Printing machine special for net plate for wafer protrusion

Abstract

The utility model discloses a special printing machine for a net plate for wafer protrusion, which comprises a bottom plate, two vertical plates are fixedly connected to the upper surface of the bottom plate, a top plate is fixedly connected to the top ends of the two vertical plates together, two groups of dampers are installed on the bottom surface of the top plate, and a printing machine body is installed at the bottom ends of the two groups of dampers together. The left side face and the right side face of the printing machine body are each fixedly connected with two stabilizing plates, a sliding hole is formed in the upper surface of each stabilizing plate, and the inner wall of each sliding hole is slidably connected with a sliding rod. Through cooperation of a stabilizing plate, a sliding hole, a spring, a connecting plate and a damper, when the printing machine body works, the stabilizing plate acts force generated by working of the printing machine body on the spring, the spring absorbs the force generated by working of the printing machine body, and meanwhile the damper further stabilizes the printing machine body; patterns can be guaranteed to be completed when the printing machine body prints a wafer, and therefore the quality of wafer printing is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer printing equipment, in particular to a special screen printing machine for wafer convexity. Background Art

[0002] Wafer printing does play a vital role in the semiconductor manufacturing process. It involves the precise coating and transfer of specific patterns or materials on the wafer surface. This step is crucial to ensuring the quality and performance of the final product. Wafer printing is an indispensable part of semiconductor manufacturing. It ensures the precise transfer and formation of circuit patterns, laying a solid foundation for the quality and performance of the final product.

[0003] The current printer may experience slight vibrations when processing tiny wafer bumps. Any slight vibration or error may cause pattern distortion or incomplete transfer, thus affecting product quality. Therefore, we propose a special screen printer for wafer bumps to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a screen printing machine for wafer bumping to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A special screen printing machine for wafer bumping comprises a bottom plate, the upper surface of the bottom plate is fixedly connected to two vertical plates, the top ends of the two vertical plates are commonly fixedly connected to a top plate, the bottom surface of the top plate is equipped with two groups of dampers, the bottom ends of the two groups of dampers are commonly equipped with a printing machine body, the left and right side surfaces of the printing machine body are fixedly connected to two stabilizing plates, the upper surface of each stabilizing plate is provided with a sliding hole, the inner wall of each sliding hole is slidably connected to a sliding rod, the top end of each sliding rod and the bottom end of each sliding rod are fixedly connected to a connecting plate, the side surfaces of the two connecting plates that are away from each other are respectively connected to the side surfaces of the two vertical plates that are close to each other, and the outer surface of each sliding rod is sleeved with two springs.

[0007] In a further embodiment, each group of the springs is located above and below the stabilizing plate, respectively, and ends of each group of the springs that are away from each other are respectively connected to sides of each group of connecting plates that are close to each other.

[0008] In a further embodiment, a stabilizing groove is formed on the side surfaces of the two vertical plates close to each other, and ends of the two groups of stabilizing plates away from each other extend into the inside of the stabilizing groove and are slidably connected to the inner wall of the stabilizing groove.

[0009] In a further embodiment, two sets of electric push rods are installed on the upper surface of the bottom plate, and a placement plate is jointly installed at the tops of the two electric push rods. A set of placement holes are formed in the upper surface of the placement plate.

[0010] In a further embodiment, two sponge pads are fixedly connected to the upper surface of the placement plate.

[0011] In a further embodiment, limiting grooves are formed in the right side surfaces of the two vertical plates, and limiting plates are slidably connected to the inner walls of each limiting groove. The mutually approaching ends of the two limiting plates are respectively connected to the left and right side surfaces of the placement plate.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] Through the cooperation of the stabilizing plate, sliding holes, springs, connecting plates and dampers provided in this device, when the printing machine body works, the stabilizing plate will act on the springs with the force generated by the operation of the printing machine body, and the springs will absorb the force generated by the operation of the printing machine body. At the same time, the damper will further stabilize the printing machine body, which can ensure the completion of the pattern when the printing machine body prints the wafer, thereby ensuring the quality of wafer printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of a special printing machine for a stencil for wafer protrusions.

[0015] Figure 2 It is a three-dimensional structural schematic diagram of a side view of a vertical plate of a special printing machine for a stencil for wafer protrusions.

[0016] Figure 3 It is a three-dimensional structural schematic diagram of a front view of the bottom plate of a special printing machine for a stencil for wafer protrusions.

[0017] In the figure: 1, bottom plate; 2, vertical plate; 3, top plate; 4, damper; 5, printing machine body; 6, connecting plate; 7, stabilizing groove; 8, spring; 9, stabilizing plate; 10, sliding hole; 11, sliding rod; 12, limiting groove; 13, sponge pad; 14, placement hole; 15, electric push rod; 16, placement plate; 17, limiting plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 In the utility model, a screen printing machine for wafer bumping includes a bottom plate 1, two vertical plates 2 are fixedly connected to the upper surface of the bottom plate 1, the top ends of the two vertical plates 2 are commonly fixedly connected to a top plate 3, two groups of dampers 4 are installed on the bottom surface of the top plate 3, and a printing machine body 5 is commonly installed at the bottom ends of the two groups of dampers 4, and the left and right sides of the printing machine body 5 are fixedly connected to two stabilizing plates 9, each stabilizing plate 9 has a sliding hole 10 on the upper surface, and a sliding rod 11 is slidably connected to the inner wall of each sliding hole 10, and a connecting plate 6 is fixedly connected to the top end of each sliding rod 11 and the bottom end of each sliding rod 11, and the side surfaces of the two connecting plates 6 that are away from each other are respectively connected to the side surfaces of the two vertical plates 2 that are close to each other, and the outer surface of each sliding rod 11 is sleeved with two springs 8.

