Efficient microelectronic component chip recovery device
By designing a high-efficiency microelectronic component chip recycling device that includes sliding grooves, sliding frames, clamps and placement frames, the problem of classification and value distinction in chip recycling is solved, and the chip is safely preserved and conveniently picked up and placed.
Patent Information
- Application Number
- CN202421254096.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-06-04
AI Technical Summary
In the prior art, when recycling chips of high-efficiency microelectronic component, it is difficult to achieve chip classification and value distinction, and it is prone to friction damage and contamination of stains and dust.
A highly efficient microelectronic component chip recycling device is designed, including a storage box and a sealing board. The storage box is equipped with sliding grooves, sliding frames, clamps and placement frames. Through the cooperation of sliding strips and spring columns, the placement frames are realized and the expansion and contraction of the placement frames are achieved. Extraction and pulling are convenient for the classification and pick-up of chips.
The chip is classified, preserved and distinguished in value, prevents chips from being damaged due to friction, and has a certain dust-proof effect. The telescopic design of the placing frame is easy to pick up the chip.
Smart Images
Figure CN222432871U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip recycling, and in particular relates to a high-efficiency microelectronic component chip recycling device. Background Art
[0002] High-efficiency microelectronic component chip is a microelectronic device or component. It uses a certain process to interconnect the transistors, diodes, resistors, capacitors, inductors and other components and wiring required in a circuit, and is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a tube shell to become a microstructure with the required circuit function; all the components have formed a whole in structure, making electronic components a big step towards miniaturization, low power consumption and high reliability. It is represented by the letter "IC" in the circuit.
[0003] There are hundreds of thousands of high-efficiency microelectronic component chips in existing technology. The recycling value of various chips is different. When recycling, the used chips are mostly piled together in kraft bags and plastic boxes. The chips cannot be classified and their value cannot be distinguished, which makes it troublesome to organize. The accumulation of various chips together may also cause friction and damage to the chip package, which is easy to be stained with stains and dust. Utility Model Content
[0004] The purpose of the utility model is to provide an efficient microelectronic component chip recycling device, which can place waste chips in a storage box for easy classification and storage, distinguish the values of different chips, prevent chips from piling up and causing chip packages to be damaged due to friction, has a certain dustproof effect, and the placement rack can be vertically extended and retracted while being pulled, so that chips can be taken out more conveniently.
[0005] The technical solution adopted by the utility model is as follows:
[0006] The cam is movably connected to the bottom of the storage box, and the cam is movably connected to the bottom of the storage box by a spring, which is pressed against the top of the storage box to release the spring.
[0007] The sealing plate is detachably arranged on one side of the clamping plate, and T-shaped cards are fixedly connected to both sides of the sealing plate. Fixed blocks are fixedly connected to both sides of the placement rack located in the middle of the storage box. The sealing plate is movably engaged with the fixed block through the T-shaped card, and a sealing plate groove for engaging and placing the sealing plate is opened through the middle of the wedge plate.
[0008] The sliding groove and the sliding frame are arranged at right angles to each other, and a pull rod is fixedly connected to the middle of the sealing plate.
[0009] One side of the sealing plate is provided with a name category slot for marking names, and the top of the fixing block is symmetrically fixedly connected with a protrusion for preventing the T-shaped card from being dislocated.
[0010] The spring column is internally slidably and telescopically provided with a telescopic rod four, one end of the telescopic rod four is fixedly connected to the placement frame, and the outer wall of the telescopic rod four is slidably connected with a telescopic rod three.
[0011] Through slots are provided on both sides of the placement rack and below the spring column.
[0012] The inner wall of the through groove is fixedly connected with a retaining ring for the telescopic rod to slide through, and the retaining ring is fixedly connected to the spring column.
