Laser device, light source, projection equipment, vehicle-mounted display system and vehicle

Abstract

The utility model provides a laser device, a light source, projection equipment, a vehicle-mounted display system and a vehicle. The laser device comprises a housing, the top of which is provided with a transparent flat plate; and the chip array is arranged in the shell, the chip array comprises M PCSEL photonic crystal surface emitting laser chips, the M PCSEL chips are used for emitting M laser beams towards the transparent flat plate, so that the M laser beams are polymerized at the transparent flat plate to form a first light beam, and M is an integer greater than or equal to 2. A plurality of laser beams emitted by the PCSEL chip array are polymerized to form a light beam, so that a laser device with high collimation, high integration and simple process is realized.

Description

Technical Field

[0001] The present application relates to the field of projection equipment, and in particular to a laser device, a light source, a projection equipment, a vehicle-mounted display system and a vehicle. Background Art

[0002] Laser projection display technology, that is, image information terminal display technology that uses lasers as light sources, has better color expression and color reproduction capabilities than traditional light sources, and is widely used. With the development of laser projection display technology, the requirements for the collimation of lasers are getting higher and higher. The more collimated the laser emitted by the light source, the smaller the divergence angle of the light source, and the more accurate and stable the projection image. However, in the current laser light source solution, it is often necessary to add additional optical elements such as reflectors and collimating lenses to the packaging structure of the light source, which makes it impossible to integrate the laser chip with high density. In addition, the laser chip needs to be set corresponding to optical elements such as reflectors and collimating lenses. The misalignment of optical elements in the packaging structure will cause the deterioration of the light source, and the setting of optical elements and the monitoring (active coupling) required during installation also increase the complexity of the packaging process of the light source and increase the cost. Therefore, how to realize a laser device with high collimation, high integration and simple process is an urgent problem to be solved. Utility Model Content

[0003] The present application provides a laser device, a light source, a projection device, a vehicle-mounted display system and a vehicle, which realize a laser device with high collimation, high integration and simple process by aggregating multiple laser beams emitted by a photonic crystal surface emitting laser chip array to form a light beam.

[0004] In a first aspect, a laser device is provided, comprising: a shell with a transparent plate disposed on the top; a chip array disposed in the shell, the chip array comprising M PCSEL photonic crystal surface emitting laser chips, the M PCSEL chips being used to emit M laser beams toward the transparent plate, so that the M laser beams are aggregated at the transparent plate to form a first beam or a first beam set, where M is an integer greater than or equal to 2.

[0005] Thus, a plurality of PCSEL chips arranged in an array emit laser beams toward a transparent flat plate to form a first beam with high collimation and high power. When the laser device is used in the light source of a projection device, the accuracy and stability of the projection image can be improved. Using this solution, the generated first beam has high collimation. The first beam can also be understood as a collimated beam or a parallel beam. Among them, "aggregation" can also be understood as "merging".

[0006] In combination with the first aspect, in some implementations of the first aspect, a divergence angle of the first light beam or the first light beam set is greater than or equal to -5° and less than or equal to 5°.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the size of the chip array is greater than or equal to 1 mm and less than or equal to 30 mm; when M laser beams are aggregated at a transparent flat plate to form a first beam, the spacing between any two PCSEL chips in the M PCSEL chips is greater than or equal to 5 μm and less than or equal to 100 μm; when M laser beams are aggregated at a transparent flat plate to form a first beam set, the spacing between any two PCSEL chips in the M PCSEL chips is greater than or equal to 100 μm and less than or equal to 5000 μm. Under this structural design, a high-collimation, high-power first beam can be aggregated to be used as a laser projection light source.

[0008] In combination with the first aspect, in certain implementations of the first aspect, wherein: the spot size of the PCSEL chip in the M PCSEL chips is greater than 100μm and less than 5000μm. In the case where the M laser beams are aggregated at the transparent flat plate to form a first beam, the spacing between any two PCSEL chips in the M PCSEL chips is greater than or equal to 5μm and less than or equal to 100μm; in the case where the M laser beams are aggregated at the transparent flat plate to form a first beam set, the spacing between any two PCSEL chips in the M PCSEL chips is greater than or equal to 100μm and less than or equal to 5000μm. Under this structural design, a high-collimation, high-power first beam can be aggregated to be used as a laser projection light source.

[0009] In combination with the first aspect, in some implementations of the first aspect, the housing includes a transparent flat plate, a frame, and a bottom plate, wherein: a first opening is provided at the top of the frame, a second opening is provided at the bottom of the frame, the transparent flat plate is provided in the first opening, and the bottom plate is provided in the second opening; the chip array is provided on the upper surface of the bottom plate, and the bottom plate is used for heat conduction. Thus, the three separate components, the frame, the transparent cover plate, and the bottom plate, cooperate with each other to form a housing together, thereby achieving airtight packaging.

