Vibration temperature composite sensor and helicopter tail rotor operating lever bearing monitoring structure

Abstract

The utility model discloses a vibration and temperature composite sensor which comprises a base, a vibration sensitive assembly, a temperature sensitive device, a shell and a connector. The base comprises a base body and a stand column formed by extending from one surface of the base body, and the vibration sensitive assembly is installed on the stand column; the shell is provided with a containing space, the base is installed on the shell through a base body, and the vibration sensitive assembly extends into the containing space to be contained in the containing space; the bottom of the shell extends downwards to form a probe, the probe is provided with an inner cavity communicated with the containing space, and the temperature sensitive device is placed at the bottom of the inner cavity. The utility model further provides a helicopter tail rotor operating lever bearing monitoring structure, and the vibration temperature composite sensor is arranged on a bearing seat of the tail rotor operating lever bearing. Compared with the prior art, the vibration and temperature composite sensor and the helicopter tail rotor operating lever bearing monitoring structure can monitor vibration and temperature signals at the same time, and are easy to assemble and convenient to install and maintain.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a vibration-temperature composite sensor and a helicopter tail rotor joystick bearing monitoring structure. Background Art

[0002] The tail rotor lever is an important component for helicopter maneuvering control, and the operating status of its bearing is directly related to the aircraft's operating safety. However, due to the structural characteristics of the tail rotor lever bearing (the outer ring and guide rod rotate with the tail rotor shaft, and the inner ring does not move), it is difficult to monitor the operating status of the tail rotor lever bearing by installing a sensor on the tail rotor shaft.

[0003] How to simultaneously monitor vibration and temperature signals on such a small space and product is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a vibration-temperature composite sensor and a helicopter tail rotor joystick bearing monitoring structure that can simultaneously monitor vibration and temperature signals.

[0005] The technical solution provided by the utility model is as follows:

[0006] A vibration-temperature composite sensor comprises a base, a vibration-sensitive component, a temperature-sensitive device, a shell, and a connector; the base comprises a base body and a column formed by extending from a surface of the base body, and the vibration-sensitive component is installed on the column; the shell is provided with a receiving space, the base is installed on the shell through the base body, and the vibration-sensitive component extends into the receiving space to be received; the bottom of the shell extends downward to form a probe, the probe is provided with an inner cavity connected to the receiving space, and the temperature-sensitive device is placed at the bottom of the inner cavity; the connector is fixed on the shell, and its pins are respectively connected to the vibration-sensitive component and the temperature-sensitive device through wires to lead out vibration and temperature signals.

[0007] Preferably, the side wall of the shell is provided with a base mating hole and a connector mating hole, and the seat body and the connector are respectively fixed to the hole walls of the base mating hole and the connector mating hole.

[0008] Preferably, the seat body and the connector are respectively located on two opposite side walls of the shell.

[0009] Preferably, the shell comprises an outer shell and a cover plate, the base mating hole and the connector mating hole are located on the outer shell, the outer shell top wall is provided with a cover plate mating hole, and the cover plate is fixed to the hole wall of the cover plate mating hole.

[0010] Preferably, the vibration sensitive component includes a first lead-in plate, a piezoelectric chip, a mass block, and a pre-tightening ring. The first lead-in plate is installed on the outer periphery of the column and is insulated from the column. The piezoelectric chip is installed on the outer side of the first lead-in plate. The mass block is installed on the outer side of the piezoelectric chip. The pre-tightening ring is sleeved on the outer periphery of the mass block. The first lead-in plate, the piezoelectric chip, and the mass block are fixed on the column. The first lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated inside the piezoelectric chip.

[0011] Preferably, the column is in a cubic shape and has four assembly surfaces. The first lead-in plate, piezoelectric chip and mass block are all installed along the assembly surfaces. There are four of the first lead-in plate, piezoelectric chip and mass block, and the shapes of the first lead-in plate, piezoelectric chip and mass block match the assembly surfaces of the column.

