LED chip packaging structure with good safety

Abstract

The utility model relates to the technical field of LED chips, in particular to an LED chip packaging structure with good safety, which comprises a substrate, a fluorescent cover body and an LED module, the substrate is provided with a slot structure for connection and installation, the fluorescent cover body is installed on the substrate, the LED module is an LED lamp bead with a cylindrical insertion column at the bottom, the LED lamp bead is arranged on the substrate, and the cylindrical insertion column is arranged on the substrate. And the fluorescent cover body wraps inside. According to the LED chip packaging structure with the good safety, the stability and the safety of the cover body and the LED module which are installed on the substrate are improved by arranging insertion grooves and insertion hole structures of different specifications on the substrate, and the LED chip packaging structure is matched with a heat dissipation cavity structure wrapping the LED module, so that the LED heating condition in the using process can be reduced, the using time is prolonged, and the overall service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chips, in particular to a LED chip packaging structure with good safety. Background Art

[0002] Based on the light-emitting principle of LED, the white spectrum produced by LED inevitably contains blue light spectrum components. However, current medical evidence shows that blue light spectrum can cause irreversible damage to the retina. Therefore, how to solve the blue light component in the LED spectrum has become a key point in whether LED lighting can be introduced to the public in a healthy way.

[0003] China Patent Network discloses an LED packaging structure CN208939010U. The utility model coats a fluorescent film layer on a substrate, and a fluorescent cover at least partially extends into the fluorescent film layer to encapsulate an LED blue light chip on the fluorescent film layer on the substrate. The blue light emitted by the LED blue light chip cooperates with the fluorescent film layer to form white light, thereby preventing blue light overflow from affecting the visual effect. However, the packaging structure of the utility model does not have a stable mounting structure and is not designed with a structure for heat dissipation, and needs to be improved in terms of safety. Utility Model Content

[0004] The purpose of the utility model is to provide a LED chip packaging structure with good safety, high heat dissipation performance and stable packaging structure, so as to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a LED chip packaging structure with good safety, including a substrate, a fluorescent cover and an LED module, the substrate is provided with a slot structure for connection and installation, the fluorescent cover is installed on the substrate, and the LED module is an LED lamp bead with a cylindrical plug at the bottom, which is arranged on the substrate and wrapped inside by the fluorescent cover.

[0006] During packaging, the fluorescent film layer, the conductive layer and the PCB layer are first stacked in sequence to form the main body of the substrate. After the cover slot and the LED module jack are opened on the substrate, the LED module is inserted into the LED module jack, and then the fluorescent cover is inserted into the cover slot. The overflowed heat dissipation cavity filler is cleaned to complete the packaging.

[0007] Preferably, the substrate includes a fluorescent film layer, a conductive layer, a PCB layer, a cover body slot and an LED module socket, and the fluorescent film layer, the conductive layer and the PCB layer are sequentially stacked, covered, and fixed in order from top to bottom. The cover body slot is a structure of six small rectangular slots, and the central axis of the six small rectangular slots is located on the edge line of the same large rectangle. The LED module socket is a circular socket structure, which is arranged in an array inside the large rectangle surrounded by the cover body slots.

[0008] Preferably, the bottom of the cover body slot passes through the fluorescent film layer, and the bottom of the LED module socket passes through the conductive layer.

[0009] The fluorescent cover installed on the cover slot will not cause circuit confusion with the LED module installed on the LED module socket, thereby ensuring the power circuit of the LED module.

[0010] Preferably, the fluorescent cover includes a heat dissipation cavity and a cover buckle. The fluorescent cover is an integral rectangular structure with a bottom draw-out shell incorporating fluorescent material. The heat dissipation cavity is filled with heat dissipation colloid. The cover buckle is six protruding small rectangular plug-in structures arranged on the edge of the bottom outer shell of the fluorescent cover.

[0011] Preferably, the LED module is completely wrapped inside the heat dissipation cavity.

[0012] The LED module is wrapped in the heat dissipation cavity, so that the self-generated heat of the LED module is fully absorbed, thereby increasing the service life.

[0013] Preferably, the cover body slot matches with the cover body buckle at the bottom of the fluorescent cover body, and the LED module socket matches with the cylindrical plug post of the LED module.

[0014] This allows each component to be stably mounted and fixed on the substrate to form a packaging structure.

[0015] Compared with the prior art, the utility model provides a LED chip packaging structure with good safety, which has the following beneficial effects: the LED chip packaging structure with good safety improves the stability and safety of the cover and LED module installed on the substrate by arranging slots and jack structures of different specifications on the substrate, and combined with the heat dissipation cavity structure wrapped around the LED module, it can reduce the heat generation of the LED during use and increase the use time and overall lifespan. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional demonstration diagram of the structure of the utility model;

[0017] Figure 2 It is a three-dimensional half-section diagram of the structure of the utility model;

[0018] Figure 3 It is a three-dimensional exploded diagram of the structure of the utility model.