[0010] In combination with the first aspect, in certain implementations of the first aspect, wherein: a first pad group is provided on the inner wall of the frame, and the chip array is electrically connected to the first pad group; a second pad group is provided on the bottom of the frame, and the second pad group is used to connect to a printed circuit board, and the first pad group is electrically connected to the second pad group. Thus, by respectively providing pads on the bottom and the inner wall of the package shell, the pads on the bottom and the inner wall are correspondingly connected. Thus, the pads on the bottom are connected to the PCB, and the pads on the inner wall are connected to the PCSEL chip, providing corresponding electrical signals for the PCSEL chip.

[0011] In a second aspect, a light source is provided for emitting a second light beam, the light source comprising a printed circuit board and a laser device array, wherein: the laser device array is arranged on the printed circuit board, the laser device array comprises N laser devices of the first aspect and any possible implementation thereof; the N laser devices are used to emit N first light beams or N first light beam sets toward a first direction, so that the N first light beams and N first light beam sets are aggregated to form a second light beam, wherein the first direction is perpendicular to the plane where the printed circuit board is located, and N is a positive integer. Thus, by setting the laser array, the power of the laser beam is further expanded.

[0012] In conjunction with the second aspect, in certain implementations of the second aspect, the shape of the laser device array is determined according to a preset spot shape of the second light beam, so that the structural design of the light source meets the use requirements of the back-end projection device.

[0013] In conjunction with the second aspect, in certain implementations of the second aspect, the laser device array is a hollow array, thereby saving energy consumption while achieving power expansion of the second light beam emitted by the light source. Alternatively, the laser device array is a solid array, thereby ensuring that the energy of the second light beam emitted by the light source is concentrated.

[0014] In a third aspect, a projection device is provided, comprising a light source, a modulator and a lens as in the second aspect and any possible implementation thereof, wherein: the light source is used to emit a second light beam; the modulator is used to modulate the second light beam to obtain a light signal; and the lens is used to project the light signal to display a projection picture.

[0015] In a fourth aspect, a vehicle-mounted display system is provided, comprising the projection device of the third aspect.

[0016] In a fifth aspect, a vehicle is provided, comprising the vehicle-mounted display system of the fourth aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of a laser device provided in an embodiment of the present application.

[0018] Figure 2 It is a schematic diagram of the beam aggregation effect of a laser device provided in an embodiment of the present application.

[0019] Figure 3 It is a structural schematic diagram of a PCSEL chip provided in an embodiment of the present application.

[0020] Figure 4 It is a structural schematic diagram of a light source provided in an embodiment of the present application.

[0021] Figure 5 It is a structural schematic diagram of a projection device provided in an embodiment of the present application.

[0022] Figure 6 It is a schematic diagram of a vehicle-mounted display system provided in an embodiment of the present application.

[0023] Figure 7 It is a means of transportation provided by an embodiment of the present application. DETAILED DESCRIPTION

[0024] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0025] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0026] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0027] In the description of the embodiments of the present application, the terms "upper", "lower", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientations of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0028] The terms "including" and "having" and any variations thereof in the embodiments of the present application shown below are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0029] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions, and embodiments or designs described as "exemplary" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way for easy understanding.

[0030] In the embodiments of the present application, the same reference numerals are used to represent the same components or parts. In addition, the various parts in the drawings are not drawn to scale, and the sizes and dimensions of the parts shown in the drawings are only exemplary and should not be understood as limiting the present application.

[0031] It should be understood that in the present application, "electrical connection" can be understood as physical contact and electrical conduction between components, and can also be understood as a form of connection between different components in a circuit structure through physical lines such as substrate lines, pads or wires that can transmit electrical signals. In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "configuration", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0032] It should be understood that in this application, "circuit" can also be understood as "line" etc. according to actual conditions. "Pad" can also refer to a path for electrical connection such as "bump" or "bump point" according to actual conditions. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of this application can be understood according to specific conditions.

[0033] Laser projection display technology, that is, image information terminal display technology that uses lasers as light sources, has better color expression and color reproduction capabilities than traditional light sources, and is widely used. With the development of laser projection display technology, the requirements for the collimation of lasers are getting higher and higher. The more collimated the laser emitted by the light source, the smaller the divergence angle of the light source, and the more accurate and stable the projection image. However, in the current laser light source solution, it is often necessary to add additional optical elements such as reflectors and collimating lenses to the packaging structure of the light source, which makes it impossible to integrate the laser chip with high density. In addition, the laser chip needs to be set corresponding to optical elements such as reflectors and collimating lenses, and the misalignment of optical elements in the packaging structure will cause the deterioration of the light source. The setting of optical elements and the monitoring required during installation also increase the complexity and cost of the light source packaging process. Therefore, how to achieve a laser device with high collimation, high integration and simple process is an urgent problem to be solved.