[0021] Each group of springs 8 is located above the stabilizing plate 9 and below the stabilizing plate 9, respectively. The ends of each group of springs 8 that are away from each other are respectively connected to the side surfaces of each group of connecting plates 6 that are close to each other. By connecting the springs 8 and the connecting plates 6, the springs 8 can be fixed to prevent displacement when the springs 8 are extended or retracted.

[0022] A stabilizing groove 7 is provided on the side surfaces of the two vertical plates 2 that are close to each other, and the ends of the two sets of stabilizing plates 9 that are away from each other extend into the interior of the stabilizing groove 7 and are slidably connected to the inner wall of the stabilizing groove 7. The connection between the stabilizing plate 9 and the stabilizing groove 7 can further stabilize the stabilizing plate 9, thereby ensuring the firmness of the stabilizing plate 9 in reinforcing the printing machine body 5.

[0023] Two groups of electric push rods 15 are installed on the upper surface of the base plate 1, and a placement plate 16 is installed on the top of the two electric push rods 15. A group of placement holes 14 are opened on the upper surface of the placement plate 16. The placement holes 14 can be used to position and place the wafer, and the electric push rods 15 can be used to push the placement plate 16 up, so as to complete the printing of the wafer.

[0024] Two sponge pads 13 are fixedly connected to the upper surface of the placement plate 16 . The sponge pads 13 can be used to isolate the placement plate 16 from the printer body 5 , thereby avoiding collision between the placement plate 16 and the printer body 5 .

[0025] A limiting groove 12 is provided on the right side surface of the two vertical plates 2, and the inner wall of each limiting groove 12 is slidably connected to a limiting plate 17. The ends of the two limiting plates 17 that are close to each other are respectively connected to the left and right side surfaces of the placement plate 16. By utilizing the cooperation between the set limiting groove 12 and the limiting plate 17, the rising height of the placement plate 16 can be limited to avoid damage to the wafer.

[0026] The working principle of the utility model is: when in use, the wafer can be placed in the placement hole 14, and then the electric push rod 15 is started to work, the electric push rod 15 will push the placement plate 16 to rise, and then the printer body 5 is started to work, and the force generated by the printer body 5 when working will act on the spring 8 through the stabilizing plate 9, and the spring 8 will shrink to absorb the force generated by the printer body 5, and the damper 4 will further stabilize the printer body 5, which can avoid vibration when printing the wafer, thereby ensuring the completion of the pattern and further improving the quality of wafer printing.

[0027] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A screen printing machine for wafer bumping, characterized in that: The invention comprises a bottom plate (1), the upper surface of the bottom plate (1) is fixedly connected to two vertical plates (2), the top ends of the two vertical plates (2) are commonly fixedly connected to a top plate (3), the bottom surface of the top plate (3) is installed with two groups of dampers (4), the bottom ends of the two groups of dampers (4) are commonly installed with a printing machine body (5), the left and right side surfaces of the printing machine body (5) are fixedly connected to two stabilizing plates (9), the upper surface of each stabilizing plate (9) is provided with a sliding hole (10), the inner wall of each sliding hole (10) is slidably connected to a sliding rod (11), the top end of each sliding rod (11) and the bottom end of each sliding rod (11) are fixedly connected to a connecting plate (6), the side surfaces of the two connecting plates (6) that are away from each other are respectively connected to the side surfaces of the two vertical plates (2) that are close to each other, and the outer surface of each sliding rod (11) is sleeved with two springs (8).

2. The wafer bumping screen printing machine according to claim 1, characterized in that: Each group of springs (8) is located above the stabilizing plate (9) and below the stabilizing plate (9), respectively, and one end of each group of springs (8) that is away from each other is connected to one side of each group of connecting plates (6) that is close to each other.

3. The wafer bumping screen printing machine according to claim 1, characterized in that: The sides of the two vertical plates (2) close to each other are each provided with a stabilizing groove (7), and the ends of the two groups of stabilizing plates (9) away from each other extend into the interior of the stabilizing groove (7) and are slidably connected to the inner wall of the stabilizing groove (7).

4. The wafer bumping screen printing machine according to claim 1, characterized in that: Two groups of electric push rods (15) are installed on the upper surface of the base plate (1), a placement plate (16) is installed on the top ends of the two electric push rods (15), and a group of placement holes (14) are opened on the upper surface of the placement plate (16).

5. The wafer bumping screen printing machine according to claim 4, characterized in that: Two sponge pads (13) are fixedly connected to the upper surface of the placement plate (16).

6. The wafer bumping screen printing machine according to claim 1, characterized in that: The right sides of the two vertical plates (2) are each provided with a limiting groove (12), the inner wall of each limiting groove (12) is slidably connected to a limiting plate (17), and the ends of the two limiting plates (17) that are close to each other are respectively connected to the left and right side surfaces of the placement plate (16).

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