Soldering tin device for semiconductor lighting device

Abstract

The utility model relates to the technical field of semiconductor welding, in particular to a tin soldering device for a semiconductor lighting device, which comprises a tin soldering platform and a tin soldering device, a pin of the lighting device is firstly put into a hole in a welding plate, then the welding plate needing tin soldering is clamped through a clamp, and a spring enables the clamp to clamp the welding plate; as the movable rod moves downwards in the working groove, the position of the pin at the bottom of the welding plate faces downwards, the pin is placed into a high-temperature furnace and makes contact with tin liquid, the movable rod moves upwards, the tin liquid left on the pin can be fixed along with the pin, and after the clamp reaches the working groove, the clamp rotationally connected to the movable rod rotates by 180 degrees, and the pin can be fixed. The pins on the welding plate face upwards, then the tin soldering device is used for conducting secondary tin soldering adjustment, and due to the fact that the pins are fixed through the tin liquid and the tin liquid is fixed to the pins, the tin liquid only needs to be adjusted to the welding spots when secondary tin soldering is conducted.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor welding, and in particular to a soldering device for semiconductor lighting devices. Background Art

[0002] In order to reduce the contact resistance and contact thermal resistance of electronic components and improve the reliability of components, welding is usually used to make the contact surface of electronic components more precise. The components are directly fixed on the circuit board by welding, so that the volume of the entire circuit board is smaller. It is suitable for occasions with limited space. During the soldering process, it is usually necessary to fix it before welding. Usually, a clamp can be used for fixing. However, when encountering smaller devices or too many devices, the clamp usually cannot perform well. At this stage, it can also be fixed with a fixing liquid. At that time, the fixing liquid may have an adverse effect on welding, such as reducing welding strength, causing false welding or cold welding, etc., which requires a higher level of welding staff.

[0003] Therefore, a soldering device for semiconductor lighting devices is needed to solve the above technical problems. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present application is to provide a semiconductor lighting device for solving the problem that when there are too many semiconductor devices, they cannot be fixed well at the same time.

[0005] The above-mentioned purpose of the present application is achieved through the following technical solutions: a soldering device for semiconductor lighting devices, comprising a soldering platform and a soldering device, a base rod is fixedly arranged below the soldering device, a high-temperature furnace is arranged below the soldering platform and fixedly connected to the base rod, the high-temperature furnace contains tin liquid, a working groove is opened in the soldering platform, two movable rods are arranged at both ends of the working groove, a fixing device is arranged at one end of the movable rod close to the high-temperature furnace, the fixing device comprises a clamp and an adjusting rod, rotating shafts are fixedly arranged at both ends of the clamp, a spring is arranged on the clamp, both ends of the spring are fixedly connected to the clamp, the end of the rotating shaft away from the clamp is rotatably connected to the adjusting rod, and the soldering device is fixedly arranged on the soldering platform.

[0006] By adopting the above technical solution, the pins of the lighting device are first placed into the holes on the welding plate, and then the welding plate to be soldered is clamped by the clamp. The spring will pull in the two clamps to clamp the welding plate. As the staff adjusts the movable rod to move downward in the working groove, the bottom pin position of the welding plate is facing downward, and the pin is placed in a high-temperature furnace. After it is exposed to the tin liquid, the movable rod is moved upward. The tin liquid remaining on the pin will be cooled and fixed over time. When the clamp reaches the working groove, the clamp rotatably connected on the movable rod is rotated 180 degrees to make the pins on the welding plate face upward, and then the soldering device is used for secondary soldering adjustment. Since it has been fixed by the tin liquid and the tin liquid has been fixed on the pin, when performing secondary soldering, it is only necessary to adjust the tin liquid to the soldering point.

[0007] Furthermore, the adjusting rod and the movable rod are rotatably connected.

[0008] By adopting the above technical solution, after the movable rod is slid upward, it can be rotated and adjusted to place the movable rod horizontally on the soldering platform.

[0009] Furthermore, movable buckles are provided at both ends of the working groove and are fixedly connected to the working groove, and the movable rod and the movable buckles are plugged.

[0010] By adopting the above technical solution and setting the movable buckle, the movable rod can slide up and down within a limited range, so that the movable rod can be adjusted up and down more conveniently.

[0011] Furthermore, a placement groove is provided on the clamp.

[0012] By adopting the above technical solution, the welding plate can be easily placed in the placement, and the welding plate will not accidentally fall out of the fixture.

[0013] Furthermore, an extrusion layer is provided at the upper end of the placement groove.

[0014] By adopting the above technical solution, the extrusion layer can be arranged so that the welding plate can be better clamped in the groove, and at the same time, a buffering effect can be exerted on it during welding.