[0034] In view of the above problems, the present application provides a laser device, a light source, a projection device, a vehicle-mounted display system and a vehicle, which forms a light beam by aggregating multiple laser beams emitted by a photonic crystal surface emitting semiconductor lasers (PCSEL) chip array, thereby realizing a laser device with high collimation, high integration and simple process.

[0035] Figure 1 Schematic diagram of the structure of a laser device provided in an embodiment of the present application. Figure 1 As shown, the laser device includes a housing and a chip array 120. The laser device can be used in a light source of a laser projector.

[0036] The housing has a transparent plate 111 disposed on the top. The upper surface of the transparent plate 111 is parallel to the lower surface. The transparent plate 111 can be made of glass, quartz glass, sapphire and other materials, which are determined according to actual conditions.

[0037] The chip array 120 is disposed in the housing. The chip array 120 includes M PCSEL chips. The M PCSEL chips are located in the same horizontal plane, and the M PCSEL chips are used to emit M laser beams toward the transparent plate 111, so that the M laser beams converge at the transparent plate 111 to form a first beam or a first beam set, where M is an integer greater than or equal to 2.

[0038] Thus, a plurality of PCSEL chips arranged in an array emit laser beams toward the transparent flat plate 111, and the transparent flat plate 111 is used to aggregate the plurality of laser beams to form a first beam or a first beam set with high collimation and high power. Among them, "aggregation" can also be understood as "merging". When the laser device is used in the light source of a projection device, the accuracy and stability of the projection picture can be improved. Using this solution, the divergence angle of the generated first beam or the first beam set is greater than or equal to -5° and less than or equal to 5°, that is, it has a high collimation. The first beam can also be understood as a collimated beam or a parallel beam.

[0039] In some implementations, in the chip array 120, the size of the chip array 120 may be greater than or equal to 1 mm and less than or equal to 30 mm. Figure 1 As shown in (a), when M laser beams converge at the transparent plate to form a first beam, the spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 5 μm and less than or equal to 100 μm. Figure 1As shown in (b), when M laser beams converge at the transparent plate to form a first beam set, the spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 100 μm and less than or equal to 5000 μm.

[0040] In some implementations, the spot size of the laser beam emitted by the PCSEL chip in the M PCSEL chips is greater than 100 μm and less than 5000 μm. Figure 1 As shown in (a), when M laser beams converge at the transparent plate to form a first beam, the spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 5 μm and less than or equal to 100 μm. Figure 1 As shown in (b), when M laser beams are aggregated at a transparent flat plate to form a first beam set, the spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 100 μm and less than or equal to 5000 μm. Among them, since there is no need to set a reflector, the spacing between the M PCSEL chips can be equal or unequal, and the M PCSEL chips can be arranged in any shape (such as matrix arrangement, circular arrangement, etc.). The laser beams emitted by the M PCSEL chips can overlap or non-overlap. Under this structural design, a first beam or a first beam set with high collimation and high power can be aggregated to be used as a laser projection light source.

[0041] Among them, the PCSEL chip can be used to emit a laser beam with a wavelength range greater than or equal to 380nm and less than or equal to 740nm. In some implementations, the PCSEL chip is used to emit a laser beam of at least one wavelength range, and the laser beam of at least one wavelength range includes at least one of the following: a red light wavelength range, a green light wavelength range, and a blue light wavelength range. The emitted red light wavelength range may refer to a wavelength range greater than or equal to 615nm and less than or equal to 665nm. The green light wavelength range may refer to a wavelength range greater than or equal to 500nm and less than or equal to 560nm. The blue light wavelength range may refer to a wavelength range greater than or equal to 420nm and less than or equal to 480nm.

[0042] In some implementations, the housing includes a transparent flat plate 111, a frame 112, and a bottom plate 113. The top of the frame 112 is provided with a first opening, the bottom of the frame 112 is provided with a second opening, the transparent flat plate 111 is provided in the first opening, and the bottom plate 113 is provided in the second opening. The chip array 120 is provided on the upper surface of the bottom plate 113, and the bottom plate 113 is used for heat conduction. Thus, the three separate components, the frame, the transparent cover plate, and the bottom plate 113, cooperate with each other to form a housing together to achieve airtight packaging.

[0043] In some implementations, the inner wall of the frame 112 is provided with a first pad group 131, and the chip array 120 is electrically connected to the first pad group 131. A second pad group 132 is provided at the bottom of the frame 112, and the second pad group 132 is used to connect a printed circuit board (PCB), and the first pad group 131 is electrically connected to the second pad group 132. Among them, the first pad group 131 may include one or more pads. The second pad group 132 may include one or more pads. The pads in the first pad group 131 can be determined according to the connection relationship with the PCSEL chip. The pads in the second pad group 132 can be determined according to the conduction relationship with the pads in the first pad group 131. Thus, by respectively providing pads at the bottom and the inner wall of the package shell, the pads at the bottom and the inner wall are correspondingly connected. Thus, the pads at the bottom are connected to the PCB, and the pads at the inner wall are connected to the PCSEL chip, providing corresponding electrical signals for the PCSEL chip.