[0013] The technical effect achieved by the utility model is that waste chips can be placed in a storage box for easy classification and storage, the value of different chips can be distinguished, and chips can be prevented from being piled up and causing the chip package to be damaged due to friction. The utility model has a certain dust-proof effect, and the placement rack can be extended and retracted vertically while being pulled, so that the chips can be taken out more conveniently. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is an overall appearance diagram of the chip recovery device provided in the embodiment of the utility model;
[0015] Figure 2 yes Figure 1 A partial enlarged view of the middle A;
[0016] Figure 3 It is a structural exploded view of a chip recovery device provided in an embodiment of the utility model;
[0017] Figure 4 It is a bottom view of the structure of the placement rack provided in the embodiment of the utility model;
[0018] Figure 5 yes Figure 4 A partial enlarged view of point B in the middle.
[0019] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0020] 1. Storage box; 101. Sliding slot; 102. Sliding rack; 103. Sliding bar; 104. Placement rack; 105. Spring column; 106. Clamp; 107. Telescopic rod one; 108. Wedge plate; 109. Closing plate slot; 110. Fixed block; 111. Bump; 112. Sponge block; 113. Telescopic rod two; 114. Telescopic rod three; 115. Telescopic rod four; 116. Through slot; 117. Retaining ring; 2. Closing plate; 201. T-shaped card; 202. Pull rod; 203. Name slot. DETAILED DESCRIPTION
[0021] In order to make the purpose and advantages of the utility model more clear, the utility model is specifically described in combination with the following embodiments. It should be understood that the following text is only used to describe one or several specific implementations of the utility model, and does not strictly limit the protection scope of the specific request of the utility model.
[0022] like Figure 1-3 As shown, a high-efficiency microelectronic component chip recovery device includes a storage box 1 and a sealing plate 2, the inner wall of the storage box 1 is symmetrically fixedly connected with a sliding groove 101, one side of the sliding groove 101 is slidably connected with a sliding bar 103, the inner wall of the storage box 1 is symmetrically fixedly connected with a sliding frame 102, the sliding groove 101 and the sliding frame 102 are arranged at right angles to each other, the interior of the storage box 1 is symmetrically slidably provided with a clamping plate 106, one side of the clamping plate 106 is symmetrically fixedly connected with a wedge plate 108, the clamping plate 106 is slidably connected to the sliding frame 102 through the wedge plate 108, a plurality of placement racks 104 are equidistantly arranged between the two clamping plates 106, the placement rack 104 located in the middle of the storage box 1 is fixedly connected to the sliding bar 103, and one side of the clamping plate 106 and the placement rack 104 are fixedly connected with a sponge pressing block 112.
[0023] According to the above structure, the placement rack 104 slides in the sliding groove 101 through the sliding bar 103 and can slide out from the inside of the storage box 1. The clamping plate 106 is slidably connected to the sliding rack 102 through the wedge plate 108 and slides out from the inside of the storage box 1. Due to the wedge surface of the wedge plate 108, when the wedge plate 108 slides to the outer wall of the storage box 1, the placement rack 104 uses the spring column 105 to open the clamping plates 106 and other placement racks 104 on both sides, so that the chip placed on the placement rack 104 can be taken. When the placement rack 104 and the clamping plate 106 slide toward the inside of the storage box 1, the wedge surface of the wedge plate 108 squeezes the clamping plate 106, and the placement rack 104 located in the middle of the storage box 1 is fixedly connected to the sliding bar 103, and its position will not change with the expansion and contraction of the spring column 105. The sponge pressing block 112 softly squeezes and fixes the chip when the placement rack 104 and the clamping plate 106 are compressed and closed to prevent the chip from shifting and rubbing.