[0012] Preferably, it further comprises four insulating sheets respectively attached to each assembly surface, wherein the insulating sheets are located between the column assembly surface and the first current lead sheet and are used to insulate the first current lead sheet from the column.

[0013] Preferably, an insulating gap is provided between the upper surface of the seat body and the first lead-in plate, the piezoelectric chip, the mass block and the pre-tightening ring.

[0014] Preferably, the first current lead-in plates are connected to each other via a connecting portion, wherein any of the first current lead-in plates further comprises a first lead-out portion for leading out the charge generated by the piezoelectric chip.

[0015] Preferably, the mass block and the pre-tightening ring are made of conductive materials, and a second lead-in plate is provided between at least one of the piezoelectric chips and the mass block. The second lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated outside the piezoelectric chip.

[0016] Preferably, the inner surface of the mass block is a plane, and the outer surface is an arc surface; the preload ring is annular and is fixed to each mass block by an interference fit sleeve.

[0017] Preferably, the probe comprises an inserting portion at the bottom thereof for penetrating into the bearing seat.

[0018] Preferably, the bottom of the shell forms a base, the lower surface of the base is arc-shaped to be consistent with the arc surface on which it is installed, and the base includes a fixing portion formed by extending outward from the side wall of the shell.

[0019] Preferably, the extending direction of the fixing portion is perpendicular to the insertion direction of the base and the connector.

[0020] A helicopter tail rotor joystick bearing monitoring structure is characterized in that a vibration-temperature composite sensor as described above is installed on the tail rotor joystick bearing seat for simultaneously monitoring the vibration and temperature signals of the bearing.

[0021] Compared with the prior art, the vibration-temperature composite sensor and helicopter tail rotor joystick bearing monitoring structure of the utility model include a base including a base body and a column extended from a surface of the base body, a vibration sensitive component is installed on the column, the base is installed on the shell through the base body, and the vibration sensitive component extends into and is accommodated in the accommodating space of the shell; and a probe is formed by extending downward from the bottom of the shell, the probe is provided with an inner cavity connected to the accommodating space, and a temperature sensitive device is placed at the bottom of the inner cavity; the connector pins are respectively connected to the vibration sensitive component and the temperature sensitive device through wires to lead out vibration and temperature signals, so that the vibration-temperature composite sensor can monitor vibration and temperature signals at the same time, and by respectively installing the vibration sensitive component and the temperature sensitive device on the base and the shell, the vibration sensitive component and the temperature sensitive device are easy to assemble, and convenient to install and maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a three-dimensional exploded view of the vibration-temperature composite sensor according to an embodiment of the utility model;

[0024] Figure 2 for Figure 1 A combined cross-sectional view of the vibration-temperature composite sensor shown;

[0025] Figure 3 for Figure 1 A three-dimensional diagram of a base and a vibration sensitive component in the vibration-temperature composite sensor shown;

[0026] Figure 4 for Figure 1 A perspective view of the base in the vibration temperature composite sensor shown;

[0027] Figure 5 for Figure 1 A perspective view of the housing in the vibration-temperature composite sensor shown;

[0028] Figure 6 for Figure 5 A three-dimensional view of the housing from another angle;

[0029] Figure 7 for Figure 1 A three-dimensional diagram of the first current guide plate in the vibration temperature composite sensor shown;

[0030] Figure 8 for Figure 7 A schematic diagram of the first current guide plate in an unfolded state;

[0031] Fig. 9 for Figure 1 A three-dimensional diagram of the second lead-in piece in the vibration temperature composite sensor shown;

[0032] Fig.10 for Figure 1 A three-dimensional view of the mass piece in the vibration-temperature composite sensor shown. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it can be directly on the other element or indirectly set on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0037] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0038] like Figure 1 , Figure 2 , Figure 3 As shown, an embodiment of the utility model provides a vibration-temperature composite sensor, including a base 1, a vibration sensitive component 2, a temperature sensitive device 3, a shell 4, and a connector 5.