[0044] In some implementations, the PCSEL chips in the chip array 120 can be connected to the first pad group 131 through wires. In some implementations, the chip array 120 includes a first PCSEL chip and a second PCSEL chip, and the first pad group 131 includes a first pad and a second pad. The positive electrode of the first PCSEL chip is connected to the first pad, and the negative electrode of the second PCSEL chip is connected to the second pad. The first PCSEL chip and the second PCSEL chip are connected in series. Thereby, the electrical connection between the chip array 120 and the first pad group 131 is realized.

[0045] In some implementations, one or more holes are provided inside the housing, and the holes are used to set wiring, and the wiring is used to connect the first pad group 131 and the second pad group 132. Thereby, mutual conduction between the first pad group 131 and the second pad group 132 is achieved. In some implementations, a boss is provided inside the housing, and the first pad group 131 is specifically provided on the upper surface of the boss, so as to provide a space for accommodating the wiring.

[0046] In addition, when the shell is specifically composed of the transparent flat plate 111 , the frame 112 and the bottom plate 113 , the first pad group 131 being arranged inside the shell may also mean that the first pad group 131 is arranged inside the frame 112 .

[0047] In the chip array 120, the PCSEL chip can be used to emit a laser beam with a wavelength greater than or equal to 380nm and less than or equal to 740nm. In some implementations, the PCSEL chip is used to emit any one of a blue laser beam, a green laser beam, or a red laser beam. Among them, the wavelength of the blue laser beam can be greater than or equal to 420nm and less than or equal to 480nm. The wavelength of the red laser beam can be greater than or equal to 615nm and less than or equal to 665nm. The wavelength of the green laser beam can be greater than or equal to 500nm and greater than or equal to 560nm. Thereby forming a three-color laser light source, so that when used in a projection device, the color is more accurate and the contrast is higher.

[0048] Figure 2 It is a schematic diagram of the beam aggregation effect of a laser device provided in an embodiment of the present application.

[0049] like Figure 2 (a) shows the structure of the laser device when a reflector 220 is provided in the laser device. In this case, the laser chip 210 emits a laser beam in a direction parallel to the plane in which it is located. The laser beam changes direction after passing through the reflector 220, and is emitted from the laser device after being collimated at the lens 230. Among them, when multiple laser chips 210 are provided, since the settings of the emitting mirror and the lens 230 need to correspond one-to-one with the position of the laser chip 210, the arrangement of the laser chip 210 is limited. The laser chip 210 may specifically refer to an edge emitting semiconductor laser (edge ​​emitting laser, EEL) chip. The laser beam emitted by the EEL chip has two directions, a fast axis and a slow axis, and the laser beams in both directions have a large divergence angle. The light spot 240 emitted from the laser device is as shown in FIG. Figure 2 The one shown in (b) is a long strip, and the near-field light spot is inconsistent with the far-field light spot.

[0050] like Figure 2 (c) shows the structure of a laser device with a collimating lens in the laser device. In this case, the laser chip emits a laser beam in a direction perpendicular to the plane in which it is located. The laser chip may specifically refer to a vertical cavity surface emitting laser (VCSEL) chip or a horizontal cavity surface laser (HCSEL) chip. Before being collimated by the laser chip, the divergence angle of the laser beam emitted by the laser chip ranges from -10° to more than 10°, which cannot meet the application of projection equipment. Figure 2 As shown in (d), a one-to-one corresponding lens 250 needs to be provided for each laser chip.

[0051] like Figure 2 (e) and (f) show the Figure 1 The laser device structure corresponding to the provided embodiment. By controlling the overall dimensions d1 and d2 of the PCSEL laser chip array, the interval between two PCSEL chips, and the divergence angle of each PCSEL chip, the divergence angle of the aggregated first light beam or the first light beam set emitted by the laser device is made to be less than -5° to 5°. When the laser device is used in the light source of a projection device, the accuracy and stability of the projection image can be improved.

[0052] Figure 3 Schematic diagram of the structure of a PCSEL chip provided in an embodiment of the present application. Figure 3 As shown in (a), the PCSEL chip includes a first electrode 310, a substrate 320, an active layer 330, a resonant cavity 340 and a second electrode 350.

[0053] The first electrode 310 and the second electrode 350 may be disposed on the same surface or different surfaces of the PCSEL chip. The first electrode 310 may be a P-type metal, and the second electrode 350 may be an N-type metal.

[0054] The active layer 330 is used to generate a pump source.