[0024] See attached Figure 1 , Figure 4-5 , several placement racks 104 are elastically connected with spring columns 105 in a mirror-like manner, and through grooves 116 are penetrated on both sides of the placement racks 104 and below the spring columns 105. A telescopic rod four 115 is provided inside the spring column 105 for sliding and telescopic operation. One end of the telescopic rod four 115 is fixedly connected to the placement rack 104, and a telescopic rod three 114 is slidably connected to the outer wall of the telescopic rod four 115. A retaining ring 117 for the telescopic rod three 114 to slide through is fixedly connected to the inner wall of the through groove 116. The retaining ring 117 is fixedly connected to the spring column 105. A telescopic rod one 107 and a telescopic rod two 113 for telescopic sliding are penetrated at the top corners of the placement rack 104 and the splint 106, and the telescopic rod one 107 is slidably arranged on the inner wall of the telescopic rod two 113.
[0025] According to the above structure, the placement rack 104 uses the spring column 105 to open the splints 106 on both sides and other placement racks 104, the telescopic rod four 115 slides out from the inner wall of the telescopic rod three 114, and the retaining ring 117 supports the telescopic rod four 115. When the placement rack 104 and the splint 106 are retracted and closed, the telescopic rod four 115 is retracted into the telescopic rod three 114, and the telescopic rod three 114 slides downward through the retaining ring 117. When the placement rack 104 and the splint 106 are retracted and closed, the telescopic rod one 107 is retracted into the interior of the telescopic rod two 113 to save vertical space.
[0026] See attached Figure 1-3 The sealing plate 2 is detachably arranged on one side of the splint 106, and a name category slot 203 for marking the name is opened on one side of the sealing plate 2. A pull rod 202 is fixedly connected to the middle of the sealing plate 2, and T-shaped cards 201 are fixedly connected to both sides of the sealing plate 2. Fixed blocks 110 are fixedly connected to both sides of the placement rack 104 located in the middle of the storage box 1, and the sealing plate 2 is movably engaged with the fixed block 110 through the T-shaped card 201. The top of the fixed block 110 is symmetrically fixedly connected with a protrusion 111 for preventing the T-shaped card 201 from being dislocated. A sealing plate slot 109 for engaging and placing the sealing plate 2 is opened through the middle of the wedge plate 108.
[0027] According to the above structure, pull the pull rod 202, the pull rod 202 drives the sealing plate 2 and the T-shaped card 201, the T-shaped card 201 is connected with the fixed block 110 to pull the placement rack 104 out of the interior of the storage box 1, and the sealing plate 2 is slid upward to separate the T-shaped card 201 from the fixed block 110, and the sealing plate 2 is inserted horizontally into the sealing plate groove 109 for temporary placement, and the name slot 203 can be labeled with the chip name for easy retrieval; the utility model can place waste chips in the storage box 1, which is convenient for classification and storage, distinguishes the value of different chips, prevents chips from piling up and causing the chip package to be damaged due to friction, has a certain dust-proof effect, and the placement rack 104 can be extended and retracted vertically while pulling and pulling, so that the chips can be taken more conveniently.
[0028] The working principle of the utility model is as follows: the placement rack 104 slides in the sliding groove 101 through the sliding bar 103, and can slide out from the inside of the storage box 1. The clamping plate 106 is slidably connected to the sliding rack 102 through the wedge plate 108 at the same time, and slides out from the inside of the storage box 1. Due to the wedge surface of the wedge plate 108, when the wedge plate 108 slides to the outer wall of the storage box 1, the placement rack 104 opens the clamping plates 106 and other placement racks 104 on both sides through the spring column 105, and the chip placed on the placement rack 104 can be taken out. When the placement rack 104 and the clamping plate 106 slide into the interior of the storage box 1, the wedge surface of the wedge plate 108 squeezes the clamping plate 106, and the placement rack 104 located in the middle of the storage box 1 is fixedly connected to the sliding bar 103, and its position will not change with the expansion and contraction of the spring column 105. The sponge pressing block 112 softly squeezes and fixes the chip when the placement rack 104 and the clamping plate 106 are compressed and closed, so as to prevent the chip from shifting and rubbing. The placing rack 104 uses the spring column 105 to open the clamping plates 106 on both sides and other placing racks 104, and the telescopic rod 4 115 slides out from the inner wall of the telescopic rod 3 114, and the retaining ring 117 supports the telescopic rod 4 115. When the placing rack 104 and the clamping plates 106 are retracted and closed, the telescopic rod 4 115 is retracted into the telescopic rod 3 114, and the telescopic rod 3 114 slides downward through the retaining ring 117. The telescopic rod 107 is When closed, it is retracted into the interior of the telescopic rod 113 to save vertical space; pull the pull rod 202, the pull rod 202 drives the sealing plate 2 and the T-shaped card 201, the T-shaped card 201 is connected with the fixed block 110 to pull the placement rack 104 out of the storage box 1, and the sealing plate 2 can be slid upward to separate the T-shaped card 201 from the fixed block 110. The sealing plate 2 can be inserted horizontally into the sealing plate slot 109 for temporary placement, and the name slot 203 can be labeled with the chip name for easy retrieval.