[0039] like Figures 1 to 4 As shown, in this embodiment, the base 1 includes a base body 11 and a column 12 extending from a surface of the base body 11. The base body 11 is in a circular pancake shape, and the column 12 is in a cubic shape, with four assembly surfaces (in other embodiments, the assembly surfaces may be provided in different numbers such as three or six). The temperature sensitive device 3 is a PT100 platinum resistor, and its resistance value changes with the change of temperature. Of course, in other embodiments, the temperature sensitive device 3 may be other components.

[0040] like Figure 1 , Figure 2 , Figure 5 , Figure 6 As shown, in this embodiment, the housing 4 is provided with a receiving space for receiving the vibration sensitive component 2, the base 1 is mounted on the housing 4 through the base body 11, and the vibration sensitive component 2 extends into the receiving space to be received. The housing 4 protects and seals the internal components (vibration sensitive component 2, temperature sensitive device 3, etc.).

[0041] The housing 4 has base mating holes 41 and connector mating holes 42 on opposite side walls. The base 11 and connector 5 are welded and fixed to the hole walls of the base mating holes 41 and connector mating holes 42, respectively, so that the accommodation space is sealed. Further, in this embodiment, the housing 4 includes an outer shell 43 and a cover plate 44. The base mating holes 41 and connector mating holes 42 are located on the outer shell 43. The outer shell 43 is also provided with a cover plate mating hole 45 to match with the cover plate 44. The cover plate 44 and the outer shell 43 are sealed and fixed by welding (the welding position of the outer shell and the base, connector, and cover plate is Figure 2The bottom of the shell 4 extends downward to form a probe 46. The probe 46 is cylindrical, and the bottom is an insertion portion 461 for penetrating into the bearing seat. An inner cavity 462 connected to the accommodating space is provided inside, and the temperature sensitive device 3 is placed at the bottom of the inner cavity 462. A base 47 is also formed at the bottom of the shell. The lower surface of the base 47 is arc-shaped to be consistent with the installed arc surface (such as the inner ring or outer ring of the tail rotor joystick bearing). The base 47 includes a fixing portion 471 formed by extending outward from the two side walls of the shell. A mounting through hole can be provided on the fixing portion 471 to fix the vibration-temperature composite sensor to the object to be measured by bolts. Preferably, the extension direction of the fixing portion is perpendicular to the insertion direction of the base and the connector.

[0042] like Figure 1 , Figure 2 , Figure 3 as well as Figures 7 to 10 As shown, in this embodiment, the vibration sensitive component 2 is installed on the column 12 to form a piezoelectric second-order system. The vibration sensitive component 2 includes an insulating sheet 21, a first lead sheet 22, a piezoelectric chip 23, a mass block 24, a pre-tightening ring 25, and a second lead sheet 26. The first lead sheet 22 is installed on the periphery of the column 12 and is insulated from the column 12 by the insulating sheet 21 (other insulation methods may also be used), the piezoelectric chip 23 is installed on the outside of the first lead sheet 22, the second lead sheet 26 is installed on the outside of the piezoelectric chip 23, the mass block 24 is installed on the outside of the piezoelectric chip 23 and the second lead sheet 26, and the pre-tightening ring 25 is sleeved on the periphery of the mass block 24 to fix the first lead sheet 22, the piezoelectric chip 23, the second lead sheet 26, and the mass block 24 on the column 12. In this embodiment, the column 12 is in the shape of a square and is provided with four assembly surfaces. The insulating sheet 21, the first lead sheet 22, the piezoelectric chip 23, and the mass block 24 are all installed along the assembly surfaces. There are four insulating sheets 21, the first lead sheet 22, the piezoelectric chip 23, and the mass block 24. The shapes of the insulating sheets 21, the first lead sheet 22, the piezoelectric chip 23, and the mass block 24 match the assembly surfaces of the column 12. There is one second lead sheet 26, which is sandwiched between one of the piezoelectric chips 23 and the mass block 24. The insulating sheet 21, the piezoelectric chip 23, and the second lead sheet 26 are square sheets. In the longitudinal direction, there is an insulating gap between the upper surface of the seat body and the first lead sheet 22, the piezoelectric chip 23, the mass block 24, and the pre-tightening ring 25.

