The heat sink (4) comprises a base plate (41) connected to the semiconductor cooling plate (2), and the base plate (41) extends toward the air outlet (12) to form a plurality of fins (42) arranged side by side, and the air inlet end of the wind tunnel (53) is connected to the top of the fin (42).

8. The refrigeration and heat dissipation structure according to claim 1, characterized in that: The air inlet (11) and the air outlet (12) are arranged in alignment with each other.

9. The refrigeration and heat dissipation structure according to any one of claims 1 to 8, characterized in that: The air outlet (12) comprises a curved plate (121), the curved plate (121) being formed on the side wall of the accommodating cavity (1) and arching outwards, and the curved plate (121) being provided with a plurality of ventilation micropores (122) dispersedly arranged.

10. A hot and cold water dispenser, characterized in that: It comprises a refrigeration and heat dissipation structure as described in any one of claims 1 to 9.

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