LED chip alignment device and scrubbing machine

Abstract

The utility model provides an LED chip alignment device and a scrubbing machine, and the LED chip alignment device comprises a mechanical arm used for taking and placing an LED chip, a supporting part used for bearing the LED chip, and an alignment mechanism used for adjusting the LED chip, the alignment mechanism comprises a vacuum air suction pipe fixedly connected with the supporting part, a vacuum extractor connected with the vacuum air suction pipe, a first driving assembly driving the supporting part to rotate and a light sensor located in the same vertical direction with the flat edge of the LED chip, and the light sensor is electrically connected with the first driving assembly; the vacuum air suction pipe adsorbs the LED chip to the supporting component, the first driving assembly drives the supporting component to drive the LED chip to rotate, the flat edge of the LED chip rotates to the position of the light sensor, so that the light sensor senses light exposed out of the flat edge of the LED chip, the first driving assembly is controlled to stop rotating, and the first driving assembly drives the supporting component to rotate. According to the utility model, the flat edges of the LED chips are sensed through the light sensor, so that the orientation of the flat edges of the LED chips is controlled to be consistent.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chip production and manufacturing, in particular to an LED chip alignment device and a scrubbing machine. Background Art

[0002] Chip cleaning is a necessary procedure in every chip preparation process. Its purpose is to reduce the contaminants on the chip surface as much as possible, so that the components can obtain good and stable characteristics, and make the process have good reproducibility. Currently, LED chips are generally cleaned by a scrubber.

[0003] In the prior art, the scrubbing machine has the following problems: the chip is not completely round and has a flat edge. The robotic arm directly takes the chip from the plug and puts it into the cavity for scrubbing. Since the chip is placed randomly in the plug, the flat edge of the chip is also placed randomly when it is placed in the cleaning cavity. This results in that after the chip is cleaned, when the robotic arm puts the chip back into the plug, the orientation of the flat edge of each chip is different, which is not conducive to the subsequent processing of the chip. It is necessary to manually adjust the flat edges of the chip to the same orientation, which may cause the chip that has just been cleaned to be contaminated again. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the present utility model is to provide an LED chip alignment device, which aims to solve the technical problem in the prior art that when the robotic arm puts the chip back into the jam, the orientation of the flat edges of each chip is different, which is not conducive to the subsequent processing of the chip, and it is necessary to manually adjust the flat edges of the chip to the same orientation, which may cause the chip that has just been cleaned to be contaminated again.

[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0006] An LED chip alignment device includes a mechanical arm for picking up and placing LED chips, a supporting component for carrying the LED chip, and an alignment mechanism for adjusting the LED chip, wherein the alignment mechanism includes a vacuum suction pipe fixedly connected to the supporting component, a vacuum absorber connected to the vacuum suction pipe, a first driving component for driving the supporting component to rotate, and an optical fiber sensor located in the same vertical direction as the flat edge of the LED chip, wherein the optical fiber sensor is electrically connected to the first driving component, the vacuum suction pipe adsorbs the LED chip onto the supporting component, the first driving component drives the supporting component to drive the LED chip to rotate, and the flat edge of the LED chip rotates to the optical fiber sensor, so that the optical fiber sensor senses the light exposed by the flat edge of the LED chip and controls the first driving component to stop rotating.

[0007] Compared with the prior art, the beneficial effects of the utility model are:

[0008] By setting a first driving component for driving the support component to rotate, and a fiber optic sensor that is in the same vertical direction as the flat edge of the LED chip, the robotic arm places the LED chip on the support component, and controls the support component through the first driving component to drive the LED chip thereon to rotate. When the flat edge of the LED chip rotates to the fiber optic sensor, light is exposed. After capturing the light, the fiber optic sensor controls the first driving mechanism to stop rotating. In this way, the flat edge of each cleaned LED chip is in the same position. When the robotic arm takes the chip and puts the LED chip into the plug, the flat edges of the LED chips are all facing the same position, which facilitates subsequent processing and does not require manual adjustment of the LED chip by staff, which may cause the cleaned LED chip to be contaminated.

[0009] Furthermore, the LED chip alignment device also includes a centering component arranged near the supporting component, the centering component includes two clamping components relatively arranged on both sides of the supporting component, the clamping components are composed of a plurality of clamping plates, the sizes of the clamping plates increase sequentially from top to bottom, and a placement step is formed between adjacent clamping plates, and the LED chip is located on the placement step.

