High-precision feeding tray for semiconductor auxiliary materials

Abstract

The utility model discloses a high-precision feeding tray for semiconductor auxiliary materials. The high-precision feeding tray comprises a bottom plate; the tray is arranged at the top of the bottom plate in a sliding and pulling mode, and a plurality of storage areas are arranged at the top of the tray and used for storing workpieces to be fed; the positioning module is connected with the bottom plate and the tray, and when the tray slides on the top of the bottom plate for feeding, the position of the tray is positioned; and the in-place detection module is connected with the bottom plate and the tray, and when the tray slides on the top of the bottom plate for feeding, whether the tray slides in place or not is detected. The tray feeding mechanism has the advantages that the problems that a tray is inaccurate in feeding positioning and prone to moving are solved, and the effect of accurately clamping and feeding of an external clamping module is achieved; 2, the whole structure is mainly a mechanical structure, so that the cost is low and the operation cost is low; and 3, the modular design is adopted, the expansibility is high in the actual use process, and standardized application is easy.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a high-precision feeding tray for semiconductor auxiliary materials. Background Art

[0002] The application scale of intelligence and automation in the semiconductor industry is getting bigger and bigger, and the demand accounts for an increasing proportion. The management of the life cycle of semiconductor processing consumables and intelligent storage equipment have begun to enter major packaging manufacturers. All kinds of consumables need to be managed reasonably and meticulously. Among them, the most demanded is the intelligent equipment for the management of various auxiliary materials.

[0003] In warehouse management, semiconductor auxiliary materials need to be loaded. During the loading process, the loading trays are currently loaded by pushing and pulling. However, the trays currently do not have precise positioning, and the loading accuracy cannot be controlled, which affects the processing accuracy of the workpiece after loading. Summary of the invention

[0004] According to an embodiment of the utility model, a high-precision loading tray for semiconductor auxiliary materials is provided, comprising:

[0005] Base plate;

[0006] The tray is slidably arranged on the top of the bottom plate, and the top of the tray is provided with a plurality of storage areas for placing the workpieces to be loaded;

[0007] Positioning module: The positioning module is connected with the bottom plate and the tray. When the tray slides on the top of the bottom plate to load materials, the position of the tray is located;

[0008] The in-place detection module is connected to the base plate and the tray. When the tray slides on the top of the base plate to load materials, it detects whether the tray has slid into place.

[0009] Furthermore, it also includes:

[0010] Two outer plates, the two outer plates are fixed on both sides of the top of the bottom plate;

[0011] Two inner side panels, the two inner side panels are fixed on both sides of the bottom of the tray;

[0012] two pairs of sliders, either pair of sliders being arranged on either outer side plate;

[0013] Two slide rails are respectively fixed on the two inner side plates, and any slide rail is slidably connected to any pair of sliders.

[0014] Furthermore, it also includes:

[0015] Two magnetic baffles, the two magnetic baffles are respectively opened on the two outer panels;

[0016] Two pull-out protection brackets, the two pull-out protection brackets are respectively connected to one end of the two slide rails away from the two inner side plates;

[0017] Two magnets, the two magnets are respectively connected to the two pull-out protection brackets.

[0018] Furthermore, it also includes:

[0019] Two push-in protection brackets are respectively connected to the ends of the two inner side plates.

[0020] Furthermore, it also includes: a handle, which is arranged on the tray.

[0021] Furthermore, the positioning module includes:

[0022] Two positioning blocks, the two positioning blocks are arranged at the bottom of the tray, and the bottoms of the two positioning blocks are provided with V-shaped grooves;

[0023] Two fixing seats are arranged on the top of the bottom plate, and steel ball rollers are arranged on the two fixing seats.

[0024] Furthermore, the in-place detection module includes:

[0025] A sensing paddle, which is arranged at the bottom of the tray;

[0026] Sensor,The sensor is arranged on the top of the base plate.

[0027] Furthermore, the in-place detection module further comprises: a cable management rack, which is arranged on the top of the bottom plate.

[0028] A high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model has the following beneficial effects:

[0029] 1. Solve the problem of inaccurate positioning and easy movement of pallet loading, which helps to achieve the precise clamping and loading of the external clamping module.

[0030] 2. The whole structure is mainly mechanical structure, with low cost and low operating cost.

[0031] 3. Modular design, high expandability and easy standardized application in actual use.

[0032] 4. There are positioning protection brackets at the front and rear of the tray loading mechanism. Pulling out and retracting them can reduce the impact and play a role in auxiliary positioning and shock absorption.