[0043] The first lead plates 22 are connected by arc-shaped connecting portions 27. Figure 7 The plate-shaped bending shown is formed as Figure 6The polyhedral cylindrical structure with upper and lower openings is shown. A through hole 221 is provided in the middle of each first lead-in sheet 22, and a through groove 222 that penetrates to the outside is provided below the through hole 221. The through groove 222 can provide deformation to reduce the local stress during the assembly of the piezoelectric chip 23, prevent the piezoelectric chip 23 from being broken by uneven force, and can also facilitate sharing of the part with other products. Any of the first lead-in sheets 22 also includes a first lead-out portion 223 for leading out the charge generated inside the piezoelectric chip 23. Of course, in other embodiments, the first lead-in sheet can also adopt other structures.

[0044] In this embodiment, the mass block 24 and the pre-tightening ring 25 are made of conductive materials, the second lead-in plate 26 is provided with a second lead-out portion 261, the piezoelectric chip 23 is conductively connected to the corresponding mass block 24, and each mass block 24 is conductively connected to the pre-tightening ring 25, so one second lead-in plate 26 can be conductively connected to each piezoelectric chip 23 (of course, multiple second lead-in plates can also be provided), and the second lead-out portion 261 of the second lead-in plate 26 is then connected to the pin of the connector through the wire 6 to lead out the charge generated on the outside of the piezoelectric chip 23.

[0045] In this embodiment, the inner side of the piezoelectric chip 23 is the positive electrode, which is in contact with the first lead-in plate 22 to draw out the positive charge through the first lead-in plate 22; the outer side of the piezoelectric chip 23 is the negative electrode, which is connected to the second lead-in plate 26 to draw out the negative charge through the second lead-in plate 26 (of course, it can also be the opposite, and the drawing out of the positive and negative charges is determined by the placement position of the piezoelectric chip 23).

[0046] like Fig.10 As shown, in this embodiment, the mass block 24 is block-shaped, with a flat inner surface and an arc outer surface; the preload ring 25 is annular and is fixed to each mass block 24 by interference fit. After assembly, the center lines of the outer surfaces of all mass blocks 24 are on the same straight line, forming multiple arcs of a circle, which is concentric with the preload ring 25.

[0047] like Figure 1 , Figure 2 As shown, in this embodiment, the pins 51 of the connector 5 are connected to the vibration sensitive component 2 and the temperature sensitive device 3 through the wires 6 to extract the vibration and temperature signals. In this embodiment, the connector 5 has four pins 51 (such as Figure 1 ), two of which are connected to the first lead sheet 22 and the second lead sheet in the vibration sensitive component 2, and the other two are connected to the temperature sensitive device 3 ( Figure 2 Only two pins connecting the first lead plate and the second lead plate are shown, and the two pins connecting the temperature sensitive device are not shown due to cross-sectional reasons).

[0048] This embodiment also provides a helicopter tail rotor joystick bearing monitoring structure, wherein the tail rotor joystick bearing seat is equipped with the above-mentioned vibration temperature composite sensor for simultaneously monitoring the vibration and temperature signals of the bearing. The vibration temperature composite sensor is small in size and can be conveniently inserted into the bearing seat (such as the inner ring or outer ring of the tail rotor joystick bearing) for installation.

[0049] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vibration temperature composite sensor, characterized in that: It includes a base, a vibration sensitive component, a temperature sensitive device, a shell, and a connector; the base includes a base body and a column extended from a surface of the base body, and the vibration sensitive component is installed on the column; the shell is provided with a accommodating space, the base is installed on the shell through the base body, and the vibration sensitive component extends into the accommodating space; the bottom of the shell extends downward to form a probe, the probe is provided with an inner cavity connected to the accommodating space, and the temperature sensitive device is placed at the bottom of the inner cavity; the connector is fixed on the shell, and its pins are respectively connected with the vibration sensitive component and the temperature sensitive device through wires to lead out vibration and temperature signals.