[0010] Furthermore, the centering component also includes a second driving component for controlling the relative movement of the two clamping components, and the two clamping components move relative to each other through the second driving component, so that the clamping plates arranged opposite to each other clamp the LED chip.

[0011] Furthermore, the supporting component is a telescopic cylinder, which includes a cylinder body and a piston rod sliding along the cylinder body, the vacuum suction pipe runs through the interior of the piston rod, and one end of the vacuum suction pipe close to the LED chip is located on the surface of the free end of the piston rod.

[0012] Furthermore, there are multiple fiber optic sensors, and the multiple fiber optic sensors are respectively located under the flat edges of the LED chips of different sizes. The LED chip includes a wafer portion and a notch portion. The wafer portion and the notch portion are divided by the flat edge. The projections of the fiber optic sensors in the vertical direction overlap with the wafer portion and the notch portion.

[0013] Furthermore, the first driving assembly includes a motor, a first pulley connected to a motor shaft of the motor, a second pulley connected to the cylinder body, and a belt structure connecting the first pulley and the second pulley.

[0014] Furthermore, one end of the clamping plate close to the LED chip is recessed to form a clamping groove, and the size of the clamping groove matches the size of the LED chip.

[0015] Furthermore, the LED chip alignment device also includes a supporting base plate, the second driving component is a slide rail cylinder, the slide rail cylinder is fixedly connected to the supporting component, and a slide rail for the slide rail cylinder to slide is provided on the supporting base plate.

[0016] The utility model also provides a scrubbing machine, comprising the LED chip alignment device as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a plan view of the LED chip alignment device in the first embodiment of the utility model;

[0018] Figure 2 This is a vertical view of the LED chip alignment device in the first embodiment of the utility model;

[0019] Figure 3 for Figure 2 A magnified view of part A;

[0020] Description of main component symbols:

[0021] Robotic Arm 10 LED Chips 20 Wafer Department 21 Notch 22 Flat Edge 23 Support base 30 Clamping parts 40 Clamping plate 41 Clamping slot 42 Light sensor 50 First drive assembly 60 Motor 61 First pulley 62 Belt structure 63 Second pulley 64 Second drive assembly 70 Support components 80 Cylinder 81 Piston rod 82 Vacuum suction pipe 91 Vacuum cleaner 92

[0022] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] See also Figures 1 to 3 , shown is an LED chip alignment device in an embodiment of the utility model, including a mechanical arm 10 for picking up and placing an LED chip 20, a supporting component 80 for carrying the LED chip 20, and an alignment mechanism for adjusting the LED chip 20, the alignment mechanism including a vacuum suction pipe 91 fixedly connected to the supporting component 80, a vacuum absorber 92 connected to the vacuum suction pipe 91, a first driving component 60 for driving the supporting component 80 to rotate, and an optical fiber sensor located in the same vertical direction as the flat edge 23 of the LED chip 20, the optical fiber sensor is electrically connected to the first driving component 60, the vacuum suction pipe 91 adsorbs the LED chip 20 onto the supporting component 80, the first driving component 60 drives the supporting component 80 to drive the LED chip 20 to rotate, and the flat edge 23 of the LED chip 20 rotates to the optical fiber sensor, so that the optical fiber sensor senses the light exposed by the flat edge 23 of the LED chip 20 and controls the first driving component 60 to stop rotating.

[0027] It can be understood that by setting a first driving component 60 for driving the support component 80 to rotate, and a fiber optic sensor that is in the same vertical direction as the flat edge 23 of the LED chip 20, the robotic arm 10 places the LED chip 20 on the support component 80, and controls the support component 80 through the first driving component 60 to drive the LED chip 20 thereon to rotate. When the flat edge 23 of the LED chip 20 rotates to the fiber optic sensor, light is exposed. After capturing the light, the fiber optic sensor controls the first driving mechanism to stop rotating. In this way, the flat edge 23 of each cleaned LED chip 20 is in the same position. When the robotic arm 10 takes the chip and puts the LED chip 20 into the plug, the flat edges 23 of the LED chip 20 are all facing the same position, which facilitates subsequent processing and does not require the staff to manually adjust the LED chip 20, which may cause the cleaned LED chip 20 to be contaminated.

[0028] Specifically, the LED chip alignment device further includes a centering component disposed near the support component 80, the centering component includes two clamping components 40 disposed relatively on both sides of the support component 80, the clamping component 40 is composed of a plurality of clamping plates 41, the size of the clamping plates 41 increases from top to bottom, and a placement step is formed between adjacent clamping plates 41, the LED chip 20 is located on the placement step, and in this embodiment, there are three clamping plates 41, corresponding to three different sizes of LED chips 20 from top to bottom;

[0029] The centering assembly further includes a second driving assembly 70 for controlling the relative movement of the two clamping members 40. The two clamping members 40 are relatively moved by the second driving assembly 70 so that the clamping plates 41 arranged opposite to each other clamp the LED chip 20.