[0033] 5. The sensor cable management rack is fixed to the bottom plate of the tray to route the cables and protect the cables when the tray moves.

[0034] 6. The V-shaped positioning block can be disassembled separately, and low maintenance can be achieved through replacement, reducing the maintenance cost of key components in the later stage.

[0035] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic structural diagram of a high-precision loading tray for semiconductor auxiliary materials when it is closed according to an embodiment of the utility model.

[0037] Figure 2 It is a schematic structural diagram of a high-precision loading tray for semiconductor auxiliary materials when it is opened according to an embodiment of the utility model.

[0038] Figure 3 It is a schematic diagram of the structure explosion of a high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings to further illustrate the present invention.

[0040] First, combine Figures 1 to 3 A high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model is described, which is used for loading semiconductor auxiliary materials, such as splitters, tungsten steel needles, die heads, silver glue and other auxiliary materials, and has a wide range of application scenarios.

[0041] like Figures 1 to 3 As shown, a high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model comprises a base plate 1, a tray 2, a positioning module and an in-place detection module.

[0042] Specifically, Figures 1 to 3 As shown, the tray 2 is slidably arranged on the top of the base plate 1, and a plurality of storage areas 21 are provided on the top of the tray 2 for placing the workpieces to be loaded. By pulling out the tray 2 on the base plate 1, the materials can be pulled out for discharge and pushed in for loading.

[0043] Specifically, Figures 1 to 3 As shown, the positioning module is connected to the bottom plate 1 and the tray 2. When the tray 2 slides on the top of the bottom plate 1 to load materials, the position of the tray 2 is located. The positioning module includes: two positioning blocks 31 and two fixing seats 32. The two positioning blocks 31 are arranged at the bottom of the tray 2, and the bottoms of the two positioning blocks 31 are provided with V-shaped grooves 311; the two fixing seats 32 are arranged on the top of the bottom plate 1, and the two fixing seats 32 are provided with steel ball rollers 321. When the tray 2 slides on the top of the bottom plate 1 to load materials, the V-shaped groove 311 is pressed on the steel ball roller 321 to achieve mechanical precision positioning.

[0044] Specifically, Figures 1 to 3As shown, the in-place detection module is connected to the bottom plate 1 and the tray 2. When the tray 2 slides on the top of the bottom plate 1 to load materials, it detects whether the tray 2 has slid into place. The in-place detection module includes: a sensing paddle 41 and a sensor 42. The sensing paddle 41 is arranged at the bottom of the tray 2; the sensor 42 is arranged at the top of the bottom plate 1. When the tray 2 slides on the top of the bottom plate 1 to load materials, the sensor 42 detects the sensing paddle 41, which means that the tray 2 has been in place.

[0045] Further, if Figure 3 As shown, the in-place detection module further includes: a cable management rack 43, which is arranged on the top of the bottom plate 1 and plays the role of routing cables and protecting cables when the tray 2 moves.

[0046] Further, if Figures 1 to 3 As shown, a semiconductor auxiliary material high-precision loading tray of the embodiment of the utility model further comprises: two outer plates 51, two inner plates 52, two pairs of sliders 53 and two slide rails 54. The two outer plates 51 are fixed on both sides of the top of the bottom plate 1; the two inner plates 52 are fixed on both sides of the bottom of the tray 2; any pair of sliders 53 is arranged on any outer plate 51; the two slide rails 54 are respectively fixed on the two inner plates 52, and any slide rail 54 is slidably connected to any pair of sliders 53. Through the arrangement of the two outer plates 51, the two inner plates 52, the two pairs of sliders 53 and the two slide rails 54, the tray 2 can slide stably on the bottom plate 1.

[0047] Further, if Figures 1 to 3 As shown, a semiconductor auxiliary material high-precision loading tray of an embodiment of the utility model further comprises: two magnetic baffles 55, two pull-out protection brackets 56 and two magnets 57. The two magnetic baffles 55 are respectively provided on the two outer plates 51; the two pull-out protection brackets 56 are respectively connected to one end of the two slide rails 54 away from the two inner plates 52; the two magnets 57 are respectively connected to the two pull-out protection brackets 56. When the tray 2 is completely pulled out from the bottom plate 1, the two magnets 57 will move with the tray 2 to the position of the two magnetic baffles 55 to attract and prevent the tray 2 from moving, playing an auxiliary positioning and buffering and shock absorbing role.