[0015] Furthermore, a limit buckle is provided at the position where the clamp is rotatably connected, and the limit buckle includes a first limit buckle and a second limit buckle, flanges are provided at both ends of the first limit buckle, and grooves matching the flanges are provided at both ends of the second limit buckle.

[0016] By adopting the above technical solution, when the clamp rotates, the pins on the welding plate are facing upwards and fixed by the limit buckle to prevent the welding plate from rotating with the clamp.

[0017] Furthermore, the limit buckle is clamped on the clamp.

[0018] By adopting the above technical solution, it is convenient to remove the limit buckle from the clamp and replace it more conveniently.

[0019] Furthermore, the extrusion layer is made of sponge.

[0020] By adopting the above technical solution, the sponge not only has a good cushioning effect but also has a low price.

[0021] In summary, the present application includes at least one of the following beneficial technical effects:

[0022] 1. Clamp the welding plate that needs to be soldered with the clamp. As the movable rod moves downward in the working groove, position the bottom pin of the welding plate downward, put the pin into the high-temperature furnace, let it contact the tin liquid, move the movable rod upward, and the tin liquid left on the pin will be fixed. When the clamp reaches the working groove, rotate the clamp connected to the movable rod 180 degrees to let the pin on the welding plate face upward, and then use the soldering device to adjust the soldering for the second time. Since it has been fixed by the tin liquid and the tin liquid has been fixed on the pin, when performing the secondary soldering, you only need to adjust the tin liquid to the soldering point.

[0023] 2. Through the setting of the movable buckle, the movable rod can be slid up and down within a limited range, so that the movable rod can be adjusted up and down more conveniently. At the same time, the movable rod can be rotated after being pulled to the working platform, and the movable rod can be placed on the soldering platform to enable it to perform soldering work better.

[0024] 3. When the fixture rotates, place the pins on the welding plate upwards and fix it with the limit buckle. Place the welding plate to rotate with the fixture, and at the same time, remove the limit buckle from the fixture to facilitate replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure in the embodiment;

[0026] Figure 2 2 is a schematic diagram of the structure of the movable rod and the fixing device in the embodiment;

[0027] Figure 3 Schematic diagram of the front structure of the fixing device;

[0028] Figure 4 yes Figure 3 Middle enlarged figure A;

[0029] Figure 5 2 is a schematic diagram of the limit buckle structure in the embodiment.

[0030] Figure numerals: 1. soldering platform; 101. base rod; 2. soldering device; 3. high temperature furnace; 4. movable buckle; 401. working groove; 402. movable rod; 403. rotating shaft; 5. fixing device; 501. adjusting rod; 502. clamp; 6. placement groove; 601. extrusion layer; 7. limit buckle; 701. first limit buckle; 702. second limit buckle; 703. flange; 704. groove. DETAILED DESCRIPTION

[0031] The present application is further described in detail below in conjunction with the accompanying drawings.

[0032] Example, see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 A soldering device for a semiconductor lighting device comprises a soldering platform 1 and a soldering device 2, wherein a base rod 101 is fixedly arranged below the soldering device 2, a high temperature furnace 3 is arranged below the soldering platform 1, and tin liquid is contained in the high temperature furnace 3, a working groove 401 is provided in the soldering platform 1, two movable rods 402 are arranged at both ends of the working groove 401, a fixing device 5 is arranged at one end of the movable rod 402 close to the high temperature furnace 3, the fixing device 5 comprises a clamp 502 and an adjusting rod 501, a rotating shaft 403 is fixedly arranged at both ends of the clamp 502, and a spring is fixedly arranged in the middle of the clamp 502, and the two ends of the rotating shaft 403 are rotatably connected to the adjusting rod 501, the soldering device 2 is fixedly arranged on the soldering platform 1, and the adjusting rod 501 is rotatably connected to the movable rod 402, firstly, the pins of the lighting device are placed into the soldering After the holes on the connecting plate are connected, the welding plate that needs to be soldered is clamped by the clamp 502. The spring will allow the clamp 502 to clamp the welding plate. As the movable rod 402 moves downward in the working groove 401, the bottom pin position of the welding plate is facing downward, and the pin is placed in the high-temperature furnace 3. After it is exposed to the tin liquid, the movable rod 402 is moved upward, and the tin liquid remaining on the pin will be fixed. When the clamp 502 reaches the working groove 401, the movable rod 402 is adjusted to place it on the soldering platform 1, and the clamp 502 rotatably connected to the movable rod 402 is rotated 180 degrees to make the pin on the welding plate face upward, and then the soldering device 2 is used for secondary soldering adjustment. Since it has been fixed by the tin liquid and the tin liquid has been fixed on the pin, when performing secondary soldering, it only needs to adjust the tin liquid to the soldering point.