[0030] It should be noted that, in this embodiment, the supporting component 80 is a telescopic cylinder.

[0031] It is understandable that during the production of LED chips 20, in order to reduce the pollutants on the chip surface as much as possible, so that the components can obtain good and stable characteristics, and the process has good reproducibility, the LED chips 20 are generally cleaned by a scrubber. First, LED chips 20 of various sizes are placed on the support component 80 by the mechanical arm 10, and then the telescopic cylinder is controlled to descend. When the largest LED chip 20 is at the same horizontal height as the uppermost clamping plate 41, the second drive component 70 drives the two clamping components 40 to move relative to each other, so that the two uppermost clamping plates 41 clamp the LED chip 20; similarly, when the medium-sized LED chip 20 is at the same horizontal height as the middle clamping plate 41, the second drive component 70 drives the two clamping components 40 to move relative to each other, so that the two middle clamping plates 41 clamp the LED chip 20; when the smallest LED chip 20 is at the same horizontal height as the lowermost clamping plate 41, the second drive component 70 drives the two clamping components 40 to move relative to each other, so that the two lowermost clamping plates 41 clamp the LED chip 20.

[0032] Preferably, in the present embodiment, the LED chip alignment device further comprises a supporting base plate 30, the second driving assembly 70 is a slide rail cylinder, the slide rail cylinder is fixedly connected to the supporting component 80, and a slide rail for sliding the slide rail cylinder is provided on the supporting base plate 30. When the supporting components 80 on both sides need to move relative to each other, the slide rail cylinders on both sides are started to drive the supporting components 80 on both sides to move relative to each other as a whole.

[0033] Furthermore, the telescopic cylinder includes a cylinder body 81 and a piston rod 82 sliding along the cylinder body 81 , the vacuum suction pipe 91 passes through the interior of the piston rod 82 , and one end of the vacuum suction pipe 91 close to the LED chip 20 is located on the surface of the free end of the piston rod 82 .

[0034] It is understandable that after placing the LED chip 20 on the telescopic cylinder, the vacuum suction pipe 91 can be evacuated by the vacuum suction device 92 so that the LED chip 20 is firmly adsorbed on the surface of the piston rod 82 to prevent the LED chip 20 from falling when the telescopic cylinder is extended or retracted.

[0035] Furthermore, there are multiple light sensors 50, and the multiple light sensors 50 are respectively located under the flat edges 23 of the LED chips 20 of different sizes. The LED chip 20 includes a wafer portion 21 and a notch portion 22. The wafer portion 21 and the notch portion 22 are divided by the flat edge 23. The projections of the light sensors 50 in the vertical direction overlap with the wafer portion 21 and the notch portion 22.

[0036] It can be understood that in the present embodiment, there are three light sensors 50, corresponding to three sizes of LED chips 20 respectively, and the three optical fiber sensors are located on the same horizontal line. In response to the flat edges 23 of LED chips 20 of different sizes, after the LED chip 20 is fixed by the centering component, the LED chip 20 is rotated. When the light sensor 50 corresponding to the size of the LED chip 20 senses that half of it is blocked by the wafer part 21 and the other half senses light through the notch part 22, a signal is sent to control the first driving component 60 to stop rotating, so that the flat edges 23 of LED chips 20 of each size can face the same direction.

[0037] It should be noted that the light sensor 50 can control the rotation of the motor 61 by providing a solenoid valve.

[0038] Specifically, in this embodiment, the first driving component includes a motor 61, a first pulley 62 connected to the motor 61 shaft of the motor 61, a second pulley 64 connected to the cylinder body 81, and a belt structure 63 connecting the first pulley 62 and the second pulley 64.

[0039] Furthermore, one end of the clamping plate 41 close to the LED chip 20 is recessed to form a clamping groove 42, and the size of the clamping groove 42 matches the size of the LED chip 20, so that the LED chip 20 can be placed in the clamping grooves 42 of the two oppositely arranged clamping plates 41 to be fixed.