[0029] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.
Claims
1. An efficient microelectronic component chip recycling device, comprising a storage box (1) and a sealing plate (2), characterized in that: The inner wall of the storage box (1) is symmetrically fixedly connected with a sliding groove (101), one side of the sliding groove (101) is slidably connected with a sliding bar (103), the inner wall of the storage box (1) is symmetrically fixedly connected with a sliding frame (102), the interior of the storage box (1) is symmetrically slidably provided with a clamping plate (106), one side of the clamping plate (106) is symmetrically fixedly connected with a wedge plate (108), the clamping plate (106) is slidably connected to the sliding frame (102) via the wedge plate (108), and a plurality of placement plates are equidistantly arranged between the two clamping plates (106). A rack (104), a plurality of the racks (104) are elastically connected in a mirror-like manner with spring columns (105), the rack (104) located in the middle of the storage box (1) is fixedly connected to the sliding bar (103), a telescopic rod 1 (107) and a telescopic rod 2 (113) for telescopic sliding are provided through the top corners of the rack (104) and the clamp (106), the telescopic rod 1 (107) is slidably arranged on the inner wall of the telescopic rod 2 (113), and a sponge pressing block (112) is fixedly connected to one side of the clamp (106) and the rack (104); The sealing plate (2) is detachably arranged on one side of the clamping plate (106), and T-shaped cards (201) are fixedly connected to both sides of the sealing plate (2). A fixing block (110) is fixedly connected to both sides of a placement rack (104) located in the middle of the storage box (1), and the sealing plate (2) is movably engaged with the fixing block (110) via the T-shaped card (201). A sealing plate groove (109) for engaging and placing the sealing plate (2) is provided through the middle of the wedge-shaped plate (108).
2. The high-efficiency microelectronic component chip recycling device according to claim 1 is characterized in that: The sliding groove (101) and the sliding frame (102) are arranged at right angles to each other, and a pull rod (202) is fixedly connected to the middle of the sealing plate (2).
3. The high-efficiency microelectronic component chip recycling device according to claim 1 is characterized in that: One side of the cover plate (2) is provided with a name slot (203) for marking a name, and the top of the fixing block (110) is symmetrically fixedly connected with a protrusion (111) for preventing the T-shaped card (201) from being dislocated.
4. The high-efficiency microelectronic component chip recycling device according to claim 1 is characterized in that: The spring column (105) is internally slidably and telescopically provided with a telescopic rod four (115), one end of which is fixedly connected to the placement rack (104), and the outer wall of the telescopic rod four (115) is slidably connected to a telescopic rod three (114).
5. The high-efficiency microelectronic component chip recycling device according to claim 4 is characterized in that: Through slots (116) are provided on both sides of the placement rack (104) and below the spring column (105).
6. The high-efficiency microelectronic component chip recycling device according to claim 5, characterized in that: A retaining ring (117) is fixedly connected to the inner wall of the through groove (116) for the telescopic rod three (114) to slide through, and the retaining ring (117) is fixedly connected to the spring column (105).