[0048] Further, if Figures 1 to 3 As shown, a high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model further comprises: two push-in protection brackets 58, and the two push-in protection brackets 58 are respectively connected to the ends of the two inner plates 52, and play a role of limiting when the tray 2 is pushed in.

[0049] Further, if Figures 1 to 3 As shown, a high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model further comprises: a handle 6 , which is arranged on the tray 2 to facilitate pushing in and pulling out of the tray 2 .

[0050] Working principle:

[0051] However, when loading is required, the tray 2 is completely pulled out from the bottom plate 1, and the workpiece is placed in the storage area 21 of the tray 2. After loading, the tray 2 is pushed in until the V-groove 311 is pressed onto the steel ball roller 321, and the sensor 42 detects the sensing paddle 41, indicating that the tray 2 is in place, and the positioning of the loading tray 2 is completed, waiting to be grabbed by the external grab module.

[0052] Above, refer to Figures 1 to 3 A high-precision loading tray for semiconductor auxiliary materials according to an embodiment of the utility model is described, which has the following beneficial effects:

[0053] 1. Solve the problem of inaccurate positioning and easy movement of tray 2, which helps to achieve the precise clamping and loading of the external clamping module.

[0054] 2. The whole structure is mainly mechanical structure, with low cost and low operating cost.

[0055] 3. Modular design, high expandability and easy standardized application in actual use.

[0056] 4. There are positioning protection brackets at the front and rear of the tray 2 feeding mechanism. Pulling out and retracting them can reduce the impact and play an auxiliary positioning and shock-absorbing role.

[0057] 5. The cable management frame 43 of the sensor 42 is fixed to the bottom plate 1 of the tray 2 to route the cables and protect the cables when the tray 2 moves.

[0058] 6. The V-shaped positioning block 31 can be disassembled separately, and low maintenance can be achieved through replacement, thereby reducing the maintenance cost of key components in the later stage.

[0059] It should be noted that, in this specification, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0060] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A high-precision feeding tray for semiconductor auxiliary materials, characterized in that: Include: Base plate; A tray, the tray is slidably arranged on the top of the bottom plate, and the top of the tray is provided with a plurality of storage areas for placing the workpieces to be loaded; A positioning module, the positioning module is connected to the bottom plate and the tray, and when the tray slides on the top of the bottom plate to load materials, the position of the tray is positioned; The in-place detection module is connected to the bottom plate and the tray. When the tray slides on the top of the bottom plate to load materials, the in-place detection module detects whether the tray has slid into place.

2. The semiconductor auxiliary material high-precision loading tray as claimed in claim 1, characterized in that: Also includes: Two outer panels, the two outer panels are fixed on both sides of the top of the bottom plate; Two inner side panels, the two inner side panels are fixed on both sides of the bottom of the tray; Two pairs of sliders, each pair of the sliders being arranged on each of the outer plates; Two slide rails are respectively fixed on the two inner side plates, and any one of the slide rails is slidably connected to any one pair of the sliders.

3. The semiconductor auxiliary material high-precision loading tray as claimed in claim 2, characterized in that: Also includes: Two magnetic blocking pieces, the two magnetic blocking pieces are respectively arranged on the two outer plates; Two pull-out protection brackets, the two pull-out protection brackets are respectively connected to one end of the two slide rails away from the two inner side plates; Two magnets are respectively connected to the two pull-out protection brackets.

4. The semiconductor auxiliary material high-precision loading tray as claimed in claim 2 or 3, characterized in that: Also includes: Two push-in protection brackets are respectively connected to the ends of the two inner plates.

5. The semiconductor auxiliary material high-precision loading tray as claimed in claim 1, characterized in that: It also includes a handle, which is arranged on the tray.

6. The semiconductor auxiliary material high-precision loading tray as claimed in claim 1, characterized in that: The positioning module comprises: Two positioning blocks, the two positioning blocks are arranged at the bottom of the tray, and the bottoms of the two positioning blocks are provided with V-shaped grooves; Two fixing seats are arranged on the top of the bottom plate, and steel ball rollers are arranged on the two fixing seats.

7. The semiconductor auxiliary material high-precision loading tray as claimed in claim 1, characterized in that: The in-place detection module comprises: A sensing paddle, the sensing paddle being arranged at the bottom of the tray; A sensor is disposed on the top of the base plate.

8. The semiconductor auxiliary material high-precision loading tray as claimed in claim 7, characterized in that: The in-place detection module further comprises: a wire management rack, which is arranged on the top of the bottom plate.

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