[0040] The working process of the LED chip alignment device in the utility model is as follows:

[0041] The LED chip 20 is placed on the telescopic cylinder by the robot arm 10, the vacuum absorber 92 is started, and the LED chip 20 is adsorbed on the surface of the piston rod 82 through the vacuum suction pipe 91, and then the motor 61 is started to drive the telescopic cylinder to rotate until the flat edge 23 of the LED chip 20 and the light sensor 50 are in the same vertical direction. The light sensor 50 controls the motor 61 to stop rotating, so that the flat edge 23 of the LED chip 20 is always facing in one direction. Then, the corresponding clamping plate 41 is selected according to the size of the LED chip 20 to clamp the LED chip 20, and finally the LED chip 20 is cleaned with the brush provided by the scrubber.

[0042] In summary, the LED chip alignment device in the above-mentioned embodiment of the utility model, by setting a first driving component for driving the support component to rotate, and a light sensor that is in the same vertical direction as the flat edge of the LED chip, the robotic arm places the LED chip on the support component, and controls the support component through the first driving component to drive the LED chip thereon to rotate. When the flat edge of the LED chip rotates to the light sensor, light is exposed. After capturing the light, the light sensor controls the first driving mechanism to stop rotating. In this way, the flat edges of each cleaned LED chip are in the same position. When the robotic arm takes the chip and puts the LED chip into the plug, the flat edges of the LED chips are all facing the same position, which facilitates subsequent processing and does not require manual adjustment of the LED chip by staff, which may cause the cleaned LED chip to be contaminated.

[0043] The utility model also provides a second embodiment. Based on the first embodiment, this embodiment provides a scrubbing machine, and the scrubbing machine includes the LED chip alignment device described in the first embodiment.

[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED chip alignment device, characterized in that: It includes a mechanical arm for taking and placing LED chips, a supporting component for carrying the LED chips, and an alignment mechanism for adjusting the LED chips, the alignment mechanism includes a vacuum suction pipe fixedly connected to the supporting component, a vacuum absorber connected to the vacuum suction pipe, a first driving component for driving the supporting component to rotate, and an optical fiber sensor located in the same vertical direction as the flat edge of the LED chip, the optical fiber sensor is electrically connected to the first driving component, the vacuum suction pipe absorbs the LED chip onto the supporting component, the first driving component drives the supporting component to drive the LED chip to rotate, and the flat edge of the LED chip rotates to the optical fiber sensor, so that the optical fiber sensor senses the light exposed by the flat edge of the LED chip and controls the first driving component to stop rotating.

2. The LED chip alignment device according to claim 1, characterized in that: The LED chip alignment device also includes a centering component arranged near the supporting component, the centering component includes two clamping components arranged on both sides of the supporting component relatively, the clamping components are composed of multiple clamping plates, the sizes of the clamping plates increase from top to bottom, and a placement step is formed between adjacent clamping plates, and the LED chip is located on the placement step.

3. The LED chip alignment device according to claim 2, characterized in that: The centering assembly further comprises a second driving assembly for controlling the relative movement of the two clamping components. The two clamping components are relatively moved by the second driving assembly so that the clamping plates arranged opposite to each other clamp the LED chip.

4. The LED chip alignment device according to claim 3, characterized in that: The supporting component is a telescopic cylinder, which includes a cylinder body and a piston rod sliding along the cylinder body. The vacuum suction pipe runs through the interior of the piston rod, and one end of the vacuum suction pipe close to the LED chip is located on the surface of the free end of the piston rod.

5. The LED chip alignment device according to claim 1, characterized in that: There are multiple fiber optic sensors, which are respectively located under the flat edges of the LED chips of different sizes. The LED chip includes a wafer portion and a notch portion. The wafer portion and the notch portion are divided by the flat edge. The projections of the fiber optic sensors in the vertical direction overlap with the wafer portion and the notch portion.

6. The LED chip alignment device according to claim 4, characterized in that: The first driving assembly includes a motor, a first pulley connected to a motor shaft of the motor, a second pulley connected to the cylinder body, and a belt structure connecting the first pulley and the second pulley.

7. The LED chip alignment device according to claim 2, characterized in that: One end of the clamping plate close to the LED chip is recessed to form a clamping groove, and the size of the clamping groove matches the size of the LED chip.

8. The LED chip alignment device according to claim 3, characterized in that: The LED chip alignment device also includes a supporting base plate. The second driving component is a slide rail cylinder. The slide rail cylinder is fixedly connected to the supporting component. A slide rail for the slide rail cylinder to slide is provided on the supporting base plate.

9. A scrubbing machine, characterized in that: The LED chip alignment device comprises the LED chip alignment device according to any one of claims 1 to 8.

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