2. The vibration temperature composite sensor according to claim 1, characterized in that: The side wall of the shell is provided with a base matching hole and a connector matching hole, and the seat body and the connector are respectively fixed to the hole walls of the base matching hole and the connector matching hole.

3. The vibration temperature composite sensor according to claim 2, characterized in that: The seat body and the connector are respectively located on two opposite side walls of the shell.

4. The vibration temperature composite sensor according to claim 2, characterized in that: The shell comprises an outer shell and a cover plate. The base mating hole and the connector mating hole are located on the outer shell. The top wall of the outer shell is provided with a cover plate mating hole. The cover plate is fixed to the hole wall of the cover plate mating hole.

5. The vibration temperature composite sensor according to claim 1, characterized in that: The vibration sensitive component includes a first lead-in plate, a piezoelectric chip, a mass block, and a pre-tightening ring. The first lead-in plate is installed on the outer periphery of the column and is insulated from the column. The piezoelectric chip is installed on the outer side of the first lead-in plate, the mass block is installed on the outer side of the piezoelectric chip, and the pre-tightening ring is sleeved on the outer periphery of the mass block. The first lead-in plate, the piezoelectric chip, and the mass block are fixed on the column. The first lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated inside the piezoelectric chip.

6. The vibration temperature composite sensor according to claim 5, characterized in that: The column is in a square shape and has four assembly surfaces. The first lead-in plate, piezoelectric chip, and mass block are all installed along the assembly surfaces. There are four of the first lead-in plate, piezoelectric chip, and mass block, and the shapes of the first lead-in plate, piezoelectric chip, and mass block match the assembly surfaces of the column.

7. The vibration temperature composite sensor according to claim 5, characterized in that: It also includes four insulating sheets, which are respectively attached to each assembly surface. The insulating sheets are located between the column assembly surface and the first current lead sheet and are used to insulate the first current lead sheet from the column.

8. The vibration temperature composite sensor according to claim 5, characterized in that: An insulating gap is provided between the upper surface of the seat body and the first lead-in sheet, the piezoelectric wafer, the mass block and the pre-tightening ring.

9. The vibration temperature composite sensor according to claim 5, characterized in that: The first current-leading plates are connected to each other via a connecting portion, and any of the first current-leading plates further includes a first lead-out portion for leading out the charge generated by the piezoelectric chip.

10. The vibration temperature composite sensor according to claim 5, characterized in that: The mass block and the pre-tightening ring are made of conductive materials. A second lead-in plate is provided between at least one of the piezoelectric chips and the mass block. The second lead-in plate is connected to the pins of the connector through a wire to lead out the charge generated outside the piezoelectric chip.

11. The vibration temperature composite sensor according to claim 5, characterized in that: The inner surface of the mass block is a plane, and the outer surface is an arc surface; the preload ring is annular and is fixed on each mass block by interference fit.

12. The vibration temperature composite sensor according to any one of claims 1 to 11, characterized in that: The probe comprises an inserting portion at the bottom thereof for penetrating into the bearing seat.

13. The vibration temperature composite sensor according to any one of claims 1 to 11, characterized in that: The bottom of the shell forms a base, the lower surface of the base is arc-shaped to be consistent with the arc surface on which it is installed, and the base includes a fixing portion formed by extending outward from the side wall of the shell.

14. The vibration temperature composite sensor according to claim 13, characterized in that: The extending direction of the fixing portion is perpendicular to the insertion direction of the base and the connector.

15. A helicopter tail rotor control rod bearing monitoring structure, characterized in that: The tail rotor joystick bearing seat is equipped with a vibration-temperature composite sensor as described in any one of claims 1 to 14, which is used to simultaneously monitor the vibration and temperature signals of the bearing.

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