[0055] The resonant cavity 340 is formed by a photonic crystal array. The photonic crystal array includes K×L photonic crystal structures, K is a positive integer greater than or equal to 2, and L is a positive integer greater than or equal to 2. Among them, the K photonic crystal structures form rows in the photonic crystal array, and the L photonic crystal structures form columns in the photonic crystal array, and the rows and columns are perpendicular to each other. Therefore, the resonant cavity 340 is formed along the two vertical directions of the row and the column, which amplifies the pump source and emits a laser beam in a direction perpendicular to the substrate 320.

[0056] The photonic crystal structure may be a two-dimensional structure or a three-dimensional structure. For example, the photonic crystal structure may be a three-dimensional structure such as a hemispherical structure. Alternatively, the photonic crystal structure may be a two-dimensional structure such as a circular, elliptical, triangular, rectangular, etc.

[0057] In some implementations, such as Figure 3 (b) shows a top view of the resonant cavity 340, each photonic structure crystal includes a first type of photonic crystal structure and a second type of photonic crystal structure, the first type of photonic crystal structure and the second type of photonic crystal structure have different shapes or sizes, so that the pump source is further amplified by the pattern design of the photonic crystal structure.

[0058] In some implementations, such as Figure 3As shown in (c), the photonic crystal array includes a first region and a second region, the first region forms a first pattern, the second region forms a second pattern, and the first pattern is different from the second pattern. Thus, the pump source is further amplified by the pattern design of the photonic crystal structure.

[0059] In addition, a lower cladding layer may be provided below the active layer 330, and an upper cladding layer may be provided above the active layer 330. In addition, a buffer layer may be provided between the active layer 330 and the resonant cavity 340, which is determined according to actual conditions and is not limited in this application.

[0060] In addition, the present application also provides a light source, a projection device, a vehicle-mounted display system and a vehicle.

[0061] Figure 4 1 is a schematic diagram of the structure of a light source provided in an embodiment of the present application. The light source is used to emit a second light beam.

[0062] like Figure 4 As shown in (a), the light source includes a printed circuit board 420 and a laser device array 410. The laser device array 410 is disposed on the printed circuit board 420. The laser device array 410 specifically includes N laser devices such as Figure 1 The laser device shown. N laser devices are used to emit N first light beams or first light beam sets toward a first direction, so that the N first light beams or first light beam sets are aggregated to form a second light beam. The first direction is perpendicular to the plane where the printed circuit board 420 is located, and N is a positive integer. In the case of using the first light beam or the first light beam set to aggregate to form the second light beam, an optical device, such as a fly-eye lens, can be added to or outside the structure to homogenize the second light beam. Thus, by setting the laser array, the power of the laser beam can be further expanded.

[0063] In the laser device array 410, the laser devices among the N laser devices can be used to emit a laser beam with a wavelength greater than or equal to 380nm and less than or equal to 740nm. In some implementations, the laser devices among the N laser devices can be used to emit any one or more of a blue laser beam, a green laser beam, or a red laser beam. Among them, the wavelength of the blue laser beam can be greater than or equal to 420nm and less than or equal to 480nm. The wavelength of the red laser beam can be greater than or equal to 615nm and less than or equal to 665nm. The wavelength of the green laser beam can be greater than or equal to 500nm and greater than or equal to 560nm. Thus, a three-color laser light source is formed, so that when used in a projection device, the color is more accurate and the contrast is higher.

[0064] In addition, according to actual conditions, a thermistor 421 may be provided on the printed circuit board 420 to monitor the temperature of the laser device. In addition, a connector 422 may be provided on the printed circuit board 422, and the connector 422 is used to transmit a power signal. The connector 422 may also be understood as a power line. In some implementations, the connector 422 is provided in a one-to-one correspondence with the N laser devices. In some implementations, the connector 422 is provided in a one-to-one correspondence with the PCSEL laser chips in the N laser devices.

[0065] In some implementations such as Figure 4 As shown in (b), the shape of the laser device array 410 is determined according to the preset spot shape of the second light beam. For example, according to the actual application requirements of the projection device, the preset spot shape is any one of square, rectangular or circular, and the shape of the laser device array 410 can be set accordingly. Among them, the size of the preset spot can be the same as the size of the laser device array 410. In addition, according to actual needs, the shape of the laser device array 410 can be set according to the preset near-field spot size and / or far-field spot size. For example, the size of the laser device array 410 is calculated based on the divergence angle of the laser device in the laser device array 410. Thereby, the structural design of the light source meets the use requirements of the back-end projection device.

[0066] In some implementations, the laser device array 410 may be a hollow array. This saves energy while achieving power expansion of the second light beam emitted by the light source. In addition, an additional optical device may be provided to further shape the second light beam. In some implementations, the laser device array 410 is a solid array. This ensures that the energy of the second light beam emitted by the light source is concentrated.