[0033] In this embodiment, movable buckles 4 are provided at both ends of the working groove 401 and are fixedly connected to the working groove 401. The movable rod 402 and the movable buckle 4 are plugged in. Through the setting of the movable buckle 4, the movable rod 402 can slide up and down within a limited range, so that the movable rod 402 can be adjusted up and down more conveniently.

[0034] In this embodiment, a placement groove 6 is opened on the clamp 502, and an extrusion layer 601 is provided at the upper end of the placement groove 6 and fixedly connected in the placement groove 6, which can facilitate the placement of the welding plate and prevent the welding plate from accidentally falling out of the clamp 502.

[0035] In this embodiment, a limit buckle 7 is provided at the position where the clamp 502 is rotatably connected. The limit buckle 7 includes a first limit buckle 701 and a second limit buckle 702. Flanges 703 are provided at both ends of the first limit buckle 701, and grooves 704 matching the flanges 703 are provided at both ends of the second limit buckle. The limit buckle 7 is clamped on the clamp 502. When the clamp 502 rotates, the pins on the welding plate are facing upwards, and the flange 703 on the first limit buckle 7017 and the groove 704 on the second limit buckle 7027 are connected, and then they are fixed by the limit buckle 7 to prevent the welding plate from rotating with the clamp 502.

[0036] Specific implementation process;

[0037] First, place the pins of the lighting device into the holes on the welding plate, and then clamp the welding plate that needs to be soldered with the clamp 502. As the movable rod 402 moves downward in the working groove 401, the bottom pin position of the welding plate is facing downward, and the pin is placed in the high-temperature furnace 3. After it is exposed to the tin liquid, the movable rod 402 is moved upward, and the tin liquid remaining on the pin will be fixed. When the clamp 502 reaches the working groove 401, the movable rod 402 is adjusted and placed on the soldering platform 1 to stabilize it. The clamp 502 rotatably connected to the movable rod 402 is rotated 180 degrees to make the pins on the welding plate face upward, and then the soldering device 2 is used for secondary soldering adjustment. Since it has been fixed by the tin liquid and the tin liquid has been fixed on the pin, when performing secondary soldering, it is only necessary to adjust the tin liquid to the soldering point.

[0038] By setting the movable buckle 4, the movable rod 402 can slide up and down within a limited range, so that the movable rod 402 can be adjusted up and down more conveniently.

[0039] The placement slot 6 can be provided to facilitate the placement of the welding plate, so as to prevent the welding plate from accidentally falling out of the fixture 502.

[0040] When the clamp 502 rotates, the pins on the welding plate are facing upwards and fixed by the limit buckle 7 to prevent the welding plate from rotating with the clamp 502.

[0041] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A soldering device for a semiconductor lighting device, characterized in that: The invention comprises a soldering platform (1) and a soldering device (2), wherein a base rod (101) is fixedly arranged below the soldering device (2), a high-temperature furnace (3) is arranged below the soldering platform (1) and is fixedly connected to the base rod (101), the high-temperature furnace (3) contains tin liquid, a working groove (401) is provided in the soldering platform (1), two movable rods (402) are arranged at both ends of the working groove (401), and the movable rods (402) are close to the high-temperature furnace (3). A fixing device (5) is provided at one end, the fixing device (5) comprising a clamp (502) and an adjusting rod (501), a spring is provided on the clamp (502), both ends of the spring are fixedly connected to the clamp (502), a rotating shaft (403) is fixedly provided at both ends of the clamp (502), one end of the rotating shaft (403) away from the clamp (502) is rotatably connected to the adjusting rod (501), and the soldering device (2) is fixedly provided on the soldering platform (1).

2. The soldering device for semiconductor lighting device according to claim 1, characterized in that: The adjusting rod (501) and the movable rod (402) are rotatably connected.

3. The soldering device for semiconductor lighting device according to claim 1, characterized in that: Both ends of the working groove (401) are provided with movable buckles (4) which are fixedly connected to the working groove (401), and the movable rod (402) and the movable buckle (4) are plugged into each other.

4. The soldering device for semiconductor lighting device according to claim 1, characterized in that: The clamp (502) is provided with a placement groove (6).

5. The soldering device for semiconductor lighting device according to claim 4, characterized in that: An extrusion layer (601) is provided at the upper end of the placement groove (6).

6. The soldering device for semiconductor lighting device according to claim 4, characterized in that: A limit buckle (7) is provided at the position where the clamp (502) is rotatably connected. The limit buckle (7) comprises a first limit buckle (701) and a second limit buckle (702). Flanges (703) are provided at both ends of the first limit buckle (701), and grooves (704) matching the flanges (703) are provided at both ends of the second limit buckle.

7. The soldering device for semiconductor lighting device according to claim 6, characterized in that: The limiting buckle (7) is clamped on the clamp (502).

8. The soldering device for semiconductor lighting device according to claim 5, characterized in that: The extrusion layer (601) is made of sponge.

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