[0019] Wherein: 1. substrate; 101. fluorescent film layer; 102. conductive layer; 103. PCB layer; 104. cover slot; 105. LED module jack; 2. fluorescent cover; 201. heat dissipation cavity; 202. cover buckle; 3. LED module. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 The utility model provides a technical solution: a LED chip packaging structure with good safety, including a substrate 1, a fluorescent cover 2 and an LED module 3, the substrate 1 is provided with a slot structure for connection and installation, the fluorescent cover 2 is installed on the substrate 1, and the LED module 3 is an LED lamp bead with a cylindrical plug at the bottom, which is arranged on the substrate 1 and wrapped inside by the fluorescent cover 2.

[0022] During packaging, the fluorescent film layer 101, the conductive layer 102 and the PCB layer 103 are first stacked in sequence to form the main body of the substrate 1, and then the cover slot 104 and the LED module socket 105 are opened on the substrate 1, and then the LED module 3 is inserted into the LED module socket 105, and then the fluorescent cover 2 is inserted into the cover slot 104, and the overflowed heat dissipation cavity 201 filler is cleaned to complete the packaging.

[0023] Specifically, the substrate 1 includes a fluorescent film layer 101, a conductive layer 102, a PCB layer 103, a cover body slot 104 and an LED module socket 105. The fluorescent film layer 101, the conductive layer 102 and the PCB layer 103 are sequentially stacked, covered, and fixed in order from top to bottom. The cover body slot 104 is a structure of six small rectangular slots. The central axes of the six small rectangular slots are located on the edge line of the same large rectangle. The LED module socket 105 is a circular socket structure, which is arranged in an array inside the large rectangle surrounded by the cover body slots 104.

[0024] Specifically, the bottom of the cover body slot 104 passes through the fluorescent film layer, and the bottom of the LED module socket 105 passes through the conductive layer 102 .

[0025] Through the above technical solution, the fluorescent cover 2 installed on the cover slot 104 will not cause circuit confusion with the LED module 3 installed on the LED module socket 105, thereby ensuring the power circuit of the LED module 3.

[0026] Specifically, the fluorescent cover 2 includes a heat dissipation cavity 201 and a cover buckle 202. The fluorescent cover 2 is an overall rectangular structure with a bottom shell mixed with fluorescent material. The heat dissipation cavity 201 is filled with heat dissipation colloid inside, and the cover buckle 202 is six protruding small rectangular plug-in structures arranged on the edge of the bottom outer shell of the fluorescent cover 2.

[0027] Specifically, the LED module 3 is completely wrapped inside the heat dissipation cavity 201 .

[0028] Through the above technical solution, the LED module 3 is wrapped in the heat dissipation cavity 201, so that the self-generated heat of the LED module 3 is fully absorbed, thereby increasing the service life.

[0029] Specifically, the cover body slot 104 matches with the cover body buckle 202 at the bottom of the fluorescent cover body 2 , and the LED module socket 105 matches with the cylindrical plug post of the LED module 3 .

[0030] Through the above technical solution, each component can be stably installed and fixed on the substrate 1 to form a packaging structure.

[0031] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit thereof, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A LED chip packaging structure with good safety, comprising a substrate (1), a fluorescent cover (2) and an LED module (3), characterized in that: The substrate (1) is provided with a slot structure for connection and installation; the fluorescent cover (2) is installed on the substrate (1); the LED module (3) is an LED lamp bead with a cylindrical plug at the bottom, which is arranged on the substrate (1) and is wrapped inside by the fluorescent cover (2); the substrate (1) comprises a fluorescent film layer (101), a conductive layer (102), a PCB layer (103), a cover slot (104) and an LED module jack (105); the fluorescent film layer (101), the conductive layer (102) and the PCB layer (103) are sequentially overlapped, covered, fitted and fixed in order from top to bottom; the cover slot (104) is The invention discloses a six small rectangular slot structure, wherein the central axes of the six small rectangular slots are located on the edge line of the same large rectangle, the LED module sockets (105) are circular socket structures, and are arranged in an array inside the large rectangle surrounded by the cover body slots (104); the fluorescent cover body (2) comprises a heat dissipation cavity (201) and a cover body buckle (202); the fluorescent cover body (2) is an integral rectangular structure of a bottom shell type with fluorescent material mixed therein; the heat dissipation cavity (201) is filled with heat dissipation colloid inside; and the cover body buckle (202) is a structure of six protruding small rectangular plug blocks arranged on the edge of the bottom outer shell of the fluorescent cover body (2).

2. The LED chip packaging structure with good safety according to claim 1, characterized in that: The bottom of the cover body slot (104) passes through the fluorescent film layer, and the bottom of the LED module socket (105) passes through the conductive layer (102).

3. The LED chip packaging structure with good safety according to claim 1, characterized in that: The LED module (3) is completely enclosed within the heat dissipation cavity (201).

4. The LED chip packaging structure with good safety according to claim 1, characterized in that: The cover body slot (104) matches with the cover body buckle (202) at the bottom of the fluorescent cover body (2), and the LED module plug hole (105) matches with the cylindrical plug post of the LED module (3).

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