[0067] In some implementations, the size of the laser device array 410 can be greater than or equal to 10 mm and less than or equal to 100 mm. Furthermore, the spacing between any two of the N laser devices can be greater than or equal to 0.1 mm and less than or equal to 5 mm. In some implementations, the spot size of the laser beam emitted by the laser device in the N laser devices is greater than or equal to 1 mm and less than or equal to 30 mm. Furthermore, the spacing between any two of the N laser devices can be greater than or equal to 0.1 mm and less than or equal to 5 mm. Among them, since no reflector is required, the spacing between the laser devices can be equal or unequal, that is, the first light beams emitted by multiple laser devices can overlap or non-overlap. Under this structural design, the light source can be aggregated to form a second light beam with high collimation and high power, which is used as a laser projection light source.

[0068] Figure 5 Schematic diagram of a projection device provided in an embodiment of the present application. Figure 5As shown, the projection device includes Figure 4 Light source 510, modulator 520 and lens 530 are shown.

[0069] The light source 510 is used to emit a second light beam.

[0070] The modulator 520 is used to modulate the second light beam to obtain an optical signal. The modulator 520 may be a liquid crystal on silicon (LCoS) modulator 520, which is a reflective spatial light modulator 520 having the function of changing the polarization direction of incident linearly polarized light. Alternatively, the modulator 520 may be a reflective spatial light modulator 520 that does not have the function of changing the polarization direction of incident linearly polarized light, such as a micro-electro-mechanical system (MEMS) or a digital micro mirror device (DMD). In addition, the modulator 520 may also be a transmissive spatial light modulator 520, such as a liquid crystal display (LCD).

[0071] The lens 530 is used to project light signals to display a projection image.

[0072] Figure 6 Schematic diagram of a vehicle display system provided by an embodiment of the present application. Figure 6 As shown, the vehicle display system mainly includes a host CPU 601, an external memory interface 602, an internal memory 603, an audio module 604, a video module 605, a power module 606, a wireless communication module 607, an I / O interface 608, a video interface 609, and a projection device 610. The host processor 601 and its peripheral components, such as the external memory interface 602, the internal memory 603, the audio module 604, the video module 605, the power module 606, the wireless communication module 607, the I / O interface 608, the video interface 609, and the projection device 610, can be connected via a bus. The host processor 601 can be called a front-end processor.

[0073] The main processor 601 includes one or more processing units, for example, the main processor 601 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processor (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0074] The main processor 601 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in the main processor 601 is a cache memory. The memory may store instructions or data that the main processor 601 has just used or circulated. If the main processor 601 needs to use the instruction or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the main processor 601, and thus improves the efficiency of the system.

[0075] The projection device 610 may be a projection device provided in any of the above embodiments. In some embodiments, the projection device 610 may further include a plurality of input / output (I / O) interfaces 608 connected to the main processor 601. The interface 608 may include an Inter-Integrated Circuit (I2C) interface, an Inter-Integrated Circuit Sound (I2S) interface, a Pulse Code Modulation (PCM) interface, a Universal Asynchronous Receiver / Transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a General-Purpose Input / Output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and / or a Universal Serial Bus (USB) interface, etc. The I / O interface 608 may be connected to devices such as a mouse, touchpad, keyboard, camera, speaker, microphone, etc., and may also be connected to physical buttons on the projection device (such as volume buttons, brightness adjustment buttons, power buttons, etc.).

[0076] The external memory interface 602 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the projection device. The external memory card communicates with the main processor 601 through the external memory interface 602 to implement a data storage function.

[0077] The internal memory 603 can be used to store computer executable program codes, which include instructions. The internal memory 603 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system, an application required for at least one function (such as a call function, a time setting function, etc.), etc. The data storage area may store data created during the use of the projection device (such as a phone book, world time, etc.), etc. In addition, the internal memory 603 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (Universal Flash Storage, UFS), etc. The main processor 601 executes various functional applications and data processing of the projection device by running instructions stored in the internal memory 603 and / or instructions stored in a memory provided in the main processor 601.

[0078] The projection device can realize audio functions such as music playing and calling through the audio module 604 and the application processor.

[0079] The audio module 604 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signal. The audio module 604 can also be used to encode and decode audio signals, such as playing or recording. In some embodiments, the audio module 604 can be arranged in the main processor 601, or some functional modules of the audio module 604 can be arranged in the main processor 601.

[0080] The video interface 609 can receive external audio and video signals, which can be specifically a high-definition multimedia interface (HDMI), a digital video interface (DVI), a video graphics array (VGA), a display port (DP), etc. The video interface 609 can also output video to the outside. When the projection device is used as a vehicle display, the video interface 609 can receive speed signals and power signals input from peripheral devices, and can also receive external VR video signals. When the projection device is in use, the video interface 609 can receive video signals input from an external computer or terminal device.

[0081] The video module 605 can decode the video input by the video interface 609, for example, by performing H.264 decoding. The video module can also encode the video collected by the projection device, for example, by performing H.264 encoding on the video collected by the external camera. In addition, the main processor 601 can also decode the video input by the video interface 609, and then output the decoded image signal to the projection device 610.

[0082] The projection device 610 is used to display the corresponding image. In this embodiment, the video interface 609 receives the external input video source signal, and the video module 605 decodes and / or digitally processes and outputs one or more image signals to the projection device 610. The projection device 610 images the incident light source according to the input image signal, and then outputs the image light. In addition, the main processor 601 can also output one or more image signals to the projection device 610.

[0083] The wireless communication module 607 enables the projection device to communicate wirelessly with the outside world, and can provide wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication technology (NFC), infrared technology (IR) and other wireless communication solutions. The wireless communication module 607 can be one or more devices integrating at least one communication processing module. The wireless communication module 607 receives electromagnetic waves via an antenna, modulates the frequency of the electromagnetic wave signal and performs filtering, and sends the processed signal to the main processor 601. The wireless communication module 607 can also receive the signal to be sent from the main processor 601, modulate the frequency of the signal, amplify it, and convert it into electromagnetic waves for radiation through the antenna.

[0084] In addition, in addition to being input through the video interface 609, the video data decoded by the video module 605 can also be received wirelessly through the wireless communication module 607 or read from an external memory. For example, the projection device can receive video data from a terminal device or an in-vehicle entertainment system through the wireless LAN in the car, and the projection device can also read audio and video data stored in an external memory.

[0085] In addition, if Figure 6 The in-vehicle display system described in the invention can be installed on a vehicle.

[0086] Figure 7 It is a vehicle provided by an embodiment of the present application. The functional framework of the vehicle may include various subsystems, such as the sensor system 12, the control system 14, one or more peripheral devices 16 (one is shown as an example in the figure), the power supply 18, the computer system 20 and the vehicle display system 22. Optionally, the vehicle may also include other functional systems, such as an engine system that provides power for the vehicle, etc., which are not limited in the present application.

[0087] The sensor system 12 may include a number of detection devices, which can sense the measured information and convert the sensed information into electrical signals or other required forms of information output according to a certain rule. As shown in the figure, these detection devices may include a global positioning system (GPS), a vehicle speed sensor, an inertial measurement unit (IMU), a radar unit, a laser rangefinder, a camera device, a wheel speed sensor, a steering sensor, a gear position sensor, or other components for automatic detection, etc., and the present application does not limit them.

[0088] The control system 14 may include several components, such as the steering unit, brake unit, lighting system, automatic driving system, map navigation system, network timing system and obstacle avoidance system shown in the figure. Optionally, the control system 14 may also include components such as a throttle controller and an engine controller for controlling the vehicle's speed, which are not limited in this application.

[0089] The peripheral device 16 may include several components, such as the communication system, touch screen, user interface, microphone, and speaker shown in the figure. The communication system is used to realize network communication between the vehicle and other devices other than the vehicle. In practical applications, the communication system may use wireless communication technology or wired communication technology to realize network communication between the vehicle and other devices. The wired communication technology may refer to communication between the vehicle and other devices through network cables or optical fibers.

[0090] The power source 18 represents a system that provides power or energy for the vehicle, which may include but is not limited to a rechargeable lithium battery or a lead-acid battery, etc. In practical applications, one or more battery components in the power source are used to provide power or energy for starting the vehicle, and the type and material of the power source are not limited in this application.

[0091] Several functions of the vehicle are controlled and implemented by the computer system 20. The computer system 20 may include one or more processors 2001 (one processor is shown as an example) and a memory 2002 (also referred to as a storage device). In actual applications, the memory 2002 is also inside the computer system 20, or it may be outside the computer system 20, for example, as a cache in the vehicle, etc., which is not limited in this application.

[0092] The processor 2001 may include one or more general-purpose processors, such as a graphics processing unit (GPU). The processor 2001 may be used to run related programs or instructions corresponding to the programs stored in the memory 2002 to implement corresponding functions of the vehicle.

[0093] The memory 2002 may include a volatile memory, such as a RAM; the memory may also include a non-volatile memory, such as a ROM, a flash memory, a HDD or a solid-state drive SSD; the memory 2002 may also include a combination of the above-mentioned types of memories. The memory 2002 may be used to store a set of program codes or instructions corresponding to the program codes, so that the processor 2001 calls the program codes or instructions stored in the memory 2002 to implement the corresponding functions of the vehicle. In the present application, a set of program codes for vehicle control may be stored in the memory 2002, and the processor 2001 calls the program codes to control the safe driving of the vehicle. How to achieve safe driving of the vehicle is described in detail below in the present application.

[0094] Optionally, in addition to storing program codes or instructions, the memory 2002 may also store information such as road maps, driving routes, sensor data, etc. The computer system 20 may be combined with other elements in the vehicle functional framework diagram, such as sensors in the sensor system, GPS, etc., to implement relevant functions of the vehicle. For example, the computer system 20 may control the driving direction or driving speed of the vehicle based on the data input from the sensor system 12, which is not limited in this application.

[0095] The vehicle display system 22 may include several components, such as a controller and a vehicle display system. The controller 222 is used to generate an image (such as an image of VR content) according to user instructions, and send the image to the vehicle display system for display; the vehicle display system may include an image generation unit, a window unit, and an image magnification unit, and passengers can view the target image presented by the vehicle display system through the window unit. Among them, the functions of some components in the vehicle display system can also be implemented by other subsystems of the vehicle, for example, the controller can also be a component in the control system.

[0096] Among them, this application Figure 7 The four subsystems shown are sensor system 12, control system 14, computer system 20 and vehicle display system 22, which are only examples and not limiting. In practical applications, vehicles can combine several components in the vehicle according to different functions to obtain subsystems with corresponding different functions. In practical applications, vehicles can include more or fewer systems or components, which is not limited in this application.

[0097] The above-mentioned means of transportation may be a car, a truck, a bus, a ship, an airplane, a helicopter, an amusement vehicle, a train, etc., and the embodiments of the present application do not make any particular limitation.

[0098] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0099] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0100] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0101] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0102] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0103] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A laser device, characterized in that: include: The shell body has a transparent flat plate on the top; A chip array is arranged in the shell, the chip array includes M PCSEL photonic crystal surface emitting laser chips, and the M PCSEL chips are used to emit M laser beams toward the transparent flat plate, so that the M laser beams are aggregated at the transparent flat plate to form a first beam or a first beam set, where M is an integer greater than or equal to 2.

2. The laser device according to claim 1, characterized in that: The divergence angle of the first light beam or the first light beam set is greater than or equal to -5° and less than or equal to 5°.

3. The laser device according to claim 1 or 2, characterized in that: in: The size of the chip array is greater than or equal to 1 mm and less than or equal to 30 mm; When the M laser beams converge at the transparent flat plate to form a first beam, a spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 5 μm and less than or equal to 100 μm; When the M laser beams are aggregated at the transparent flat plate to form a first beam set, a distance between any two PCSEL chips among the M PCSEL chips is greater than or equal to 100 μm and less than or equal to 5000 μm.

4. The laser device according to claim 1 or 2, characterized in that: in: The spot size of the PCSEL chip in the M PCSEL chips is greater than 100 μm and less than 5000 μm; When the M laser beams converge at the transparent flat plate to form a first beam, a spacing between any two PCSEL chips among the M PCSEL chips is greater than or equal to 5 μm and less than or equal to 100 μm; When the M laser beams are aggregated at the transparent flat plate to form a first beam set, a distance between any two PCSEL chips among the M PCSEL chips is greater than or equal to 100 μm and less than or equal to 5000 μm.

5. The laser device according to claim 1 or 2, characterized in that: The housing comprises the transparent flat plate, a frame and a bottom plate, wherein: The top of the frame is provided with a first opening, the bottom of the frame is provided with a second opening, the transparent flat plate is provided in the first opening, and the bottom plate is provided in the second opening; The chip array is arranged on the upper surface of the base plate, and the base plate is used for heat conduction.

6. The laser device according to claim 5, characterized in that: in: The inner wall of the frame is provided with a first pad group, and the chip array is electrically connected to the first pad group; A second pad group is disposed at the bottom of the frame, the second pad group is used to connect to a printed circuit board, and the first pad group is electrically connected to the second pad group.

7. A light source, characterized in that: For emitting a second light beam, the light source comprises a printed circuit board and a laser device array, wherein: the laser device array is arranged on the printed circuit board, and the laser device array comprises N laser devices according to any one of claims 1 to 6; The N laser devices are used to emit N first light beams or N first light beam sets toward a first direction, so that the N first light beams or N first light beam sets are aggregated to form the second light beam, wherein the first direction is perpendicular to the plane where the printed circuit board is located, and N is a positive integer.

8. The light source according to claim 7, characterized in that The shape of the laser device array is determined according to a preset spot shape of the second light beam.

9. The light source according to claim 8, characterized in that The laser device array is a hollow array, or the laser device array is a solid array.

10. A projection device, characterized in that: The method comprises a light source, a modulator and a lens as claimed in any one of claims 7 to 9, wherein: The light source is used to emit the second light beam; The modulator is used to modulate the second light beam to obtain an optical signal; The lens is used to project the optical signal to display a projection picture.

11. A vehicle-mounted display system, characterized in that: Comprising the projection device as claimed in claim 10.

12. A means of transport, characterized in that: Comprising the vehicle-mounted display system as claimed in claim 11.

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